KR101381123B1 - Method of cutting substrate - Google Patents

Method of cutting substrate Download PDF

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Publication number
KR101381123B1
KR101381123B1 KR1020120134572A KR20120134572A KR101381123B1 KR 101381123 B1 KR101381123 B1 KR 101381123B1 KR 1020120134572 A KR1020120134572 A KR 1020120134572A KR 20120134572 A KR20120134572 A KR 20120134572A KR 101381123 B1 KR101381123 B1 KR 101381123B1
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KR
South Korea
Prior art keywords
thin glass
cutting
substrate
glass
protective film
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KR1020120134572A
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Korean (ko)
Inventor
임진성
양기모
신동근
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삼성코닝정밀소재 주식회사
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Priority to KR1020120134572A priority Critical patent/KR101381123B1/en
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Publication of KR101381123B1 publication Critical patent/KR101381123B1/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention relates to a substrate cutting method, more specifically, to a substrate cutting method capable of easily processing a touch panel substrate made of laminated materials with different characteristics into the cell shape. In doing so, the substrate cutting method according to the present invention in which a touch panel substrate with a thin plate of glass, a coating layer formed on one side of the thin glass plate, and a protection film attached to the other side of the thin glass plate is cut into cells includes a cutting step in which the thin glass plate is partially cut inwards from the coating layer side according to the thickness of the thin glass plate; an etching step in which the cut portion of the thin glass plate is etched to expose the protection film; and a punching step in which the thin glass plate is cut into cells by punching the protection film through holes created throughout the cutting step and the etching step.

Description

Substrate Cutting Method {METHOD OF CUTTING SUBSTRATE}

The present invention relates to a substrate cutting method, and more particularly, to a substrate cutting method capable of easily processing a substrate for a touch panel made of a stack of materials having different properties into a cell form.

In recent years, with the advent of smart phones, the use of touch panels is expanding rapidly, especially in mobile displays. The touch panel requires high mechanical durability because it satisfies the high light transmittance in terms of function and withstands millions of contacts. To this end, the touch panel adopts tempered glass as cover glass (C / G) and sensor glass.

As the tempered glass for mobile display, chemical tempered glass of 1.0 mm or less is mainly used, and the surface stress is about 700 MPa or more.

Conventional tempered glass is made in a cell based process. Due to the absence of processing technology, tempered glass cannot be mechanically cut and externally processed after the ion reinforcement process. Therefore, the tempered glass is subjected to the ion reinforcement process after cutting the original size to the product size. At this time, in the cell-based process, there are many manual processes for handling individual cells, which leads to a high probability of defective products and a high labor cost ratio. In particular, as the size of a mobile display increases, the unit cost of a cell increases, and a low yield of a glass manufacturing process for a cell-based touch panel is a serious problem.

In order to solve this problem, a glass manufacturing process technology for a large full sheet based touch panel has been proposed. The glass manufacturing process for large thin glass-based touch panel is a method of producing a cell by performing a touch panel process in a large thin glass state after the strengthening process, and finally cutting and external processing.

Here, in the case of the sensor glass for the touch panel, a carrier film is attached to prevent cracking and secondary contamination thereof. However, as described above, the sensor glass made of a stack of materials having different properties from each other has a problem that cannot be cut by the conventional cutting method. That is, since surface stress of 600 ~ 700 MPa or more is formed on the surface of chemical tempered glass, the median crack is not formed uniformly by wheel scribing. Chipping of the chip is generated. In addition, the technology of cutting the surface of the tempered glass by using a CO 2 laser to apply thermal shock to the surface of the tempered glass is very demanding and the CO 2 laser equipment is very expensive, so it is suitable for a touch panel manufacturing process requiring low cost and high yield. I can't. In the case of the chemical cutting method, it is necessary to select an etching solution for each material, and it takes a long time, and the sandblaster has a problem in that a cell may be damaged by an arc and is expensive. There is a limit to cutting chemically strengthened sensor glass that is made of a stack of materials with different properties by the cutting method.

Republic of Korea Patent Publication No. 10-2011-0005346 (2011.01.18.)

The present invention has been made to solve the problems of the prior art as described above, an object of the present invention is to provide a substrate cutting method that can easily process a substrate for a touch panel made of a stack of materials having different properties in a cell form To provide.

To this end, the present invention is a method for cutting a substrate for a touch panel comprising a thin glass, a coating layer formed on one surface of the thin glass and a protective film attached to the other surface of the thin glass, the coating layer Cutting in the inward direction of the thin glass from the cutting step of cutting the part of the thin glass on the basis of the thickness of the thin glass; An etching step of etching the cut portion of the thin glass to expose the protective film; And a punching step of punching the protective film through the holes formed through the cutting step and the etching step to cut the cell into a form of a cell.

Here, in the cutting step, the thin glass can be cut to less than 1/2 of the thickness of the thin glass.

At this time, in the cutting step, the thin glass can be cut by 18 to 38% of the thickness of the thin glass.

