KR101104536B1 - 플라즈마 처리 장치 - Google Patents
플라즈마 처리 장치 Download PDFInfo
- Publication number
- KR101104536B1 KR101104536B1 KR1020090059296A KR20090059296A KR101104536B1 KR 101104536 B1 KR101104536 B1 KR 101104536B1 KR 1020090059296 A KR1020090059296 A KR 1020090059296A KR 20090059296 A KR20090059296 A KR 20090059296A KR 101104536 B1 KR101104536 B1 KR 101104536B1
- Authority
- KR
- South Korea
- Prior art keywords
- baffle plate
- exhaust
- downstream
- openings
- processing apparatus
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32834—Exhausting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2008-171948 | 2008-07-01 | ||
JP2008171948A JP5086192B2 (ja) | 2008-07-01 | 2008-07-01 | プラズマ処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100003708A KR20100003708A (ko) | 2010-01-11 |
KR101104536B1 true KR101104536B1 (ko) | 2012-01-11 |
Family
ID=41514141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090059296A KR101104536B1 (ko) | 2008-07-01 | 2009-06-30 | 플라즈마 처리 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5086192B2 (ja) |
KR (1) | KR101104536B1 (ja) |
CN (1) | CN101620972B (ja) |
TW (1) | TW201015636A (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010272551A (ja) * | 2009-05-19 | 2010-12-02 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
JP5567392B2 (ja) * | 2010-05-25 | 2014-08-06 | 東京エレクトロン株式会社 | プラズマ処理装置 |
CN102732860B (zh) * | 2011-04-14 | 2015-01-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔及具有其的化学气相沉积设备 |
KR101814013B1 (ko) * | 2011-05-09 | 2018-01-03 | 삼성디스플레이 주식회사 | 플라스마 장치 |
KR101963862B1 (ko) * | 2011-05-31 | 2019-03-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 에지, 측면 및 후면 보호를 갖는 건식 식각을 위한 장치 및 방법들 |
CN102828167B (zh) * | 2011-06-13 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种排气方法、装置及基片处理设备 |
KR101356664B1 (ko) * | 2012-02-03 | 2014-02-05 | 주식회사 유진테크 | 측방배기 방식 기판처리장치 |
TWI449080B (zh) * | 2012-07-25 | 2014-08-11 | Au Optronics Corp | 電漿反應機台 |
WO2014062323A1 (en) * | 2012-10-18 | 2014-04-24 | Applied Materials, Inc. | Shadow frame support |
CN103794460B (zh) * | 2012-10-29 | 2016-12-21 | 中微半导体设备(上海)有限公司 | 用于半导体装置性能改善的涂层 |
JP5798143B2 (ja) * | 2013-03-12 | 2015-10-21 | 株式会社東芝 | 平行平板型ドライエッチング装置及びこれを用いた半導体装置の製造方法 |
KR101451244B1 (ko) * | 2013-03-22 | 2014-10-15 | 참엔지니어링(주) | 라이너 어셈블리 및 이를 구비하는 기판 처리 장치 |
KR102171514B1 (ko) * | 2013-08-29 | 2020-10-29 | 세메스 주식회사 | 기판처리장치 |
KR101535155B1 (ko) * | 2014-01-09 | 2015-07-09 | 주식회사 유진테크 | 기판 처리장치 |
KR101629213B1 (ko) * | 2015-02-02 | 2016-06-10 | (주) 일하하이텍 | 기판 처리 장치 및 방법 |
US9963782B2 (en) * | 2015-02-12 | 2018-05-08 | Asm Ip Holding B.V. | Semiconductor manufacturing apparatus |
JP6548484B2 (ja) * | 2015-07-01 | 2019-07-24 | 東京エレクトロン株式会社 | プラズマ処理装置およびそれに用いる排気構造 |
CN105280469A (zh) * | 2015-09-17 | 2016-01-27 | 武汉华星光电技术有限公司 | 用以降低排气口等离子体损害的蚀刻反应*** |
CN107170660A (zh) * | 2017-05-02 | 2017-09-15 | 惠科股份有限公司 | 干蚀刻设备及干蚀刻设备的电极 |
JP6967954B2 (ja) * | 2017-12-05 | 2021-11-17 | 東京エレクトロン株式会社 | 排気装置、処理装置及び排気方法 |
CN108321101B (zh) * | 2018-02-24 | 2020-09-11 | 惠科股份有限公司 | 一种电极组件和蚀刻设备 |
JP7166147B2 (ja) * | 2018-11-14 | 2022-11-07 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP7232705B2 (ja) * | 2019-05-16 | 2023-03-03 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP7308711B2 (ja) * | 2019-09-26 | 2023-07-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP7418285B2 (ja) | 2020-05-27 | 2024-01-19 | 東京エレクトロン株式会社 | 基板処理装置とその製造方法、及び排気構造 |
JP7519973B2 (ja) | 2020-10-20 | 2024-07-22 | 東京エレクトロン株式会社 | 基板処理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022263A (ja) | 1996-06-28 | 1998-01-23 | Sony Corp | プラズマエッチング装置 |
JPH1140398A (ja) | 1997-07-23 | 1999-02-12 | Kokusai Electric Co Ltd | プラズマ生成装置 |
KR100880784B1 (ko) * | 2006-03-24 | 2009-02-02 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6298727A (ja) * | 1985-10-25 | 1987-05-08 | Mitsubishi Electric Corp | エツチング処理装置 |
JPS634615A (ja) * | 1986-06-25 | 1988-01-09 | Hitachi Tokyo Electron Co Ltd | 半導体装置製造装置 |
JP3002448B1 (ja) * | 1998-07-31 | 2000-01-24 | 国際電気株式会社 | 基板処理装置 |
JP2000054147A (ja) * | 1998-08-07 | 2000-02-22 | Kokusai Electric Co Ltd | 基板処理装置 |
JP4330315B2 (ja) * | 2002-03-29 | 2009-09-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP4087674B2 (ja) * | 2002-09-27 | 2008-05-21 | 株式会社ユーテック | 半導体製造装置 |
JP4286576B2 (ja) * | 2003-04-25 | 2009-07-01 | 東京エレクトロン株式会社 | プラズマ処理装置 |
JP2006060073A (ja) * | 2004-08-20 | 2006-03-02 | Tokyo Electron Ltd | プラズマ処理装置 |
JP5217569B2 (ja) * | 2008-03-31 | 2013-06-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2008
- 2008-07-01 JP JP2008171948A patent/JP5086192B2/ja not_active Expired - Fee Related
-
2009
- 2009-06-30 TW TW098122071A patent/TW201015636A/zh unknown
- 2009-06-30 KR KR1020090059296A patent/KR101104536B1/ko not_active IP Right Cessation
- 2009-07-01 CN CN2009101518708A patent/CN101620972B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022263A (ja) | 1996-06-28 | 1998-01-23 | Sony Corp | プラズマエッチング装置 |
JPH1140398A (ja) | 1997-07-23 | 1999-02-12 | Kokusai Electric Co Ltd | プラズマ生成装置 |
KR100880784B1 (ko) * | 2006-03-24 | 2009-02-02 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 플라즈마 처리 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2010016021A (ja) | 2010-01-21 |
JP5086192B2 (ja) | 2012-11-28 |
CN101620972B (zh) | 2011-06-22 |
CN101620972A (zh) | 2010-01-06 |
TW201015636A (en) | 2010-04-16 |
KR20100003708A (ko) | 2010-01-11 |
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