KR100683224B1 - Assembly structure for printed circuit board - Google Patents

Assembly structure for printed circuit board Download PDF

Info

Publication number
KR100683224B1
KR100683224B1 KR1020050079630A KR20050079630A KR100683224B1 KR 100683224 B1 KR100683224 B1 KR 100683224B1 KR 1020050079630 A KR1020050079630 A KR 1020050079630A KR 20050079630 A KR20050079630 A KR 20050079630A KR 100683224 B1 KR100683224 B1 KR 100683224B1
Authority
KR
South Korea
Prior art keywords
circuit board
case
assembly structure
printed circuit
elastic
Prior art date
Application number
KR1020050079630A
Other languages
Korean (ko)
Inventor
이재호
Original Assignee
현대모비스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대모비스 주식회사 filed Critical 현대모비스 주식회사
Priority to KR1020050079630A priority Critical patent/KR100683224B1/en
Application granted granted Critical
Publication of KR100683224B1 publication Critical patent/KR100683224B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1401Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1405Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by clips or resilient members, e.g. hooks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0004Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H05K5/0013Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by resilient members

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

An assembly structure for a printed circuit board is provided to prevent a hook connection from being damaged by reducing a connection force caused by an external force of a case and enhancing the hook connection. An assembly structure for a printed circuit board includes an elastic unit(122), a pressing unit(125), and a supporting unit(130). The elastic unit(122) is arranged on one side of the printed circuit board. One surface of the elastic unit(122) is connected to the printed circuit board. The elastic unit(122) is elastically pressed by a predetermined external force. The pressing unit(125) is formed to be protruded inside one of both cases, and presses the elastic unit(122). The supporting unit(130) is installed on the other case of both cases so that the supporting unit(130) is cross with the pressing unit(125) and supports the printed circuit board.

Description

회로기판의 조립구조{ASSEMBLY STRUCTURE FOR PRINTED CIRCUIT BOARD}Assembly structure of circuit board {ASSEMBLY STRUCTURE FOR PRINTED CIRCUIT BOARD}

도 1은 종래의 회로기판의 조립구조를 나타낸 부분 단면도이다.1 is a partial cross-sectional view showing an assembly structure of a conventional circuit board.

도 2는 본 발명의 일실시예 따른 회로기판의 조립구조의 부분 단면도이다.2 is a partial cross-sectional view of an assembly structure of a circuit board according to an embodiment of the present invention.

도 3은 본 발명의 일실시예에 따른 회로기판의 조립구조에 대한 사시도이다.3 is a perspective view of an assembly structure of a circuit board according to an embodiment of the present invention.

*도면의 주요부분에 대한 부호의 설명** Explanation of symbols for main parts of drawings *

100, 110: 케이스 102: 후크 100, 110: Case 102: Hook

120: 회로기판 122: 탄력부120: circuit board 122: elastic portion

125; 가압부 130: 지지부125; Pressing portion 130: support portion

132: 절곡통공132: bending through

본 발명은 회로기판의 조립구조에 관한 것으로, 케이스의 내부로 회로기판이 배치되고 케이스가 조립될 때, 양측 케이스가 서로 반대방향으로 가압되는 힘을 상기 회로기판이 제공하여 케이스의 후크결합이 강화되고, 케이스의 외력에 의한 체 결력을 감소시켜 후크결합의 훼손을 방지하는 회로기판의 조립구조에 관한 것이다.The present invention relates to an assembly structure of a circuit board, when the circuit board is placed inside the case and when the case is assembled, the circuit board provides a force that both sides are pressed in opposite directions to each other to strengthen the hook coupling of the case The present invention relates to an assembly structure of a circuit board which reduces the fastening force due to the external force of the case and prevents damage to the hook coupling.

일반적으로, 전장부품의 발전에 따라 회로기판을 이용한 제품들이 급속하게 증가하고 있으며, 과거에는 대부분 회로기판이 배치되는 케이스가 나사체결을 이용하여 고정하였으나, 최근에는 원감절감 및 공정 간소화를 위하여 케이스에 대해서는 후크결합을 선호하고 있다.In general, with the development of electronic components, products using circuit boards are increasing rapidly. In the past, cases in which circuit boards are placed are fixed by screwing. I prefer hook coupling.

도 1은 종래의 회로기판의 조립구조를 나타낸 부분 단면도로서, 케이스의 내부로 회로기판이 조립되는 구조를 간단하게 도시하고 있다.1 is a partial cross-sectional view showing a conventional assembly structure of a circuit board, and simply shows a structure in which the circuit board is assembled into the case.

