KR100925456B1 - Method of manufacturing liquid crystal display - Google Patents

Method of manufacturing liquid crystal display Download PDF

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KR100925456B1
KR100925456B1 KR1020020070090A KR20020070090A KR100925456B1 KR 100925456 B1 KR100925456 B1 KR 100925456B1 KR 1020020070090 A KR1020020070090 A KR 1020020070090A KR 20020070090 A KR20020070090 A KR 20020070090A KR 100925456 B1 KR100925456 B1 KR 100925456B1
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substrate
metal pattern
liquid crystal
plastic substrate
forming
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KR1020020070090A
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Korean (ko)
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KR20040041977A (en
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노수귀
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삼성전자주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/12—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
    • G02F2201/123—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode pixel

Abstract

본 발명에 따른 액정 표시 장치의 제조 방법은 버퍼 기판 위에 금속 패턴을 형성하는 단계, 금속 패턴 위에 열점착액을 코팅하여 접합층을 형성하는 단계, 접합층 위에 플라스틱 기판을 얹는 단계, 금속 패턴과 플라스틱 기판을 열로 접합하는 단계, 플라스틱 기판 위에 박막 트랜지스터, 박막 트랜지스터와 연결되는 배선 및 화소 전극을 형성하는 단계, 적 녹, 청색 색필터, 블랙 매트릭스 및 기준 전극을 포함하는 색필터 기판을 형성하는 단계, 플라스틱 기판과 색필터 기판 사이에 액정을 충진한 후 밀봉하는 단계, 금속 패턴을 습식 식각으로 제거하여 플라스틱 기판과 버퍼 기판을 분리하는 단계를 포함한다.According to an exemplary embodiment of the present invention, a method of manufacturing a liquid crystal display device includes forming a metal pattern on a buffer substrate, forming a bonding layer by coating a heat adhesive solution on the metal pattern, placing a plastic substrate on the bonding layer, a metal pattern and a plastic Bonding the substrates thermally, forming a thin film transistor, wirings and pixel electrodes connected to the thin film transistor, forming a color filter substrate including a red green, a blue color filter, a black matrix, and a reference electrode; Filling the liquid crystal between the plastic substrate and the color filter substrate and sealing the liquid crystal; and removing the metal pattern by wet etching to separate the plastic substrate and the buffer substrate.

액정표시장치, 플라스틱기판, 접합층LCD, Plastic Substrate, Bonding Layer

Description

액정 표시 장치의 제조 방법{method of manufacturing liquid crystal display }Method of manufacturing liquid crystal display

도 1a 내지 도 1e는 본 발명에 따른 플라스틱 기판에 액정 표시 장치를 형성하는 방법을 순서대로 도시한 단면도이다. 1A to 1E are cross-sectional views sequentially illustrating a method of forming a liquid crystal display on a plastic substrate according to the present invention.

도 2는 본 발명에 따른 금속 패턴의 배치도이다. 2 is a layout view of a metal pattern according to the present invention.

※도면의 주요 부분에 대한 부호 설명※※ Code explanation about main part of drawing ※

1 : 박막 트랜지스터 표시판 2 : 색필터 표시판 1 thin film transistor display panel 2 color filter display panel

100 : 버퍼 기판 102 : 금속 패턴100: buffer substrate 102: metal pattern

104 : 접합층 106 : 플라스틱 기판104: bonding layer 106: plastic substrate

본 발명은 액정 표시 장치의 제조 방법으로 특히 플라스틱 기판을 이용한 액정 표시 장치의 제조 방법에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device, in particular a method of manufacturing a liquid crystal display device using a plastic substrate.

박막 트랜지스터 기판(Thin Film Transistor, TFT)은 액정 표시 장치나 유기 EL(Electro Luminescence) 표시 장치 등에서 각 화소를 독립적으로 구동하기 위한 회로 기판으로써 사용된다. 박막 트랜지스터 기판은 주사 신호를 전달하는 주사 신 호 배선 또는 게이트 배선과 화상 신호를 전달하는 화상 신호선 또는 데이터 배선이 형성되어 있고, 게이트 배선 및 데이터 배선과 연결되어 있는 박막 트랜지스터, 박막 트랜지스터와 연결되어 있는 화소 전극, 게이트 배선을 덮어 절연하는 게이트 절연층 및 박막 트랜지스터와 데이터 배선을 덮어 절연하는 층간 절연층 등으로 이루어져 있다. A thin film transistor substrate (TFT) is used as a circuit board for independently driving each pixel in a liquid crystal display device, an organic electroluminescence (EL) display device, or the like. The thin film transistor substrate has a scan signal wiring or gate wiring for transmitting a scan signal and an image signal line or data wiring for transmitting an image signal, and is connected to the thin film transistor and the thin film transistor connected to the gate wiring and the data wiring. A pixel electrode, a gate insulating layer covering and insulating the gate wiring, and an interlayer insulating layer covering and insulating the thin film transistor and the data wiring, and the like.

