KR101226747B1 - One united type semiconductor processing device - Google Patents

One united type semiconductor processing device Download PDF

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Publication number
KR101226747B1
KR101226747B1 KR1020120019297A KR20120019297A KR101226747B1 KR 101226747 B1 KR101226747 B1 KR 101226747B1 KR 1020120019297 A KR1020120019297 A KR 1020120019297A KR 20120019297 A KR20120019297 A KR 20120019297A KR 101226747 B1 KR101226747 B1 KR 101226747B1
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South Korea
Prior art keywords
space
wafer
processing apparatus
moving
pull
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KR1020120019297A
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Korean (ko)
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유정호
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유정호
나노세미콘(주)
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Priority to KR1020120019297A priority Critical patent/KR101226747B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated semiconductor processing apparatus, comprising a process processing apparatus for storing a plurality of pools inside a unitary semiconductor processing main body and processing a wafer stored in the pool, and before and after some of the plurality of pools. Selectively secure a space to move the pool to the load port module to increase the maximum number of pools that can be stored inside the integrated semiconductor processing body to improve the productivity of the wafer, the space occupied by the semiconductor processing device in the factory Minimize.

Description

Integrated semiconductor processing device {ONE UNITED TYPE SEMICONDUCTOR PROCESSING DEVICE}

The present invention relates to an integrated semiconductor processing apparatus, and more particularly, to an integrated semiconductor processing apparatus for supplying a wafer to a processing apparatus of a wafer at a shortest distance, preventing external exposure of the wafer, and storing the unwind as much as possible. .

As the development of semiconductor technology is accelerated, researches on the technology for processing wafers required for semiconductor production are progressing. Wafers are materials used in semiconductor manufacturing, and silicon wafers are supplied to materials that can be used in semiconductor manufacturing through various processing processes.

A silicon wafer is a circular plate in which a thin ingot in which a kind crystal of a material of a silicon semiconductor is grown on a circumference is thinly cut. In the process of growing a silicon wafer as a crystal, oxygen may combine to cause a phenomenon in which a resistance value controlled through impurities on the silicon wafer is shifted from a desired resistance value.

Therefore, a heat treatment process is required to separate oxygen from the wafer and produce a high quality wafer. In addition, the heat treatment process may be necessary to alleviate wafer processing stress and to reduce defects in the wafer crystals.

Important issues in the wafer heat treatment process are productivity and yield. It would be natural to produce wafers of high yield, i.e., high quality in the heat treatment of the wafer, and in addition, it should be possible to rapidly process the wafer to produce a large amount of heat treated wafers.

Related prior arts include Korean Patent Publication No. 10-2010-0024220 (2010.03.05, substrate processing apparatus and substrate transfer method thereof).

SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated semiconductor processing apparatus for supplying a wafer to a processing apparatus of a wafer at the shortest distance and preventing the external exposure of the wafer to improve the production speed of the wafer.

SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated semiconductor processing apparatus which secures the storage space of a pool to the maximum, minimizes the space occupied by the semiconductor processing apparatus in a factory, and improves the yield of the wafer.

This object of the present invention is an integrated semiconductor processing body having a first space for storing a plurality of pools storing a plurality of wafers, and a second space in which a process processing apparatus for processing the wafers stored in the first space is provided. Wow;

A load port module installed in a first space of the integrated semiconductor processing main body, the load port module opening the pull to allow the wafer inside the pull to be withdrawn;

A pull transfer device mounted in the first space to transfer the pull to the load port module;

A pull moving device for moving a part of the plurality of pools stored in the first space before and after; And

It is solved by providing an integrated semiconductor processing apparatus including a wafer transfer device which takes out the wafer inside the pool and transports it to the process processing apparatus of the second space.

The pull transfer device is an integrated semiconductor processing apparatus, comprising a pull holding member disposed on the front side of the pull in the first space and moved up, down, left, and left.

The fulcrum moving device according to the present invention includes a movable wall part which is arranged to be movable forward and backward in the first space and is equipped with a fulcrum, and a wall moving part which moves the movable wall part before and after.

The pull moving device according to the present invention further includes a wall moving guide rail disposed at the bottom of the first space to guide the movement of the moving wall part before and after.

