KR101583495B1

KR101583495B1 - Apparatus for Pre-Bonding COF of Panel

Info

Publication number: KR101583495B1
Application number: KR1020140124105A
Authority: KR
Inventors: 김성민; 정진명; 하성원
Original assignee: 세광테크 주식회사
Priority date: 2014-09-18
Filing date: 2014-09-18
Publication date: 2016-01-11

Abstract

Provided is a chip on film (COF) pre-bonding apparatus of a panel for effectively securing an upper room of a facility by being placed to punch from the lower side to the upper side thereof, toward the COF, and for allowing all the elements to provide a COF to be located lower than a punching location site, and thus the facility can be effectively maintained and managed. The COF pre-bonding apparatus of a panel comprises: a panel carrier unit for adsorbing and supporting a panel to be transferred; a punching unit for bonding correspondingly located at intervals in the lower part of the panel carrier unit to vertically reciprocate toward the panel carrier unit, and coming into contact with the COF so as to thermally compress the COF while cutting the same, thereby bonding the COF on the panel; a COF providing unit installed to be rotated in the lower part of the punching unit, winding the COF to which a protective film and a punching film are attached, and providing the COF through a path which is a space between the panel carrier unit and the punching unit; a protective film collecting unit installed to be rotated on one side of the COF providing unit and collecting the protective film attached to the COF in the process of providing the COF toward the punching unit; and a punching film collecting unit fixed to and installed on the opposite side of the protective film collecting unit based on the COF providing unit and collecting, from the punching unit, the remaining punching films after cutting according to COF bonding, wherein all of the COF providing unit, the protective film collecting unit and the punching film collecting unit are located in the lower part based on the punching unit and are arranged in a linear structure.

Description

Apparatus for Pre-Bonding COF of Panel [0002]

The present invention relates to a COF bonding apparatus for a panel, and more particularly, to a COF bonding apparatus for a panel, in which COF (Chip On Film) is pre-bonded to a panel, The present invention also relates to a COF bonding apparatus for a panel in which all the components for supplying a COF can be efficiently positioned,

In general, various types of high-density semiconductor packages are mounted on parts of a panel so as to realize a low-voltage driving, a low power consumption, and a full-color implementation in a portable electronic device such as a mobile phone, a notebook computer, a PDA, do. Furthermore, in order to mount a high-density semiconductor package on a panel, a bonding apparatus of a variety of structures is used so that a semiconductor package, which is a driving circuit, can be electrically connected to the display panel.

As a technique for manufacturing a high-density semiconductor package, a TCP (tape carrier package) called a tape carrier system is a typical method in which a semiconductor chip, which is a plurality of integrated circuit elements, is mounted on a single panel in a high density manner In recent years, technologies such as COB (chip on board), COG (chip on glass) and COF (chip on film) have been developed and used to mount semiconductor chips.

These various types of semi-replacement packages are produced as a display product through a process of bonding on a panel from a bonding apparatus (for example, a COB bonding apparatus, a COG bonding apparatus, a COF bonding apparatus) having different structures.

As a conventional technique disclosed in connection with the above-described bonding apparatus, Korean Registered Patent No. 806919 (Mar. 18, 2008) discloses a loader in which a glass is loaded; An ACF is automatically attached to a glass (panel) supplied from the loading part, the semiconductor chip is centered, the semiconductor chip is supplied onto the glass by a rotary method, and preliminary bonding (bundling) is performed by aligning A main body for performing main bonding; An Un-Loader comprising a conveyor for discharging the glass mounted on the semiconductor chip supplied from the main body to the outside; A transfer unit provided between the loading unit, the body unit, and the unloading unit to transfer chips to the respective sections; And a control unit for controlling the loading unit, the body unit, and the unloading unit. Accordingly, there is known an inline automatic COG bonding apparatus in which the bonding operation time is shortened and the working efficiency is improved.