이러한 박막 트랜지스터 기판은 노트북, 모니터, 텔레비전, 핸드폰 등의 다양한 표시 장치에 널리 이용되고 있다. 따라서 더욱 얇고 가벼우며, 값싸고 튼튼한 플랙서블(flexible) 기판이 요구되고 있다. 플랙서블 한 기판을 얻기 위해서는 박막 트랜지스터를 형성하는 절연 기판을 플랙서블 한 기판을 사용하여야 한다. Such thin film transistor substrates are widely used in various display devices such as notebooks, monitors, televisions, and mobile phones. Therefore, there is a need for a thinner, lighter, cheaper and more durable flexible substrate. In order to obtain a flexible substrate, a flexible substrate of an insulating substrate forming a thin film transistor should be used.

플랙서블 한 기판 재료로서 고내열성, 고투과성, 저수축성의 플라스틱 기판 또는 매우 얇아서 깨지지 않고 쉽게 휠 수 있는 유리를 사용하거나 이들의 하이브리드형을 사용한다.As a flexible substrate material, a high heat resistant, high permeability, low shrinkage plastic substrate or a very thin and easily broken glass can be used or a hybrid type thereof is used.

현재 유리 기판을 사용한 공정에 기판만을 플라스틱 기판으로 변경한 후 공정을 진행하면, 기판을 고정하기 위한 진공척에 의한 국부적인 휨, 반송 과정에서의 자중에 의한 휨등의 문제 및 특성 균일성 불량 등이 발생하게 된다. In the current process using glass substrates, only the substrate is changed to a plastic substrate, and then the process proceeds, such as local warpage by a vacuum chuck to fix the substrate, warpage due to self-weight in the conveying process, and poor property uniformity. Will occur.

따라서 이러한 휨을 방지하기 위해서 유리 기판을 버퍼 기판으로 사용한다. 그러나 이러한 경우 플라스틱 기판을 버퍼 기판에 부착 및 탈착하는 공정을 거치게 된다. Therefore, in order to prevent such warpage, a glass substrate is used as the buffer substrate. In this case, however, the plastic substrate is attached to and detached from the buffer substrate.

따라서 본 발명은 고저항 금속을 이용하여 플라스틱 기판과 버퍼 기판의 부 착 및 탈착을 용이하게 하기 위한 방법을 제공한다. Accordingly, the present invention provides a method for facilitating attachment and detachment of a plastic substrate and a buffer substrate using a high resistance metal.

상기한 목적을 달성하기 위해 본 발명에 따른 액정 표시 장치의 제조 방법은 버퍼 기판 위에 금속 패턴을 형성하는 단계, 금속 패턴 위에 열점착액을 코팅하여 접합층을 형성하는 단계, 접합층 위에 플라스틱 기판을 얹는 단계, 금속 패턴과 플라스틱 기판을 열로 접합하는 단계, 플라스틱 기판 위에 박막 트랜지스터, 박막 트랜지스터와 연결되는 배선 및 화소 전극을 형성하는 단계, 적 녹, 청색 색필터, 블랙 매트릭스 및 기준 전극을 포함하는 색필터 기판을 형성하는 단계, 플라스틱 기판과 색필터 기판 사이에 액정을 충진한 후 밀봉하는 단계, 금속 패턴을 습식 식각으로 제거하여 플라스틱 기판과 버퍼 기판을 분리하는 단계를 포함한다. In order to achieve the above object, a method of manufacturing a liquid crystal display device according to the present invention may include forming a metal pattern on a buffer substrate, forming a bonding layer by coating a thermal adhesive on the metal pattern, and forming a plastic substrate on the bonding layer. Mounting, thermally bonding the metal pattern and the plastic substrate, forming a thin film transistor, wirings and pixel electrodes connected to the thin film transistor on the plastic substrate, a color including a red green, a blue color filter, a black matrix, and a reference electrode Forming a filter substrate, filling and sealing the liquid crystal between the plastic substrate and the color filter substrate, and removing the metal pattern by wet etching to separate the plastic substrate and the buffer substrate.