An integrated semiconductor processing apparatus according to the present invention includes a fixed wall portion in which a pull is mounted in the first space, and the movable wall portion and the fixed wall portion are disposed to cross the width direction of the first space to loosen the first space. The storage wall is divided into a space in which the wafer transfer device is disposed, and the movable wall portion is disposed between the fixed wall portion, and the load port module is provided on the front side of the fixed wall portion, and the rear surface of the fixed wall portion is provided. On the side, a wafer transfer device is arranged.

The integrated semiconductor processing apparatus according to the present invention further includes a robot moving device for moving the wafer transfer device, wherein the robot moving device moves the wafer transfer device to the front side of the process processing device disposed in the second space. The wafer is then fed into each processing apparatus.

The load port module according to the present invention is provided in plural in the first space, at least one of which supplies an unprocessed wafer stored in the pool to the process processing apparatus, and the rest processes the wafer processed in the process processing apparatus. Allow storage from the process unit back into the pool.

The processing apparatus according to the present invention is any one of a heat treatment apparatus for heat treating a wafer, and an apparatus for etching and depositing the wafer.

In the integrated semiconductor processing body according to the present invention, the first space and the second space are distinguished, and the first space and the second space communicate with each other and the wafer stored in the pool is stored in the first space in the second space. There is provided a space partition wall portion in which a connection passage hole is formed for supplying into the process processing apparatus therein.

The integrated semiconductor processing body according to the present invention is provided with a space opening / closing door capable of opening and closing the connection passage hole.

In the integrated semiconductor processing apparatus according to the present invention, the components necessary for processing a wafer may be integrated into one device, thereby minimizing the copper wire of the wafer, thereby improving the processing speed.

The integrated semiconductor processing apparatus according to the present invention can minimize the exposure of the wafer to the outside in space and time, thereby increasing the yield in the process processing.

The integrated semiconductor processing apparatus according to the present invention has the effect of minimizing the space occupied by the semiconductor processing apparatus in the factory by improving the productivity of the wafer by storing the maximally.

1 is a perspective view showing an integrated semiconductor processing apparatus according to the present invention.
2 is a longitudinal sectional view showing an integrated semiconductor processing apparatus according to the present invention.
3 is a perspective view of a load port module according to an embodiment of the present invention;
4 is a cross-sectional view illustrating a structure of a load port module according to an exemplary embodiment of the present invention.
5 to 6 are plan views showing the integrated semiconductor processing apparatus according to the present invention.
7 is a schematic diagram illustrating an internal structure of an integrated semiconductor processing apparatus according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the integrated semiconductor processing apparatus of the present invention includes a first semiconductor 11 and an integrated semiconductor processing body 10 in which a second space 12 is formed.

The first space 11 is a space in which the pool 1 is stored, and the second space 12 is a space in which a process processing apparatus 40 for processing a wafer stored in the first space 11 is installed. to be.

In the first space 11 and the inside of the pool 1, an oxygen-free environment may be established to prevent loss of the wafer. For example, nitrogen may be filled in the first space 11 and the pool 1 to prevent the wafer from bonding with oxygen.

The fulcrum 1 has a case shape, the door 1a is opened and closed on one surface thereof, and stores the wafer therein. The pool 1 stores a wafer before processing or a processed wafer. The wafer processed through the process apparatus 40 may also be stored in the first space 11.

The process processing apparatus 40 is a device for processing a wafer, may be a heat treatment apparatus for heat treating the wafer, a deposition apparatus such as an image vapor deposition (CVD), or may be an etcher.

Therefore, the plurality of pools 1 for storing the unprocessed wafer and the processed wafer may be simultaneously stored in the first space 11. Accordingly, the first space 11 in which the pool 1 is stored is divided into a first zone and a second zone, and the first zone includes a plurality of pools 1 for storing unprocessed wafers. A plurality of pulls 1 for storing the processed wafers can be stored. The first space 11 stores 1 to 40 pools 1.

The first space 11 may take the structure of a cuboid in an embodiment of the present invention. The plurality of pulls 1 may be arranged in a plurality of rows stacked by a predetermined number inside the first space 11. For example, load port modules 20 may be installed at both lower sides of the first space 11, and unwinding 1 may be stacked on top of the load port module 20, respectively, and the load port modules 20 may be stacked. The pool 11 may be arranged in a plurality of rows between the columns.

The load port module 20 is installed in the first space 11 to open the pull 1 so as to withdraw the wafer inside the pull 1. In addition, the first space 11 is provided with a pull transfer device 50 for transferring the pull 1 to the load port module 20.