Also, Korean Patent Registration No. 720408 (May 15, 2007) discloses a semiconductor device comprising: a substrate on which a semiconductor chip is mounted; A pick-up tool for moving the semiconductor chip on which bumps are formed and mounting the semiconductor chip on the substrate; An anisotropic conductive film positioned between the supertwand and the pick-up tool to which the chip is attached; And a film separating means for separating as much unit film as necessary for chip mounting from the anisotropic conductive film, wherein the pick-up tool is configured to thermally compress the chip to the supertat while separating as many unit films as necessary for the supersatellite mounting, There is known a flip chip bonding apparatus using an anisotropic conductive film which is characterized in that the speed is increased, workability is improved, and productivity is improved.

On the other hand, in a high density semiconductor package, COF is a structure in which a semiconductor chip is mounted on a punch film and a protective film is attached on the semiconductor chip. In the case of a COF bonding device using a COF method, an anisotropic conductive film Bonding an ACF (anisotropic conductive film) on the anisotropic conductive film, placing the COF on the anisotropic conductive film, and then thermally compressing and bonding the COF on the anisotropic conductive film; and transferring the bonded panel to a COF To the main surface of the panel, and proceeds to a stepwise process similar to the above-described COG bonding apparatus. However, as shown in FIG. 1, the COF substrate bonding apparatus includes a carrier 1 for supporting the panel and a punching means 2 for punching the COF, A COF supplying means 3 for supplying COF, and a protective film collecting means 4 for collecting the protective film and a punching film collecting means 5 for collecting the punching film.

However, in the conventional COF bonding apparatus, since the position of the COF supplying means is disposed above the punching means while the punching means is pushed toward the COF located at the lower side, the force due to the continuous punching operation of the punching means is applied to the COF supplying means Of course, there is a problem in that the COF supplying means is added with its own weight, so that the COF supplying means may drop.

Also, conventionally, when no tension is applied to the COF supplying means, since the COF is sagged as time passes, accurate cutting can not be performed, and thus the rate of defective in the process is increased and the COF is fed downward from the COF supplying means. If the foreign matter falls down, the COF is buried in the COF and the quality is deteriorated.

Further, in the case of the conventional COF bonding apparatus, since the lower portion of the pulling means moves up and down and the COF is pulled out, the lower punching portion of the pulling means is required to be viewed at the time of setting the pulling means, .

In addition, when the conventional COF bonding apparatus is combined with the ACF apparatus and the main bonding apparatus, which are the previous processes, there is a problem that the accessibility between the ACF apparatus and the main bonding apparatus is poor and the maintenance, that is, maintenance is difficult The spacing between the ACF device and the main bonding device for the sake of maintenance is increased, resulting in an increase in the overall width of the equipment, thereby occupying a considerably large amount of equipment space.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an apparatus and a method for preventing COF from being damaged due to punching as well as enhancing safety and durability of a facility, And it is an object of the present invention to provide a COF charging apparatus for a panel which can reduce a space between the apparatus and a facility at the same time while minimizing the overall facility width and improve accessibility to maintenance due to smooth accessibility with other facilities.

It is another object of the present invention to provide a COF charging apparatus for a panel in which the upper portion of the COF is driven to be punched so that the setting operation for the punching unit is very simple and the setting time can be minimized.

The COF substrate bonding apparatus of the present invention includes a panel carrier unit for adsorbing and supporting the panel in a transportable manner; A punching unit positioned correspondingly with the lower portion of the panel carrier unit so as to reciprocate upward and downward toward the panel carrier unit, wherein the punching unit contacts the panel to bond the COF to the panel by thermocompression; A COF supply unit that is rotatably installed at a lower portion of the punching unit and that winds the COF having the protective film attached thereto together with the punching film and supplies the COF through the space between the panel carrier unit and the punching unit; A protective film collecting unit rotatably installed on one side of the COF supplying unit and collecting a protective film attached to the COF in a process of supplying COF toward the punching unit; And a punching film collecting unit fixed on the opposite side of the protective film collecting unit with respect to the COF supplying unit and collecting the remaining punching film remaining after cutting by the COF bonding from the punching unit, And the punching film collecting part are both arranged at a lower part with respect to the punching unit and aligned in a row.

