KR100848837B1 - A memory module heat sink and it's manufacturing method - Google Patents

A memory module heat sink and it's manufacturing method Download PDF

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KR100848837B1
KR100848837B1 KR1020070078454A KR20070078454A KR100848837B1 KR 100848837 B1 KR100848837 B1 KR 100848837B1 KR 1020070078454 A KR1020070078454 A KR 1020070078454A KR 20070078454 A KR20070078454 A KR 20070078454A KR 100848837 B1 KR100848837 B1 KR 100848837B1
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South Korea
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memory module
manufacturing
heat sink
adhesive
heat dissipation
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KR1020070078454A
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Korean (ko)
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명윤경
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주식회사 휘닉스아이씨피
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Priority to PCT/KR2008/000796 priority patent/WO2009020265A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A memory module heat sink and a method for manufacturing the same are provided to improve productivity by unifying a dualized manufacture source. A method for manufacturing a memory module heat sink includes the step of: adhering a heat sink by adhesion devices which are provided on front and rear surfaces of a memory module and have a thermal conduction characteristic, wherein the adhesion device is formed through the steps of: preparing a liquid adhesive with the thermal conduction characteristic(S11); directly coating the liquid adhesive to a portion of the heat sink in contact with the memory module(S12); and curing the liquid adhesive(S13). The liquid adhesive is formed by adding a conductive filler and a curing agent to silicon.

Description

메모리모듈 방열장치 및 그 제조방법{A MEMORY MODULE HEAT SINK AND IT'S MANUFACTURING METHOD} MEMORY MODULE HEAT SINK AND IT'S MANUFACTURING METHOD}

본 발명은 메모리모듈의 방열장치에 관한 것으로서, 특히 히트싱크의 접착수단이 종래기술에서 시트형 패드로 형성하는데 수반되었던 여러 중간단계 및 패드 재단공정을 배제하고 이원화되었던 제조원을 하나로 하여 히트싱크의 제조가 현저히 간편해지며 생산성을 획기적으로 향상시켜 제조비용을 대폭 절감시키도록 하는 메모리모듈 방열장치 및 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation device of a memory module, and more particularly, to manufacture a heat sink by using one of the manufacturing units which has been dualized, excluding various intermediate steps and pad cutting processes, which were involved in forming a sheet-type pad in the prior art. The present invention relates to a memory module heat dissipation device and a method of manufacturing the same, which are greatly simplified and greatly improve the productivity to significantly reduce the manufacturing cost.

메모리모듈의 고성능화 및 고속화가 증대되고 이에 비례하여 발열량이 증대됨에 따라 메모리모듈 방열장치의 중요성이 더욱 강조되고 있다.As the high performance and high speed of the memory module is increased and the heat generation amount is increased in proportion to the memory module, the importance of the memory module heat dissipation device is further emphasized.

종래기술의 메모리모듈 방열장치(100)는 도 1에 도시된 바와 같이, 메모리모듈(2) 전ㆍ후면에 각각 히트싱크가 열전도 특성을 갖는 접착패드(130)를 통하여 히트싱크(110A)(110B)가 접착되고, 상기 전ㆍ후면의 히트싱크를 고정하는 클립(150)이 부여되어 구성된다.As shown in FIG. 1, the memory module heat dissipating device 100 according to the related art has heat sinks 110A and 110B formed on the front and rear surfaces of the memory module 2 through adhesive pads 130 having thermal conductivity. ) Is bonded to each other, and a clip 150 for fixing the front and rear heat sinks is provided.

상기 접착패드(130)는 히트싱크가 메모리모듈에 부착되기 위한 접착수단으로서 열전도 특성을 갖는 점성체(粘性體)로 이루어진다.The adhesive pad 130 is made of a viscous body having thermal conductivity as an adhesive means for attaching the heat sink to the memory module.

종래기술 메모리모듈 방열장치에서 접착수단으로서의 상기 접착패드(130)의 제조 및 취부는 도 2에 나타낸 바와 같이. 실리콘원액에 경화제를 혼합 경화시켜 액상의 점착제를 조성(S21)한 다음 슬림 시트형 패드를 형성한다(S22).Manufacturing and mounting of the adhesive pad 130 as an adhesive means in the prior art memory module heat dissipation device as shown in FIG. The curing agent is mixed and cured in the silicon stock solution to form a liquid adhesive (S21), and then a slim sheet pad is formed (S22).