이때 버퍼 기판은 유리 기판을 사용하는 것이 바람직하다. 그리고 열로 접합하는 방법은 플라스틱 기판을 고온 압착하는 방법 또는 금속 패턴에 전압을 인가하여 발열된 열로 접합하는 방법 중 하나인 것이 바람직하다. At this time, the buffer substrate is preferably a glass substrate. And the method of bonding by heat is preferably one of a method of high-temperature pressing the plastic substrate or a method of bonding by heat generated by applying a voltage to the metal pattern.

또한, 금속 패턴은 IZO 또는 ITO 로 형성하고, 습식 식각시 초음파를 가해주는 것이 바람직하다. In addition, the metal pattern is formed of IZO or ITO, it is preferable to apply ultrasonic waves during wet etching.

이하 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

이제 본 발명의 실시예를 도면과 함께 상세히 설명한다. 도 1a 내지 도 1e는 본 발명에 따른 플라스틱 기판을 버퍼 기판에 부착 및 탈착하는 과정을 순서대로 도시한 도면이다. Embodiments of the present invention will now be described in detail with reference to the drawings. 1A to 1E are diagrams sequentially illustrating a process of attaching and detaching a plastic substrate to a buffer substrate according to the present invention.

도 1a에 도시한 바와 같이, 버퍼 기판(100) 위에 금속층을 형성한 후 패터닝하여 금속 패턴(102)을 형성한다. 버퍼 기판은 유리 기판(100)을 사용하는 것이 바람직하다. As shown in FIG. 1A, a metal layer is formed on the buffer substrate 100 and then patterned to form a metal pattern 102. It is preferable to use the glass substrate 100 as a buffer substrate.

그리고 금속 패턴(102)은 고저항 금속을 사용하여 형성하며, 바람직하게는 IZO, ITO 등을 사용한다. 금속 패턴(102)은 도 2에서와 같이 한글 ㄹ자가 계속 연결된 형태로 형성한다. 이는 금속 패턴(102)의 양단에 전압을 인가하여 저항에 의해 발열되는 열을 최대화하고, 이후에 제거를 용이하게 하기 위한 것이다. The metal pattern 102 is formed using a high resistance metal, and preferably IZO, ITO, or the like. As shown in FIG. 2, the metal pattern 102 is formed in a form in which the Hangul letter R is continuously connected. This is to apply a voltage across the metal pattern 102 to maximize the heat generated by the resistance, and to facilitate later removal.

또한, 도 1b에 도시한 바와 같이, 금속 패턴(102) 위에 접합층(104)을 형성한다. 접합층(104)은 열점착액을 분사하여 형성한다. 분사 방식은 열점착액이 기판(100) 전체에 얇게 도포되도록 한다. 따라서 점착액이 금속 패턴(102) 사이를 메워 금속 패턴(102) 사이에 형성된 접합층(104)과 이후에 얹혀지는 플라스틱 기판이 접합되지 않고, 일정한 간격을 유지하도록 한다. 만약 공간이 없다면 금속 패턴(103) 사이의 접합층(104)과 플라스틱 기판이 접합되어 마지막 공정에서 접합층(104)으로부터 플라스틱 기판을 분리하기가 어려워진다. In addition, as shown in FIG. 1B, the bonding layer 104 is formed on the metal pattern 102. The bonding layer 104 is formed by spraying a heat adhesive liquid. The spraying method allows the heat-adhesive liquid to be applied thinly on the entire substrate 100. Therefore, the adhesive liquid fills the spaces between the metal patterns 102 so that the bonding layer 104 formed between the metal patterns 102 and the plastic substrate placed thereon are not bonded to each other and maintain a constant distance. If there is no space, the bonding layer 104 between the metal pattern 103 and the plastic substrate are bonded, making it difficult to separate the plastic substrate from the bonding layer 104 in the final process.

열점착액은 열에 의해 경화되는 열경화성 수지로 에폭시 수지 계열을 사용한다. The heat adhesive liquid uses an epoxy resin series as a thermosetting resin cured by heat.

도 1c에 도시한 바와 같이, 접합층 위에 플라스틱 기판(106)을 배치한 후 플라스틱 기판(106)과 유리 기판(100)을 접합한다. 이 때, 기판(100, 106)을 접합하 는 방법은 기판 전체를 고온에서 가압하여 접합하거나, 금속 패턴(102)의 양단에 전압을 인가하여 금속 패턴(102)의 저항에 의해 발열된 열에 의해 접합한다. As shown in FIG. 1C, the plastic substrate 106 is disposed on the bonding layer, and then the plastic substrate 106 and the glass substrate 100 are bonded. In this case, the method of bonding the substrates 100 and 106 may be performed by pressing the entire substrate at a high temperature to bond or by applying heat to both ends of the metal pattern 102 by heat generated by the resistance of the metal pattern 102. Bond.

