KR100990240B1 - Elastic coating composition with heat conductive and spread function - Google Patents

Elastic coating composition with heat conductive and spread function Download PDF

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KR100990240B1
KR100990240B1 KR1020090089157A KR20090089157A KR100990240B1 KR 100990240 B1 KR100990240 B1 KR 100990240B1 KR 1020090089157 A KR1020090089157 A KR 1020090089157A KR 20090089157 A KR20090089157 A KR 20090089157A KR 100990240 B1 KR100990240 B1 KR 100990240B1
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weight
parts
coating composition
heat
elastic coating
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이승욱
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이승욱
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D109/00—Coating compositions based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09D109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres

Abstract

PURPOSE: An elastic coating composition is provided to easily coat the composition regardless of the shape and size of an object, and to form a conductive coating layer by the electrical property of a heat dissipation filler. CONSTITUTION: An elastic coating composition with the heat-radiant function contains the following: a liquid phase binder formed by dissolving 800 parts of styrene butadiene styrene by weight to 400 parts of cyclohexane by weight and 800 parts of toluene by weight; and a filler mixture containing 150 parts of aluminum oxide by weight, 100 parts of boron nitride by weight, and 50 parts of beryllium oxide by weight, dispersed to 600 parts of xylene by weight.

Description

방열기능을 갖는 탄성도료 조성물{Elastic coating composition with heat conductive and spread function}Elastic coating composition with heat conductive and spread function

본 발명은 방열기능을 갖는 탄성도료 조성물에 관한 것으로서, 좀더 상세히 설명하면 바인딩 수지인 열가소성 엘라스토머와, 상기 엘라스토머를 용해하여 액상 도료화 하는 탄화수소계 유기용매, 그리고 방열(放熱) 특성을 부여하는 기능성 필러(Filler)를 포함하고 있어서, 액상 탄성도료 고유의 방습 및 방식효과는 물론, 피도체의 열을 효과적으로 전도 및 방출시켜 주는 방열성 피막을 형성하는 탄성도료 조성물에 관한 것이다. The present invention relates to an elastic coating composition having a heat dissipation function, and in more detail, a thermoplastic elastomer, which is a binding resin, a hydrocarbon-based organic solvent which dissolves the elastomer to liquid-form paint, and a functional filler that provides heat dissipation characteristics. It relates to an elastic coating composition comprising a (Filler), as well as the moisture-proof and anticorrosive effect inherent to the liquid elastic coating, as well as forming a heat-dissipating film that effectively conducts and releases the heat of the object.

종래에도 어떤 물체, 즉 피도체(被塗體)를 외부의 충격이나 습기, 부식, 오염 등으로부터 보호하기 위해서는 그 물체의 표면에 보호피막을 형성해 주는 합성수지 재질의 액상도료 조성물이 개발되어 있다. Conventionally, in order to protect a certain object, that is, a subject from external impact, moisture, corrosion, contamination, etc., a liquid coating composition made of a synthetic resin material which forms a protective film on the surface of the object has been developed.

예컨대, 국내 특허공개 제2006-84237호(공개일자; 2006.07.24.)에 소개된 박리성 코팅제 조성물은 열가소성 고무 100 중량부에 대하여 탈크 충진제 0.1 내지 100 중량부와; 스테아르산, 식물성 기름 및 프로세스 오일 중에서 선택된 어느 하나의 1차 이형제 0.1 내지 50 중량부와; 아연(Zn)이 첨가된 스테아르산, 식물성 기름 및 프로세스 오일 중 선택된 어느 하나의 2차 이형제0.1 내지 50 중량부와; 토너 안료 0.1 내지 50 중량부와; 탄화수소계 유기용매인 1차 용제 0.1 내지 200 중량부; 및 탄화수소계 유기용매인 2차 용제 0.1 내지 500 중량부; 를 포함하여 구성되는 것을 특징으로 한다.For example, the peelable coating composition introduced in Korean Patent Publication No. 2006-84237 (published date; July 24, 2006) includes 0.1 to 100 parts by weight of talc filler based on 100 parts by weight of thermoplastic rubber; 0.1 to 50 parts by weight of any one primary release agent selected from stearic acid, vegetable oil and process oil; 0.1 to 50 parts by weight of a secondary release agent selected from stearic acid, vegetable oil and process oil to which zinc (Zn) is added; 0.1 to 50 parts by weight of toner pigment; 0.1 to 200 parts by weight of a primary solvent which is a hydrocarbon organic solvent; And 0.1 to 500 parts by weight of a secondary solvent that is a hydrocarbon-based organic solvent; And a control unit.

상기 박리성 코팅제 조성물은 액상으로서 피도체의 형태나 구조와 상관없이 도포 작업이 용이하고, 특히 이형제가 포함되어 있어서 상기 피막을 박리시키고자 할 때 이를 용이하게 박리시킬 수 있는 장점이 있다. 이러한 종래의 코팅제 조성물들이 형성하는 피막은 대체로 열의 전도 또는 방출을 차단하는 성질을 갖는다.The peelable coating composition is easy to apply regardless of the shape or structure of the coating material as a liquid, in particular, a release agent is included, so that when the peeling of the coating, there is an advantage that can be easily peeled off. The coating formed by these conventional coating compositions generally has the property of blocking the conduction or release of heat.