상기 슬림 시트형 패드 형성공정(S22)은 여러 단계의 서브공정을 거치는 것으로서 점성을 갖는 얇은 시트에 다단계의 공정이 가해져야 되므로 취급이 대단히 번거롭고 많은 시간과 인력이 투입된다.The slim sheet pad forming step (S22) is a multi-step process to be applied to a thin sheet having a viscous step as a multi-step sub-process is very cumbersome to handle and a lot of time and manpower.

이후 액상 점착제의 경화공정을 거치며(S23), 여기까지의 공정은 접착패드 제조공장에서 이루어진다.After going through the curing process of the liquid adhesive (S23), the process up to here is made in the adhesive pad manufacturing plant.

그리고 슬림 시트형 패드가 히트싱크 조립제조현장에 제공되며, 히트싱크 조립현장에서는 슬림 시트형 패드를 해당 규격으로 재단하여(S24) 히트싱크에 조립 부착하였다(S25).And a slim sheet pad is provided in the heat sink assembly manufacturing site, in the heat sink assembly site, the slim sheet pad was cut to the corresponding standard (S24) and attached to the heat sink (S25).

종래기술에서는 상기와 같이, 제조원이 접착패드 제조공장과 히트싱크 조립현장으로 이원화되고, 여러 단계의 공정을 통하여 슬림 시트형 패드로 제조된 후 히트싱크 조립현장에서 다시 재단과정을 거쳐 하나의 패드로 부착되므로 인력과 시간이 과다하게 소요되고 제조원가를 상승시키는 문제점이 있었다.In the prior art, as described above, the manufacturer is dualized into the adhesive pad manufacturing plant and the heat sink assembly site, and manufactured as a slim sheet pad through several steps, and then attached to one pad through the cutting process again at the heat sink assembly site. As a result, excessive labor and time are required, and there is a problem of increasing manufacturing costs.

본 발명은 상기한 문제점을 해소하기 위하여 안출된 것으로서,The present invention has been made to solve the above problems,

본 발명의 목적은 히트싱크의 접착수단이 종래기술에서 시트형 패드로 형성하는데 수반되었던 여러 중간단계 및 패드 재단공정을 배제하고 이원화되었던 제조원을 하나로 하여 히트싱크의 제조가 현저히 간편해지며 생산성을 획기적으로 향상시켜 제조비용을 대폭 절감시키도록 하는 메모리모듈 방열장치 및 그 제조방법을 제공함에 있다.The object of the present invention is to simplify the production of the heat sink by excluding one of the intermediate steps and pad cutting process involved in forming the sheet-shaped pad in the prior art, and the production of the heat sink is significantly simpler and significantly improves the productivity. To provide a memory module heat dissipation device and a method of manufacturing the same to significantly reduce the manufacturing cost.

상기한 목적을 달성하는 본 발명에 따른 메모리모듈 방열장치 제조방법은
메모리모듈 전ㆍ후면에 각각 구비되며 열전도 특성을 갖는 접착수단에 의하여 히트싱크가 접착되는 메모리모듈 방열장치의 제조방법에 있어서,
상기 접착수단은
열전도 특성을 갖는 액상 점착제 준비공정;
상기 액상 점착제를 히트싱크의 메모리모듈과 접하는 부분에 직접 도포하는 공정; 및
상기 액상 점착제 경화공정;으로 형성되고,
상기 액상 점착제는 실리콘에 열전도성 충전제(filler) 및 경화제가 첨가된 것을 특징으로 한다.Memory module heat dissipation device manufacturing method according to the present invention for achieving the above object
In the manufacturing method of the memory module heat dissipation device which is provided on the front and rear surfaces of the memory module and the heat sink is bonded by the adhesive means having thermal conductivity,
The adhesive means
Preparing a liquid adhesive having thermal conductivity;
Directly applying the liquid adhesive to a portion in contact with the memory module of the heat sink; And
The liquid pressure-sensitive adhesive curing step;
The liquid adhesive is characterized in that the thermal conductive filler (hardener) and the curing agent is added to the silicone.

