KR101115288B9 - 몰디드 리드리스 패키지 및 이를 이용한 led 패키지 - Google Patents
몰디드 리드리스 패키지 및 이를 이용한 led 패키지Info
- Publication number
- KR101115288B9 KR101115288B9 KR1020100020030A KR20100020030A KR101115288B9 KR 101115288 B9 KR101115288 B9 KR 101115288B9 KR 1020100020030 A KR1020100020030 A KR 1020100020030A KR 20100020030 A KR20100020030 A KR 20100020030A KR 101115288 B9 KR101115288 B9 KR 101115288B9
- Authority
- KR
- South Korea
- Prior art keywords
- package
- same
- fabricated
- molded leadless
- led
- Prior art date
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020100020030A KR101115288B1 (ko) | 2010-03-05 | 2010-03-05 | 몰디드 리드리스 패키지 및 이를 이용한 led 패키지 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020100020030A KR101115288B1 (ko) | 2010-03-05 | 2010-03-05 | 몰디드 리드리스 패키지 및 이를 이용한 led 패키지 |
Publications (3)
Publication Number | Publication Date |
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KR20110100933A KR20110100933A (ko) | 2011-09-15 |
KR101115288B1 KR101115288B1 (ko) | 2012-03-05 |
KR101115288B9 true KR101115288B9 (ko) | 2023-07-20 |
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KR1020100020030A KR101115288B1 (ko) | 2010-03-05 | 2010-03-05 | 몰디드 리드리스 패키지 및 이를 이용한 led 패키지 |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR101343050B1 (ko) * | 2012-03-07 | 2013-12-18 | 에스티에스반도체통신 주식회사 | 반도체 패키지 |
KR101443870B1 (ko) * | 2014-03-05 | 2014-09-23 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
KR20160033870A (ko) | 2014-09-18 | 2016-03-29 | 제엠제코(주) | 클립 구조체를 이용한 반도체 패키지 |
US9917039B2 (en) * | 2016-04-20 | 2018-03-13 | Amkor Technology, Inc. | Method of forming a semiconductor package with conductive interconnect frame and structure |
KR102557466B1 (ko) * | 2018-02-23 | 2023-07-20 | 해성디에스 주식회사 | 리드 프레임 및 리드 프레임의 제조방법 |
KR102172689B1 (ko) | 2020-02-07 | 2020-11-02 | 제엠제코(주) | 반도체 패키지 및 그 제조방법 |
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JP2006049694A (ja) | 2004-08-06 | 2006-02-16 | Freescale Semiconductor Inc | 二重ゲージ・リードフレーム |
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KR101115288B1 (ko) | 2012-03-05 |
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