KR100890975B1 - 칩 검사장치 - Google Patents
칩 검사장치 Download PDFInfo
- Publication number
- KR100890975B1 KR100890975B1 KR1020080002040A KR20080002040A KR100890975B1 KR 100890975 B1 KR100890975 B1 KR 100890975B1 KR 1020080002040 A KR1020080002040 A KR 1020080002040A KR 20080002040 A KR20080002040 A KR 20080002040A KR 100890975 B1 KR100890975 B1 KR 100890975B1
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- external connection
- chip
- socket
- connection terminal
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
상기와 같은 프로브핀은 반도체 패키지 테스트 소켓용 프로브핀, 마이크로 프로세스 테스트 소켓용 프로브핀, 전자기기 테스트 소켓용 프로브핀으로 사용이 되도록 되어 있다.
Claims (4)
- 소켓판에 고정되고 탄성부재에 의해 탄성되는 탐침으로 칩을 검사하도록 구성되는 칩 검사장치에 있어서,상기 소켓판을 탄성재질로 구성하고, 상기 탐침의 상부와 하부가 상기 소켓판의 상면과 하면에 일정길이 돌출되도록 40-50°의 경사각으로 고정되어 소켓판의 탄성력에 의해 탐침이 탄성력을 가지도록 구성한 것을 특징으로 하는 칩 검사장치
- (삭제)
- (삭제)
- (삭제)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080002040A KR100890975B1 (ko) | 2008-01-08 | 2008-01-08 | 칩 검사장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080002040A KR100890975B1 (ko) | 2008-01-08 | 2008-01-08 | 칩 검사장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100890975B1 true KR100890975B1 (ko) | 2009-03-27 |
Family
ID=40698816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080002040A KR100890975B1 (ko) | 2008-01-08 | 2008-01-08 | 칩 검사장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100890975B1 (ko) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1058766A (ja) * | 1996-08-23 | 1998-03-03 | Fuji Xerox Co Ltd | 画像データ出力制御装置 |
KR200148651Y1 (ko) | 1996-12-16 | 1999-06-15 | 문정환 | 반도체 비 지 에이 패키지 검사용 소켓 |
KR200144809Y1 (ko) | 1996-11-30 | 1999-06-15 | 정문술 | 반도체 소자 검사용 소켓 |
KR100232715B1 (ko) | 1997-02-25 | 1999-12-01 | 정문술 | 반도체 소자 테스터용 컨넥터 |
JP2000162270A (ja) | 1998-11-02 | 2000-06-16 | Delaware Capital Formation Inc | 試験用ソケット |
KR20010111118A (ko) * | 2000-06-08 | 2001-12-17 | 윤수 | 프로브 카드 |
US6356090B2 (en) * | 1997-12-24 | 2002-03-12 | Stmicroelectronics S.A. | Probe tip card for the testing of semiconductor components |
-
2008
- 2008-01-08 KR KR1020080002040A patent/KR100890975B1/ko not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1058766A (ja) * | 1996-08-23 | 1998-03-03 | Fuji Xerox Co Ltd | 画像データ出力制御装置 |
KR200144809Y1 (ko) | 1996-11-30 | 1999-06-15 | 정문술 | 반도체 소자 검사용 소켓 |
KR200148651Y1 (ko) | 1996-12-16 | 1999-06-15 | 문정환 | 반도체 비 지 에이 패키지 검사용 소켓 |
KR100232715B1 (ko) | 1997-02-25 | 1999-12-01 | 정문술 | 반도체 소자 테스터용 컨넥터 |
US6356090B2 (en) * | 1997-12-24 | 2002-03-12 | Stmicroelectronics S.A. | Probe tip card for the testing of semiconductor components |
JP2000162270A (ja) | 1998-11-02 | 2000-06-16 | Delaware Capital Formation Inc | 試験用ソケット |
KR20000035134A (ko) * | 1998-11-02 | 2000-06-26 | 워드 에이미 | 테스트 소켓 |
KR20010111118A (ko) * | 2000-06-08 | 2001-12-17 | 윤수 | 프로브 카드 |
Non-Patent Citations (2)
Title |
---|
한국공개실용신안번호 실1998-058766 |
한국공개특허공보 특2000-0035134호 |
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