Wherein the COF supply unit and the punching film recovery unit are located on a COF supply path via the punching unit and are spaced apart on both sides of the punching unit and between the panel carrier unit and the punching unit, A pair of guide rollers for holding the guide rollers in a horizontal state.

The punching unit is adjustable in the X-axis direction and the Y-axis direction so that the bonding position can be set.

Further, the striking unit may further include a position camera unit mounted on one side so as to face upward, and photographing the position of the COF supplied from the COF supplying unit so that the position can be confirmed.

The punching unit, the COF supplying unit, the protective film collecting unit, and the punching film collecting unit may be configured to have a two-column structure symmetrical with respect to the panel carrier unit.

According to the COF charging apparatus of the panel according to the present invention, since the configurations of the COF supplying unit, the protective film collecting unit, and the punching film collecting unit are disposed below the punching unit, The space between the ACF facility and the main bonding facility can be reduced, the facility space can be fully utilized by reducing the overall facility width, the ease of access to the ACF facility and the main bonding facility can be improved, .

Further, since the COF charging unit of the panel according to the present invention has a structure in which the COF supplying unit is disposed below the punching unit, the COF supplying unit is not affected by the own load of the COF supplying unit and the striking operation of the punching unit, It is possible to prevent the equipment from being damaged due to the drop, to secure the safety of the facility and stable driving, and to supply the COF from the COF supply part upwardly, thereby preventing contamination of the COF due to the generation of foreign matter, .

In addition, since the COF charging unit of the panel according to the present invention is constructed such that the punching unit is located at the lower part of the COF and is driven to punch upward toward the COF, the defective product of the COF is prevented from being defective at the lower part of the COF, The setting operation of the punching unit is easy, so that the convenience of the operator can be improved and the setting time can be shortened.

In addition, since the COF charging unit of the panel according to the present invention constitutes a position camera unit for photographing the position of the COF supplied from the COF supplying unit in an identifiable manner, the accuracy of the punching unit is improved, Of course, there is an effect that production of good article can be planned.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram schematically showing a conventional COF imaging apparatus. FIG.
2 is a schematic diagram showing an embodiment according to the present invention;
3 is a schematic view showing a first embodiment of a stamping unit according to an embodiment of the present invention.
4 is a schematic view showing a second embodiment of a take-off unit according to an embodiment of the present invention;

The present invention relates to a panel carrier unit for adsorbing and transporting a panel, A punching unit positioned correspondingly with the lower portion of the panel carrier unit so as to reciprocate upward and downward toward the panel carrier unit, wherein the punching unit contacts the panel to bond the COF to the panel by thermocompression; A COF supply unit that is rotatably installed at a lower portion of the punching unit and that winds the COF having the protective film attached thereto together with the punching film and supplies the COF through the space between the panel carrier unit and the punching unit; A protective film collecting unit rotatably installed on one side of the COF supplying unit and collecting a protective film attached to the COF in a process of supplying COF toward the punching unit; And a punching film collecting unit fixed on the opposite side of the protective film collecting unit with respect to the COF supplying unit and collecting the remaining punching film remaining after cutting by the COF bonding from the punching unit, And the punching film collecting unit are all arranged at a lower portion with respect to the punching unit and aligned in a line.

And the COF supply unit and the blow-off film return unit are located on the COF supply path via the blow out unit, and are provided at both sides of the blow out unit in front of and behind the blow out unit and in the area between the panel carrier unit and the blow out unit The present invention is characterized by a COF charging apparatus of a panel including a pair of guide rollers for keeping the COF in a horizontal state.

Further, the pushing unit is capable of adjusting the position in the X-axis direction and the Y-axis direction so that the bonding position can be set.

