KR101026497B1 - The vacuum chamber inside where the high precision stage is installed and cooling device - Google Patents

The vacuum chamber inside where the high precision stage is installed and cooling device Download PDF

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Publication number
KR101026497B1
KR101026497B1 KR1020100090515A KR20100090515A KR101026497B1 KR 101026497 B1 KR101026497 B1 KR 101026497B1 KR 1020100090515 A KR1020100090515 A KR 1020100090515A KR 20100090515 A KR20100090515 A KR 20100090515A KR 101026497 B1 KR101026497 B1 KR 101026497B1
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KR
South Korea
Prior art keywords
vacuum chamber
ultra
precision stage
heat
cooling
Prior art date
Application number
KR1020100090515A
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Korean (ko)
Inventor
신명동
Original Assignee
(주)뉴옵틱스
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Publication date
Application filed by (주)뉴옵틱스 filed Critical (주)뉴옵틱스
Priority to KR1020100090515A priority Critical patent/KR101026497B1/en
Application granted granted Critical
Publication of KR101026497B1 publication Critical patent/KR101026497B1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers

Abstract

The present invention removes the heat generated by the operation of the device inside the vacuum chamber in which the ultra-precision stage is installed to cool the inside of the vacuum chamber, and the ultra-precision stage is installed to enable nanometer (nm) -class processing at the same time as the efficient control of the device. The present invention relates to a cooling method and a cooling device inside a vacuum chamber, wherein an inside and an outside of a vacuum chamber in which an ultra-precision stage is installed are connected to a heat pipe filled with a refrigerant, and a heat sink or a condenser for cooling the heat pipe at the end of the heat pipe. The cooling member 120 is configured to heat the heat generated inside the vacuum chamber 20 from the inside of the vacuum chamber to the outside through the heat pipe and at the same time remove the heat generated inside the vacuum chamber, according to the heat removal It is characterized in that the inside of the chamber is cooled.

Description

The vacuum chamber inside where the high precision stage is installed and cooling device}

The present invention relates to a cooling device inside a vacuum chamber in which an ultra-precision stage is installed, and to remove the heat generated by the driving of the device in the vacuum chamber in which the ultra-precision stage is installed so that the inside of the vacuum chamber is cooled, thereby driving a stable device. The present invention relates to an internal vacuum chamber cooling apparatus in which ultra-precision stages are installed to improve nano-meter (nm) -class production and processing efficiency.

In general, the ultra-precision stage is used for scanning devices for precise inspection of semiconductor wafers and liquid crystal display panels (LCDs), various processing equipments used in semiconductor processing processes, and precision processing equipments. The exposure process which carves a circuit in a semiconductor process using the following) is mentioned.

In the exposure process, the substrate material does not need to move when forming a pattern on a small area such as a semiconductor chip, but the large-scale nanometer-class pattern required for a display, etc., must be moved while moving the exposure position of the material substrate. Therefore, the use of an ultra-precision stage is required, and such an ultra-precision stage includes a stage of air levitation type which injects air to the bottom of the stage and floats the stage, and a magnetic levitation type stage using magnets.

The ultra-precision stage in the above manner is installed in a closed vacuum chamber, and heat is generated inside the vacuum chamber by driving the device. Such heat must be cooled to facilitate nanometer (nm) level numerical control. As a result, ultra-precision workpieces can be provided.

At this time, the applied cooling method is to circulate the coolant and the fluid from the outside into the vacuum chamber to cool the heat inside the chamber to vortex due to the bending of the inner surface of the pipe when the coolant is introduced into the vacuum chamber. The phenomenon caused a fine vibration.

Of course, the fine vibration may not have a significant effect on the performance of the process, but in the nanometer (nm) pattern forming process, the fine vibration is transmitted to the stage to reduce the fine control efficiency of the device has a problem that the product defects .

In the present invention, to solve the problems described above to efficiently cool the heat generated inside the vacuum chamber, while preventing the generation of vibration during the cooling in advance to facilitate efficient fine control of the device Accordingly, an object of the present invention is to provide a cooling device inside a vacuum chamber in which ultra-precision stages are installed so that nanometer (nm) -class products can be stably provided.

In the vacuum chamber internal cooling apparatus 100 provided with the ultra-precision stage provided by the present invention,

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Connects the inside and the outside of the vacuum chamber 20 in which the ultra-precision stage 10 is installed, and the heat pipe 110 filled with any one selected from the refrigerants R-22, R-134a, and R-407C, and the heat pipe. In the vacuum chamber internal cooling apparatus 100 is installed, the ultra-precision stage consisting of a cooling member 120 is driven by an external power source to remove heat transferred to the heat pipe,
One end of the heat pipe 110 is connected and fixed to the ultra-precision stage 20.

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The vacuum chamber internal cooling apparatus provided with the ultra-precision stage provided in the present invention can easily remove the heat inside the vacuum chamber in which the ultra-precision stage is installed without generating vibration, thereby enabling fine control of the device, thereby improving production efficiency as well as It is effective to receive high quality nanometer (nm) class products.

1 is a perspective view schematically showing the inside of a vacuum chamber in which a conventional high precision stage is installed
Figure 2 is a schematic perspective view of the inside of the vacuum chamber showing a preferred embodiment of the present invention
3 is a perspective view to which the technical spirit of the present invention is applied

In order to achieve the above object, the vacuum chamber internal cooling apparatus 100 in which the ultra-precision stage provided by the present invention is provided based on the accompanying drawings will be described in detail as follows.

