KR101321884B1 - Thermal conductive epoxy molding compound and manufacturing method of heatsink using the same - Google Patents
Thermal conductive epoxy molding compound and manufacturing method of heatsink using the same Download PDFInfo
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- KR101321884B1 KR101321884B1 KR1020120052347A KR20120052347A KR101321884B1 KR 101321884 B1 KR101321884 B1 KR 101321884B1 KR 1020120052347 A KR1020120052347 A KR 1020120052347A KR 20120052347 A KR20120052347 A KR 20120052347A KR 101321884 B1 KR101321884 B1 KR 101321884B1
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- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 229920006336 epoxy molding compound Polymers 0.000 title 1
- 239000000203 mixture Substances 0.000 claims abstract description 40
- 239000006260 foam Substances 0.000 claims abstract description 27
- 239000000945 filler Substances 0.000 claims abstract description 24
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims abstract description 14
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 11
- 229920003986 novolac Polymers 0.000 claims abstract description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 9
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 7
- 239000004088 foaming agent Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 239000012745 toughening agent Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 239000000463 material Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000007602 hot air drying Methods 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Abstract
본 발명은 방열 발포형 충진제 조성물, 이를 포함하는 방열판 및 이의 제조방법에 관한 것으로, 보다 구체적으로 Al2O3; 노볼락수지와 에피클로로히드린과의 반응생성물; 페놀계 경화제; 프로필렌 글리콜 모노에틸에테르; 첨가제; 및 유기 용매를 포함하여 우수한 방열효과를 가질 수 있고, 접착력이 우수하여 액주입 및 고형화를 통하여 모든 조립을 완료할 수 있는 방열 발포형 충진제 조성물 및 이를 이용한 방열판의 제조방법에 관한 것이다.The present invention relates to a heat dissipating foam filler composition, a heat sink including the same, and a method for manufacturing the same, more specifically Al 2 O 3 ; Reaction product of novolak resin with epichlorohydrin; Phenolic curing agents; Propylene glycol monoethyl ether; additive; And it may have an excellent heat dissipation effect, including an organic solvent, and excellent adhesive force to the heat dissipation foam type filler composition that can complete all the assembly through the liquid injection and solidification and a method for producing a heat sink using the same.
Description
본 발명은 Al2O3; 노볼락수지와 에피클로로히드린과의 반응생성물; 페놀계 경화제; 프로필렌 글리콜 모노에틸에테르; 첨가제; 및 유기 용매를 포함하는 방열 발포형 충진제 조성물 및 이를 이용한 방열판의 제조방법에 관한 것이다.
The present invention Al 2 O 3 ; Reaction product of novolak resin with epichlorohydrin; Phenolic curing agents; Propylene glycol monoethyl ether; additive; And it relates to a heat-dissipating foam filler composition comprising an organic solvent and a method for producing a heat sink using the same.
방열판은 장치 또는 시스템의 발열부분, 예컨대 LED 조명등의 발광모듈과 같이 고열을 발생하는 곳에 면접촉 상태로 설치되어 그의 발열을 흡수하고, 공기와의 넓은 접촉면적으로 흡수된 열을 공기 중에 방열하는 용도로 사용된다. 이러한 용도로 사용되는 방열판은 열전달을 통해 열을 공기 중에 방열하는 것으로, 종래에는 금속재를 사용하였으며, 특히 알루미늄소재가 많이 사용되었다. 알루미늄은 비중이 2.7로 가볍고 또한 열전도율이 236 W/mK로 우수한 물리적 특성을 가질 뿐만 아니라 값이 싸고 구입하기 쉬워 방열판으로 가장 널리 사용되고 있다.The heat sink is installed in a surface contact state where high heat is generated, such as a heat generating part of a device or a system, for example, a light emitting module such as an LED light, to absorb heat generated therein, and to radiate heat absorbed in a wide contact area with air in the air. Used as The heat sink used for this purpose is to radiate heat into the air through heat transfer, and in the past, a metal material was used, in particular, aluminum material was used. Aluminum has a specific gravity of 2.7 and has a thermal conductivity of 236 W / mK. It has excellent physical properties, and is widely used as a heat sink because it is cheap and easy to purchase.
