KR100806381B1 - 웨이퍼 공급장치 - Google Patents
웨이퍼 공급장치 Download PDFInfo
- Publication number
- KR100806381B1 KR100806381B1 KR1020060137792A KR20060137792A KR100806381B1 KR 100806381 B1 KR100806381 B1 KR 100806381B1 KR 1020060137792 A KR1020060137792 A KR 1020060137792A KR 20060137792 A KR20060137792 A KR 20060137792A KR 100806381 B1 KR100806381 B1 KR 100806381B1
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- Prior art keywords
- wafer
- unit
- transfer unit
- cassette
- probing inspection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
- 삭제
- 웨이퍼에 형성된 반도체소자를 테스트하는 프로빙검사부에 상기 웨이퍼를 공급하는 장치에 있어서,카세트에 수납된 웨이퍼를 픽업하여 상기 프로빙검사부로 반ㆍ출입시키는 아암이 구비된 이송유닛;상기 이송유닛에 설치되고, 이온을 공급하는 장치와 연결되어 상기 웨이퍼에 이온을 분사하는 분사부; 및상기 이송유닛과 상기 프로빙검사부 사이에 설치되는 보조분사부;를 포함하는 것을 특징으로 하는 웨이퍼 공급장치.
- 웨이퍼에 형성된 반도체소자를 테스트하는 프로빙검사부에 상기 웨이퍼를 공급하는 장치에 있어서,카세트에 수납된 웨이퍼를 픽업하여 상기 프로빙검사부로 반ㆍ출입시키는 아암이 구비된 이송유닛; 및상기 이송유닛에 설치되고, 이온을 공급하는 장치와 연결되어 상기 웨이퍼에 이온을 분사하는 분사부;를 포함하되,상기 이송유닛은,상기 분사부가 설치되고, 다수개의 홀이 형성된 상부플레이트;상기 상부플레이트와 다수개의 연결부재로 결합되는 하부플레이트; 및상기 상ㆍ하부플레이트 사이에 설치되고, 상기 웨이퍼의 중심을 설정하는 센터조정기;를 포함하는 것을 특징으로 하는 웨이퍼 공급장치.
- 제 3항에 있어서,상기 분사부는,상기 센터조정기가 회전될 때 이온이 분사되어 상기 웨이퍼의 상면 전면적에 이온이 분사되는 것을 특징으로 하는 상기 웨이퍼 공급장치.
- 제 2항에 있어서,상기 보조분사부는,상기 웨이퍼가 공급되는 상기 프로빙검사부의 인입부에 횡 방향으로 다수개가 구비된 것을 특징으로 하는 상기 웨이퍼 공급장치.
- 제 5항에 있어서,상기 보조분사부는,양측 끝단의 거리가 적어도 상기 웨이퍼의 직경과 동일한 간격을 갖도록 설치되는 것을 특징으로 하는 상기 웨이퍼 공급장치.
- 삭제
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060137792A KR100806381B1 (ko) | 2006-12-29 | 2006-12-29 | 웨이퍼 공급장치 |
Applications Claiming Priority (1)
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KR1020060137792A KR100806381B1 (ko) | 2006-12-29 | 2006-12-29 | 웨이퍼 공급장치 |
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KR100806381B1 true KR100806381B1 (ko) | 2008-02-27 |
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KR1020060137792A KR100806381B1 (ko) | 2006-12-29 | 2006-12-29 | 웨이퍼 공급장치 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101021239B1 (ko) * | 2008-11-25 | 2011-03-11 | 스템코 주식회사 | 프로브 카드, 이를 포함하는 연성 인쇄 회로 기판의 검사 시스템, 및 연성 인쇄 회로 기판의 검사 방법 |
TWI495032B (zh) * | 2008-06-13 | 2015-08-01 | Tokyo Electron Ltd | 被處理體的移載機構及被處理體的處理系統 |
KR102590869B1 (ko) * | 2022-08-05 | 2023-10-19 | 제너셈(주) | 플립 칩 본딩을 위한 웨이퍼 로딩 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH022144A (ja) * | 1988-06-13 | 1990-01-08 | Tokyo Electron Ltd | 半導体ウエハのプロービング方法 |
JP2003100821A (ja) | 2001-09-27 | 2003-04-04 | Sony Corp | ウェハーの検査システムおよび検査方法 |
KR20060020349A (ko) * | 2004-08-31 | 2006-03-06 | 주식회사 에이디피엔지니어링 | 기판 검사 장치 |
KR20060032914A (ko) * | 2004-10-13 | 2006-04-18 | 동부아남반도체 주식회사 | 웨이퍼 상의 불순물 제거 장치 |
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2006
- 2006-12-29 KR KR1020060137792A patent/KR100806381B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH022144A (ja) * | 1988-06-13 | 1990-01-08 | Tokyo Electron Ltd | 半導体ウエハのプロービング方法 |
JP2003100821A (ja) | 2001-09-27 | 2003-04-04 | Sony Corp | ウェハーの検査システムおよび検査方法 |
KR20060020349A (ko) * | 2004-08-31 | 2006-03-06 | 주식회사 에이디피엔지니어링 | 기판 검사 장치 |
KR20060032914A (ko) * | 2004-10-13 | 2006-04-18 | 동부아남반도체 주식회사 | 웨이퍼 상의 불순물 제거 장치 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI495032B (zh) * | 2008-06-13 | 2015-08-01 | Tokyo Electron Ltd | 被處理體的移載機構及被處理體的處理系統 |
KR101021239B1 (ko) * | 2008-11-25 | 2011-03-11 | 스템코 주식회사 | 프로브 카드, 이를 포함하는 연성 인쇄 회로 기판의 검사 시스템, 및 연성 인쇄 회로 기판의 검사 방법 |
KR102590869B1 (ko) * | 2022-08-05 | 2023-10-19 | 제너셈(주) | 플립 칩 본딩을 위한 웨이퍼 로딩 장치 |
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