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상기한 목적을 달성하는 본 발명에 따른 메모리모듈 방열장치는Memory module heat dissipation device according to the present invention to achieve the above object

상기 제조방법에 의하여 제조된 것을 특징으로 한다.Characterized in that the manufacturing method.

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상기 구성을 지닌 본 발명에 따른 메모리모듈 방열장치 및 그 제조방법은 히트싱크의 접착수단이 종래기술에서 시트형 패드로 형성하는데 수반되었던 여러 중간단계 및 패드 재단공정이 빠지게 되고 이원화되었던 제조원이 하나로 되어 히트싱크의 제조가 현저히 간편해지며 생산성을 획기적으로 향상시켜 제조비용을 대폭 절감시키는 뛰어난 효과가 있다.Memory module heat dissipation device and a manufacturing method according to the present invention having the above configuration is the heat sink adhesive means is a number of intermediate steps and pad cutting process involved in forming a sheet-like pad in the prior art is eliminated and the heat source is a unit The manufacturing of sinks is significantly simplified and the productivity is dramatically improved, which greatly reduces the manufacturing cost.

이하, 본 발명의 메모리모듈 방열장치 및 그 제조방법에 대한 실시예를 첨부도면을 참조하여 보다 상세히 설명한다.Hereinafter, an embodiment of a memory module heat dissipation device and a method of manufacturing the same will be described in more detail with reference to the accompanying drawings.

도 3은 본 발명에 따른 메모리모듈 방열장치 접착수단 제조 과정도, 도 4는 본 발명에 따른 일 실시예의 메모리모듈 방열장치 일부 사시도이다.Figure 3 is a process of manufacturing a memory module heat dissipating device adhesive means according to the present invention, Figure 4 is a partial perspective view of the memory module heat dissipating device of one embodiment according to the present invention.

도 3 및 도 4에 도시된 바와 같이, 본 발명에 따른 메모리모듈 방열장치 제조방법은 메모리모듈(2) 전ㆍ후면에 각각 구비되며 열전도 특성을 갖는 접착수단에 의하여 히트싱크가 접착되는 메모리모듈 방열장치의 제조방법에 있어서,
상기 접착수단은 열전도 특성을 갖는 액상 점착제 준비공정(S11),
상기 액상 점착제를 히트싱크의 메모리모듈과 접하는 부분에 직접 도포하는 공정(S12), 및 상기 액상 점착제 경화공정(S13)으로 형성되고, 상기 액상 점착제(31)는 실리콘에 열전도성 충전제(filler) 및 경화제가 첨가되는 것이다.As shown in Figures 3 and 4, the method for manufacturing a memory module heat dissipation device according to the present invention is provided on the front and rear surfaces of the memory module 2, respectively, and heat dissipation of the memory module to which the heat sink is bonded by an adhesive means having thermal conductivity. In the manufacturing method of the device,
The adhesive means is a liquid pressure-sensitive adhesive preparation step (S11) having a thermal conductivity,
The liquid pressure-sensitive adhesive is formed by a process of directly applying the liquid pressure-sensitive adhesive to the memory module of the heat sink (S12), and the liquid pressure-sensitive adhesive curing process (S13), wherein the liquid pressure-sensitive adhesive 31 is a thermally conductive filler (silicone) and Hardener is added.

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또한, 상기 액상 점착제는 2액형으로 됨이 바람직하다.
그 중 하나는 열전도 실리콘이 주제이며 또 하나는 경화제로서 두 종류가 적정비율로 혼합되어야 하고 특정조건(150도에서 30분 가열)에서 경화가 이루어진다.
액상 점착제는 상온에서 경화시킬 경우에는 시간이 대단히 오래 걸린다.
주제와 경화제의 혼합비율은 기본적으로 50:50에서부터 최대 80:20 비율로 혼합하여 경화 후의 경도를 조절한다.
액상 점착제의 경도조절은 히트싱크가 넓은 면적의 메모리모듈상의 디램들에 충분히 접착되도록 하는 적정경도를 갖도록 하기 위함으로 적정경도는 실리콘 제조메이커에 따라 차이가 있다.In addition, the liquid adhesive is preferably in a two-component type.
One of them is heat conductive silicone, and the other is a curing agent, and the two kinds must be mixed in an appropriate ratio, and curing occurs under specific conditions (heating at 150 ° C for 30 minutes).
Liquid adhesives take a very long time when cured at room temperature.
The mixing ratio of the main material and the curing agent is basically mixed at a ratio of 50:50 to a maximum of 80:20 to adjust the hardness after curing.
Hardness control of the liquid adhesive is to ensure that the heat sink has a suitable hardness to sufficiently adhere to the DRAMs on the memory module of a large area, the appropriate hardness is different depending on the silicon manufacturer.