한편, 최근 전자산업의 발달과 함께 각종 전자제품, 특히 반도체 부품이나 디스플레이 부품 등이 점점 고집적화 및 소형화되면서 LCD, PDP, LED 및 각종 회로 등에서 발생하는 열(熱) 문제를 효율적으로 해결하는 것이 이들 제품의 성능 및 수명에 매우 중요한 영향을 미치는 요인으로 부각되고 있다. 그래서 이들 전자제품에는 열원(熱源)에서 발생하는 열을 신속하게 냉각시켜 주기 위하여 히트싱크(Heat sink)나 방열판을 설치한다. 그리고, 상기 열원과 히트싱크 사이에는 방열그리스(Thermal grease)나 방열 패드, 방열 테이프 등과 같은 열 전달물질, 즉 TIM(Thermal Interface Materials)을 삽입한다. On the other hand, with the recent development of the electronics industry, various electronic products, especially semiconductor components and display components, have been increasingly integrated and miniaturized, which effectively solves the thermal problems occurring in LCDs, PDPs, LEDs, and various circuits. Is a very important factor affecting the performance and lifespan. Therefore, heat sinks or heat sinks are installed in these electronic products to quickly cool the heat generated from the heat source. In addition, a heat transfer material such as a thermal grease, a thermal pad, a thermal tape, or the like is inserted between the heat source and the heat sink.

그런데 상기와 같은 종래의 TIM은 열원에서 발생하는 열을 단순히 히트씽크로 전달하는 기능만 할 뿐, 히트싱크에 축적된 열을 공기 중으로 방출하는 기능은 수행하지 못한다. 특히 최근에 히트싱크나 방열판의 재료로 주로 사용되고 있는 알루미늄은 열전도성은 뛰어나지만 열을 붙잡아 두는 보온 특성이 있어서 히트싱크의 열을 빨리 공기 중으로 방출시켜 주지 않으면, 더 이상 열원에 대한 온도 하강 기능을 기대할 수 없게 된다. However, the conventional TIM as described above merely transmits heat generated from a heat source to a heat sink, and does not perform a function of releasing heat accumulated in the heat sink into the air. In particular, aluminum, which is recently used as a material for heat sinks and heat sinks, has excellent thermal conductivity, but has a thermal insulation property that holds heat. Therefore, if the heat sink does not quickly release heat into the air, it is no longer expected to have a temperature drop function for a heat source. It becomes impossible.

더구나 전자제품의 열원이나 히트싱크, 방열판 등을 보호하기 위하여 그 표면에다 종래의 액상도료를 코팅하게 되면, 그 피막이 피도체의 열 방출을 차단하여 오히려 상기 전자제품의 성능이나 수명에 악영향을 미치는 결과를 초래한다. Furthermore, if conventional liquid paint is coated on the surface to protect heat sources, heat sinks, heat sinks, etc. of the electronics, the coating blocks heat release of the subjects, which in turn adversely affects the performance or life of the electronics. Brings about.

이에 본 발명이 해결하고자 하는 과제는 피도체의 구조나 형태에 상관없이 도포작업이 용이하고, 건조된 후에는 탄성이 매우 우수한 보호피막을 형성하며, 동시에 상기 피막이 피도체의 열을 효과적으로 전도 및 방출시켜 주는 방열기능을 갖는 탄성도료 조성물을 제공하는 것이다.Therefore, the problem to be solved by the present invention is easy to apply regardless of the structure or shape of the object, and after drying, it forms a protective film with excellent elasticity, and at the same time the film effectively conducts and releases the heat of the subject. It is to provide an elastic coating composition having a heat dissipation function.

또한 최근에 각광받고 있는 LED 조명등의 경우에는 PCB 와 히트씽크 사이에 방열성과 절연성을 동시에 갖는 TIM을 사용하는 것이 필수적인데, 전기적으로 절연특성을 갖는 도료들은 대부분 열의 이동을 차단하는 특성을 갖기 때문에 지금까지 방열성과 절연성을 동시에 갖는 도료는 개발되어 있지 않았다. In addition, in the case of LED lighting, which is in the spotlight recently, it is essential to use a TIM having both heat dissipation and insulation between the PCB and the heatsink. Since electrically insulating paints have a property of blocking heat transfer. Until now, no paint having both heat dissipation and insulation has been developed.

따라서 본 발명이 해결하고자 하는 다른 과제는 전기적으로 절연특성을 가지면서 동시에 방열특성을 갖는 새로운 개념의 탄성도료 조성물을 제공하는 것이다.Accordingly, another problem to be solved by the present invention is to provide a new concept elastic coating composition having electrical insulation properties and heat dissipation properties.

본 발명에 따른 방열기능을 갖는 탄성도료 조성물은, 탄화수소계 유기용매에 용해되는 올레핀계 또는 스티렌계 열가소성 엘라스토머 100 중량부에 대하여 탄화수소계 유기용매 50~500 중량부와 방열성 필러(放熱性 Filler) 10~200 중량부를 포함하여 이루어지는 것을 특징으로 한다.The elastic coating composition having a heat dissipation function according to the present invention, 50 to 500 parts by weight of a hydrocarbon-based organic solvent and a heat dissipating filler 10 to 100 parts by weight of an olefin- or styrene thermoplastic elastomer dissolved in a hydrocarbon-based organic solvent. It comprises a ~ 200 parts by weight.

