KR100806841B1 - 슬러리 공급장치에서의 버블 댐퍼 - Google Patents
슬러리 공급장치에서의 버블 댐퍼 Download PDFInfo
- Publication number
- KR100806841B1 KR100806841B1 KR1020060087552A KR20060087552A KR100806841B1 KR 100806841 B1 KR100806841 B1 KR 100806841B1 KR 1020060087552 A KR1020060087552 A KR 1020060087552A KR 20060087552 A KR20060087552 A KR 20060087552A KR 100806841 B1 KR100806841 B1 KR 100806841B1
- Authority
- KR
- South Korea
- Prior art keywords
- slurry
- vessel
- damper
- drum
- bubble damper
- Prior art date
Links
- 239000002002 slurry Substances 0.000 title claims abstract description 187
- 238000000034 method Methods 0.000 claims description 19
- 230000001939 inductive effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000010419 fine particle Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910021642 ultra pure water Inorganic materials 0.000 description 5
- 239000012498 ultrapure water Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0036—Flash degasification
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0073—Degasification of liquids by a method not covered by groups B01D19/0005 - B01D19/0042
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Treatment Of Sludge (AREA)
Abstract
Description
Claims (10)
- 슬러리를 저장하고 있는 슬러리 드럼(Slurry drum);상기 슬러리 드럼으로부터 상기 슬러리를 공급받는 베슬(Vessel); 및상기 슬러리 드럼과 상기 베슬 사이에 위치하여 상기 슬러리 드럼으로부터 운반되는 슬러리에서 발생하는 기포를 수거하는 버블 댐퍼(Bubble damper)를 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서,상기 베슬에 연결되어 상기 베슬의 압력을 상대적으로 낮게 하여 상기 버블 댐퍼에 있는 슬러리를 상기 베슬에 공급하는 진공 펌프를 더 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서, 상기 버블 댐퍼는상기 버블 댐퍼에 슬러리의 양을 감지하는 댐퍼 센서를 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서,상기 버블 댐퍼에 연결되고, 상대적으로 유속이 빠른 가스 유동을 통하여 상기 버블 댐퍼에 상대적으로 낮은 압력을 유도함에 의해 상기 슬러리 드럼으로부터 상기 버블 댐퍼에 슬러리를 운반하는 흡입기를 더 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서, 상기 베슬은상기 베슬에 있는 슬러리의 양을 감지하는 베슬 센서를 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서,상기 슬러리 드럼과 상기 베슬 댐퍼 사이에 위치하여 상기 슬러리 드럼으로부터 운반되는 슬러리에서 이물질을 걸러내는 드럼 필터(Drum filter)를 더 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서,가스 또는 초순수(DI water)에 의해 상기 버블 댐퍼를 세정하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 1항에 있어서,상기 슬러리 드럼과 상기 버블 댐퍼 사이에 위치하여 일정한 압력에 의해 슬러리 드럼에 저장된 슬러리를 상기 버블 댐퍼를 통하여 상기 베슬에 공급하는 가압 펌프를 더 포함하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 8항에 있어서,상기 버블 댐퍼에 슬러리가 줄어든 경우에 상기 베슬에 슬러리 공급을 멈추고 상기 슬러리 드럼에서 상기 버블 댐퍼로 상기 가압 펌프에 의해 슬러리를 채우는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
- 제 8항에 있어서,상기 버블 댐퍼로부터 상기 슬러리 드럼에 연결되는 배관을 설치하여 상기 가압 펌프에 의해 상기 버블 댐퍼에 잔류한 슬러리를 상기 슬러리 드럼에 운반하여 재사용하는, 슬러리 공급장치에서의 버블 댐퍼 시스템.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060087552A KR100806841B1 (ko) | 2006-09-11 | 2006-09-11 | 슬러리 공급장치에서의 버블 댐퍼 |
JP2007171379A JP4597168B2 (ja) | 2006-09-11 | 2007-06-29 | スラリ供給装置におけるバブルダンパ |
TW096127622A TW200812752A (en) | 2006-09-11 | 2007-07-27 | Bubble damper of slurry supply apparatus |
CNA2007101401822A CN101143275A (zh) | 2006-09-11 | 2007-08-08 | 研磨液供应装置的气泡抑制器 |
US11/899,366 US7776142B2 (en) | 2006-09-11 | 2007-09-05 | Bubble damper of slurry supply apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060087552A KR100806841B1 (ko) | 2006-09-11 | 2006-09-11 | 슬러리 공급장치에서의 버블 댐퍼 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100806841B1 true KR100806841B1 (ko) | 2008-02-22 |
Family
ID=39168261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060087552A KR100806841B1 (ko) | 2006-09-11 | 2006-09-11 | 슬러리 공급장치에서의 버블 댐퍼 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7776142B2 (ko) |
JP (1) | JP4597168B2 (ko) |
KR (1) | KR100806841B1 (ko) |
CN (1) | CN101143275A (ko) |
TW (1) | TW200812752A (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109866110A (zh) * | 2019-03-11 | 2019-06-11 | 东旭科技集团有限公司 | 排水装置及玻璃研磨机 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013013373A1 (zh) * | 2011-07-22 | 2013-01-31 | 温州欣视界科技有限公司 | 小型硬性角膜接触镜抛光液自动清洗装置 |