The fulcrum transfer device 50 is connected to the vertical movement guide rail member 51 and the vertical movement guide rail member 51 disposed in the longitudinal direction in the first space 11 so as to be movable up and down separately. It is moved up and down by a driving device of the horizontal movement guide rail member 52 and horizontally disposed in the first space 11 and the horizontal movement guide rail member 52 is connected to the left and right so as to be movable It moves left and right by a separate drive device and includes a pull holding member 53 for separating the pull (1) from the stored position to move to the load port module 20.

The pull holding member 53 has a plurality of transfer arm portions 53a protruding toward the pool 1 so that the transfer arm portion 53a supports the lower portion of the pool 1 to lift the pool 1. As an example, the lifting port 1 is moved to the load port module 20. Although not illustrated, the pull 1 may be held by the transfer arm 53a, including an arm operating part for adjusting a distance between the transfer arm 53a. It can also be lifted and transported.

The loose holding member 53 moves left and right along the horizontal moving guide rail member 52, and the horizontal moving guide rail member 52 moves up and down along the vertical moving guide rail member 51. By doing so, it moves left, right, up and down. Therefore, the plurality of pulls 1 stored in the first space 11 can be freely transferred to the load port module 20.

In the integrated semiconductor processing body 10, a wafer transfer device 30 is installed to take out a wafer inside the pool 1 and transport it to the process processing apparatus of the second space 12.

The wafer transfer device 30 is installed at the rear side of the load port module 20 in the first space 11 or the second space 12 and opened by the operation of the load port module 20. The wafer is directly taken out from inside 1) and supplied into the process processing apparatus 40 of the second space 12.

The wafer transfer device 30 performs a function of supplying the wafer taken out from the load port module 20 to the process processing apparatus 40.

The wafer transfer device 30 is to fix the wafer from the load port module 20 and to carry it out, and to accurately transfer the wafer to the process processor 40. In addition, the processed wafer must also be taken out of the process processing apparatus 40, and the wafer must be accurately loaded into the pool 1 in the load port module 20.

For example, the wafer transfer device 30 is a wafer transfer robot. In order to perform the above functions, the wafer transfer robot includes a holding device for holding the wafer, a transfer means for transferring the wafer, and a wafer unwind (1) for transferring the wafer from or to the open pool (1). Alternatively, an aligner may be included to adjust the position of the wafer so as to accurately enter the processing apparatus 40.

As the transfer means of the wafer transfer robot, a plurality of arms rotatably hinged, an arm operating unit for rotatably operating the plurality of arms at each hinge connection unit, and an arm up and down moving the plurality of arms up and down A robot arm structure including a steel part and a rotating part for rotating the arm is taken as an example.

In addition to the above examples, the wafer transfer device 30 may be any configuration that performs a function of transferring a wafer from the load port module 20 to the processing apparatus 40. For example, the wafer transfer device 30 may be rotated so that the holding device for fixing the wafer from the load port module 20 to the process processing device 40 may be rotated and transferred. Alternatively, the wafer transfer device 30 may be a rail moving means, and the wafer may be supplied to the process processor 40 by rail moving the holding device.

In addition, the holding device may have a configuration to prevent the loss of the wafer by minimizing the contact surface with the wafer. For example, it may be configured to support the wafer from below through a predetermined number of contacts at the bottom of the wafer.

On the other hand, the load port module 20 is an example that is installed in the lower portion of the first space (11). The load port module 20 may have a space for supporting the pull 1 so that the pull 1 may be positioned on the load port module 20, and the opening 1 may be opened and closed. . When the pool 1 is opened by the load port module 20, the unprocessed wafer is taken out and supplied to the process processor 40, or the processed wafer is loaded into the pool 1 from the process processor 40. .

The load port module 20 opens the pool 1 transferred by the pool transfer robot 50 and performs a function of directly carrying out the wafer inside the pool 1 to store the wafer stored in the pool 1. May be supplied to the process treatment apparatus 40. Alternatively, the wafer transfer robot included in the wafer transfer device 30 may directly enter the load port module 20 to carry out the wafer.

In the embodiment of the present invention, a plurality of load port modules 20 may be present at one side of the lower portion of the first space 11. One side of the lower portion of the first space 11 may be the same side as an inner wall side of the first space 11 in which the pools 1 are stacked. However, in addition to this, the load port module 20 may be installed at any position as long as it can transfer the wafer through a series of wafer movement paths connecting the wafer transfer device 30 and the process processor 40. will be.

