KR100780496B1 - 반도체 장치, 자기 센서 및 자기 센서 유닛 - Google Patents
반도체 장치, 자기 센서 및 자기 센서 유닛 Download PDFInfo
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- KR100780496B1 KR100780496B1 KR1020050023596A KR20050023596A KR100780496B1 KR 100780496 B1 KR100780496 B1 KR 100780496B1 KR 1020050023596 A KR1020050023596 A KR 1020050023596A KR 20050023596 A KR20050023596 A KR 20050023596A KR 100780496 B1 KR100780496 B1 KR 100780496B1
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Abstract
Description
Claims (14)
- 반도체 장치로서,주면(principle surface)에 집적 회로 및 이에 전기 접속된 센서 소자가 형성된 반도체 칩과,상기 반도체 칩의 상기 주면측에 형성되고, 적어도 상기 집적 회로에 전기 접속된 패드 전극과,상기 반도체 칩의 상기 주면측에 위치하고, 상기 반도체 칩을 외부 회로에 전기 접속하는 전극부와,상기 패드 전극 및 상기 전극부를 서로 전기 접속하는 배선부와,전기적인 절연 재료로 형성되고, 적어도 상기 전극부를 상기 반도체 칩의 상기 주면측에 노출시킨 상태에서, 상기 반도체 칩의 상기 주면을 피복함과 함께 상기 센서 소자, 배선부 및 전극부를 밀봉하는 절연부를 포함하고,상기 전극부는 상기 반도체 칩의 두께 방향으로 상기 센서 소자와 중첩되지 않는 위치에 배치되어 있는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 배선부는 상기 반도체 칩의 두께 방향으로 상기 센서 소자와 중첩되지 않는 위치에 배치되어 있는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 전극부가 복수개 제공되고,상기 반도체 칩의 상기 주면을 균등하게 분할하도록, 상기 주면을 따라 한 방향으로 연장되는 복수의 제1 격자선을 등간격들로 배열하여 상정함과 함께, 상기 주면을 따라 상기 제1 격자선들과 교차하는 복수의 제2 격자선을 등간격들로 배열하여 상정하고,이들 제1 격자선들과 제2 격자선들과의 각 교점을 상기 전극부들의 가상의 배치 위치들로 하며,상기 전극부들 중에서, 상기 두께 방향으로 상기 센서 소자와 중첩되지 않는 하나의 전극부가 상기 가상의 배치 위치에 배치되고,상기 전극부들 중 다른 전극부들은, 상기 가상의 배치 위치들로부터 제1 격자선들 혹은 제2 격자선들을 따라 상기 센서 소자로부터 이격하는 방향으로 이동한 위치들에 배치되고,상기 제1 격자선들 혹은 제2 격자선들 상에 있어, 서로 인접하는 격자선들 사이에 배치되는 전극부의 수를 1 이하로 하는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 센서 소자 및 상기 전극부가 각각 복수 제공되고,각 센서 소자와 이 센서 소자의 주위에 배치되는 상기 전극부들 간의 위치 관계, 및 각 센서 소자의 주위에 배치되는 상기 전극부들의 수가, 상기 모든 센서 소자에 관하여 동일한 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서,상기 센서 소자에 인접하는 위치에 배치된 하나의 전극부가, 그 하나의 전극부보다도 상기 센서 소자로부터 더 이격하여 배치된 다른 전극부들과 비교하여 작게 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 반도체 장치로서,표면에 집적 회로 및 이에 전기 접속된 센서 소자가 형성된 반도체 칩과,상기 반도체 칩의 상기 표면측에 형성되고, 적어도 상기 집적 회로에 전기 접속된 패드 전극과,상기 반도체 칩의 상기 표면측에 위치하고, 상기 반도체 칩을 외부 회로에 전기 접속하는 복수의 전극부와,상기 패드 전극 및 상기 전극부들을 서로 전기 접속하는 배선부와,전기적인 절연 재료로 형성되고, 적어도 상기 전극부들을 상기 반도체 칩의 표면측에 노출시킨 상태에서, 상기 반도체 칩의 상기 표면을 피복함과 함께 상기 센서 소자, 배선부 및 전극부들을 밀봉하는 절연부를 포함하고,상기 전극부들은 상기 절연부에서 상기 반도체 칩의 두께 방향으로 돌출하는 돌기부들을 포함하고,상기 센서 소자에 인접하여 배치된 하나의 돌기부는, 상기 센서 소자로부터 이격하여 배치된 다른 돌기부들과 비교하여 상기 절연부로부터의 돌출 길이가 작은 것을 특징으로 하는 반도체 장치.