이러한 방열판은 사용 목적과 용도에 따라 다양한 형태로 제작되고 있는데, 공통된 특징은 몸체 일측면에 형성된 평면부분이 열을 발생시키는 발열부재와 넓은 면접촉 상태로 고정되고, 타측면에 형성된 복수 개의 방열돌기는 공기에 노출된다. 따라서, 방열판은 복수 개의 방열돌기들 사이에 형성된 틈으로 공기가 순환하므로 몸체 및 방열돌기에 흡열된 열이 상기 순환하는 공기에 노출되어 냉각되므로 공랭식으로 방열 목적을 수행하게 된다. These heat sinks are manufactured in various forms according to the purpose and purpose of use, and the common feature is that a flat portion formed on one side of the body is fixed in a wide surface contact state with a heat generating member that generates heat, and a plurality of heat dissipation protrusions formed on the other side Is exposed to air. Therefore, since the heat is circulated in the gap formed between the plurality of heat dissipating protrusions, heat absorbed by the body and the heat dissipating protrusion is exposed to the circulating air and cooled, thereby performing the heat dissipation purpose in an air-cooled manner.
그러나, 이러한 종래의 방열판은 비록 비중이 작고 열전도율이 비교적 우수한 알루미늄 소재를 사용하고 있으나, 대형 조명등을 방열시키기 위해서는 알루미늄 방열판도 대형을 사용해야 하므로, 부피가 크고 중량이 무거워 설치가 곤란할 뿐만 아니라 고장시 무거운 중량 때문에 방열판 교체작업에 많은 번거로움이 있는 단점이 있었다.
However, although the conventional heat sink is made of aluminum material having a small specific gravity and a relatively excellent thermal conductivity, the aluminum heat sink must also be large in order to radiate a large lamp, which is difficult to install due to its bulky and heavy weight. Due to the weight, there was a disadvantage in that the heat sink was replaced with a lot of trouble.
본 발명의 일 구현예는 적은 양으로도 우수한 방열효과를 가질 수 있는 방열 발포형 충진제 조성물을 제공하는 것이다.One embodiment of the present invention is to provide a heat-dissipating foam filler composition that can have a good heat dissipation effect even in a small amount.
또한, 본 발명의 또 다른 일 구현예는 상기 방열 발포형 충진제 조성물을 이용한 방열판의 제조방법을 제공하는 것이다.
In addition, another embodiment of the present invention is to provide a method for manufacturing a heat sink using the heat dissipating foam filler composition.
본 발명의 일 구현예는 Al2O3 70 내지 90 중량%; 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물 2 내지 10 중량%; 페놀계 경화제 1 내지 10 중량%; 프로필렌 글리콜 모노에틸에테르(Propylene glycol monoethylether) 1 내지 5 중량%; 첨가제 1 내지 5 중량%; 및 유기 용매 1 내지 5 중량%를 포함하는 방열 발포형 충진제 조성물을 제공한다.One embodiment of the present invention is Al 2 O 3 70 to 90% by weight; 2 to 10% by weight of a reaction product of novolac resin and epichlorohydrin; 1 to 10 wt% phenolic curing agent; 1 to 5% by weight of propylene glycol monoethylether; Additives 1 to 5 weight percent; And 1 to 5% by weight of an organic solvent.
상기 Al2O3는 평균 입경이 각각 45μm, 10μm, 5μm인 Al2O3 분말의 혼합물인 것을 사용할 수 있고, 상기 Al2O3는 평균 입경이 각각 45μm, 10μm, 5μm인 Al2O3 분말이 50: 30: 20의 중량비로 혼합된 것을 사용할 수 있다. 또한, 상기 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물; 및 페놀계 경화제는 1: 1의 중량비로 혼합되는 것을 사용할 수 있다. 또한, 상기 첨가제는 촉매, 발포제(foaming agent), 강화제(toughener) 및 이들의 혼합물로 이루어진 군에서 선택되는 1종 이상인 것을 사용할 수 있다.The Al 2 O 3 may be used having an average particle diameter of the Al in the mixture of the 2 O 3 powder, respectively 45μm, 10μm, 5μm, the Al 2 O 3 has an average particle diameter of respectively 45μm, 10μm, 5μm Al 2 O 3 powder A mixture of these 50: 30: 20 weight ratios can be used. In addition, the reaction product of the novolac resin and epichlorohydrin (epichlorohydrin); And phenolic curing agent may be used that is mixed in a weight ratio of 1: 1. In addition, the additive may be one or more selected from the group consisting of catalysts, foaming agents, tougheners, and mixtures thereof.
