KR100790557B1 - 선입선출을 하는 버퍼 시스템 - Google Patents
선입선출을 하는 버퍼 시스템 Download PDFInfo
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- KR100790557B1 KR100790557B1 KR1020060057077A KR20060057077A KR100790557B1 KR 100790557 B1 KR100790557 B1 KR 100790557B1 KR 1020060057077 A KR1020060057077 A KR 1020060057077A KR 20060057077 A KR20060057077 A KR 20060057077A KR 100790557 B1 KR100790557 B1 KR 100790557B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/34—Devices for discharging articles or materials from conveyor
- B65G47/46—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points
- B65G47/51—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination
- B65G47/5104—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination for articles
- B65G47/5109—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination for articles first In - First Out systems: FIFO
- B65G47/514—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination for articles first In - First Out systems: FIFO using stacking and/or destacking arrangements or stacks of articles or article carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
- Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (6)
- 샤프트와 샤프트에 삽입되어 고정되는 롤러로 이루어져 기판을 임시로 저장 또는 이송하는 하나 이상의 버퍼층;고정된 위치에서 상기 이송하려는 기판이 있는 버퍼층의 샤프트와 연결되어 상기 샤프트를 회전시켜 기판을 이송시키는 구동부; 및상기 버퍼층을 상하로 이동시켜 상기 이송하려는 기판이 있는 버퍼층을 상기 구동부에 연결시키는 상하이동부를 포함하는 선입선출을 하는 버퍼 시스템.
- 제 1항에 있어서,상기 샤프트를 지지하는 홀을 구비하는 버퍼 몸체를 더 포함하는 선입선출을 하는 버퍼 시스템.
- 제 1항에 있어서, 상기 구동부는마그네틱 헬리컬 기어를 이용하여 상기 버퍼층의 샤프트를 회전시키는, 선입선출을 하는 버퍼 시스템.
- 제 1항에 있어서, 상기 구동부는마그네틱 디스크 기어를 이용하여 상기 버퍼층의 샤프트를 회전시키는, 선입선출을 하는 버퍼 시스템.
- 제 1항에 있어서,상기 상하이동부는 선입된 기판의 버퍼층 순서를 저장하여 선입된 순서대로 선출시키도록 버퍼층을 상하로 이동시키는, 선입선출을 하는 버퍼 시스템.
- 제 1항에 있어서,상기 상하이동부는 피스톤 또는 나사기어에 의하여 버퍼층을 상하로 이동시키는, 선입선출을 하는 버퍼 시스템.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060057077A KR100790557B1 (ko) | 2006-06-23 | 2006-06-23 | 선입선출을 하는 버퍼 시스템 |
JP2007098917A JP2008004919A (ja) | 2006-06-23 | 2007-04-04 | 先入先出を行うバッファシステム |
CN200710107577A CN100595900C (zh) | 2006-06-23 | 2007-05-21 | 用于调整先进先出的缓冲*** |
TW096119471A TWI388028B (zh) | 2006-06-23 | 2007-05-31 | 調整先入先出之緩衝系統 |
US11/820,675 US8033378B2 (en) | 2006-06-23 | 2007-06-20 | Buffer system for adjusting first-in first-out |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060057077A KR100790557B1 (ko) | 2006-06-23 | 2006-06-23 | 선입선출을 하는 버퍼 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070122073A KR20070122073A (ko) | 2007-12-28 |
KR100790557B1 true KR100790557B1 (ko) | 2008-01-02 |
Family
ID=38917878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060057077A KR100790557B1 (ko) | 2006-06-23 | 2006-06-23 | 선입선출을 하는 버퍼 시스템 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8033378B2 (ko) |
JP (1) | JP2008004919A (ko) |
KR (1) | KR100790557B1 (ko) |
CN (1) | CN100595900C (ko) |
TW (1) | TWI388028B (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US10442226B2 (en) | 2008-06-13 | 2019-10-15 | Kateeva, Inc. | Gas enclosure assembly and system |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US9604245B2 (en) | 2008-06-13 | 2017-03-28 | Kateeva, Inc. | Gas enclosure systems and methods utilizing an auxiliary enclosure |
AU2012230845B2 (en) * | 2011-03-22 | 2016-09-08 | Richard Lunn | Anchor system and delivery device for use therewith |
CH705229B1 (de) | 2011-07-08 | 2015-06-15 | Esec Ag | Verfahren und Vorrichtung für die Montage von Halbleiterchips. |
CN103625933B (zh) * | 2013-12-15 | 2016-03-02 | 佛山市鼎吉包装技术有限公司 | 一种瓷砖垛缓存补偿机构 |
EP3787016B1 (en) | 2013-12-26 | 2023-09-20 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
KR102307190B1 (ko) | 2014-01-21 | 2021-09-30 | 카티바, 인크. | 전자 장치 인캡슐레이션을 위한 기기 및 기술 |
US9343678B2 (en) | 2014-01-21 | 2016-05-17 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
KR102177898B1 (ko) | 2014-04-30 | 2020-11-12 | 카티바, 인크. | 가스 쿠션 장비 및 기판 코팅 기술 |
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KR19990052615A (ko) * | 1997-12-22 | 1999-07-15 | 윤종용 | 인쇄회로기판 조립라인의 버퍼 및 이에 의한 인쇄회로기판적재방법 |
JP2004075203A (ja) | 2002-08-09 | 2004-03-11 | Dainippon Printing Co Ltd | バッファ装置 |
JP2006001696A (ja) | 2004-06-17 | 2006-01-05 | Shinko Electric Co Ltd | 基板バッファ装置、及び基板の収容方法 |
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2006
- 2006-06-23 KR KR1020060057077A patent/KR100790557B1/ko active IP Right Grant
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2007
- 2007-04-04 JP JP2007098917A patent/JP2008004919A/ja active Pending
- 2007-05-21 CN CN200710107577A patent/CN100595900C/zh active Active
- 2007-05-31 TW TW096119471A patent/TWI388028B/zh active
- 2007-06-20 US US11/820,675 patent/US8033378B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990052615A (ko) * | 1997-12-22 | 1999-07-15 | 윤종용 | 인쇄회로기판 조립라인의 버퍼 및 이에 의한 인쇄회로기판적재방법 |
KR20060015660A (ko) * | 1999-05-06 | 2006-02-17 | 동경 엘렉트론 주식회사 | 유리 기판의 반송 시스템 |
JP2004075203A (ja) | 2002-08-09 | 2004-03-11 | Dainippon Printing Co Ltd | バッファ装置 |
JP2006001696A (ja) | 2004-06-17 | 2006-01-05 | Shinko Electric Co Ltd | 基板バッファ装置、及び基板の収容方法 |
Also Published As
Publication number | Publication date |
---|---|
US8033378B2 (en) | 2011-10-11 |
KR20070122073A (ko) | 2007-12-28 |
TW200802673A (en) | 2008-01-01 |
TWI388028B (zh) | 2013-03-01 |
CN101093810A (zh) | 2007-12-26 |
CN100595900C (zh) | 2010-03-24 |
JP2008004919A (ja) | 2008-01-10 |
US20080005881A1 (en) | 2008-01-10 |
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