본 발명에서, 상기 방열성 필러(放熱性 Filler)는 산화알루미늄(Al2O3), 질화 붕소(BN), 탄화규소(SiC), 질화규소, 산화베릴륨(BeO), 질화알루미늄(AlN) 중에서 선택된 어느 하나 또는 둘 이상의 절연성 필러인 것을 특징으로 한다. In the present invention, the heat dissipating filler is any one selected from aluminum oxide (Al 2 O 3 ) , boron nitride (BN), silicon carbide (SiC), silicon nitride, beryllium oxide (BeO), aluminum nitride (AlN). It is characterized by one or more insulating fillers.

또한, 상기 방열성 필러(放熱性 Filler)는 탄소나노튜브(CNT), 그라파이트(Graphite), 구리(Cu), 은(Ag) 중에서 선택된 어느 하나 또는 둘 이상의 전도성 필러인 것을 특징으로 한다. In addition, the heat dissipating filler is characterized in that any one or two or more conductive fillers selected from carbon nanotubes (CNT), graphite (Graphite), copper (Cu), silver (Ag).

본 발명에 따른 탄성도료 조성물은 액상으로서 피도체의 구조나 형태에 상관없이 도포작업이 용이하고, 건조된 후에는 방열특성과 탄성이 매우 우수한 피막을 형성하며, 나아가 방열성 필러의 전기적 특성에 따라서 전도성 피막을 형성할 수도 있고, 절연성 피막을 형성할 수도 있다. The elastic coating composition according to the present invention is a liquid, regardless of the structure or form of the coating is easy to apply, and after drying, forms a film having excellent heat dissipation properties and elasticity, and furthermore, according to the electrical properties of the heat dissipating filler A film may be formed and an insulating film may be formed.

따라서 본 발명에 따른 탄성도료 조성물은 일반적인 금속제품이나 전기, 전자제품에 방습 및 방식용 보호피막을 형성하는 용도로는 물론, 특히 피도체에서 발생하는 열을 공기 중으로 신속하게 방출시키고자 할 경우, 두 물체 사이의 접착력과 열전도성이 동시에 요구되는 경우, 방열성과 절연성이 동시에 요구되는 경우, 전자파 차단용(EMC, EMI, EMS)이나 대전 방지용 피막을 형성하고자 할 경우 등에 다양하게 사용될 수 있다.Therefore, the elastic coating composition according to the present invention is not only used for forming a protective film for moisture proof and anticorrosion in general metal products, electrical and electronic products, but also particularly in order to quickly release heat generated from the object into the air. When the adhesion between the two objects and the thermal conductivity is required at the same time, when the heat dissipation and insulation are required at the same time, it can be used in a variety of cases, such as to form an electromagnetic shielding (EMC, EMI, EMS) or an antistatic film.

이하, 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.

본 발명에 따른 방열기능을 갖는 탄성도료 조성물은 올레핀계 또는 스티렌계 열가소성 엘라스토머 100 중량부에 대하여 탄화수소계 유기용매 50~500 중량부, 그리고 방열성 필러(Filler) 10~200 중량부를 포함하여 이루어진다.The elastic coating composition having a heat dissipation function according to the present invention comprises 50 to 500 parts by weight of a hydrocarbon-based organic solvent, and 10 to 200 parts by weight of a heat dissipating filler based on 100 parts by weight of an olefinic or styrene thermoplastic elastomer.

먼저 상기 열가소성 엘라스토머는 바인더 수지로서 그 자체로는 상온에서 고형이지만 용제인 탄화수소계 유기용매에 용해되어 액상도료를 형성하고, 피도체에 도포 및 건조된 후에는 상기 유기용매가 휘발하면서 소정의 두께를 갖는 고형 피막을 형성 한다.First, the thermoplastic elastomer is a binder resin, which itself is solid at room temperature, but is dissolved in a hydrocarbon-based organic solvent, which is a solvent, to form a liquid coating. After coating and drying on a subject, the organic solvent is volatilized to have a predetermined thickness. To form a solid coating.

본 발명에서 상기 열가소성 엘라스토머로는 EPDM(Ethylene Propylene Diene Monomer), EPM(Ethylene Propylene Monomer), EPD(Ethylene Propylene Dicyclo pentadiene), EPR((Ethylene Propylene Rubber), NBR(Nitrile Butadiene Rubber), SBR(Styrene Butadiene Rubber), SBS(Styrene Butadiene Styrene), SES(Styrene Ethylene Styrene), SIS(Styrene Isoprene Styrene), SEPS(Styrene Ethylene Propylene Styrene), SEBS(Styrene Ethylene Butylene Styrene) 고무 중에서 선택된 어느 하나 또는 둘 이상인 것을 포함한다.In the present invention, the thermoplastic elastomer is EPDM (Ethylene Propylene Diene Monomer), EPM (Ethylene Propylene Monomer), EPD (Ethylene Propylene Dicyclo pentadiene), EPR (Ethylene Propylene Rubber), NBR (Nitrile Butadiene Rubber), SBR (Styrene Butadiene) Rubber), SBS (Styrene Butadiene Styrene), SES (Styrene Ethylene Styrene), SSIS (Styrene Isoprene Styrene), SIS (Styrene Ethylene Propylene Styrene), SEBS (Styrene Ethylene Butylene Styrene) .

