KR101465644B1 - Shelf for supporting container receiving wafer and cap assembly used therefor - Google Patents

Shelf for supporting container receiving wafer and cap assembly used therefor Download PDF

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Publication number
KR101465644B1
KR101465644B1 KR20130145258A KR20130145258A KR101465644B1 KR 101465644 B1 KR101465644 B1 KR 101465644B1 KR 20130145258 A KR20130145258 A KR 20130145258A KR 20130145258 A KR20130145258 A KR 20130145258A KR 101465644 B1 KR101465644 B1 KR 101465644B1
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KR
South Korea
Prior art keywords
hole
peripheral
plate
cap assembly
rib
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Application number
KR20130145258A
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Korean (ko)
Inventor
이호근
이정영
윤준필
Original Assignee
크린팩토메이션 주식회사
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Priority to KR20130145258A priority Critical patent/KR101465644B1/en
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Publication of KR101465644B1 publication Critical patent/KR101465644B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a plasma processing apparatus comprising: a plate on which a container for storing a wafer is placed; A nozzle mounted on the plate and having a connection for connection to the container; And a cap assembly disposed on the plate to support the container and coupled to the plate to enclose the connection, and a cap assembly for use therewith.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a shelf for supporting a wafer accommodating container, and a cap assembly for use therein. BACKGROUND OF THE INVENTION [0002]

The present invention relates to a shelf for supporting a wafer accommodation container and a cap assembly used therein.

Generally, in a semiconductor manufacturing process, a wafer is produced, and the produced wafer is transferred to the next stage to manufacture a semiconductor package.

At this time, the produced wafers can not be used in the next step, and after waiting for a certain time, they are sequentially sent to the next step as needed. As a facility for such storage, a device having a shelf is used.

However, the surface of the wafer may be damaged during such storage. In order to solve this problem, a method of injecting an inert gas into a container for holding a wafer or the like is used.

In order to stably inject the gas, the container holding the wafer should be placed on the shelf, and no leakage should occur between the shelf and the container.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a shelf for supporting a wafer accommodating container and a cap assembly used therein, capable of supporting a gas without leakage in a gas injection process with respect to a wafer accommodating container into which gas is to be injected.

A shelf for supporting a wafer accommodating container related to the aspect of the present invention for realizing the above-mentioned problems includes a plate formed to mount a container for storing a wafer thereon; A nozzle mounted on the plate and having a connection for connection to the container; And a cap assembly disposed on the plate to support the container while surrounding the connection, the cap assembly being coupled to the plate.

Here, the plate may include: a through hole formed to penetrate the connection portion; And a coupling hole formed around the through hole, wherein the cap assembly includes a center hole corresponding to the coupling portion and a peripheral hole corresponding to the coupling hole; And a coupling piece inserted into the peripheral hole and the coupling hole to couple the body to the plate.

Here, the coupling piece may include a bolt, and the cap assembly may further include a metal nut positioned in the peripheral hole and screwed to the bolt.

Here, the body may be formed by injecting the nut and the insert.

The nozzle may further include a support portion that is connected to the connection portion while being positioned on the opposite side of the body with respect to the plate and includes a fastening hole corresponding to the fastening hole, Can be inserted.

Here, the connecting portion may include a latching groove, and the body may further include a latching protrusion protruding from the inner circumferential surface of the center hole so as to be engaged with the latching groove.

Here, the body may be formed as an ellipse, the peripheral holes may be provided as a pair, and the center hole and the pair of peripheral holes may be disposed on the main axis line of the ellipse.

The cap assembly may further include a reinforcing rib protruding from the body.

Here, the reinforcing rib may include a central circular rib formed to surround the center hole; And a radial rib extending from the central circular rib in a radial direction of the center hole.

Here, the reinforcing rib may further include a peripheral circular rib formed to surround the peripheral hole.

A cap assembly for use in a lathe for supporting a wafer accommodating container according to another embodiment of the present invention includes a center hole, a peripheral hole located in the periphery of the center hole, and a protrusion protruding from the inner peripheral surface of the center hole Body; And a metal nut disposed in the peripheral hole by injection of an insert with the body.

The reinforcing rib may include a central circular rib formed to surround the center hole and a plurality of ribs extending radially from the central circular rib, And peripheral circular ribs formed to surround the peripheral holes.