상기 액상 점착제(31)는 히트싱크(10)에 실크인쇄 또는 스텐실 인쇄기법으로 도포됨이 바람직하다.The liquid adhesive 31 is preferably applied to the heat sink 10 by silk printing or stencil printing.

또한, 상기 액상 점착제(31)는 히트싱크(10)에 디스펜서를 이용하여 투출 도포되어도 무방하다.In addition, the liquid adhesive 31 may be applied to the heat sink 10 by a dispenser.

본 발명에 따른 메모리모듈 방열장치(1)는 메모리모듈(2) 전ㆍ후면에 각각 열전도 특성을 갖는 접착수단에 의하여 히트싱크(10)가 접착되는 메모리모듈 방열장치에 있어서, 상기 접착수단(30)은 히트싱크(10)의 해당부분에 열전도 특성을 갖는 액상 점착제(31)를 직접 도포하여 경화시켜 이루어지는 것이다(도 4 참조).The memory module heat dissipation device 1 according to the present invention is a memory module heat dissipation device in which a heat sink 10 is adhered to the front and rear surfaces of the memory module 2 by adhesive means having thermal conductivity, respectively. ) Is formed by applying a cured liquid pressure-sensitive adhesive 31 having thermal conductivity directly to the corresponding portion of the heat sink 10 (see FIG. 4).

이와 같은 본 발명에 따른 메모리모듈 방열장치(1) 및 그 제조방법은 히트싱크(10)를 메모리모듈(2)에 취부시키기 위한 접착수단(30) 형성공정이 대폭적으로 감축되어 생산성을 현저히 향상시키고 제조비용을 절감시키게 된다.The memory module heat dissipation device 1 and the method of manufacturing the same according to the present invention greatly reduce the process of forming the adhesive means 30 for attaching the heat sink 10 to the memory module 2, thereby significantly improving productivity. The manufacturing cost is reduced.

또한, 대량생산이 용이하게 이루어지며 방열장치 조립라인의 자동화를 가능하게 한다. In addition, mass production is facilitated and enables automation of the heat dissipation assembly line.

즉, 액상 점착제(31)를 직접 히트싱크(10)에 도포하여 접착수단(30)의 형성이 완료되므로 자동화가 가능하고, 종래기술에서 시트형 패드로 형성하는데 수반되었던 여러 중간단계 및 패드 재단공정이 빠지게 되고 더구나 이원화되었던 제조원이 하나로 되어 히트싱크의 제조가 현저히 간편해지며 생산성을 획기적으로 향상시키게 된다.That is, since the liquid pressure-sensitive adhesive 31 is directly applied to the heat sink 10 and the formation of the adhesive means 30 is completed, automation is possible, and various intermediate steps and pad cutting processes involved in forming a sheet-type pad in the prior art are possible. In addition, the production of the heat sink is further reduced, and the manufacturing of the heat sink is greatly simplified and the productivity is dramatically improved.

이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정된 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능한 것이 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be apparent to those who have knowledge.