In the cutting step, the thin glass may be wheel-cut.

On the other hand, the present invention is a method for cutting a substrate for a touch panel comprising a thin glass, a coating layer formed on one surface of the thin glass and a protective film attached to the other surface of the thin glass, the coating layer Etching from the inner side of the thin glass from the etching step of etching the thin glass based on the thickness of the thin glass; Cutting in the direction of the protective film from the etched portion of the thin glass to expose the protective film; And a punching step of punching the protective film through the holes formed through the etching step and the cutting step to cut the cell into a form of a cell.

According to the present invention, a part of the coating layer and the thin glass is cut through a wheel cutting or etching process, and then the protective film attached to the thin glass is finally cut through a punching process, that is, the properties of the material forming the layer for each layer. By using a suitable processing method, a substrate for a touch panel formed by lamination of a coating layer, thin glass, and a protective film made of materials having different properties can be easily processed into a cell form.

Further, according to the present invention, the thin glass itself can also be easily processed.

In addition, according to the present invention, the substrate can be cut by an in-line process through a conveyor.

1 is a cross-sectional view showing a substrate for a touch panel according to an embodiment of the present invention.
2 to 5 is a process schematic diagram showing a substrate cutting method according to an embodiment of the present invention in the order of process.

Hereinafter, with reference to the accompanying drawings will be described in detail a substrate cutting method according to an embodiment of the present invention.

In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

As shown in FIG. 1, a substrate cutting method according to an embodiment of the present invention is a method of cutting a substrate that has undergone a glass manufacturing process for a touch panel based on a large sheet glass. Here, the thin glass 110 is a glass used as the sensor glass of the touch panel. In this case, as shown, the coating layer 120 may be formed on the upper surface of the thin glass 110.

In this case, the coating layer 120 may be formed of an IML layer (index matching layer) for preventing a phenomenon that the transparent conductive layer serving as a touch sensor and the patterned transparent conductive layer is visually recognized from the outside. In addition, the coating layer 120 may include a bezel part that partitions an effective screen area of the touch panel.

In addition, a protective film 130 is essentially attached to the bottom surface of the thin glass 110 to prevent cracking or secondary contamination during the process movement of the thin glass 110.

That is, in the substrate cutting method according to an embodiment of the present invention, the substrate is a substrate for a touch panel, a method for cutting a substrate for a touch panel consisting of a thin glass 110, a coating layer 120 and a protective film 130.

In addition, the thin glass 110 may be soda lime silicate glass or aluminosilicate glass. In addition, the thin glass 110 may be tempered glass chemically strengthened the original glass.

As shown in Figures 2 to 5, the substrate cutting method according to an embodiment of the present invention is a method for cutting a substrate for a touch panel made of a laminate of materials having different properties as described above, cutting step, etching step and Punching step.

First, as shown in FIG. 2, the cutting step is a step of partially cutting the thin glass 110 based on the thickness of the thin glass 110.

In the cutting step, the cutting groove 111 is formed on the upper surface (based on the drawing) of the edge of the thin glass 110 by cutting in the inward direction of the thin glass 110 from the coating layer 120. In this case, the cutting groove 111 partitions the region of the cell (110a of FIG. 5) to be finally formed based on the plane of the thin glass 110. That is, the shape of the cell 110a of FIG. 5 is made by the cutting groove 111.

On the other hand, in the cutting step according to an embodiment of the present invention, while the edge of the coating layer 120 is completely cut, the edge of the laminated glass 110 is partially cut.

In this case, in the cutting step, the thin glass 110 may be cut to less than 1/2 of the thickness of the thin glass 110 by a wheel cutting method. For example, in the cutting step, the thin glass 110 is cut to form a cutting groove 111 having a depth d 1 of 18 to 38% of the thickness d 1 + d 2 of the thin glass 110. It is preferable.

Next, as shown in FIG. 3, the etching step is a step of etching the cut portion of the thin glass 110. That is, in the etching step, the protective film 130 formed on the bottom surface of the thin glass 110 is etched to be exposed upward.

As such, based on the thickness of the thin glass 110, when the portion left uncut in the cutting step is removed through etching, the edge of the thin glass 110 is formed along the shape of the cell (110a in FIG. 5) to be finally formed. The hole 140 is formed.

Finally, as shown in Figure 4, the punching step is a step of punching the protective film 130 through the hole 140 formed through the cutting step and the etching step. That is, in the punching step, a hole is formed in the protective film 130 in parallel with the hole 140 by using a punching machine.

As such, when the protective film 130 is punched through a punching machine, as shown in FIG. 5, the substrate for the touch panel formed of the laminated glass 110, the coating layer 120, and the protective film 130 is a cell ( 110a).

As described above, in one embodiment of the present invention for the touch panel substrate consisting of a laminated glass 110, the coating layer 120 and the protective film 130, the properties of the material forming the layer for each layer Processing method, that is, the cutting method for the thin glass 110 and the coating layer 120 using a wheel cutting method and an etching method, the punching method for the protective film 130, by stacking materials of different properties The present invention provides an optimal cutting method for processing a touch panel substrate in the form of a cell 110a having a size applied to a mobile device. Through this, the touch panel substrate can be easily processed into a cell 110a. Can be.