도 1d에 도시한 바와 같이, 플라스틱 기판(106) 위에 게이트 배선(도시하지 않음), 게이트 배선과 절연되어 교차하는 데이터 배선(도시하지 않음), 이들과 연결되는 박막 트랜지스터 및 박막 트랜지스터와 연결되어 있는 화소 전극(190)을 형성하여 박막 트랜지스터 표시판(1)을 완성한다. 박막 트랜지스터는 게이트 배선의 일부인 게이트 전극(123), 데이터 배선의 일부인 소스 전극(173), 소스 전극과 대향하는 드레인 전극(175), 게이트 전극의 위에 형성되며 소스 전극(173)과 드레인 전극(175) 사이에 채널을 형성하기 위한 반도체층(154)을 포함한다. 그리고 소스 전극(173), 드레인 전극(175)과 반도체층(154) 사이에 형성되어 있는 저항성 접촉층(163, 165)을 더 포함한다. As shown in FIG. 1D, a gate wiring (not shown), a data wiring (not shown) that is insulated from and intersects with the gate wiring, a thin film transistor and a thin film transistor connected thereto are connected to the plastic substrate 106. The pixel electrode 190 is formed to complete the thin film transistor array panel 1. The thin film transistor is formed on the gate electrode 123 which is a part of the gate wiring, the source electrode 173 which is a part of the data wiring, the drain electrode 175 facing the source electrode, and the gate electrode and is formed on the source electrode 173 and the drain electrode 175. ) And a semiconductor layer 154 for forming channels therebetween. The semiconductor device may further include ohmic contacts 163 and 165 formed between the source electrode 173, the drain electrode 175, and the semiconductor layer 154.

이후 색필터 표시판(2)을 형성하기 위해, 투명한 유리 기판(210) 위에 블랙 매트릭스(220)를 형성하고, 블랙 매트릭스(220)에 의해 정의되는 영역에 색필터(230R, 230G, 230B)를 형성한다. 그리고 색필터(230R, 230G, 230B) 위에 기준 전극(270)을 형성한다. Then, in order to form the color filter panel 2, the black matrix 220 is formed on the transparent glass substrate 210, and the color filters 230R, 230G, and 230B are formed in the region defined by the black matrix 220. do. The reference electrode 270 is formed on the color filters 230R, 230G, and 230B.

박막 트랜지스터 표시판(1)과 색필터 표시판(2)을 대향하도록 배치한 후 액정(도시하지 않음)을 주입한 후 밀봉재(310)로 밀봉하여 액정 표시 장치를 완성한다. 이때 박막 트랜지스터 표시판(1) 위에 액정을 미리 주입한 후 색필터 표시판(2)을 배치한 후 가압하여 액정 표시 장치를 형성할 수도 있다. After the thin film transistor array panel 1 and the color filter panel 2 are disposed to face each other, a liquid crystal (not shown) is injected and then sealed with a sealing material 310 to complete the liquid crystal display. In this case, the liquid crystal may be pre-injected on the thin film transistor array panel 1, and then the color filter display panel 2 is disposed and pressed to form a liquid crystal display device.

도 1e에 도시한 바와 같이, 습식 식각으로 액정 표시 장치와 유리 기판(100) 을 분리한다. 여기서 습식 식각시 초음파를 가하면 탈착이 더 용이해진다. 초음파는 기판에 진동을 발생시켜 진동에 의해 식각이 용이하게 되도록 한다. As shown in FIG. 1E, the liquid crystal display and the glass substrate 100 are separated by wet etching. In this case, the ultrasonic wave is applied during the wet etching to make the desorption easier. Ultrasonic waves generate vibration on the substrate to facilitate etching by vibration.

이후 세정으로 플라스틱 기판(106)에 남겨진 접합층(104)을 제거하여 액정 표시 장치를 완성한다. Thereafter, the bonding layer 104 left on the plastic substrate 106 is removed by cleaning to complete the liquid crystal display device.

본 발명에 대한 설명은 액정 표시 장치 한 개에 대해서 설명하였다. 그러나 양산시에는 액정 표시 장치가 하나의 플라스틱 기판 위에 복수 개 형성되기 때문에 각각의 액정 표시 장치로 절단한 후 유리 기판과 액정 표시 장치를 분리한다. Description of the present invention has been described with respect to one liquid crystal display device. However, in mass production, since a plurality of liquid crystal display devices are formed on one plastic substrate, the glass substrate and the liquid crystal display device are separated after being cut into each liquid crystal display device.