본 발명의 또 다른 일 구현예는 상기 본 발명의 일 구현예에 따른 방열 발포형 충진제 조성물을 혼합하는 단계; 기판에 상기 혼합물을 도포하는 단계; 및 상기 혼합물이 도포된 기판을 170 내지 180 ℃의 온도에서 열풍 건조시키는 단계를 포함하는 방열판의 제조방법을 제공한다.
Another embodiment of the present invention comprises the steps of mixing the heat-resistant foam filler composition according to an embodiment of the present invention; Applying the mixture to a substrate; And it provides a method for producing a heat sink comprising the step of drying the hot air drying the substrate coated with the mixture at a temperature of 170 to 180 ℃.
본 발명의 일 구현예에 따른 방열 발포형 충진제 조성물은 발포 방열면적을 극대화하여, 적은 양으로도 우수한 방열효과를 가질 수 있고, 접착력이 우수하여 기존 전자회로 부품의 조립방식인 나사조임이나 납땜방식을 전혀 사용하지 않고, 단순히 액주입 및 고형화를 통하여 모든 조립을 완료할 수 있다.The heat dissipating foam filler composition according to the embodiment of the present invention maximizes the heat dissipation area of the foam, and may have excellent heat dissipation effect even with a small amount, and has excellent adhesive strength, such as screwing or soldering, which is an assembly method of an existing electronic circuit component. All assembly can be completed simply by liquid injection and solidification, without using any.
또한, 본 발명의 다른 일 구현예는 상기 본 발명의 일 구현예에 따른 방열 발포형 충진제 조성물을 사용하여 종래의 방열방식인 알루미늄판의 가공(FIN형상가공)과 부착방식을 없애 매우 간편하게 방열판을 조립할 수 있어, 제조공정의 간단화와, 재료비 절감, 및 이러한 방열판이 부착된 제품의 품질을 향상시킬 수 있는 효과가 있다.In addition, another embodiment of the present invention using the heat-dissipating foam filler composition according to the embodiment of the present invention to remove the heat dissipation method (FIN shape processing) and the attachment method of the conventional heat dissipation aluminum plate very easily heat sink Since it can be assembled, there is an effect of simplifying the manufacturing process, reducing material costs, and improving the quality of the product to which the heat sink is attached.
도 1은 본 발명의 일 구현예에 따라 제조된 LED용 램프의 모식도를 나타낸 것이다.
도 2는 본 발명의 일 구현예에 따라 제조될 수 있는 크로스컷(CROSSCUT) 방식의 방열판의 모식도를 나타낸 것이다.
도 3은 본 발명의 실시예 1에서 제조된 LED용 램프의 발광 모습을 나타낸 것이다.Figure 1 shows a schematic diagram of the LED lamp manufactured according to an embodiment of the present invention.
Figure 2 shows a schematic diagram of the heat sink of the cross cut (CROSSCUT) method that can be prepared according to an embodiment of the present invention.
Figure 3 shows the light emission state of the LED lamp manufactured in Example 1 of the present invention.
이하, 본 발명의 구현예를 상세히 설명하기로 한다. 다만, 이는 예시로서 제시되는 것으로, 이에 의해 본 발명이 제한되지는 않으며 본 발명은 후술할 청구범위의 범주에 의해 정의될 뿐이다. Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.
본 발명의 일 구현예는 Al2O3 70 내지 90 중량%; 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물 2 내지 10 중량%; 페놀계 경화제 1 내지 10 중량%; 프로필렌 글리콜 모노에틸에테르(Propylene glycol monoethylether) 1 내지 5 중량%; 첨가제 1 내지 5 중량%; 및 유기 용매 1 내지 5 중량%를 포함하는 방열 발포형 충진제 조성물을 제공한다.One embodiment of the present invention is Al 2 O 3 70 to 90% by weight; 2 to 10% by weight of a reaction product of novolac resin and epichlorohydrin; 1 to 10 wt% phenolic curing agent; 1 to 5% by weight of propylene glycol monoethylether; Additives 1 to 5 weight percent; And 1 to 5% by weight of an organic solvent.