And a position camera unit mounted on the one side of the striking unit so as to positively photograph the position of the COF supplied from the COF supply unit.

And the COF supply unit, the COF supply unit, the protective film recovery unit, and the pulling film recovery unit are bilaterally symmetrical with respect to the panel carrier unit.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments of a COF imaging apparatus for a panel according to the present invention will be described in detail with reference to the drawings.

2, a panel carrier unit 10, a striking unit 20, a COF supplying unit 30, a protective film collecting unit (not shown) 40 and a punching film collecting unit 50.

The panel carrier unit 10 performs the function of transporting the panel in a supported state. The panel carrier unit 10 sucks and supports and supports the panel supplied from the ACF facility in the previous process. The panel carrier unit 10 linearly moves in the X- and Y- And the panel is configured to be transportable.

The panel carrier unit 10 may be constructed so that the panel carrier unit 10 generates a simple suction force for sucking air from the outside to be attracted to the panel carrier unit 10 so that the panel contacts the panel carrier unit 10, It is also possible to construct a structure in which a vacuum is generated from the carrier unit 10 to adsorb the panel in a noncontact manner to support the panel.

The panel carrier unit 10 transfers the panel from the striking unit 20 to a position where it can be struck and supports the panel until the striking operation by the striking unit 20 is performed.

The punching unit 20 is disposed to correspond to the lower portion of the panel carrier unit 10 with a gap therebetween and is vertically reciprocable toward the panel carrier unit 10 so that the punching unit 20 can be punched in accordance with upward driving toward the panel . That is, the punching unit 20 is positioned below the COF (M) and driven to punch upward toward the COF (M), so that the punching unit 20 is configured to be able to hit the COF (M).

The punching unit 20 performs a function of attaching the COF (M) to the panel so that the COF (M) is dubbed on the panel while touching the COF (M).

As shown in FIG. 3, the punching unit 20 is provided with a foot tip 21 that moves up and down linearly, and the foot tip 21 has a heat generating structure to thermally compress the COF (M) do.

Although not shown in the drawings, the up and down linear motion of the punching unit 20 includes a driving motor and a cam to transmit power to the punching tip 21, and thus the punching of the COF (M) It is preferable to configure it to work.

The striking unit 20 is configured to contact the COF (M) on the panel in a thermocompression manner and to cut a part of the pull film f1 of the COF (M). That is, the punching blade 23 is formed in the punching unit 20 around the punching tip 21 to cut the contact portion of the punching film f1 by the force of the linear motion of the punching unit 20 do.

If the punching unit 20 is positioned below the COF M and is pushed upward toward the COF M as described above, the sagging phenomenon of the COF M is also generated at the lower portion of the COF M It is possible to prevent defects of the product and facilitate the setting operation of the striking unit 20, thereby making it possible to shorten the setting time while improving the convenience of the operator.

The punching unit 20 is configured to be able to change and adjust the punching position in accordance with the operation setting of the operator while keeping the punching unit 20 fixed at the punching position. That is, the striking unit 20 is adjustable in the X-axis direction and the Y-axis direction so that the bonding position can be set.

For example, the striking unit 20 is configured to be coupled to a rail of an LM guide or the like and to move linearly, but to transmit power for linear motion of the striking unit 20 from a separate motor or cylinder.

By configuring the position of the punching unit 20 as described above, it is possible to smoothly set the position of the punching unit 20, thereby providing the convenience of the operator and shortening the time required for setting the punching machine.

4, the striking unit 20 is provided with a position camera unit 25 which is upwardly mounted on one side and photographs the position of the COF (M) supplied from the COF supplying unit 30 so as to be able to confirm the position of the COF It is also possible to construct the system further.

The position camera unit 25 senses and signals the position of the semiconductor chip c mounted on the COF M, that is, the pull film f1, so that the position camera unit 25 detects And receives the signal to form a punching operation toward the COF (M).