The load port module 20 may be provided in plural, at least one of which supplies an unprocessed wafer stored in the pool 1 to a process processing apparatus, and the remaining wafers processed by the process processing apparatus 40. May be stored in the pool again from the process processing device 40.

3 and 4, the load port module 20 includes a moving panel member 21 having a door opening and closing means for opening and closing the transfer passage hole and opening and closing the pull 1, and the movement. It is disposed on the lower side of the panel member 21 and includes a fulcrum support member 22 on which the fulcrum 1 is placed.

The door opening / closing means protrudes on the front surface of the movable panel member 21 facing the spool 1 and is inserted into a locking groove 1b formed in the spool 1a of the spool 1 to open the door of the spool 1. Lock ring 24a is formed at one end to open and close (1a), and is connected to the rotating shaft 24 rotated by a separate driving means and the moving panel member 21 and the moving panel member 21. It includes a panel lifting device 25 for moving the up and down).

The panel elevating device 25 is connected to the moving panel member 21 and connected to the panel moving unit 25a for moving the moving panel member 21 forward and backward and the panel moving unit 25a. And a panel elevating portion 25b for moving the movable panel member 21 up and down.

The load port module 20 opens the door 1a of the release 1 in the following operation.

On the upper surface of the loose support member 22, the loose 1 is seated such that the door 1a of the loose 1 is in close contact with the movable panel member 21. Then, the locking ring 24a formed at the end of the rotation shaft 24 of the door opening and closing means is inserted into the locking groove 1b formed in the door 1a of the release 1, and the locking groove 1b is inserted into the locking groove 1b. As the rotating shaft 24 is rotated, the door 1a of the pull 1 is unlocked.

The panel elevating device 25 retreats to the panel moving part 25a so as not to be caught when the door 1a of the loose 1 in close contact with the moving panel member 21 and the moving panel member 21 is lowered. After moving, the panel is lowered to the elevating portion 25b.

The pull 1 is opened while the movable panel member 21 and the door 1a of the pull 1 are lowered by the panel lifting device 25 together.

The load port module 20 is not limited to the above example, and it can be understood that various modifications can be made to various structures capable of opening and closing the door 1a of the pull 1.

Meanwhile, referring to FIG. 5, a pull moving device 60 for moving some of the plurality of pulls 1 stored in the first space 11 according to the present invention before and after is included.

The pull moving device 60 may move a part of the plurality of pools 1 stored in the first space 11 before and after to secure a moving space of the pool transfer device 50.

The front of the fulcrum 1 stored in the first space 11 in a fixed state and the fulcrum 1 moved by the fulcrum moving device 60 is arranged to match, and the fulcrum transport device 50 is It is disposed on the front side of the pool (1) and transfers all the pool (1) stored in the first space (11) in the up, down, left, right movement to the load port module 20.

The pull moving device 60 moves backward some of the plurality of pools 1 so as to transfer the space required for the movement of the pool transfer device 50 and the pool 1 to the load port module 20. Secure the necessary space.

In addition, the pull moving device 60 reverses a part of the pool 1 stored in the first space 11 only when a space for transferring the pool 1 is needed, and transfers the pool 1. In order to transfer the fulcrum (1) to the load port module (20), which is not necessary or moveable to the fulcrum transfer device (60), the fulcrum transfer device (50) can lift and carry the fulc (1). It is moved to the default position.

The basic position of the pull 1 moved by the pull moving device 60 is a state in which the front face is disposed to coincide with the front face of the pull 1 stored in the first space 11. For example, it is a position that can be caught or gripped by the pull transfer device 50 moving up, down, left and right.

That is, in the first space 11, the pool 1 is arranged in a plurality of rows without empty space on the front surface between the pool transfer device 50 and the wafer transfer device 30, and among the plurality of rows. One row or two rows are moved backward by the pull moving device 60 to secure the moving space of the pool transferring device 50.

Therefore, the pool 1 can be stored as much as possible in the first space 11.

On the other hand, the pull moving device 60 is a movable wall portion 61 which is arranged to be movable before and after in the first space (11) and the pull (1) is mounted;

And a wall moving part 62 for moving the moving wall part 61 before and after.