다음으로 상기 탄화수소계 유기용매는 상기 열가소성 엘라스토머를 용해하여 액상으로 만들어 주는 기능을 하며, 공기 중에서 쉽게 휘발하기 때문에 피도체에 도포된 이후에는 신속히 건조되어 상기 바인더 수지가 고형 피막을 형성하게 한다.Next, the hydrocarbon-based organic solvent functions to dissolve the thermoplastic elastomer to form a liquid phase, and is easily volatilized in air, thereby rapidly drying after being applied to the object, thereby allowing the binder resin to form a solid film.

상기 유기용매로는 톨루엔, 노말헥산, 시클로헥산, 펜탄, 크실렌, 이소옥탄, 헵탄 중에서 선택된 어느 하나 또는 둘 이상이 사용될 수 있고, 그 함량은 상기 열가소성 엘라스토머 100 중량부에 대하여 50~500 중량부를 포함한다. 상기 유기용매 의 함량이 50 중량부 이하이면, 탄성도료 조성물의 점도가 너무 높아져서 도포작업이 곤란한 문제가 있고, 반대로 500 중량부 이상이면, 피막의 두께가 너무 얇아져서 원하는 기능을 발휘하지 못할 가능성이 있고, 나아가 건조시간이 지연되는 단점이 있다. 상기 유기용매의 함량은 다음에 설명하는 방열성 필러의 종류에 따라 큰 차이를 보인다.As the organic solvent, any one or two or more selected from toluene, normal hexane, cyclohexane, pentane, xylene, isooctane, and heptane may be used, and the content thereof includes 50 to 500 parts by weight based on 100 parts by weight of the thermoplastic elastomer. . If the content of the organic solvent is 50 parts by weight or less, the viscosity of the elastic coating composition is too high, there is a problem that the coating operation is difficult, on the contrary, if more than 500 parts by weight, the thickness of the film is too thin, there is a possibility that the desired function may not be exhibited In addition, there is a disadvantage that the drying time is further delayed. The content of the organic solvent shows a large difference depending on the type of heat dissipating filler described below.

마지막으로 방열성 필러(Filler)는 본 발명의 특징인 방열기능을 제공하는 성분으로서, 산화알루미늄(Al2O3), 질화붕소(BN), 탄화규소(SiC), 질화규소, 산화베릴륨(BeO), 질화알루미늄(AlN), 탄소나노튜브(CNT), 그라파이트(Graphite), 구리(Cu), 은(Ag) 중에서 선택된 어느 하나 또는 둘 이상을 포함한다. 상기 방열성 필러는 크기가 10㎛ 이하, 바람직하기로는 0.1~5㎛인 것을 사용하는 것이 좋다.Finally, the heat dissipating filler (Filler) is a component providing the heat dissipation function of the present invention, aluminum oxide (Al 2 O 3 ), boron nitride (BN), silicon carbide (SiC), silicon nitride, beryllium oxide (BeO), Aluminum nitride (AlN), carbon nanotubes (CNT), graphite (Graphite), copper (Cu), silver (Ag) selected from any one or two or more. The heat dissipating filler is preferably a size of 10㎛ or less, preferably 0.1 to 5㎛.

상기 방열성 필러는 전기적 특성에 따라 절연성 필러와 전도성 필러로 구분할 수 있다. 즉, 산화알루미늄(Al2O3), 질화붕소(BN), 탄화규소(SiC), 질화규소, 산화베릴륨(BeO) 및 질화알루미늄(AlN)은 절연성 필러에 속하고, 탄소나노튜브(CNT), 그라파이트(Graphite), 구리(Cu) 및 은(Ag)은 전도성 필러에 속한다. The heat dissipating filler may be classified into an insulating filler and a conductive filler according to electrical characteristics. That is, aluminum oxide (Al 2 O 3 ), boron nitride (BN), silicon carbide (SiC), silicon nitride, beryllium oxide (BeO) and aluminum nitride (AlN) belong to the insulating filler, carbon nanotubes (CNT), Graphite, copper and silver belong to conductive fillers.

본 발명에서는 필요에 따라 상기 절연성 필러와 전도성 필러를 구분하여 이들 중 어느 하나 또는 둘 이상을 선택하여 사용하므로서, 절연성 방열도료를 제조할 수도 있고, 전도성 방열도료를 제조할 수도 있다. In the present invention, by dividing the insulating filler and the conductive filler as needed, any one or two or more of these may be selected and used to prepare an insulating heat dissipating paint or a conductive heat dissipating paint.

상기 방열성 필러의 함량은 상기 열가소성 엘라스토머 100 중량부에 대하여 10~200 중량부를 포함한다. 상기 방열성 필러의 함량이 10 중량부 미만이면 방열 효과를 거의 기대하기 힘들고, 반대로 200 중량부 이상이면 상기 필러가 바인더 내에 고르게 분산되지 않아서 피막의 물성이 저하될 우려가 있으며, 추가적인 방열 효과의 상승도 기대할 수 없다.The content of the heat dissipating filler may include 10 to 200 parts by weight based on 100 parts by weight of the thermoplastic elastomer. When the content of the heat dissipating filler is less than 10 parts by weight, it is hard to expect a heat dissipation effect. On the contrary, when the content of the heat dissipating filler is 200 parts by weight or more, the filler may not be evenly dispersed in the binder, thereby deteriorating the physical properties of the film. Can't expect

한편, 본 발명에 따른 탄성도료 조성물은 상기 3가지 필수적 구성성분 이외에 자외선(UV) 특성을 강화하기 위해 UV 안정제와 UV 차단제를 각각 0.5~5 중량부 포함할 수도 있고, 필요에 따라서는 다양한 색상의 안료 2~20 중량부를 포함 할 수도 있다. On the other hand, the elastic coating composition according to the present invention may include 0.5 to 5 parts by weight of a UV stabilizer and a UV blocker, respectively, in addition to the three essential components to enhance ultraviolet (UV) properties, if necessary, of various colors It may contain 2 to 20 parts by weight of the pigment.