In addition, when the touch panel substrate is a cover glass rather than a sensor glass, that is, a laminated structure of the thin glass 110 and the protective film 130 can be easily processed in the form of the cell (110a) in the same manner. Of course.

And the substrate cutting method according to an embodiment of the present invention can be applied to the in-line (in-line) method using a conveyor, has the advantage that can be applied to the mass production process.

Hereinafter, a substrate cutting method according to another embodiment of the present invention will be described.

A substrate cutting method according to another embodiment of the present invention includes an etching step, a cutting step and a punching step.

In another embodiment of the present invention, only the order of the cutting step and the etching step is changed compared to the embodiment of the present invention, and the process itself is the same.

That is, in another embodiment of the present invention, the etching step is first performed to form an etching groove at the edge of the thin glass (110 in FIG. 1), and then the wheel is cut through the etching groove to cut the hole in the thin glass (110 in FIG. 1). 3, 140).

And finally, as in the embodiment of the present invention, the cell (110a of FIG. 5) is separated from the thin glass (110 of FIG. 1) by punching the protective film (130 of FIG. 1).

As such, the substrate for a touch panel made of a stack of materials having different properties may be easily cut and processed into a cell (110a of FIG. 5) through a substrate cutting method according to another exemplary embodiment of the present disclosure.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. This is possible.

Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the scope of the appended claims as well as the appended claims.

110: thin glass 111: cutting groove
120: coating layer 130: protective film
140: hole 110a: cell

Claims (5)

In the method for cutting a substrate for a touch panel comprising a thin glass, a coating layer formed on one surface of the thin glass and a protective film attached to the other surface of the thin glass,
Cutting in the inner direction of the thin glass from the coating layer, the cutting step of partially cutting the thin glass based on the thickness of the thin glass;
An etching step of etching the cut portion of the thin glass to expose the protective film; And
A punching step of punching the protective film through the holes formed through the cutting step and the etching step to cut the cell into a shape of a cell;
Substrate cutting method comprising a.
The method of claim 1,
In the cutting step, the substrate cutting method, characterized in that for cutting the thin glass to less than 1/2 of the thickness of the thin glass.
3. The method of claim 2,
The cutting step is a substrate cutting method, characterized in that for cutting the thin glass by 18 to 38% of the thickness of the thin glass.
The method of claim 1,
The cutting step substrate cutting method, characterized in that for cutting the thin glass.
In the method for cutting a substrate for a touch panel comprising a thin glass, a coating layer formed on one surface of the thin glass and a protective film attached to the other surface of the thin glass,
An etching step of etching the thin glass from the coating layer in an inward direction of the thin glass, based on the thickness of the thin glass;
Cutting in the direction of the protective film from the etched portion of the thin glass to expose the protective film; And
A punching step of punching the protective film through the holes formed through the etching step and the cutting step to cut the cell into a form of a cell;
Substrate cutting method comprising a.
KR1020120134572A 2012-11-26 2012-11-26 Method of cutting substrate KR101381123B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105446531A (en) * 2015-11-19 2016-03-30 业成光电（深圳）有限公司 Touch panel and manufacture method thereof
KR20180099366A (en) 2017-02-28 2018-09-05 동우 화인켐 주식회사 Touch Sensor and Cutting Method of the Same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02132844A (en) * 1988-07-19 1990-05-22 Matsushita Electric Ind Co Ltd Division of compound semiconductor wafer
JP2005219960A (en) * 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk Cutting and separation method of glass, glass substrate for flat panel display, and flat panel display
KR20080028766A (en) * 2006-09-27 2008-04-01 니시야마 스테인레스 케미컬 가부시키가이샤 Laminated glass sheet cutting method
US20090283127A1 (en) * 2005-08-01 2009-11-19 Hiroyuki Juso Method of Manufacturing Photoelectric Conversion Element and the Photoeletric Conversion Element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02132844A (en) * 1988-07-19 1990-05-22 Matsushita Electric Ind Co Ltd Division of compound semiconductor wafer
JP2005219960A (en) * 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk Cutting and separation method of glass, glass substrate for flat panel display, and flat panel display
US20090283127A1 (en) * 2005-08-01 2009-11-19 Hiroyuki Juso Method of Manufacturing Photoelectric Conversion Element and the Photoeletric Conversion Element
KR20080028766A (en) * 2006-09-27 2008-04-01 니시야마 스테인레스 케미컬 가부시키가이샤 Laminated glass sheet cutting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105446531A (en) * 2015-11-19 2016-03-30 业成光电（深圳）有限公司 Touch panel and manufacture method thereof
KR20180099366A (en) 2017-02-28 2018-09-05 동우 화인켐 주식회사 Touch Sensor and Cutting Method of the Same

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