KR101464990B1 - 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치 - Google Patents

반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치 Download PDF

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Publication number
KR101464990B1
KR101464990B1 KR20130162898A KR20130162898A KR101464990B1 KR 101464990 B1 KR101464990 B1 KR 101464990B1 KR 20130162898 A KR20130162898 A KR 20130162898A KR 20130162898 A KR20130162898 A KR 20130162898A KR 101464990 B1 KR101464990 B1 KR 101464990B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
guide
socket unit
guide sheet
probe pin
Prior art date
Application number
KR20130162898A
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English (en)
Korean (ko)
Inventor
김기민
윤용희
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Priority to KR20130162898A priority Critical patent/KR101464990B1/ko
Application granted granted Critical
Publication of KR101464990B1 publication Critical patent/KR101464990B1/ko
Priority to PCT/KR2014/012768 priority patent/WO2015099431A1/ko
Priority to TW103145215A priority patent/TWI578001B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)
KR20130162898A 2013-12-24 2013-12-24 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치 KR101464990B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR20130162898A KR101464990B1 (ko) 2013-12-24 2013-12-24 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치
PCT/KR2014/012768 WO2015099431A1 (ko) 2013-12-24 2014-12-23 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치
TW103145215A TWI578001B (zh) 2013-12-24 2014-12-24 半導體元件對準插座單元以及含其之半導體元件測試裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130162898A KR101464990B1 (ko) 2013-12-24 2013-12-24 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치

Publications (1)

Publication Number Publication Date
KR101464990B1 true KR101464990B1 (ko) 2014-11-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR20130162898A KR101464990B1 (ko) 2013-12-24 2013-12-24 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치

Country Status (3)

Country Link
KR (1) KR101464990B1 (zh)
TW (1) TWI578001B (zh)
WO (1) WO2015099431A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101943750B1 (ko) 2017-09-14 2019-01-30 매그나칩 반도체 유한회사 플렉서블 반도체 칩 패키지의 벤딩 테스트 소켓 및 이를 이용한 벤딩 테스트 방법
KR101952722B1 (ko) * 2017-09-12 2019-02-27 리노공업주식회사 검사장치
KR20190035742A (ko) * 2016-08-09 2019-04-03 가부시키가이샤 엔프라스 전기 부품용 소켓
KR101981521B1 (ko) 2018-03-05 2019-05-23 (주)티에스이 반도체 디바이스의 테스트 소켓과 소켓 가이드의 일체화 방법 및 소켓 가이드가 일체화된 반도체 디바이스의 테스트 소켓
US11828792B2 (en) 2019-11-29 2023-11-28 Amt Co., Ltd. Test apparatus for semiconductor chips with fine-pitch bumps
US11982708B2 (en) 2020-03-12 2024-05-14 Amt Co., Ltd. Apparatus for aligning device having fine pitch, apparatus for testing device having fine pitch, and device alignment method
US12019116B2 (en) 2020-03-09 2024-06-25 Amt Co., Ltd. Apparatus for aligning device having fine pitch and method therefor

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6823534B2 (ja) * 2017-04-28 2021-02-03 株式会社アドバンテスト 電子部品試験装置用のキャリア
US10634717B2 (en) * 2017-09-29 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Testing apparatus and testing method
KR20230022567A (ko) * 2021-08-09 2023-02-16 (주)테크윙 전자부품 테스터용 소켓가이더
US11656273B1 (en) * 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002196035A (ja) 2000-12-27 2002-07-10 Hitachi Ltd 半導体装置の製造方法およびキャリア
KR20100099065A (ko) * 2009-03-02 2010-09-10 리노공업주식회사 검사용 소켓
JP2013113753A (ja) 2011-11-30 2013-06-10 Yamaichi Electronics Co Ltd 半導体素子用ソケット
KR20130111066A (ko) * 2012-03-30 2013-10-10 삼성전자주식회사 반도체 칩 패키지 테스트 소켓

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100365422C (zh) * 2002-03-06 2008-01-30 株式会社爱德万测试 ***体主体、***体和电子部件处理装置
KR102000949B1 (ko) * 2012-02-29 2019-07-17 (주)제이티 소자검사장치
KR101284212B1 (ko) * 2012-04-27 2013-07-09 주식회사 아이에스시 위치정렬이 용이한 테스트용 소켓

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002196035A (ja) 2000-12-27 2002-07-10 Hitachi Ltd 半導体装置の製造方法およびキャリア
KR20100099065A (ko) * 2009-03-02 2010-09-10 리노공업주식회사 검사용 소켓
JP2013113753A (ja) 2011-11-30 2013-06-10 Yamaichi Electronics Co Ltd 半導体素子用ソケット
KR20130111066A (ko) * 2012-03-30 2013-10-10 삼성전자주식회사 반도체 칩 패키지 테스트 소켓

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190035742A (ko) * 2016-08-09 2019-04-03 가부시키가이샤 엔프라스 전기 부품용 소켓
KR102362735B1 (ko) 2016-08-09 2022-02-11 가부시키가이샤 엔프라스 전기 부품용 소켓
KR101952722B1 (ko) * 2017-09-12 2019-02-27 리노공업주식회사 검사장치
KR101943750B1 (ko) 2017-09-14 2019-01-30 매그나칩 반도체 유한회사 플렉서블 반도체 칩 패키지의 벤딩 테스트 소켓 및 이를 이용한 벤딩 테스트 방법
KR101981521B1 (ko) 2018-03-05 2019-05-23 (주)티에스이 반도체 디바이스의 테스트 소켓과 소켓 가이드의 일체화 방법 및 소켓 가이드가 일체화된 반도체 디바이스의 테스트 소켓
US11828792B2 (en) 2019-11-29 2023-11-28 Amt Co., Ltd. Test apparatus for semiconductor chips with fine-pitch bumps
US12019116B2 (en) 2020-03-09 2024-06-25 Amt Co., Ltd. Apparatus for aligning device having fine pitch and method therefor
US11982708B2 (en) 2020-03-12 2024-05-14 Amt Co., Ltd. Apparatus for aligning device having fine pitch, apparatus for testing device having fine pitch, and device alignment method

Also Published As

Publication number Publication date
TWI578001B (zh) 2017-04-11
WO2015099431A1 (ko) 2015-07-02
TW201530166A (zh) 2015-08-01

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