KR100697108B1 - 에폭시 수지 조성물 - Google Patents
에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR100697108B1 KR100697108B1 KR1020030055699A KR20030055699A KR100697108B1 KR 100697108 B1 KR100697108 B1 KR 100697108B1 KR 1020030055699 A KR1020030055699 A KR 1020030055699A KR 20030055699 A KR20030055699 A KR 20030055699A KR 100697108 B1 KR100697108 B1 KR 100697108B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- epoxy
- resin composition
- fluorene
- compound
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
실시예 1 | 실시예 2 | 실시예 3 | 실시예 4 | 실시예 5 | 실시예 6 | 실시예 7 | 실시예 8 | ||
배합량(중량부) | |||||||||
플루오렌 골격 함유 실리콘 변성 페놀 수지 a | 60 | ||||||||
플루오렌 골격 함유 실리콘 변성 페놀 수지 b | 77 | 77 | 77 | 78 | 75 | 82 | |||
플루오렌 골격 함유 실리콘 변성 페놀 수지 c | 96 | ||||||||
에폭시 화합물 A | 40 | 23 | 4 | 23 | 23 | ||||
에폭시 화합물 B | 22 | ||||||||
에폭시 화합물 C | 25 | ||||||||
에폭시 화합물 D | 18 | ||||||||
에폭시 화합물 E | |||||||||
에폭시 화합물 F | |||||||||
에폭시 화합물 G | |||||||||
에폭시 화합물 H | |||||||||
에폭시 화합물 I | |||||||||
TPP | 2 | ||||||||
DBU | 2 | 2 | 2 | 2 | 2 | 2 | |||
2E4MZ | 2 | ||||||||
측정 결과 | |||||||||
유리 전이 온도 | ℃ | -5 | -37 | -70 | -40 | -28 | -32 | 17 | -40 |
선팽창 계수 α1 | ppm | 75 | 83 | 120 | 80 | 72 | 78 | 70 | 68 |
선팽창 계수 α2 | ppm | 200 | 230 | 260 | 230 | 230 | 250 | 210 | 200 |
영률(-50℃) | ㎫ | 300 | 150 | 90 | 160 | 170 | 150 | 2060 | 160 |
영률(25℃) | ㎫ | 100 | 70 | 30 | 80 | 90 | 80 | 950 | 60 |
영률(150℃) | ㎫ | 20 | 8 | 4 | 9 | 10 | 8 | 77 | 3 |
인장 강도 | ㎫ | 10 | 8 | 8 | 10 | 9 | 9 | 15 | 7 |
신장률 | % | 25 | 35 | 50 | 30 | 33 | 34 | 5 | 41 |
부피저항률(25℃) | TΩㆍm | 200 | 190 | 170 | 200 | 200 | 200 | 230 | 190 |
부피저항률(150℃) | GΩㆍm | 80 | 70 | 60 | 70 | 70 | 80 | 100 | 80 |
유전률 | 2.5 | 2.5 | 2.5 | 2.2 | 2.1 | 2.3 | 2.2 | 2.4 | |
유전정접 | 0.008 | 0.008 | 0.007 | 0.009 | 0.008 | 0.007 | 0.008 | 0.007 | |
절연 파괴 전압 | V/㎛ | 240 | 250 | 260 | 250 | 260 | 280 | 270 | 270 |
흡수율 | % | 1.5 | 1.7 | 1.8 | 1.5 | 1.6 | 1.8 | 1.5 | 2.0 |
실시예 9 | 실시예 10 | 실시예 11 | 실시예 12 | 실시예 13 | 비교예 1 | 비교예 2 | 비교예 3 | ||
배합량(중량부) | |||||||||
플루오렌 골격 함유 실리콘 변성 페놀 수지 a | |||||||||
플루오렌 골격 함유 실리콘 변성 페놀 수지 b | 78 | 86 | 85 | 76 | 79 | ||||
플루오렌 골격 함유 실리콘 변성 페놀 수지 c | |||||||||
메틸테트라하이드로 무수프탈산 | 100 | 100 | |||||||
노볼락형 페놀 수지 | 100 | ||||||||
에폭시 화합물 A | 111 | ||||||||
에폭시 화합물 B | 105 | ||||||||
에폭시 화합물 C | 182 | ||||||||
에폭시 화합물 D | |||||||||
에폭시 화합물 E | 22 | ||||||||
에폭시 화합물 F | 14 | ||||||||
에폭시 화합물 G | 15 | ||||||||
에폭시 화합물 H | 24 | ||||||||
에폭시 화합물 I | 21 | ||||||||
TPP | |||||||||
DBU | 2 | 1 | 2 | 2 | 2 | 3 | 3 | 3 | |
2E4MZ | |||||||||
측정 결과 | |||||||||
유리 전이 온도 | ℃ | -45 | -36 | 34 | -47 | 25 | 125 | 120 | 155 |
선팽창 계수 α1 | ppm | 73 | 74 | 70 | 74 | 74 | 62 | 63 | 60 |
선팽창 계수 α2 | ppm | 220 | 220 | 210 | 220 | 220 | 270 | 260 | 240 |
영률(-50℃) | ㎫ | 140 | 150 | 4650 | 140 | 3100 | 4800 | 4000 | 5500 |
영률(25℃) | ㎫ | 70 | 90 | 1860 | 60 | 1200 | 3200 | 2800 | 4100 |