상기 방열 발포형 충진제 조성물은 보다 바람직하게 Al2O3 80 내지 90 중량%; 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물 2 내지 7 중량%; 페놀계 경화제 1 내지 5 중량%; 프로필렌 글리콜 모노에틸에테르(Propylene glycol monoethylether) 1 내지 3 중량%; 첨가제 1 내지 3 중량%; 및 유기 용매 1 내지 3 중량%를 포함하여 방열 특성을 탁월하게 개선할 수 있다.The heat-dissipating foam filler composition is more preferably Al 2 O 3 80 to 90% by weight; 2 to 7 wt% of a reaction product of a novolac resin and epichlorohydrin; 1 to 5 wt% phenolic curing agent; 1-3 wt% of propylene glycol monoethylether; Additives 1-3 wt%; And 1 to 3% by weight of the organic solvent can be excellently improved heat dissipation characteristics.
상기 Al2O3는 효과적인 방열효과를 고려하여, 평균 입경이 각각 45μm, 10μm, 5μm인 Al2O3 분말의 혼합물인 것을 사용할 수 있고, 보다 구체적으로 평균 입경이 각각 45μm, 10μm, 5μm인 Al2O3 분말이 50: 30: 20의 중량비로 혼합된 것을 사용할 수 있다. The Al 2 O 3 may be a mixture of Al 2 O 3 powder having an average particle diameter of 45 μm, 10 μm and 5 μm, respectively, in consideration of an effective heat dissipation effect, and more specifically Al having an average particle diameter of 45 μm, 10 μm or 5 μm, respectively. It is possible to use a mixture of 2 O 3 powders in a weight ratio of 50: 30: 20.
또한, 상기 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물; 및 페놀계 경화제는 1: 1의 중량비로 혼합되는 것을 사용하여, 방열 효과뿐만 아니라, 기판에의 접착 성능을 개선할 수 있다. 이 때, 상기 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물; 및 페놀계 경화제에 촉매를 1: 1: 0.004의 중량비로 첨가하면 반응 속도를 매우 개선할 수 있는 효과가 있다.In addition, the reaction product of the novolac resin and epichlorohydrin (epichlorohydrin); And phenolic curing agents can be mixed in a weight ratio of 1: 1 to improve not only the heat dissipation effect but also the adhesion performance to the substrate. At this time, the reaction product of the novolac resin and epichlorohydrin (epichlorohydrin); And when the catalyst is added to the phenolic curing agent in a weight ratio of 1: 1: 0.004, there is an effect that can greatly improve the reaction rate.
또한, 상기 첨가제는 당분야에서 일반적으로 사용되는 것으로 그 종류를 특별히 한정하지 않으나, 촉매, 발포제(foaming agent), 강화제(toughener) 및 이들의 혼합물로 이루어진 군에서 선택되는 1종 이상인 것을 사용할 수 있다.In addition, the additive is generally used in the art, but the type thereof is not particularly limited, but may be one or more selected from the group consisting of a catalyst, a foaming agent, a toughener, and a mixture thereof. .
상기 촉매, 발포제(foaming agent), 강화제(toughener)는 당분야에서 일반적으로 사용되는 것으로 그 종류를 특별히 한정하지 않으나, 보다 구체적으로 NaOH, 아민류, 이미다졸류, 산무수물, 디시안디아마이드(DICYANDIAMIDE) 등의 촉매를 바람직하게 사용할 수 있고, 유기화학 발포제를 바람직하게 사용할 수 있으며, 열경화성 플라스틱 성분을 포함한 에폭시 수지 등의 강화제를 바람직하게 사용할 수 있다. The catalyst, foaming agent (toughing agent), toughener (toughener) is generally used in the art, but the type is not particularly limited, but more specifically NaOH, amines, imidazoles, acid anhydride, dicyandiamide (DICYANDIAMIDE) Catalysts, such as these, can be used preferably, Organic chemical foaming agent can be used preferably, Reinforcing agents, such as an epoxy resin containing a thermosetting plastic component, can be used preferably.