The position camera unit 25 is for identifying the position of the semiconductor chip c in the COF M, and is the same as that of a general CCD camera or infrared camera, and a detailed description thereof will be omitted.

By constituting the position camera unit 25 as described above, it is possible to improve the accuracy of the COF punching work by the punching unit 20, improve the quality of the product, and reduce the defective rate of the product due to the work, It is possible.

The COF supplying unit 30 functions to supply the COF (M) toward the punching unit 20 while winding the COF (M) as a raw material.

As shown in FIG. 2, the COF supplying unit 30 is installed to be positioned below the punching unit 20 and is formed in a cylindrical shape so that the COF (M) is wound in a plurality of layers in a predetermined thickness .

The COF supplying unit 30 is rotatably installed to form a space between the panel carrier unit 10 and the striking unit 20 so as to supply COF (M) by a path.

The COF (M) is mounted on the COF supply unit 30 in such a structure that a semiconductor chip c is attached on the punching film f1 and a protective film is attached thereon.

The protective film recovery unit 40 is disposed on one side of the COF supply unit 30 and is configured to recover the protective film f2 attached to the COF (M).

The protective film recovery unit 40 is rotatably installed on one side of the COF supply unit 30. [ That is, the protective film recovery unit 40 rotates in the same direction as the COF supply unit 30, and rotates the protective film recovery unit 40 in the same manner as the rotation speed of the COF supply unit 30.

For example, if the COF supplying unit 30 rotates in the clockwise direction, the protective film collecting unit 40 also rotates clockwise to collect the protective film f2. When the COF supplying unit 30 is half The protective film recovery unit 40 also rotates in the counterclockwise direction to recover the protective film f2.

The protective film recovery unit 40 recovers the protective film f2 attached to the COF M in the process of supplying COF (M) toward the striking unit 20. [

The punching film recovery unit 50 is configured to recover the remaining punching film f1 remaining after cutting according to COF (M) bonding from the punching unit 20. That is, the punching film recovery unit 50 supplies COF (M) in a state where the semiconductor chip (c) is attached to the punching film (f1) in the COF supplying unit (30) To bond the COF (M) to the remaining film (f1).

The punching film recovery unit 50 is installed at one side of the COF supply unit 30 and is fixed to the opposite side of the protective film recovery unit 40 with respect to the COF supply unit 30.

The punching film recovery unit 50 may be configured as a recovery type structure that can receive the punching film f1 by forming a closed space with a constant inside thereof. The punching film recovery unit 50 may include a punching film f1 The film forming unit 50 may be constructed in an ejector structure that sucks and collects the film F1 and collects the film F1. And a punching film recovery unit 50 may be used.

And a guide roller r positioned on the COF (M) supply path via the striking unit 20 between the COF supplying unit 30 and the punching film collecting unit 50.

The guide rollers r are provided on both sides of the striking unit 20 so as to be spaced apart from each other with a gap therebetween so that COF (M) is provided between the panel carrier unit 10 and the striking unit 20 And maintains it in a horizontal state.

The COF supplying unit 30, the protective film collecting unit 40, and the punching film collecting unit 50 are both arranged at a lower portion with respect to the punching unit 20 and aligned in a line. (The COF supply unit 30, the protective film collecting unit 40, and the punch film collecting unit 50) necessary for supplying the COF (M) for COF (M) And only the panel carrier unit 10 for transferring the panel is provided on the upper portion of the punching unit 20 so that the accessibility between the ACF equipment in the previous process and the main bonding equipment in the subsequent process is improved.

The punching unit 20, the COF supplying unit 30, the protective film collecting unit 40 and the punching film collecting unit 50 are symmetrically arranged with respect to the panel carrier unit 10, It is also possible to constitute a two-column structure so that the COF can perform the bonding operation corresponding to the panel.

Next, a description will be made of the operation of the COF gobbing device of the panel according to the preferred embodiment of the present invention.