- 반도체 장치로서,표면에 집적 회로 및 이에 전기 접속된 센서 소자가 형성된 반도체 칩과,상기 반도체 칩의 상기 표면측에 형성되고, 적어도 상기 집적 회로에 전기 접속된 패드 전극과,상기 반도체 칩의 상기 표면측에 위치하고, 상기 반도체 칩을 외부 회로에 전기 접속하는 복수의 전극부와,상기 패드 전극 및 상기 전극부들을 서로 전기 접속하는 배선부와,전기적인 절연 재료로 형성되고, 적어도 상기 전극부들을 상기 반도체 칩의 상기 표면측에 노출시킨 상태에서, 상기 반도체 칩의 상기 표면을 피복함과 함께 상기 센서 소자, 배선부 및 전극부들을 밀봉하는 절연부를 포함하고,상기 전극부들은 상기 절연부에서 상기 반도체 칩의 두께 방향으로 돌출하는 돌기부들을 포함하고,상기 센서 소자에 인접하여 배치된 하나의 돌기부는, 상기 센서 소자로부터 이격하여 배치된 다른 돌기부들과 비교하여 융점이 낮은 도전성 재료로 형성되어 있는 것을 특징으로 하는 반도체 장치.
- 반도체 장치로서,표면에 집적 회로 및 이에 전기 접속된 센서 소자가 형성된 반도체 칩과,상기 반도체 칩의 상기 표면측에 형성되고, 적어도 상기 집적 회로에 전기 접속된 패드 전극과,상기 반도체 칩의 상기 표면측에 위치하고, 상기 반도체 칩을 외부 회로에 전기 접속하는 복수의 전극부와,상기 패드 전극 및 상기 전극부들을 서로 전기 접속하는 배선부와,전기적인 절연 재료로 형성되고, 적어도 상기 전극부들을 상기 반도체 칩의 상기 표면측에 노출시킨 상태에서, 상기 반도체 칩의 상기 표면을 피복함과 함께 상기 센서 소자, 배선부 및 전극부들을 밀봉하는 절연부를 포함하고,상기 전극부들은 상기 절연부에서 상기 반도체 칩의 두께 방향으로 돌출하는 돌기부들을 포함하고,상기 돌기부들은 도전성 재료로 형성된 구 형상의 코어와, 상기 도전성 재료보다도 융점이 낮은 도전성 재료로 형성된, 상기 코어의 주위를 피복하는 외피부를 포함하고,상기 센서 소자에 인접하여 배치된 하나의 돌기부의 상기 코어는, 상기 센서 소자로부터 이격하여 배치된 다른 돌기부들의 상기 코어들보다도 작게 형성되고, 또한, 상기 하나의 돌기부 및 상기 다른 돌기부들의 상기 외피부들의 직경들이 동등한 것을 특징으로 하는 반도체 장치.
- 자기 센서로서,판(sheet) 형상으로 형성되고, 자계의 적어도 1 방향의 자기 성분에 대하여 감응하는 자기 센서 칩과,상기 자기 센서 칩의 표면으로부터 돌출하고, 상기 자기 센서 칩을 판 형상의 회로 기판에 전기적으로 접속시키는 복수의 전극부를 포함하고,상기 전극부들은 상기 자기 센서 칩의 상기 표면에 일렬로 배열되고,상기 전극부들은 상기 자기 센서 칩의 저면에 돌출하고, 상기 자기 센서 칩을 경사시켜서 배치가능하게 하는 것을 특징으로 하는 자기 센서.