또한, 상기 유기용제는 당분야에서 일반적으로 사용되는 것으로 그 종류를 특별히 한정하지 않으나, 알코올류, 케톤류 등을 보다 바람직하게 사용할 수 있다. 특히, 부탄올, 메틸에틸케톤(Methyl Ethyl Ketone, MEK) 등을 사용할 수 있다.In addition, the organic solvent is generally used in the art, and the type thereof is not particularly limited, but alcohols, ketones, and the like may be more preferably used. In particular, butanol and methyl ethyl ketone (MEK) may be used.
이러한 본 발명의 일 구현예에 따른 방열 발포형 충진제 조성물은 발포 방열면적을 극대화하여, 적은 양으로도 우수한 방열효과를 가질 수 있고, 접착력이 우수하여 기존 전자회로 부품의 조립방식인 나사조임이나 납땜방식을 전혀 사용하지 않고, 단순히 액주입 및 고형화를 통하여 모든 조립을 완료할 수 있다.The heat dissipating foam filler composition according to one embodiment of the present invention maximizes the heat dissipation area of the foam, and can have excellent heat dissipation effect even with a small amount, and has excellent adhesive force, so that screw fastening or soldering is an assembly method of an existing electronic circuit component. All assembly can be completed simply by liquid injection and solidification without using any method.
본 발명의 또 다른 일 구현예는 상기 본 발명의 일 구현예에 따른 방열 발포형 충진제 조성물을 혼합하는 단계; 기판에 상기 혼합물을 도포하는 단계; 및 상기 혼합물이 도포된 기판을 170 내지 180 ℃의 온도에서 열풍 건조시키는 단계를 포함하는 방열판의 제조방법을 제공한다.Another embodiment of the present invention comprises the steps of mixing the heat-resistant foam filler composition according to an embodiment of the present invention; Applying the mixture to a substrate; And it provides a method for producing a heat sink comprising the step of drying the hot air drying the substrate coated with the mixture at a temperature of 170 to 180 ℃.
상기 혼합물을 도포하는 단계에서 도포는 도 1에 나타낸 바와 같이, 일정한 두께를 갖도록 도포할 수 있다. 또한, 도포시에 다양한 지그(jig) 또는 성형틀을 이용하여 다양한 형태의 방열판(HEATSINK)을 제조할 수 있다. 특히, 본 발명의 방열 발포형 충진제 조성물은 접착력이 매우 우수한 바, 상기 기판에 상기 혼합물을 도포한 후, 알루미늄 막대 등의 방열재료를 일정한 간격으로 부착 및 고정시키는 단계를 추가로 진행하여, 도 2에 나타낸 바와 같은 크로스컷(CROSSCUT) 방식의 방열판을 제조할 수 있다.In the step of applying the mixture, the coating may be applied to have a constant thickness, as shown in FIG. In addition, various types of heat sinks (HEATSINK) may be manufactured by using various jigs or molds during application. In particular, the heat-dissipating foam filler composition of the present invention is very excellent in adhesion, after applying the mixture to the substrate, and further proceeds to attach and fix the heat-dissipating material, such as aluminum bars at regular intervals, Figure 2 The heat sink of the crosscut type | system | group as shown to can be manufactured.
상기 열풍 건조는 30 분 내지 2 시간 동안 진행될 수 있고, 보다 바람직하기로는 약 1 시간 동안 진행되는 것이 좋다.The hot air drying may be performed for 30 minutes to 2 hours, more preferably about 1 hour.
이러한 본 발명의 일 구현예에 따른 방열판의 제조방법은 상기 본 발명의 일 구현예에 따른 방열 발포형 충진제 조성물을 사용하여 종래의 방열방식인 알루미늄판의 가공(FIN형상가공)과 부착방식을 없애 매우 간편하게 방열판을 조립할 수 있어, 제조공정의 간단화와, 재료비 절감, 및 이러한 방열판이 부착된 제품의 품질을 향상시킬 수 있는 효과가 있다.The method of manufacturing a heat sink according to an embodiment of the present invention eliminates the conventional heat dissipation method (FIN shape processing) and the attachment method using a heat dissipation foam filler composition according to an embodiment of the present invention. Since the heat sink can be assembled very easily, there is an effect of simplifying the manufacturing process, reducing material costs, and improving the quality of the product to which the heat sink is attached.