According to the shelf for supporting the wafer accommodating container according to the present invention and the cap assembly used therein, the gas accommodating container to be injected with gas can be supported without leakage during the gas injection process.

1 is a perspective view showing a shelf 100 for supporting a wafer accommodation container according to an embodiment of the present invention and a wafer accommodation container S to be placed thereon.
2 is an exploded perspective view of the cap assembly 150 of FIG. 1 separated from the plate 110. FIG.
3 is a cross-sectional view taken along line III-III in Fig.
4 is a perspective view of the bottom of the cap assembly 150 of FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a shelf for supporting a wafer accommodating container according to a preferred embodiment of the present invention and a cap assembly used therein will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

1 is a perspective view showing a shelf 100 for supporting a wafer accommodation container according to an embodiment of the present invention and a wafer accommodation container S to be placed thereon.

Referring to the drawings, a shelf 100 for supporting a wafer accommodation container may include a plate 110, a nozzle 130, and a cap assembly 150.

The plate 110 is configured such that the wafer accommodation container S is placed thereon. For this purpose, the plate 110 may have a substantially rectangular shape. The plate 110 is provided with a supply line 121 for supplying an inert gas to the wafer accommodating container S and an exhaust line 123 for exhausting the inert gas supplied to the wafer accommodating container S to the outside . In addition, a reflector 125 may be provided on the plate 110 as a marker for identifying the position of the plate 110 by a device for moving the wafer accommodating container S.

The nozzle 130 is installed on the plate 110. The nozzles 130 are connected as a pair, specifically to the supply line 121 and the exhaust line 123, respectively. The nozzle 130 is positioned corresponding to the connection port J of the wafer accommodation container S.

The cap assembly 150 is coupled to the plate 110 to support the wafer receiving container S. The cap assembly 150 may be arranged to enclose a part of the nozzle 130.

The connection port J of the wafer accommodating container S corresponds to the nozzle 130 when the wafer accommodating container S is placed on the plate 110. [ Thereby, the nozzle 130 is connected to the connection port J. This means that the supply line 121 and the exhaust line 123 communicate with the inside of the wafer accommodation container S via the nozzle 130 and the connection port J, respectively.

As a result, the inert gas supplied through the supply line 121 is introduced into the wafer accommodating container S through the nozzle 130 connected to the supply line 121 and the connection J corresponding to the nozzle. Further, the inert gas injected into the wafer accommodating container S exerts to the outside through another nozzle 130 and an exhaust line 123 connected thereto after the inert gas is applied to the wafer.

In this process, the cap assembly 150 supports the wafer receiving container S while enclosing the nozzle 130. Thereby, the connection between the nozzle 130 and the connection port J is stably performed, so that leakage of the inert gas does not occur at the connection portion thereof.

It is also the manner in which the cap assembly 150 is coupled to the plate 110, not the way it is coupled to the nozzle 130 (or even if it is coupled to the nozzle 130), so that the wafer receiving container S is placed and moved So that it is less likely to detach from the position even under the physical impact. As a result, the risk of leakage of the inert gas can be kept low even after long use.

The mounting structure of the cap assembly 150 will be described with reference to Figs. 2 and 3. Fig.

FIG. 2 is an exploded perspective view of the cap assembly 150 of FIG. 1 separated from the plate 110, and FIG. 3 is a cross-sectional view taken along line III-III of FIG.

Referring to these drawings, a plate 110 is provided with a structure for mounting the cap assembly 150. Specifically, the through hole 111 and the coupling hole 113 are formed in the plate 110. The through hole 111 is formed to have a size allowing the connection portion 131 of the nozzle 130 to pass therethrough. The coupling holes 113 are located around the through holes 111 and may be provided in pairs. At this time, the pair of coupling holes 113 may be arranged so as to form a single straight line together with the through holes 111.

The nozzle 130 may include an upper connection portion 131 and a support portion 135. The connection part 131 may be inserted into the through hole 111 and protrude from the upper surface of the plate 110. The connection portion 131 may have an engagement groove 132 formed in the shape of a ditch. The support portion 135 is a portion connected to the connection portion 131 and may also be a portion coupled with the plate 110. [ A fastening hole 136 corresponding to the coupling hole 113 may be formed in the support portion 135.