도 1에 도시된 바와 같이, 회로기판(10)은 하우징(15)과 커버(20) 사이에 배치되고, 상기 하우징(15)과 커버(20)는 하우징(15)에 제공된 후크(19)가 커버(20)에 제공된 결합공(25)에 끼워져 서로 후크결합(30)을 이루면서 결합된다.As shown in FIG. 1, the circuit board 10 is disposed between the housing 15 and the cover 20, and the housing 15 and the cover 20 have a hook 19 provided in the housing 15. Fitted into the coupling hole 25 provided in the cover 20 is coupled to form a hook coupling 30 with each other.

이때, 상기 회로기판(10)은 하우징(15)의 내부에 돌출된 지지부(16)와 커버(20)의 내측에 제공된 다른 지지부(21) 사이에 배치되어 양측의 지지부(16, 21)에 의해 하우징(15)과 커버(20) 사이에서 유동이 방지되도록 배치된다.In this case, the circuit board 10 is disposed between the support part 16 protruding in the housing 15 and the other support part 21 provided inside the cover 20 and supported by both support parts 16 and 21. It is arranged to prevent flow between the housing 15 and the cover 20.

그런데, 상기 회로기판(10)이 상기 하우징(15)과 커버(20) 사이에 배치되는 구조를 상세하게 살펴보면, 하우징(15)의 후크(19)가 외력에 의한 진동에 의해 커버(20)의 결합공(25)에서 유동하면서 훼손되거나, 하우징(15)과 커버(20)에 배치된 지지부(16, 21) 사이의 유격이 좁게 형성되면, 회로기판(10)이 지지부(16, 21) 사이에 배치되고 나서 후크(19)에 체결응력이 발생하여 후크결합(30)이 파손되는 문제점이 발생하였다.However, when the circuit board 10 is looked at in detail in the structure disposed between the housing 15 and the cover 20, the hook 19 of the housing 15 is the vibration of the cover 20 by the external force If the gap between the support portion 16 and 21 disposed in the housing 15 and the cover 20 is narrowed while flowing in the coupling hole 25, the circuit board 10 is interposed between the support portions 16 and 21. Since the fastening stress is generated in the hook 19 after being disposed in the hook coupling 30 breakage problem occurred.

이에, 본 발명은 상기와 같은 문제점들을 해소하기 위해 안출된 것으로서, 케이스의 내부로 회로기판이 배치되고 케이스가 조립될 때, 양측 케이스가 서로 반대방향으로 가압되는 힘을 상기 회로기판이 제공하여 케이스의 후크결합이 강화되고, 케이스의 외력에 의한 체결력을 감소시켜 후크결합의 훼손을 방지하는 이점을 제공함이 목적이다.Accordingly, the present invention has been made in order to solve the above problems, when the circuit board is disposed inside the case and the case is assembled, the circuit board provides a force that is pressed in the opposite direction to both cases the case The purpose of the hook coupling is to strengthen and reduce the fastening force by the external force of the case to provide an advantage of preventing damage to the hook coupling.

상기와 같은 목적을 달성하기 위한 본 발명에 따른 회로기판의 조립구조는, 양측의 케이스가 후크에 의해 서로 결합되고, 상기 케이스 사이에 회로기판이 포함되는 조립구조에 있어서, 상기 회로기판의 일측부에 배치되며, 상기 회로기판에 대해 일면부만 연결되어 소정의 외력에 의해 탄력적으로 가압되는 탄력부; 상기 일측 케이스의 내면에 돌출되도록 제공되어 상기 탄력부를 가압하는 가압부; 및 상기 가압부에 대해 엇갈리면서 상기 회로기판을 지지하도록 상기 타측 케이스에 제공된 지지부를 포함한다.The assembly structure of the circuit board according to the present invention for achieving the above object, in the assembly structure in which the case on both sides are coupled to each other by a hook, the circuit board is included between the case, one side of the circuit board An elastic part disposed on the circuit board and connected only to one surface part with respect to the circuit board, and being elastically pressed by a predetermined external force; A pressing part provided to protrude on an inner surface of the one side case to press the elastic part; And a support part provided in the other case to support the circuit board while staggering with respect to the pressing part.