영률(150℃) | ㎫ | 5 | 6 | 450 | 7 | 130 | 80 | 70 | 2400 |
인장 강도 | ㎫ | 11 | 12 | 14 | 11 | 13 | 15 | 20 | 22 |
신장률 | % | 39 | 35 | 2 | 30 | 4 | 0.3 | 0.4 | 0.4 |
부피저항률(25℃) | TΩㆍm | 200 | 190 | 180 | 200 | 190 | 100 | 100 | 80 |
부피저항률(150℃) | GΩㆍm | 90 | 80 | 90 | 80 | 90 | 50 | 70 | 50 |
유전률 | 2.3 | 2.2 | 2.1 | 2.4 | 2.2 | 3.4 | 3.5 | 4.1 | |
유전정접 | 0.009 | 0.008 | 0.007 | 0.008 | 0.007 | 0.018 | 0.015 | 0.014 | |
절연 파괴 전압 | V/㎛ | 260 | 260 | 250 | 260 | 240 | 190 | 170 | 150 |
흡수율 | % | 2.3 | 2.5 | 2.4 | 1.5 | 1.6 | 2.7 | 3.1 | 2.1 |
Claims (1)
- (ⅰ) 주제(主劑)로서, 1분자 내에 에폭시기를 적어도 2개 갖는 화합물;(ⅱ) 경화제로서, 하기 화학식 (1)로 표시되는 반복 단위를 갖는 중량 평균 분자량 1,000∼500,000의 플루오렌 골격 함유 실리콘 변성 페놀 수지; 및(ⅲ) 경화촉진제로서, 유기 인화합물, 아민 화합물 및 이미다졸 화합물로부터 선택되는 1종 또는 2종 이상을 함유하는 에폭시 수지 조성물:(화학식 (1))(상기 식에서, 상기 R1∼R4는 서로 동일하거나 상이할 수 있는 탄소수 1∼10의 1가 탄화수소기이고, 상기 n은 고분자 반복 단위의 개수를 나타내며, 상기 n은 1∼2,000인 정수임).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002235623A JP3874108B2 (ja) | 2002-08-13 | 2002-08-13 | エポキシ樹脂組成物 |
JPJP-P-2002-00235623 | 2002-08-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040023502A KR20040023502A (ko) | 2004-03-18 |
KR100697108B1 true KR100697108B1 (ko) | 2007-03-21 |
Family
ID=30768039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030055699A KR100697108B1 (ko) | 2002-08-13 | 2003-08-12 | 에폭시 수지 조성물 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7060761B2 (ko) |
EP (1) | EP1389631B1 (ko) |
JP (1) | JP3874108B2 (ko) |
KR (1) | KR100697108B1 (ko) |
DE (1) | DE60301926T2 (ko) |
TW (1) | TWI289580B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7504460B2 (en) * | 2005-03-07 | 2009-03-17 | Delphi Technologies, Inc. | Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine |
JP4878810B2 (ja) * | 2005-10-27 | 2012-02-15 | 新日鐵化学株式会社 | 熱可塑性ポリヒドロキシポリエーテル樹脂及びその使用 |
US7633220B2 (en) * | 2006-03-22 | 2009-12-15 | General Electric Company | Optoelectronic devices with multilayered structures |
US20070225477A1 (en) * | 2006-03-22 | 2007-09-27 | General Electric Company | Optoelectronic devices with multilayered structures |
JP2009040919A (ja) * | 2007-08-09 | 2009-02-26 | Sekisui Chem Co Ltd | 熱硬化性樹脂組成物、及びこれを用いてなる樹脂フィルム、積層板、プリプレグ |
US8617792B2 (en) | 2009-07-31 | 2013-12-31 | Cheil Industries, Inc. | Aromatic ring-containing polymer for resist underlayer, resist underlayer composition including the same, and method of patterning device using the same |
GB0922599D0 (en) * | 2009-12-23 | 2010-02-10 | Cytec Tech Corp | Modified resin systems for liquid resin infusion applications, prepreg autoclave applications and hybrids thereof |
US8614266B2 (en) | 2010-05-05 | 2013-12-24 | Tyco Electronics Services Gmbh | Potting for electronic components |
KR101035492B1 (ko) * | 2011-01-19 | 2011-05-20 | 에스엘코리아 주식회사 | 친환경 향기블록 |
US20120286416A1 (en) * | 2011-05-11 | 2012-11-15 | Tessera Research Llc | Semiconductor chip package assembly and method for making same |