도 1은 종래기술의 메모리모듈 방열장치1 is a memory module heat radiation device of the prior art

도 2의 종래기술의 메모리모듈 방열장치 접착수단 제조 과정도Process diagram of manufacturing a memory module heat radiation device bonding means of Figure 2

도 3은 본 발명에 따른 메모리모듈 방열장치 접착수단 제조 과정도Figure 3 is a process diagram of manufacturing a memory module heat radiation device adhesive means according to the invention

도 4는 본 발명에 따른 일 실시예의 메모리모듈 방열장치 일부 사시도Figure 4 is a partial perspective view of the memory module heat dissipation device of one embodiment according to the present invention

*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

1: 본 발명에 따른 메모리모듈 방열장치1: Memory module heat dissipation device according to the present invention

2: 메모리모듈 10: 히트싱크2: memory module 10: heatsink

30: 접착수단 31: 액상 점착제30: bonding means 31: liquid adhesive

Claims (5)

삭제delete 메모리모듈(2) 전ㆍ후면에 각각 구비되며 열전도 특성을 갖는 접착수단에 의하여 히트싱크가 접착되는 메모리모듈 방열장치의 제조방법에 있어서,In the manufacturing method of the memory module heat dissipation device is provided on the front and rear of the memory module 2, the heat sink is bonded by an adhesive means having thermal conductivity, 상기 접착수단은The adhesive means 열전도 특성을 갖는 액상 점착제 준비공정(S11); Liquid pressure-sensitive adhesive preparation step having a thermal conductivity (S11); 상기 액상 점착제를 히트싱크의 메모리모듈과 접하는 부분에 직접 도포하는 공정(S12); 및Directly applying the liquid adhesive to a portion in contact with the memory module of the heat sink (S12); And 상기 액상 점착제 경화공정(S13);으로 형성되고,The liquid pressure-sensitive adhesive curing step (S13); 상기 액상 점착제(31)는 실리콘에 열전도성 충전제(filler) 및 경화제가 첨가된 것을 특징으로 하는 메모리모듈 방열장치 제조방법.The liquid adhesive 31 is a method of manufacturing a memory module heat dissipation device, characterized in that the thermal conductive filler (filler) and the curing agent is added to the silicon. 청구항 2에 있어서,The method according to claim 2, 상기 액상 점착제(31)는 히트싱크(10)에 실크인쇄 또는 스텐실 인쇄기법으로 도포됨을 특징으로 하는 메모리모듈 방열장치 제조방법.The liquid adhesive 31 is a method for manufacturing a memory module heat dissipation device, characterized in that applied to the heat sink 10 by silk printing or stencil printing technique. 청구항 2에 있어서,The method according to claim 2, 상기 액상 점착제(31)는 히트싱크(10)에 디스펜서를 이용하여 투출 도포됨을 특징으로 하는 메모리모듈 방열장치 및 그 제조방법.The liquid pressure-sensitive adhesive 31 is a heat dissipating device and a method of manufacturing a memory module, characterized in that the heat sink 10 is dispensed by using a dispenser. 청구항 2의 제조방법에 의하여 제조된 것을 특징으로 하는 메모리모듈 방열장치.Memory module heat dissipation device, characterized in that manufactured by the manufacturing method of claim 2.
KR1020070078454A 2007-08-06 2007-08-06 A memory module heat sink and it's manufacturing method KR100848837B1 (en)

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PCT/KR2008/000796 WO2009020265A1 (en) 2007-08-06 2008-02-12 Heat dissipating device for memory modules and method of manufacturing the same

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Citations (3)

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Publication number Priority date Publication date Assignee Title
KR20000006134A (en) * 1998-06-12 2000-01-25 가네꼬 히사시 Heat sink and memory module with heat sink
KR20040024540A (en) * 2001-04-06 2004-03-20 신에쓰 가가꾸 고교 가부시끼가이샤 Radiating structural body of electronic part and radiating sheet used for the radiating structural body
KR20070078792A (en) * 2006-01-30 2007-08-02 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 Thermal interface material

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JP2004253406A (en) * 2002-12-24 2004-09-09 Adtec:Kk Module cover and memory module
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive

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Publication number Priority date Publication date Assignee Title
KR20000006134A (en) * 1998-06-12 2000-01-25 가네꼬 히사시 Heat sink and memory module with heat sink
KR20040024540A (en) * 2001-04-06 2004-03-20 신에쓰 가가꾸 고교 가부시끼가이샤 Radiating structural body of electronic part and radiating sheet used for the radiating structural body
KR20070078792A (en) * 2006-01-30 2007-08-02 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 Thermal interface material

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