In addition, it is preferable that the pull moving device 60 further includes a wall moving guide rail 63 disposed at the bottom of the first space 11 to guide the movement of the moving wall 61 before and after. . In the first space 11 is provided a fixed wall portion 1a on which the loose 1 is mounted. Although not shown, the wall moving part 62 may include a wheel movably coupled to the wall moving guide rail 63 and a motor for rotating the wheel, and screwed to the moving wall part 61. It may be configured to include a screw for coupling and a motor for rotating the screw.

Although not shown, the wall moving part 62 may be modified by various examples to enable linear movement with a rack and pinion gear, a motor for rotating the pinion gear, a hydraulic cylinder connected to the moving wall 61, and the like. .

The movable wall portion 61 and the fixed wall portion 1a are disposed to cross the width direction of the first space 11 to be spaced apart from the front portion of the integrated semiconductor processing body 10 in the first space 11. Thus, the first space 11 is divided into a space in which the pool 1 is stored and a space in which the wafer transfer device 30 is disposed.

The movable wall portion 61 is disposed between the fixed wall portion 1a, and a rear side first space 11 of the movable wall portion 61 is provided with a movable space in which the movable wall portion 61 is moved. The wall portion 61 can be moved into the moving space.

In addition, the load port module 20 is provided on the front side of the fixed wall 1a, and the wafer transfer device 30 is disposed on the rear side of the fixed wall 1a.

For example, in the first space 11, the fixed wall portions 1a are fixed to inner side surfaces of the side portions, and the movable wall portions 61 are disposed between the fixed wall portions 1a.

On the front of the fixed wall portion 1a and the movable wall portion 61, the pools 1 are arranged in one or more rows. The wafer transfer device 30 is disposed on the rear surface of the fixed wall portion 1a, and the rear surface of the movable wall portion 61 becomes an empty space in which the movable wall portion 61 can be moved backward.

Therefore, in the integrated semiconductor processing apparatus according to the present invention, the pool 1 can be disposed and stored without any empty space in front of the fixed wall 1a and the movable wall 61, and the front surface of the pool 1 is arranged. By disposing the pool transfer device 50 for transferring the pool (1) to be able to utilize the first space 11 as efficiently as possible, it is possible to compactly design the size of the integrated semiconductor processing body (10).

On the other hand, the integrated semiconductor processing apparatus according to the present invention includes a robot moving device 70 for moving the wafer transfer device 30.

The robot moving device 70 moves the wafer transfer device 30 to the moving wall portion 61, that is, the process processing device 40 disposed in the space where the pull 1 moves backward. Make it available.

That is, the robot moving device 70 moves the wafer transfer device 30 to the front side of the process processing device 40, which is disposed in the second space 12, to move the wafer to each process processing device 40. ) Can be supplied.

Therefore, in the integrated semiconductor processing apparatus according to the present invention, a plurality of process processing apparatuses 40 are disposed in the second space 12 to improve the processing speed of the wafer and the productivity of the wafer.

On the other hand, the process processing device 40 is an example in which a plurality of disposed in the width direction in the first space 11 as an example, the robot moving device 70 is the wafer transfer device 30 to the first space ( 11) is moved to the front side of each process processing apparatus 40 by moving in the width direction as an example.

The robot moving device 70 includes a driving unit 71 for moving the wafer transfer device 30. The driving unit 71 may include a wheel and a motor for rotating the wheel, although not shown. It may be configured to include a screw screwed to the wafer transfer device 30 and a motor for rotating the screw. In addition, although not shown, the driving unit 71 may be modified in various examples to enable linear movement to a rack and pinion gear, a motor for rotating the pinion gear, a hydraulic cylinder connected to the wafer transfer device 30, and the like. Do.

In addition, the robot moving device 70 further includes a robot guide rail 72 for guiding movement to smoothly move and to allow a preset accurate position control.

In the integrated semiconductor processing apparatus according to the present invention, the process processing apparatus 40 may be disposed in a moving space in which the pull 1 is moved, and the wafer transfer apparatus 30 is moved to the robot moving apparatus 70. It is possible to transfer a wafer to the process processing apparatus 40 in the moving space.

The first space 11 and the second space 12 may be formed as one space communicated with the integrated semiconductor processing body 10. In the integrated semiconductor processing body 10, as illustrated in FIG. 9, a space partition wall part 13 may be provided to separate the first space 11 and the second space 12. The first space 11 and the second space 12 communicate with each other in the space partition wall part 13 to store a wafer stored in the pool 1 in the first space 11 in the second space 12. A connecting passage 13a is formed to allow supply into the process processing apparatus 40 therein, and a passage opening / closing door 14 capable of opening and closing the connecting passage 13a is provided.