또한 액상도료의 유동성(Fluidity)을 개선하고, 피막의 질감을 향상시켜 주는 활택제(滑澤劑)로서 탈크(Talc)를 포함할 수도 있다. 이 경우, 탈크는 비중이 높아서 쉽게 침전되기 때문에 사용할 때 마다 충분히 교반한 후에 사용해야 하는 불편함이 있다.In addition, talc may be included as a lubricant to improve the fluidity of the liquid paint and to improve the texture of the coating. In this case, talc has a high specific gravity and is easily precipitated, so it is inconvenient to use it after sufficiently stirring each time.

본 발명에 따른 탄성도료 조성물은 피도체의 종류 및 작업 방법에 따라 그 점도를 100~5,000cps로 유지하는 것이 바람직하다. 상기 점도는 상기 유기용매의 함량에 따라 조절된다.It is preferable that the elastic coating composition according to the present invention maintains its viscosity at 100 to 5,000 cps according to the type of workpiece and the working method. The viscosity is adjusted according to the content of the organic solvent.

상기 탄성도료 조성물의 방열특성은 피막의 두께가 20~300㎛ 인 범위 내에서 피막 두께가 두꺼울수록 대체로 방열특성이 증가하는 특성을 갖는다. 그러나, 피막의 두께가 300 ㎛ 이상이면 피막의 두께가 증가하여도 방열효과가 더 이상 증가하지 않거나 오히려 역효과를 가져온다.The heat dissipation characteristics of the elastic coating composition has a characteristic that the heat dissipation characteristics generally increase as the thickness of the coating is thick within the range of 20 to 300 μm. However, if the thickness of the coating is 300 ㎛ or more, even if the thickness of the coating increases, the heat dissipation effect no longer increases or rather has an adverse effect.

본 발명에 따른 탄성도료 조성물의 제조방법은 상기 탄화수소계 유기용매에 바인더 수지를 용해시킨 ‘액상 바인더’와, 상기 유기용매에 방열성 필러를 균일 하게 분산시킨 ‘필러 혼합물’을 각각 따로 제조한 다음, 상기 액상 바인더와 필러 혼합물을 다시 혼합하여 최종 목적물을 제조하는 것이 바람직하다.In the method for preparing an elastic coating composition according to the present invention, separately preparing a 'liquid binder' in which a binder resin is dissolved in the hydrocarbon-based organic solvent and a 'filler mixture' in which a heat dissipating filler is uniformly dispersed in the organic solvent, Preferably, the liquid binder and the filler mixture are mixed again to prepare a final target product.

이하, 실시예를 들어 본 발명을 보다 상세히 설명한다. 그러나, 하기 실시예가 본 발명의 권리범위를 한정하는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples do not limit the scope of the present invention.

[실시예 1]Example 1

우선 톨루엔 600g 및 크실렌 600g의 혼합용매에다 SBS 800g을 충분히 용해하여 액상 바인더를 제조하고, 이와 별도로 톨루엔 600g에 입경이 1~2㎛인 Al2O3 150g과 BN 100g 및 SiC 100g을 혼합한 다음, 밀링기와 고속 교반기로 1 시간 정도 충분히 교반하여 필러 혼합물을 제조하였다. First, a liquid binder is prepared by sufficiently dissolving 800 g of SBS in a mixed solvent of 600 g of toluene and 600 g of xylene, and separately, 150 g of Al 2 O 3 having a particle diameter of 1-2 μm, 100 g of BN, and 100 g of SiC are mixed with 600 g of toluene. The filler mixture was prepared by sufficiently stirring for 1 hour with a mill and a high speed stirrer.

이어 상기 액상 바인더와 필러 혼합물을 다시 혼합하고, 이를 2~3시간 정도 충분히 교반하여 본 발명의 탄성도료 조성물을 얻었다. 이때 교반과정에서 톨루엔 용제가 계속 휘발하여 그 양이 줄어들기 때문에 중간 중간에 톨루엔 용제의 양을 초기와 동일하게 보충해 주었다.Subsequently, the liquid binder and the filler mixture were mixed again, and then sufficiently stirred for about 2 to 3 hours to obtain the elastic coating composition of the present invention. At this time, the toluene solvent was continuously volatilized in the stirring process, so that the amount was reduced.

상기 실시예 1에 따라 제조된 SBS 탄성도료 조성물은 비중이 0.94이고, 건조 후 피막 표면의 경도는 쇼아 A 경도로 90, 신장률은 피막의 두께에 따라 300~800%인 것으로 확인되었다.The SBS elastic coating composition prepared according to Example 1 has a specific gravity of 0.94, and after drying, the hardness of the surface of the coating was found to be 90% as Shore A hardness, and the elongation was 300 to 800% depending on the thickness of the coating.