US8957520B2 (en) * | 2011-06-08 | 2015-02-17 | Tessera, Inc. | Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts |
JP5966955B2 (ja) * | 2012-02-10 | 2016-08-10 | 信越化学工業株式会社 | 蛍光性化合物及びその製造方法並びに蛍光性樹脂組成物 |
JP5890284B2 (ja) * | 2012-09-04 | 2016-03-22 | 信越化学工業株式会社 | 新規有機珪素化合物の製造方法 |
JP2012246497A (ja) * | 2012-09-04 | 2012-12-13 | Sekisui Chem Co Ltd | 樹脂フィルム、積層板、及びプリプレグ |
US8884427B2 (en) | 2013-03-14 | 2014-11-11 | Invensas Corporation | Low CTE interposer without TSV structure |
JP6163803B2 (ja) * | 2013-03-14 | 2017-07-19 | 味の素株式会社 | 樹脂組成物 |
JP6265105B2 (ja) * | 2014-10-30 | 2018-01-24 | 信越化学工業株式会社 | シリコーン樹脂、樹脂組成物、樹脂フィルム及び半導体装置とその製造方法 |
US10181447B2 (en) | 2017-04-21 | 2019-01-15 | Invensas Corporation | 3D-interconnect |
WO2021084632A1 (ja) * | 2019-10-29 | 2021-05-06 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂フィルム、銅箔付き熱硬化性樹脂フィルム、フレキシブルプリント配線板用積層フィルムの製造方法、及びフレキシブルプリント配線板 |
US12040284B2 (en) | 2021-11-12 | 2024-07-16 | Invensas Llc | 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5157061A (en) * | 1988-04-05 | 1992-10-20 | Mitsubishi Denki Kabushiki Kaisha | Epoxy resin containing an epoxy resin-modified silicone oil flexibilizer |
MY107113A (en) * | 1989-11-22 | 1995-09-30 | Sumitomo Bakelite Co | Epoxy resin composition for semiconductor sealing. |
US5512376A (en) * | 1994-06-20 | 1996-04-30 | Hercules Incorporated | Nonpolar polymers comprising antiplasticizers |
US5583195A (en) | 1995-09-29 | 1996-12-10 | General Electric Company | Photocurable epoxy silicones functionalized with fluorescent or photosensitizing marker dyes |
US5998509A (en) * | 1996-11-29 | 1999-12-07 | Kabushiki Kaisha Toshiba | Resin composition and semiconductor device employing the same |
JP3767676B2 (ja) * | 2000-09-12 | 2006-04-19 | 信越化学工業株式会社 | オルガノシロキサン系高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜 |
JP3832572B2 (ja) * | 2001-10-09 | 2006-10-11 | 信越化学工業株式会社 | 光硬化性樹脂組成物、パターン形成方法及び基板保護用フィルム |
-
2002
- 2002-08-13 JP JP2002235623A patent/JP3874108B2/ja not_active Expired - Fee Related
-
2003
- 2003-08-12 KR KR1020030055699A patent/KR100697108B1/ko active IP Right Grant
- 2003-08-13 TW TW092122289A patent/TWI289580B/zh not_active IP Right Cessation
- 2003-08-13 DE DE60301926T patent/DE60301926T2/de not_active Expired - Lifetime
- 2003-08-13 US US10/639,623 patent/US7060761B2/en not_active Expired - Lifetime
- 2003-08-13 EP EP03255037A patent/EP1389631B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20040034187A1 (en) | 2004-02-19 |
EP1389631B1 (en) | 2005-10-19 |
TW200413466A (en) | 2004-08-01 |
TWI289580B (en) | 2007-11-11 |
JP3874108B2 (ja) | 2007-01-31 |
DE60301926T2 (de) | 2006-07-06 |
EP1389631A1 (en) | 2004-02-18 |
DE60301926D1 (de) | 2006-03-02 |
US7060761B2 (en) | 2006-06-13 |
KR20040023502A (ko) | 2004-03-18 |
JP2004075769A (ja) | 2004-03-11 |
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