이상 본 발명의 바람직한 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements using the basic concept of the present invention as defined in the following claims are also within the scope of the present invention. It belongs to.

이상 기술한 바와 같이, 본 발명에 따른 탈, 부착 방법을 이용하면 플라스틱 기판을 사용하여 박막 트랜지스터 기판을 용이하게 제조할 수 있다. 따라서 종래의 유리 기판을 이용한 공정에 그대로 사용하여 설비의 변경을 하지 않아도 된다. As described above, the thin film transistor substrate can be easily manufactured using a plastic substrate by using the detachment and attachment method according to the present invention. Therefore, it does not need to change a facility, using it as it is in the process using a conventional glass substrate.

Claims (5)

버퍼 기판 위에 금속 패턴을 형성하는 단계, Forming a metal pattern on the buffer substrate, 상기 금속 패턴 위에 열점착액을 코팅하여 접합층을 형성하는 단계, Forming a bonding layer by coating a thermal adhesive on the metal pattern; 상기 접합층 위에 플라스틱 기판을 얹는 단계,Placing a plastic substrate on the bonding layer, 상기 금속 패턴과 상기 플라스틱 기판을 열로 접합하는 단계,Bonding the metal pattern and the plastic substrate to heat; 상기 플라스틱 기판 위에 박막 트랜지스터, 상기 박막 트랜지스터와 연결되는 배선 및 화소 전극을 형성하는 단계,Forming a thin film transistor, wirings and pixel electrodes connected to the thin film transistor on the plastic substrate, 적, 녹, 청색 색필터, 블랙 매트릭스 및 기준 전극을 포함하는 색필터 기판을 형성하는 단계,Forming a color filter substrate comprising red, green, blue color filters, a black matrix and a reference electrode, 상기 플라스틱 기판과 상기 색필터 기판 사이에 액정을 충진한 후 밀봉하는 단계,Filling the liquid crystal between the plastic substrate and the color filter substrate and then sealing the liquid crystal; 상기 금속 패턴을 습식 식각으로 제거하여 상기 플라스틱 기판과 상기 버퍼 기판을 분리하는 단계를 포함하는 액정 표시 장치의 제조 방법.And removing the metal pattern by wet etching to separate the plastic substrate from the buffer substrate. 제1항에서,In claim 1, 상기 버퍼 기판은 유리 기판인 액정 표시 장치의 제조 방법.The buffer substrate is a glass substrate manufacturing method of a liquid crystal display device. 제1항에서,In claim 1, 상기 열로 접합하는 방법은 상기 플라스틱 기판을 고온 압착하는 방법 또는 상기 금속 패턴에 전압을 인가하여 발열된 열로 접합하는 방법 중 하나인 액정 표시 장치의 제조 방법.The method of bonding by heat is one of a method of high-temperature pressing the plastic substrate or a method of bonding a heat generated by applying a voltage to the metal pattern. 제1항에서,In claim 1, 상기 금속 패턴은 IZO 또는 ITO 로 형성하는 액정 표시 장치의 제조 방법.And the metal pattern is formed of IZO or ITO. 제1항에서,In claim 1, 상기 습식 식각시 초음파를 가해주는 액정 표시 장치의 제조 방법.A method of manufacturing a liquid crystal display device applying ultrasonic waves during the wet etching.
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JPH0764038A (en) * 1993-08-31 1995-03-10 Matsushita Electric Ind Co Ltd Production of flexible liquid crystal display panel
JP2001060697A (en) * 1995-02-16 2001-03-06 Semiconductor Energy Lab Co Ltd Thin-film integrated circuit
KR20020032951A (en) * 2000-10-28 2002-05-04 구본준, 론 위라하디락사 An array substrate for liquid crystal display device and method of manufacturing there of

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Publication number Priority date Publication date Assignee Title
JPH0764038A (en) * 1993-08-31 1995-03-10 Matsushita Electric Ind Co Ltd Production of flexible liquid crystal display panel
JP2001060697A (en) * 1995-02-16 2001-03-06 Semiconductor Energy Lab Co Ltd Thin-film integrated circuit
KR20020032951A (en) * 2000-10-28 2002-05-04 구본준, 론 위라하디락사 An array substrate for liquid crystal display device and method of manufacturing there of

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