[실시예 2 ~ 9][Examples 2 to 9]

상기 실시예 1과 동일한 방법으로 실시하되, 바인더 수지와 유기용매 및 방열성 필러의 종류와 함량을 다음 < 표 1 > 과 같이 다양하게 변경해 가면서 본 발명의 탄성도료 조성물을 제조하였다. The elastic coating composition of the present invention was prepared in the same manner as in Example 1, while varying the type and content of the binder resin, the organic solvent, and the heat dissipating filler as shown in Table 1 below.

다만, 바인더 수지와 필러의 종류에 따라 액상 바인더와 필러 혼합물의 교반시간은 1시간에서 3시간 정도의 범위에서 실시하였다. 그리고 탄소나노튜브(CNT)는 평균 직경이 10nm 이고, 평균 길이가 10㎛인 것을 사용하였고, 그라파이트(Graphite)는 탄소함량이 99% 이상이고, 직경이 1~10㎛인 것을 사용하였다.However, the stirring time of the liquid binder and the filler mixture was performed in the range of about 1 hour to about 3 hours depending on the type of binder resin and filler. The carbon nanotubes (CNT) had an average diameter of 10 nm, an average length of 10 μm, and graphite (Graphite) having a carbon content of 99% or more and a diameter of 1˜10 μm.

< 표 1 ><Table 1>

구분division 액상 바인더 Liquid binder 필러 혼합물Filler mixture 전기적
특성Electrical
characteristic 바인더 수지Binder resin 유기용매Organic solvent 방열성 필러 Heat-resistant filler 유기용매Organic solvent 실시예 2Example 2 SBR 800gSBR 800g 톨루엔 600g
크실렌 600gToluene 600g
Xylene 600 g Al2O3 150g,
BN 100g, SiC 100gAl 2 O 3 150 g,
BN 100g, SiC 100g 톨루엔 600gToluene 600g 절연성Insulation 실시예 3Example 3 SBS 800gSBS 800g 톨루엔 800g
시클로헥산 400gToluene 800g
400 g of cyclohexane Al2O3 150g,
BN 100g, BeO 50g Al 2 O 3 150 g,
BN 100g, BeO 50g 크실렌 600gXylene 600 g 절연성Insulation 실시예 4Example 4 EPDM 800gEPDM 800g 톨루엔 1200gToluene 1200g AlN 250g AlN 250g 노말헥산 600gNormal Hexane 600g 절연성Insulation 실시예 5Example 5 SBR 800gSBR 800g 톨루엔 1200gToluene 1200g CNT 120gCNT 120g 톨루엔 840gToluene 840g 전도성conductivity 실시예 6Example 6 SBS 800gSBS 800g 톨루엔 600g
크실렌 600gToluene 600g
Xylene 600 g CNT 120g
Cu 200gCNT 120g
Cu 200g 크실렌 900gXylene 900g 전도성conductivity 실시예 7Example 7 EPDM 800gEPDM 800g 톨루엔 1200gToluene 1200g Ag 120gAg 120g 톨루엔 600gToluene 600g 전도성conductivity 실시예 8Example 8 SIS 800gSIS 800g 톨루엔 1200gToluene 1200g Graphite 800gGraphite 800g 톨루엔 600gToluene 600g 전도성conductivity 실시예 9Example 9 SEBS 800gSEBS 800g 톨루엔 800g
크실렌 400gToluene 800g
Xylene 400g CNT 250g
Graphite 400gCNT 250g
Graphite 400g 톨루엔 700g
크실렌 500gToluene 700g
Xylene 500g 전도성conductivity

[시험예][Test Example]

1. One. 방열성Heat dissipation (( 放熱性放熱 性 ) 시험) exam

먼저 용량이 8W 및 16W인 조명용 LED(모델명; LH-8K-E27 및 LH-16K-E27, 제조사; 화우)를 이용하여 상기 실시예 1의 탄성도료 조성물에 대한 방열효과를 시험하였다. 시험방법은 상기 LED의 히트싱크(Heat sink) 표면에다 실시예 1에 따라 제 조된 탄성도료를 붓으로 각각 1~2회 도포하여 두께가 100~200㎛ 정도인 피막을 형성하고, 약 24시간 이상 충분히 건조하였다. 이어 상기 LED 전구를 점등하고, 점등 후 1시간 경과시점 부터 24시간 동안 1시간 마다 상기 LED의 주요부위에 대한 온도를 측정하였다. First, the heat dissipation effect of the elastic coating composition of Example 1 was tested by using the LEDs for illumination (capacity name; LH-8K-E27 and LH-16K-E27, manufacturer; Hwa) having capacities of 8W and 16W. The test method was applied to the surface of the heat sink of the LED by applying the elastic paint prepared according to Example 1 once or twice with a brush to form a film having a thickness of about 100 to 200 μm, and about 24 hours or more. It was dried enough. Subsequently, the LED bulb was turned on, and the temperature of the main portion of the LED was measured every 1 hour for 24 hours after the 1 hour elapsed time after the lighting.

이때, 온도 측정위치는 상기 히트싱크의 내부(Check point 1)와 히트싱크의 외부(Check point 2) 및 PCB 표면(Check point 3)에서 각각 온도를 측정하였으며, 온도측정기는 모델명 'DataChart 2000'(제조사; Monach)를 사용하였다. 입력전원은 220V, 60Hz를 사용하였고, 시험 당시의 주변온도는 28℃, 습도는 50% 이었다.At this time, the temperature measurement position was measured at the inside of the heat sink (Check point 1), the outside of the heat sink (Check point 2) and the PCB surface (Check point 3), respectively, and the temperature measuring instrument is a model name 'DataChart 2000' ( Monach) was used. The input power was 220V and 60Hz. The ambient temperature at the time of testing was 28 ℃ and the humidity was 50%.