First of all, the term 'cooling' in the term of the present invention indicates that the inside of the vacuum chamber, which is not below zero or below 5 ° C., becomes a temperature environment close to room temperature, and the core of the present invention is the heat inside the vacuum chamber. By removing the inside to be cooled, so that there is no generation of vibration during cooling.

As shown in FIGS. 2 and 3, in order to cool the inside of the vacuum chamber by removing heat generated inside the vacuum chamber, the inside and the outside of the vacuum chamber in which the ultra-precision stage is installed are connected with a heat pipe filled with a refrigerant, and the heat At the end of the pipe, a cooling member 120 such as a heat sink or a condenser for cooling the heat pipe is configured.

The heat generated inside the vacuum chamber 20 by the configuration as described above is moved from the inside of the vacuum chamber to the outside through the heat pipe and at the same time, the heat generated inside the vacuum chamber is removed. Is cooled.

Since the cooling method as described above does not circulate fluid and cooling water into the vacuum chamber, there is no occurrence of vibration, thereby facilitating fine control of the device.

The refrigerant filled in the heat pipe 110 is any one selected from R-22, R-134a, and R-407C, and the heat transferred to the heat pipe is removed using a cooling heat sink or a condenser. do.

In addition, the thermal cooling apparatus 100 inside the vacuum chamber in which the ultra-precision stage of the present invention is installed, connects the inside and the outside of the vacuum chamber 20 in which the ultra-precision stage 10 is installed, and the refrigerants R-22, R-134a, and R. The heat pipe 110 filled with any one selected from -407C and the heat pipe connected to the heat pipe to remove heat transferred to the heat pipe, and the cooling member 120 driven by an external power source are organically connected.

In this case, the cooling member 120 may be any one selected from a cooling heat sink or a condenser. If the cooling member 120 is capable of cooling the heat pipe, the cooling member 120 is satisfied, and the heat pipe is connected and fixed to one side of the ultra-precision stage.

In addition, the ultra-precision stage 20 refers to a precision stage for semiconductor exposure equipment, a large area precision stage for display panel exposure equipment, a large area precision stage for nanometer processing machines, and a large area precision stage for semiconductor and display electron beam lighters. In either case, the cooling method and the cooling device disclosed in the present invention can be applied to any one selected device.

10: Ultra Precision Stage 20: Vacuum Chamber
100: cooling unit 110: heat pipe
120: cooling member

Claims (7)

Connects the inside and the outside of the vacuum chamber 20 in which the ultra-precision stage 10 is installed, and the heat pipe 110 filled with any one selected from the refrigerants R-22, R-134a and R-407C, and the heat pipe. In the vacuum chamber internal cooling apparatus 100 is installed, the ultra-precision stage consisting of a cooling member 120 is driven by an external power source to remove heat transferred to the heat pipe,
One end of the heat pipe 110 is connected to the ultra-precision stage 20, characterized in that the ultra-precision stage is installed inside the vacuum chamber cooling device. delete delete delete delete delete delete
KR1020100090515A 2010-09-15 2010-09-15 The vacuum chamber inside where the high precision stage is installed and cooling device KR101026497B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100090515A KR101026497B1 (en) 2010-09-15 2010-09-15 The vacuum chamber inside where the high precision stage is installed and cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100090515A KR101026497B1 (en) 2010-09-15 2010-09-15 The vacuum chamber inside where the high precision stage is installed and cooling device

Publications (1)

Publication Number Publication Date
KR101026497B1 true KR101026497B1 (en) 2011-04-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160102667A (en) * 2015-02-23 2016-08-31 국민대학교산학협력단 Contactless machining apparatus with multidrectional controlling and radiating structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000092815A (en) * 1998-09-10 2000-03-31 Canon Inc Stage device and aligner using the same
KR20030053973A (en) * 2001-12-24 2003-07-02 엘지이노텍 주식회사 Radiating structure of travelling-wave tube for travelling-wave amplifier
JP2009192569A (en) * 2008-02-12 2009-08-27 Canon Inc Exposure apparatus and method for manufacturing device
KR20090009586U (en) * 2008-03-19 2009-09-23 한국생산기술연구원 Light emitting diode package having apparatus for cooling electronic circuits with thin-plate type heat pipe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000092815A (en) * 1998-09-10 2000-03-31 Canon Inc Stage device and aligner using the same
KR20030053973A (en) * 2001-12-24 2003-07-02 엘지이노텍 주식회사 Radiating structure of travelling-wave tube for travelling-wave amplifier
JP2009192569A (en) * 2008-02-12 2009-08-27 Canon Inc Exposure apparatus and method for manufacturing device
KR20090009586U (en) * 2008-03-19 2009-09-23 한국생산기술연구원 Light emitting diode package having apparatus for cooling electronic circuits with thin-plate type heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160102667A (en) * 2015-02-23 2016-08-31 국민대학교산학협력단 Contactless machining apparatus with multidrectional controlling and radiating structure
KR101667556B1 (en) * 2015-02-23 2016-10-20 국민대학교산학협력단 Contactless machining apparatus with multidrectional controlling and radiating structure

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