JP5741549B2 (ja) * | 2012-10-09 | 2015-07-01 | 東京エレクトロン株式会社 | 処理液供給方法、処理液供給装置及び記憶媒体 |
US9543417B2 (en) * | 2014-11-07 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | High mobility devices and methods of forming same |
CN106477503A (zh) * | 2015-08-31 | 2017-03-08 | 深圳市三叶草科技开发有限公司 | 一种乳胶供应*** |
CN113103150A (zh) * | 2021-04-23 | 2021-07-13 | 长鑫存储技术有限公司 | 研磨液供给***、研磨设备、排气方法及研磨方法 |
CN113842729B (zh) * | 2021-09-24 | 2022-11-25 | 南京利卡维智能科技有限公司 | 一种多轴研磨机用真空抽取机构及其真空研磨方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000020258A (ko) * | 1998-09-18 | 2000-04-15 | 윤종용 | 반도체 씨엠피설비의 슬러리공급시스템 |
JP2002075930A (ja) | 2000-08-28 | 2002-03-15 | Toshiba Corp | Cmp用スラリ供給タンク及び半導体装置の製造方法 |
JP2004122354A (ja) | 2002-09-10 | 2004-04-22 | M Fsi Kk | Cmp装置用スラリー調製供給装置および方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2385522A (en) * | 1942-05-16 | 1945-09-25 | Shell Dev | Lubricating system |
JPS60141469A (ja) * | 1983-12-29 | 1985-07-26 | Omron Tateisi Electronics Co | 鏡面加工方法 |
US5792237A (en) * | 1996-12-13 | 1998-08-11 | Taiwan Semiconductor Manufacturing Co Ltd | Method and apparatus for eliminating trapped air from a liquid flow |
US6171367B1 (en) * | 1997-06-05 | 2001-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for delivering and recycling a bubble-free liquid chemical |
JP2000271868A (ja) * | 1999-03-25 | 2000-10-03 | Nippei Toyama Corp | ワイヤソー |
EP1069474A1 (en) * | 1999-07-12 | 2001-01-17 | Chugai Photo Chemical Co. Ltd. | Solution feeding apparatus and method |
JP2001353660A (ja) * | 2000-06-12 | 2001-12-25 | Nippei Toyama Corp | スラリの再生方法及び再生システム |
JP4374794B2 (ja) * | 2001-03-29 | 2009-12-02 | 株式会社島津製作所 | 研磨装置 |
JP3890229B2 (ja) * | 2001-12-27 | 2007-03-07 | 株式会社コガネイ | 薬液供給装置および薬液供給装置の脱気方法 |
US6732017B2 (en) * | 2002-02-15 | 2004-05-04 | Lam Research Corp. | System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system |
US6702655B2 (en) * | 2002-07-05 | 2004-03-09 | Taiwan Semiconductor Manufacturing Co., Ltd | Slurry delivery system for chemical mechanical polisher |
US7204679B2 (en) * | 2002-09-30 | 2007-04-17 | Emerson Electric Co. | Flow control system |
US6860723B2 (en) | 2002-10-05 | 2005-03-01 | Taiwan Semiconductor Manufacturing Co., Ltd | Slurry flow control and monitor system for chemical mechanical polisher |
JP4358708B2 (ja) * | 2004-08-24 | 2009-11-04 | オリンパス株式会社 | レンズ研磨方法及びレンズ研磨装置 |
JP5297695B2 (ja) * | 2008-05-30 | 2013-09-25 | Sumco Techxiv株式会社 | スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法 |
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2006
- 2006-09-11 KR KR1020060087552A patent/KR100806841B1/ko active IP Right Grant
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2007
- 2007-06-29 JP JP2007171379A patent/JP4597168B2/ja active Active
- 2007-07-27 TW TW096127622A patent/TW200812752A/zh unknown
- 2007-08-08 CN CNA2007101401822A patent/CN101143275A/zh active Pending
- 2007-09-05 US US11/899,366 patent/US7776142B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000020258A (ko) * | 1998-09-18 | 2000-04-15 | 윤종용 | 반도체 씨엠피설비의 슬러리공급시스템 |
JP2002075930A (ja) | 2000-08-28 | 2002-03-15 | Toshiba Corp | Cmp用スラリ供給タンク及び半導体装置の製造方法 |
JP2004122354A (ja) | 2002-09-10 | 2004-04-22 | M Fsi Kk | Cmp装置用スラリー調製供給装置および方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109866110A (zh) * | 2019-03-11 | 2019-06-11 | 东旭科技集团有限公司 | 排水装置及玻璃研磨机 |
Also Published As
Publication number | Publication date |
---|---|
CN101143275A (zh) | 2008-03-19 |
JP4597168B2 (ja) | 2010-12-15 |
US20080060525A1 (en) | 2008-03-13 |
TW200812752A (en) | 2008-03-16 |
JP2008068393A (ja) | 2008-03-27 |
US7776142B2 (en) | 2010-08-17 |
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