한편, 비교예로서 상기 방열성 시험에 사용된 것과 동일한 8W 및 16W인 조명용 LED(모델명; LH-8K-E27 및 LH-16K-E27, 제조사; 화우)에 대하여 초기 상태, 즉 본 발명의 탄성도료를 도포하지 않은 상태로 상기 시험방법과 동일한 방법으로 각각 온도를 측정한 다음, 각 시간대별로 측정한 온도의 평균값을 다음 표 2에 나타내었다.On the other hand, for the illumination LED (model name; LH-8K-E27 and LH-16K-E27, manufacturer; Huayu) of the same 8W and 16W used in the heat dissipation test as a comparative example, the initial state, that is, the elastic coating of the present invention After the temperature was measured in the same manner as in the above test method without coating, the average value of the temperature measured at each time zone is shown in Table 2 below.

< 표 2 > <Table 2>

구 분division 8 W LED 사용8 W LED used 16 W LED 사용16 W LED used 측정위치Measuring position 실시예 1Example 1 비교예Comparative example 차이Difference 실시예 1Example 1 비교예Comparative example 차이Difference 주변 온도Ambient temperature 28℃28 ℃ 28℃28 ℃ 없음none 25℃25 ℃ 25℃25 ℃ 없음none Check point 1Check point 1 54℃54 ℃ 47℃47 ℃ -7℃-7 ℃ 55℃55 ° C 47℃47 ℃ -8℃-8 ℃ Check point 2Check point 2 53℃53 ℃ 46℃46 ℃ -7℃-7 ℃ 54℃54 ℃ 45℃45 ℃ -9℃-9 ℃ Check point 3Check point 3 55℃55 ° C 48℃48 ℃ -7℃-7 ℃ 57℃57 ℃ 50℃50 ℃ -7℃-7 ℃

한편, 상기 실시예 2 ~ 9의 탄성도료 조성물에 대한 방열효과도 시험하였다. 시험방법은 상기 실시예 1에 대한 시험방법과 동일하게 하되, 이번에는 용량이 22W인 Power LED(제조사; Daejin DMP)를 사용하였다. 실험결과에 대하여 비교예와의 온도차를 산출하고 그 평균값을 각각 다음 표 3에 나타내었다.On the other hand, the heat radiation effect for the elastic coating composition of Examples 2 to 9 was also tested. The test method was the same as the test method for Example 1, but this time, a power LED (manufacturer; Daejin DMP) having a capacity of 22 W was used. The temperature difference with the comparative example was computed about the experimental result, and the average value is shown in following Table 3, respectively.

< 표 3 ><Table 3>

구 분division 온도 하강 효과Temperature drop effect 실시예Example Check point 1Check point 1 Check point 2Check point 2 Check point 3Check point 3 실시예 2Example 2 -9℃-9 ℃ -10℃-10 ℃ -8℃-8 ℃ 실시예 3Example 3 -3℃-3 ℃ -4℃-4 ℃ -3℃-3 ℃ 실시예 4Example 4 -4℃-4 ℃ -4℃-4 ℃ -4℃-4 ℃ 실시예 5Example 5 -7℃-7 ℃ -9℃-9 ℃ -7℃-7 ℃ 실시예 6Example 6 -7℃-7 ℃ -8℃-8 ℃ -6℃-6 ℃ 실시예 7Example 7 -4℃-4 ℃ -5℃-5 ℃ -4℃-4 ℃ 실시예 8Example 8 -5℃-5 ℃ -7℃-7 ℃ -5℃-5 ℃ 실시예 9Example 9 -7℃-7 ℃ -8℃-8 ℃ -6℃-6 ℃

상기 표 2 및 표 3의 시험결과로부터 알 수 있는 바와 같이, 통상적인 LED의 히트싱크에 본 발명에 따른 탄성도료를 도포할 경우, 약 -3℃ ~ -10℃ 정도의 뚜렷한 온도 하강효과가 있는 것으로 확인되었다.As can be seen from the test results of Table 2 and Table 3, when the elastic coating according to the present invention is applied to a heat sink of a conventional LED, there is a distinct temperature drop effect of about -3 ℃ ~ -10 ℃ It was confirmed.

2. 절연성 시험2. Dielectric Test

절연성 필러를 사용한 상기 실시예 1 내지 4의 탄성도료를 사용하여 각각 두께가 300㎛, 450㎛ 및 500㎛ 인 피막을 형성하고, 이들 각 피막에 대하여 내전압 측정기(제조사; HIPOTRONICS-ROBINSON)로 충격 내전압을 측정한 다음, 그 결과를 다음 표 4에 나타내었다. Films having thicknesses of 300 μm, 450 μm, and 500 μm were formed using the elastic paints of Examples 1 to 4 using the insulating filler, respectively, and the shock withstand voltage was measured by a withstand voltage measuring instrument (manufacturer; HIPOTRONICS-ROBINSON) for each of these films. After the measurement, the results are shown in Table 4 below.