First, the operator sets a sufficient amount of COF (M) to be wound on the equipment setting, that is, the COF supplying unit 30, and the COF (M) is charged on the panel in a state where the position of the putting unit 20 is adjusted to the correct position .

At this time, the panel carrier unit 10 receives the panel from the ACF equipment, fixes the panel in a picked up state, moves toward the striking unit 20, and positions the panel so that the COF (M) can be loaded on the panel.

Thereafter, the COF supplying unit 30 unwinds the COF M in the winding state and supplies the COF M to the striking unit 20 via the guide roller r, 20 cuts the punching film f1 and presses and bonds the COF (M) on the panel.

The COF supplying unit 30 continuously supplies COF (M) toward the punching unit 20 while the punching unit 20 continuously applies the COF (M) to the panel, Lt; / RTI >

On the other hand, the protective film f2 surrounding the semiconductor chip c of the COF M supplied from the COF supply unit 30 toward the punching unit 20 is wound around the protective film recovery unit 40, The remaining fusing film f1 having the semiconductor chip c cut out of the COF M through the punching unit 20 is collected through the punching film collecting unit 50. [

That is, according to the COF charging apparatus of the panel according to the present invention configured as described above, since the COF supply unit for supplying COF, as well as the configurations of the protective film collecting unit and the punching film collecting unit are positioned below the punching unit, The space between the ACF facility and the main bonding facility can be reduced and the overall facility width can be reduced to sufficiently utilize the facility space. Further, the ACF facility and the main bonding facility can be easily accessed, Can be improved.

Further, since the COF supply unit is disposed at a lower position than the stroke unit, the COF supply unit does not affect the self-load of the COF supply unit and the blowing operation of the stroke unit, It is possible to prevent the COF from being contaminated due to the generation of foreign matter, thereby improving the quality of the product.

While the preferred embodiments of the COF imaging apparatus for a panel according to the present invention have been described above, the present invention is not limited thereto, but may be modified in various ways within the scope of the claims, , Which are also within the scope of the present invention.

10: panel carrier unit 20: punching unit
21: Tablettip 23: Punching Day
25: Position camera unit 30: COF supply unit
40: protective film recovery unit 50: punch film recovery unit
r: guide roller M: COF c: semiconductor chip
f1: Punching film f2: Protective film

Claims

A panel carrier unit for adsorbing and supporting the panel in a transportable manner;
A punching unit positioned correspondingly with the lower portion of the panel carrier unit so as to reciprocate upward and downward toward the panel carrier unit, wherein the punching unit contacts the panel to bond the COF to the panel by thermocompression;
A COF supply unit that is rotatably installed at a lower portion of the punching unit and that winds the COF having the protective film attached thereto together with the punching film and supplies the COF through the space between the panel carrier unit and the punching unit;
A protective film collecting unit rotatably installed on one side of the COF supplying unit and collecting a protective film attached to the COF in a process of supplying COF toward the punching unit;
And a punching film collecting unit fixed on the opposite side of the protective film collecting unit with respect to the COF supplying unit and collecting the remaining punching film remaining after cutting by COF bonding from the punching unit,
Wherein the COF supplying unit, the protective film collecting unit, and the punching film collecting unit are all arranged on a lower portion with respect to the punching unit.

The method according to claim 1,
Wherein the COF supply unit and the punching film return unit are located on a COF supply path via the punching unit and are spaced apart on both sides of the punching unit and between the panel carrier unit and the punching unit, And a pair of guide rollers that hold the COFs in a horizontal state.

The method according to claim 1,
Wherein the striking unit is adjustable in X-axis direction and Y-axis direction to set a bonding position.

The method according to claim 1,
Further comprising: a position camera unit mounted on the one side of the striking unit so as to positively photograph the position of the COF supplied from the COF supplying unit.

The method according to claim 1,
Wherein the striking unit, the COF supplying unit, the protective film collecting unit, and the pulling film collecting unit are bilaterally symmetrical with respect to the panel carrier unit.