The cap assembly 150 may include a body 151, a coupling piece 155, and a nut 157.

The body 151 can be formed of silicon excellent in bufferability for close contact with the wafer accommodation container S (Fig. 1). The body 151 may include a central hole 152 corresponding to the connection portion 131 and a peripheral hole 153 corresponding to the coupling piece 155. At this time, the peripheral holes 153 may be located on both sides of the center hole 152 as a pair. The body 151 may be generally elliptical. At this time, the center hole 152 and the peripheral hole 153 may be positioned on the main axis of the elliptical body 151. A locking protrusion 154 may protrude from the center hole 152 to engage with the locking groove 133.

The coupling piece 155 is inserted into the peripheral hole 153 and the coupling piece 155 to couple the body 151 to the plate 110. At this time, the coupling piece 155 may be, for example, a bolt.

The nut 157 is located in the peripheral hole 153 and is screwed to the bolt as the engaging piece 155 on the upper side. The nut 157 may be made of a metal material and integrally formed with the body 151 by injection molding at the time of injection into the body 151. The bolt may be inserted into the coupling hole 136 of the nozzle 130 as well as the peripheral hole 153 and the coupling piece 155. The nozzle 130 and the body 151 can be coupled to the plate 110 at one time by the coupling piece 155. [

According to this configuration, the body 151 is engaged with the nozzle 130 by the engagement of the engagement groove 133 and the engagement protrusion 154. In addition, the body 151 is coupled to the plate 110 by a coupling piece 155.

The nozzle 130 is enclosed by the body 151 and the connection hole 132 of the nozzle 130 is exposed to the outside by the center hole 152 of the body 151. The nozzle 130 can be fastened together with the body 151 to the plate 110 by the engagement piece 155.

The cap assembly 150 described above will be further discussed with reference to FIG.

4 is a perspective view of the bottom of the cap assembly 150 of FIG.

Referring to this figure, the cap assembly 150 may further include a reinforcing rib 161. The reinforcing rib 161 protrudes from the body 151 to enhance the supporting force of the body 151. [ The reinforcing ribs 161 may be formed on the bottom surface of the body 151, that is, on the surface facing the plate 110.

The reinforcing rib 161 may include a central circular rib 162, a radiating rib 163, a peripheral circular rib 165, and an outer rib 166.

The central circular rib 162 is located corresponding to the center hole 152 and may be formed in a circular shape. The radial ribs 163 extend radially in the central circular ribs 162. The peripheral circular rib 165 is disposed to surround the peripheral hole 153 and further the nut 157, and may be formed in a circular shape. The outer ribs 166 may be formed in an elliptical shape corresponding to the contour of the body 151. The radial ribs 163 and the peripheral circular ribs 165 may be connected to the outer ribs 166.

According to this configuration, in the environment in which the body 151 is pressed by the wafer accommodating container S (Fig. 1), the body 151 can firmly support the wafer accommodating container S simultaneously with the buffering action.

The shelf for supporting the wafer accommodating container as described above and the cap assembly used therein are not limited to the configuration and operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: a shelf for supporting the wafer accommodation container
110: plate 130: nozzle
131: connection part 135:
150: cap assembly 151: body
155: engaging piece 157: nut

Claims (12)