이하 본 발명의 바람직한 실시예 및 비교예를 기재한다. 그러나 하기한 실시예는 본 발명의 바람직한 일 실시예일 뿐 본 발명이 하기한 실시예에 의해 한정되는 것은 아니다.
Hereinafter, preferred embodiments and comparative examples of the present invention will be described. However, the following examples are only preferred embodiments of the present invention and the present invention is not limited by the following examples.
실시예Example 1One
Al2O3 87 중량%; 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물 5 중량%; 페놀계 경화제 4 중량%; 프로필렌 글리콜 모노에틸에테르(Propylene glycol monoethylether) 2 중량%; NaOH 촉매 1 중량%; 및 유기 용매 1 중량%를 혼합하여, 방열 발포형 충진제 조성물을 준비하였다.87% Al 2 O 3 ; 5% by weight of reaction product of novolac resin and epichlorohydrin; 4% by weight of phenolic curing agent; 2% by weight of propylene glycol monoethylether; 1 wt.% NaOH catalyst; And 1% by weight of an organic solvent were prepared to prepare a heat dissipating foam filler composition.
LED PCB(2) 기판을 정렬시켜 놓은 알루미늄 틀(1)에 상기 방열 발포형 충진제 조성물(5)을 도포하였다. 상기 방열 발포형 충진제 조성물(5)을 도포한 알루미늄 틀(1)을 약 175 ℃의 온도에서 1시간 동안 열풍 건조시켜 LED PCB(2) 기판에 방열판을 부착시켰다. 상기 방열판이 부착된 LED PCB(2) 기판을 홀(hole)가공한 후, 투명렌즈(3) 및 전선(4)을 도 1에 나타낸 바와 같이 삽입하고, LED 봉지제(6)를 주입하여 약 50 ℃의 온도에서 1 시간 동안 경화시켰다. 이 후, 상기 알루미늄 틀(1)을 제거하여, 10W, 3V의 LED용 램프를 제조하였다. 상기 제조된 LED용 램프의 발광모습은 도 3에 나타내었다.
The heat dissipating foam filler composition 5 was applied to an aluminum mold 1 on which an LED PCB 2 substrate was aligned. The aluminum mold (1) to which the heat dissipating foam filler composition (5) was applied was hot-air dried at a temperature of about 175 ° C. for 1 hour to attach a heat sink to the LED PCB (2) substrate. After hole-processing the LED PCB (2) substrate with the heat sink, the
시험예Test Example
종래의 방열 물질들과 본 발명의 방열판의 방열효과를 비교 시험하기 위하여, 먼저, 알루미늄 핀(fin) 방열판 위에 합성방열 패드, 알루미늄판, 상기 실시예 1에서 준비된 방열 발포형 충진제 조성물, 및 방열접착제를 부착시켰다. 상기 시험 물질들이 부착된 알루미늄 핀(fin) 방열판을 열원(heat source) 위에 올려 5분 후의 온도를 체크하였다. 이 후, 열원을 제거하고, 3분 후의 온도를 체크하였다. In order to test the heat dissipation effect of the conventional heat dissipating materials and the heat dissipation plate of the present invention, first, a synthetic heat dissipation pad, an aluminum plate, a heat dissipating foam filler composition prepared in Example 1, and a heat dissipating adhesive on an aluminum fin heat dissipation plate Was attached. The aluminum fin heat sink to which the test materials were attached was placed on a heat source to check the temperature after 5 minutes. After that, the heat source was removed and the temperature after 3 minutes was checked.
충진제 조성물Heat Resistant Foam
Filler Composition
표 1에 나타난 결과와 같이, 상기 실시예 1에서 준비된 방열 발포형 충진제 조성물은 열원으로부터 열을 흡수한 후, 방열 전의 잠열을 더 흡수(온도상승)하는 현상을 보이는 것을 확인할 수 있었다.As shown in Table 1, after the heat-absorbing foam type filler composition prepared in Example 1 absorbed heat from the heat source, it was confirmed that the phenomenon of further absorbing the latent heat before heat radiation (temperature rise).