< 표 4 ><Table 4>

구 분division 100㎛ 피막 100㎛ film 200㎛ 피막200㎛ film 300㎛ 피막300㎛ film 실시예 1Example 1 11,000 Volt11,000 Volt 14,000 Volt14,000 Volt 17,000 Volt17,000 Volt 실시예 2Example 2 10,000 Volt10,000 Volt 13,000 Volt13,000 Volt 16,000 Volt16,000 Volt 실시예 3Example 3 11,000 Volt11,000 Volt 14,000 Volt14,000 Volt 18,000 Volt18,000 Volt 실시예 4Example 4 12,000 Volt12,000 Volt 15,000 Volt15,000 Volt 18,000 Volt18,000 Volt

3. 전도성 시험3. conductivity test

전도성 필러를 사용한 상기 실시예 5 내지 9의 탄성도료를 사용하여 절연성 기판 위에 가로 1 Cm, 세로 1 Cm, 두께 100㎛의 정사각형 도막을 각각 3개씩(시료 1 ~ 3) 형성하고, 각 시료 도막에 대하여 대각선 방향으로 전기저항을 측정한 다음, 그 결과를 다음 표 5에 나타내었다. Three square coating films (samples 1 to 3) each having a width of 1 Cm, a length of 1 Cm, and a thickness of 100 μm were formed on the insulating substrate by using the elastic paints of Examples 5 to 9 using the conductive filler, and each sample coating film was formed on each of the sample coating films. After the electrical resistance was measured in the diagonal direction, the results are shown in Table 5 below.

< 표 5 ><Table 5>

구 분division 시료 1Sample 1 시료 2Sample 2 시료 3Sample 3 실시예 5Example 5 4,800 Ω4,800 yen 4.200 Ω4.200 Ω 3,500 Ω3,500 Ω 실시예 6Example 6 3,800 Ω3,800 Ω 3,500 Ω3,500 Ω 2,700 Ω2,700 Ω 실시예 7Example 7 4,200 Ω4,200 yen 3,800 Ω3,800 Ω 3,200 Ω3,200 yen 실시예 8Example 8 150 Ω150 Ω 120 Ω120 Ω 80 Ω80 Ω 실시예 9Example 9 50 Ω50 Ω 30 Ω30 Ω 8 Ω8 Ω

4. 탄성 시험4. elasticity test

두께가 1 Cm인 실리콘 고무판 위에 상기 실시예 1 내지 9에 따라 제조된 탄성도료를 붓으로 각각 2회씩 도포하고, 24시간 정도 충분히 건조시킨 다음, 상기 실리콘 고무판을 서로 다른 방향으로 180도 이상 100회 정도 비틀어서 반복적인 굴곡시험을 실시하였다. Apply the elastic paints prepared according to Examples 1 to 9 twice each with a brush on a silicon rubber plate having a thickness of 1 Cm, and sufficiently dry for about 24 hours, and then apply the silicon rubber plate to 180 degrees or more 100 times in different directions. Twist the degree and repeated bending test was done.

시험결과, 탄성도료가 코팅된 피막은 상기 고무판과 동일한 탄성을 가지고 있어서 초기상태를 그대로 유지하였으며, 피막에 균열이 발생한다거나, 필러 등 고형성분이 이탈하는 현상은 일절 발생하지 않았다. As a result of the test, the coating coated with the elastic coating had the same elasticity as that of the rubber sheet, and thus maintained the initial state, and no cracking or peeling of solid components such as a filler occurred.

Claims (7)

삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 톨루엔 800 중량부와 시클로핵산 400 중량부에다 SBS(Styrene Butadiene Styren) 800 중량부를 용해시켜서 된 액상 바인더와, 크실렌 600 중량부에다 산화알루미늄(Al2O3) 150 중량부와 질화붕소(BN)100 중량부 및 산화베릴륨(BeO) 50 중량부를 분산시켜서 된 필러 혼합물이 혼합된 것을 특징으로 하는 방열기능을 갖는 탄성도료 조성물.A liquid binder obtained by dissolving 800 parts by weight of toluene and 400 parts by weight of cyclonucleic acid and 800 parts by weight of SBS (Styrene Butadiene Styren), 600 parts by weight of xylene and 150 parts by weight of aluminum oxide (Al 2 O 3 ) and boron nitride (BN) 100 An elastic coating composition having a heat dissipation function, characterized in that a filler mixture obtained by dispersing a weight part and 50 parts by weight of beryllium oxide (BeO) is mixed. 톨루엔 800 중량부와 크실렌 400 중량부에다 SEBS(Styrene Ethylene Butylene Styrene) 고무 800 중량부를 용해시켜서 된 액상 바인더와, 톨루엔 700 중량부와 크실렌 500 중량부에다 탄소나노튜브(CNT) 250 중량부와 그라파이트(Graphite) 400 중량부를 분산시켜서 된 필러 혼합물이 혼합된 것을 특징으로 하는 방열기능을 갖는 탄성도료 조성물.800 parts by weight of toluene and 400 parts by weight of xylene and a liquid binder obtained by dissolving 800 parts by weight of Styrene Ethylene Butylene Styrene (SEBS) rubber, 700 parts by weight of toluene and 500 parts by weight of xylene, 250 parts by weight of carbon nanotube (CNT) and graphite ( Graphite) An elastic coating composition having a heat dissipation function, characterized in that a filler mixture obtained by dispersing 400 parts by weight is mixed.
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KR101091182B1 (en) 2011-04-25 2011-12-09 한국전기연구원 Heat-radiant layer coated computer parts
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