A plate configured to mount a container for storing a wafer; A nozzle provided on the plate and having a connection portion to be connected to the container; And a cap assembly disposed on and coupled to the plate to support the container while surrounding the connection,
Wherein the plate includes: a through hole formed to penetrate the connection portion; And a coupling hole formed around the through hole,
The cap assembly includes: a body having a center hole corresponding to the connection portion and a peripheral hole corresponding to the engagement hole; And a coupling piece inserted into the peripheral hole and the coupling hole to couple the body to the plate,
The nozzle further includes a support portion connected to the connection portion while being positioned on the opposite side of the body with respect to the plate and having a fastening hole corresponding to the engagement hole,
And the coupling piece is inserted into the fastening hole.
delete The method according to claim 1,
Wherein the coupling piece includes a bolt,
Wherein the cap assembly further comprises a metal nut located in the peripheral hole and threadably engaged with the bolt.
The method of claim 3,
Wherein the body is formed by injecting the nut and the insert.
delete The method according to claim 1,
Wherein the connecting portion has an engagement groove,
Wherein the body further comprises a latching jaw formed to protrude from the inner circumferential surface of the center hole so as to be engaged with the latching groove.
The method according to claim 1,
The body is formed as an ellipse,
The peripheral holes are provided in a pair,
And the center hole and the pair of peripheral holes are disposed on the main axis line of the ellipse. The method according to claim 1,
The cap assembly includes:
Further comprising a reinforcing rib projecting from the body.
9. The method of claim 8,
The reinforcing rib
A central circular rib formed to surround the center hole; And
And a radial rib extending in the radial direction of said central hole in said central circular rib.
10. The method of claim 9,
The reinforcing rib
And a peripheral circular rib formed to surround the peripheral hole.
A body having a center hole, a peripheral hole located in the periphery of the central hole, and a protrusion protruding from an inner peripheral surface of the center hole; And
And a metal nut disposed in the peripheral hole by injection of an insert with the body.
12. The method of claim 11,
And a reinforcing rib protruding from the body to reinforce the strength of the body,
The reinforcing rib
A central circular rib formed to surround the central hole, a radial rib extending radially from the central circular rib, and a peripheral circular rib formed to surround the peripheral hole, . ≪ / RTI >
KR20130145258A 2013-11-27 2013-11-27 Shelf for supporting container receiving wafer and cap assembly used therefor KR101465644B1 (en)

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KR20130145258A KR101465644B1 (en) 2013-11-27 2013-11-27 Shelf for supporting container receiving wafer and cap assembly used therefor

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016141565A (en) * 2015-02-05 2016-08-08 村田機械株式会社 Automated warehouse fronting device and having purging function, and purging method
KR20170002536U (en) * 2017-06-21 2017-07-12 이이원 Cassette for carrying glass substrate
KR101834466B1 (en) * 2017-08-11 2018-03-05 크린팩토메이션 주식회사 Shelf for supporting wafer-receiving container and cap assembly used therefor
KR20200126644A (en) * 2019-04-30 2020-11-09 크린팩토메이션 주식회사 Shelf for supporting wafer-receiving container and cap assembly used therefor
KR20210006044A (en) * 2019-07-08 2021-01-18 세메스 주식회사 A support unit for supporting the wafer storage container

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005604A (en) * 2005-06-24 2007-01-11 Tdk Corp Purge system for product container and stage for use therein
KR20110101083A (en) * 2010-03-05 2011-09-15 신포니아 테크놀로지 가부시끼가이샤 Gas injection apparatus, gas discharge apparatus, gas injection method and gas discharge method
JP2012044033A (en) * 2010-08-20 2012-03-01 Daifuku Co Ltd Component storage facility
JP2013131712A (en) * 2011-12-22 2013-07-04 Daifuku Co Ltd Inactive gas injection apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007005604A (en) * 2005-06-24 2007-01-11 Tdk Corp Purge system for product container and stage for use therein
KR20110101083A (en) * 2010-03-05 2011-09-15 신포니아 테크놀로지 가부시끼가이샤 Gas injection apparatus, gas discharge apparatus, gas injection method and gas discharge method
JP2012044033A (en) * 2010-08-20 2012-03-01 Daifuku Co Ltd Component storage facility
JP2013131712A (en) * 2011-12-22 2013-07-04 Daifuku Co Ltd Inactive gas injection apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016141565A (en) * 2015-02-05 2016-08-08 村田機械株式会社 Automated warehouse fronting device and having purging function, and purging method
KR20170002536U (en) * 2017-06-21 2017-07-12 이이원 Cassette for carrying glass substrate
KR101834466B1 (en) * 2017-08-11 2018-03-05 크린팩토메이션 주식회사 Shelf for supporting wafer-receiving container and cap assembly used therefor
KR20200126644A (en) * 2019-04-30 2020-11-09 크린팩토메이션 주식회사 Shelf for supporting wafer-receiving container and cap assembly used therefor
KR102202915B1 (en) 2019-04-30 2021-01-14 크린팩토메이션 주식회사 Shelf for supporting wafer-receiving container and cap assembly used therefor
KR20210006044A (en) * 2019-07-08 2021-01-18 세메스 주식회사 A support unit for supporting the wafer storage container
KR102283430B1 (en) 2019-07-08 2021-07-28 세메스 주식회사 A support unit for supporting the wafer storage container

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