이로써, 본 발명의 방열 발포형 충진제 조성물은 발포 방열면적을 극대화하여, 우수한 방열효과를 가지는 것을 확인할 수 있었다.
As a result, it was confirmed that the heat dissipating foam filler composition of the present invention maximizes the heat dissipation area of the foam, and has an excellent heat dissipation effect.
1: 알루미늄 틀 2: LED PCB
3: 투명렌즈 4: 전선
5: 방열 발포형 충진제 조성물 6: LED 봉지제1: aluminum frame 2: LED PCB
3: transparent lens 4: electric wire
5: heat-resistant foam filler composition 6: LED encapsulant
Claims (3)
노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물 2 내지 10 중량%;
페놀계 경화제 1 내지 10 중량%;
프로필렌 글리콜 모노에틸에테르(Propylene glycol monoethylether) 1 내지 5 중량%;
첨가제 1 내지 5 중량%; 및
유기 용매 1 내지 5 중량%를 포함하는 것을 특징으로 하는 방열 발포형 충진제 조성물.
70 to 90 weight percent of Al 2 O 3 ;
2 to 10% by weight of a reaction product of novolac resin and epichlorohydrin;
1 to 10 wt% phenolic curing agent;
1 to 5% by weight of propylene glycol monoethylether;
Additives 1 to 5 weight percent; And
A heat-dissipating foam filler composition comprising 1 to 5% by weight of an organic solvent.
상기 Al2O3는 평균 입경이 각각 45μm, 10μm, 5μm인 Al2O3 분말이 50: 30: 20의 중량비로 혼합된 것이고,
상기 노볼락수지와 에피클로로히드린(epichlorohydrin)과의 반응생성물; 및 페놀계 경화제는 1: 1의 중량비로 혼합되는 것이고,
상기 첨가제는 촉매, 발포제(foaming agent), 강화제(toughener) 및 이들의 혼합물로 이루어진 군에서 선택되는 1종 이상인 것을 특징으로 하는 방열 발포형 충진제 조성물.
The method of claim 1,
The Al 2 O 3 is a mixture of Al 2 O 3 powder having an average particle diameter of 45μm, 10μm, 5μm respectively in a weight ratio of 50: 30: 20,
A reaction product of the novolac resin and epichlorohydrin; And phenolic curing agents are mixed in a weight ratio of 1: 1,
The additive is a heat-dissipating foam filler composition, characterized in that at least one selected from the group consisting of a catalyst, a foaming agent (foaming agent), a toughener and mixtures thereof.
기판에 상기 혼합물을 도포하는 단계; 및
상기 혼합물이 도포된 기판을 170 내지 180 ℃의 온도에서 열풍 건조시키는 단계를 포함하는 것을 특징으로 하는 방열판의 제조방법.
Mixing the heat dissipating foam filler composition according to any one of claims 1 and 2;
Applying the mixture to a substrate; And
And heat-drying the substrate to which the mixture is applied at a temperature of 170 to 180 ° C.
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2012
- 2012-01-18 KR KR1020120005523A patent/KR20120011896A/en active Search and Examination
- 2012-05-17 KR KR1020120052347A patent/KR101321884B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990021571A (en) * | 1997-08-30 | 1999-03-25 | 성재갑 | Process for producing epoxy resin for semiconductor encapsulation with reduced hydrolyzable chlorine |
| KR20090104808A (en) * | 2007-01-30 | 2009-10-06 | 덴끼 가가꾸 고교 가부시키가이샤 | Led light source unit |
| KR20100117777A (en) * | 2009-04-27 | 2010-11-04 | 주식회사 하렉스 | Method for preparing heat radiating body having imprpved heat radiating property |
| KR20110106610A (en) * | 2010-03-23 | 2011-09-29 | 주식회사 케이엠더블유 | Printed circuit board for high efficiency radiant heat and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| KR20120011896A (en) | 2012-02-08 |
| KR20130084954A (en) | 2013-07-26 |
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