In the integrated semiconductor processing apparatus according to the present invention, the components necessary for processing a wafer can be integrated into one device, thereby minimizing the copper wire of the wafer to improve the processing speed.

The integrated semiconductor processing apparatus according to the present invention can minimize the exposure of the wafer to the outside in space and time, thereby increasing the yield in the process processing.

The integrated semiconductor processing apparatus according to the present invention can improve the productivity of the wafer by storing the pool 1 as much as possible, and can compactly design the semiconductor processing apparatus in a factory, thereby minimizing the space occupied by the semiconductor processing apparatus.

The present invention is not limited to the above-described embodiments, and various changes can be made without departing from the gist of the present invention, which is understood to be included in the configuration of the present invention.

10: integrated semiconductor processing body 11: first space
12: second space 20: load port module
30: transfer device 40: process processing device
50: loosen transfer robot 60: loosen moving device
70: robot moving device

Claims (10)

An integrated semiconductor processing body having a first space for storing a plurality of pools storing a plurality of wafers and a second space for installing a process processing apparatus for processing the wafers stored in the first space;
A load port module installed in a first space of the integrated semiconductor processing main body, the load port module opening the pull to allow the wafer inside the pull to be withdrawn;
A pull transfer device mounted in the first space to transfer the pull to the load port module;
A pull moving device for moving a part of the plurality of pools stored in the first space before and after; And
And a wafer transfer device for extracting the wafer inside the fulcrum and transporting the wafer to the process processing apparatus of the second space.
The loosen moving device,
A moving wall part arranged to be movable forward and backward in the first space and mounted with a pull;
And a wall moving part for moving the moving wall part before and after. The method according to claim 1,
The pull transfer device is an integrated semiconductor processing apparatus, comprising a pull holding member disposed on the front side of the pull in the first space and moved up, down, left, and left. delete The method according to claim 1,
The loosening movement device further comprises a wall movement guide rail disposed at the bottom of the first space to guide the movement of the moving wall part before and after. The method according to claim 1,
The first space is provided with a fixed wall to which the loose is mounted,
The movable wall portion and the fixed wall portion are arranged to cross the width direction of the first space, and divides the first space into a space in which the first space is stored, and a space in which the wafer transfer device is disposed,
The movable wall portion is disposed between the fixed wall portions,
The load port module is provided on the front side of the fixed wall portion, and a wafer transfer device is disposed on the rear side of the fixed wall portion. The method according to claim 1,
Further comprising a robot moving device for moving the wafer transfer device,
And said robot moving device moves said wafer transfer device to the front side of said process processing apparatus disposed in said second space and supplies wafers into each process processing apparatus. The method according to claim 1,
A plurality of load port modules are installed in the first space, at least one of which supplies unprocessed wafers stored in the pool to the process processing apparatus, and the rest process wafers processed by the process processing apparatus from the process processing apparatus. An integrated semiconductor processing apparatus, characterized by being able to be stored in the pool again. The method according to claim 1,
The process apparatus may be any one of a heat treatment apparatus for heat treating a wafer, and an apparatus for etching and depositing the integrated semiconductor processing apparatus. The method according to claim 1,
In the integrated semiconductor processing body, the first space and the second space are distinguished, and the first and second spaces communicate with each other to process the wafer stored in the pool within the first space in the second space. An integrated semiconductor processing apparatus, comprising: a space partition wall portion having a connection passage hole for supplying into the device. The method according to claim 9,
And a space opening / closing door configured to open and close the connection passage hole in the integrated semiconductor processing body.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345854A (en) * 1998-06-02 1999-12-14 Dainippon Screen Mfg Co Ltd Board processor
JP2010016387A (en) * 2008-07-07 2010-01-21 Semes Co Ltd Substrate conveyance equipment and method for conveying substrate
KR20110123695A (en) * 2010-05-07 2011-11-15 나노세미콘(주) One united type semiconductor processing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345854A (en) * 1998-06-02 1999-12-14 Dainippon Screen Mfg Co Ltd Board processor
JP2010016387A (en) * 2008-07-07 2010-01-21 Semes Co Ltd Substrate conveyance equipment and method for conveying substrate
KR20110123695A (en) * 2010-05-07 2011-11-15 나노세미콘(주) One united type semiconductor processing device

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