- 자기 센서로서,판 형상으로 형성되고, 자계의 적어도 1 방향의 자기 성분에 대하여 감응하는 자기 센서 칩과,상기 자기 센서 칩의 표면으로부터 돌출하고, 상기 자기 센서 칩을 판 형상의 회로 기판에 전기적으로 접속시키는 복수의 전극부를 포함하고,상기 전극부들은 상기 자기 센서 칩의 상기 표면에 복수의 평행한 열로 배열되고,상기 전극부들의 돌출 길이들은 상기 복수의 열의 배열 방향으로 점차 짧아지고,상기 전극부들은 상기 자기 센서 칩의 저면에 돌출하고, 상기 자기 센서 칩을 경사시켜서 배치가능하게 하는 것을 특징으로 하는 자기 센서.
- 자기 센서 유닛으로서,제9항 또는 제10항의 자기 센서 2개와,표면에 상기 전극부들을 접촉시켜 상기 자기 센서들을 탑재하는 회로 기판을 포함하고,적어도 한 쪽의 상기 자기 센서의 자기 센서 칩이, 자계의 2 방향의 자기 성분들에 대하여 감응하고,다른 쪽의 자기 센서 칩의 감응 방향이, 상기 한 쪽의 자기 센서 칩의 2개의 감응 방향을 포함하는 평면에 대하여 교차하도록, 상기 자기 센서들을 상기 회로 기판 상에 적어도 일부 중첩시켜 배치하는 것을 특징으로 하는 자기 센서 유닛.
- 자기 센서 유닛으로서,제9항 또는 제10항의 자기 센서 2개와,상기 자기 센서들을 탑재하는 회로 기판을 포함하고,적어도 한 쪽의 상기 자기 센서의 자기 센서 칩이, 자계의 2방향의 자기 성분들에 대하여 감응하고,다른 쪽의 자기 센서 칩의 감응 방향이, 상기 한 쪽의 자기 센서 칩의 2개의 감응 방향을 포함하는 평면에 대하여 교차하도록, 상기 자기 센서들을 상기 회로 기판 상에 적어도 일부 중첩시켜 배치하는 것을 특징으로 하는 자기 센서 유닛.
- 자기 센서 유닛으로서,자계의 2방향의 자기 성분들에 대하여 감응하는 제1 자기 센서와,자계의 적어도 1방향의 자기 성분에 대하여 감응하는 제2 자기 센서와,이들 2개의 자기 센서를 표면에 탑재하는 판 형상의 회로 기판을 포함하고,상기 각 자기 센서는 판 형상으로 형성된 자기 센서 칩과, 상기 자기 센서 칩의 표면으로부터 돌출하고, 상기 회로 기판의 표면에 접촉시켜 상기 회로 기판에 전기 접속하는 복수의 전극부를 포함하고,상기 제2 자기 센서의 감응 방향이 상기 제1 자기 센서의 2개의 감응 방향을 포함하는 평면에 대하여 교차하도록, 또한, 상기 회로 기판 및 상기 전극부들의, 상기 회로 기판의 두께 방향에서의 높이 치수들의 총합이 부분적으로 변화되도록, 적어도 한 쪽의 자기 센서 칩을 상기 회로 기판의 이면(rear surface)에 대하여 경사시키는 것을 특징으로 하는 자기 센서 유닛.
- 제13항에 있어서,상기 회로 기판의 표면은 계단 형상으로 형성되고, 적어도 한 쪽의 자기 센서의 상기 전극부들을 각 단(step)의 상면들에 배치하는 것을 특징으로 하는 자기 센서 유닛.
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JP2004087139A JP4547956B2 (ja) | 2004-03-24 | 2004-03-24 | 半導体装置、及び、チップサイズパッケージ |
JP2004087140A JP2005274302A (ja) | 2004-03-24 | 2004-03-24 | 磁気センサ及び磁気センサユニット |
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CN100438011C (zh) | 2008-11-26 |
TWI281037B (en) | 2007-05-11 |
US20060197168A1 (en) | 2006-09-07 |
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EP1580568A3 (en) | 2012-09-19 |
US20080173961A1 (en) | 2008-07-24 |
CN1674270A (zh) | 2005-09-28 |
US7309904B2 (en) | 2007-12-18 |
US20050230827A1 (en) | 2005-10-20 |
US7265430B2 (en) | 2007-09-04 |
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