여기서, 상기 회로기판은 상기 탄력부를 형성하는 절곡통공을 포함하고, 상기 탄력부는 상기 회로기판의 상부에 제공되며, 상기 가압부는 상기 탄력부에 대해 수직으로 상기 일측 케이스에 배치되고, 상기 지지부는 상기 가압부의 하부에서 상기 회로기판에 대해 수직으로 상기 타측 케이스에 배치된다.Here, the circuit board includes a bent through-hole forming the resilient portion, the resilient portion is provided on the upper portion of the circuit board, the pressing portion is disposed in the one case perpendicular to the resilient portion, the support portion is The lower case is disposed in the other case perpendicular to the circuit board.

또한, 상기 가압부와 상기 지지부의 수평거리는 상기 회로기판의 두께보다 얇게 형성되어야 한다.In addition, the horizontal distance of the pressing portion and the support portion should be formed thinner than the thickness of the circuit board.

이하, 본 발명의 바람직한 일실시예를 첨부된 도면을 참조하여 설명한다.Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

또한, 하기 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 단지 예시로 제시하는 것이며, 본 기술 사상을 통해 구현되는 다양한 실시예가 있을 수 있다.In addition, the following examples are not intended to limit the scope of the present invention but merely presented by way of example, and there may be various embodiments implemented through the present invention.

도 2는 본 발명의 일실시예 따른 회로기판의 조립구조의 부분 단면도이고, 도 3은 본 발명의 일실시예에 따른 회로기판의 조립구조에 대한 사시도이다.2 is a partial cross-sectional view of an assembly structure of a circuit board according to an embodiment of the present invention, Figure 3 is a perspective view of the assembly structure of a circuit board according to an embodiment of the present invention.

도시된 바와 같이, 일실시예에 따른 회로기판(120)의 조립구조는 양측의 케이스(100, 110)가 후크(102)에 의해 서로 결합되고, 상기 케이스(100, 110) 사이에 회로기판(120)이 포함되는 조립구조에 있어서, 상기 회로기판(120)의 일측부에 배치되며, 상기 회로기판(120)에 대해 일면부만 연결되어 소정의 외력에 의해 탄력적으로 가압되는 탄력부(122); 상기 일측 케이스(100)의 내면에 돌출되도록 제공되어 상기 탄력부(122)를 가압하는 가압부(125); 및 상기 가압부(125)에 대해 엇갈리면서 상기 회로기판(120)을 지지하도록 상기 타측 케이스(110)에 제공된 지지부(130)를 포함한다.As shown, the assembly structure of the circuit board 120 according to an embodiment is the case (100, 110) of both sides are coupled to each other by the hook 102, the circuit board (between the case (100, 110) In the assembly structure including 120, the elastic portion 122 is disposed on one side of the circuit board 120, only one surface portion is connected to the circuit board 120 to be elastically pressed by a predetermined external force. ; A pressing part 125 provided to protrude on an inner surface of the one side case 100 to press the elastic part 122; And a support part 130 provided on the other case 110 to support the circuit board 120 while staggering with respect to the pressing part 125.

이때, 상기 회로기판(120)의 탄력부(122)는 상기 양측 케이스(100, 110)의 후크(102)결합 시, 일측 케이스(100)의 가압부(125)로 가압되어 휘어지면서, 상기 가압부(125) 및 상기 지지부(130)에 대해 탄력을 제공하며, 상기 양측 케이스(100, 110)는 회로기판(120)의 외측으로 향하는 상기 회로기판(120)의 탄력을 받게 된다.At this time, the elastic portion 122 of the circuit board 120 is pressed by the pressing portion 125 of the one side case 100 when the hooks 102 of the case 100, 110 both sides, the bending, The elasticity of the part 125 and the support part 130 is provided, and both case cases 100 and 110 receive the elasticity of the circuit board 120 toward the outside of the circuit board 120.

즉, 상기 회로기판(120)의 탄력부(122)에 의한 탄력은 상기 일측 케이스 (100)에 제공된 후크(102)에 전달되어, 상기 후크(102)가 타측 케이스(110)에 형성된 결합공(112)에서 유동하는 것을 방지하므로, 양측 케이스(100, 110)의 후크결합(140)이 상기 후크(102)가 받는 탄력의 의해 강화된다.That is, the elasticity of the resilient portion 122 of the circuit board 120 is transmitted to the hook 102 provided on the one side case 100, the coupling hole formed in the other case 110, the hook 102 ( Since the flow is prevented from 112, the hook coupling 140 of both cases (100, 110) is strengthened by the elasticity received by the hook (102).

이때, 양측의 케이스(100, 110)는 후크(102)의 일면부(102a)가 상기 결합공(112)을 제공하는 일측 케이스(100)에 탄력적으로 지지되어 상기 후크(102)의 유동 없이 조립된 형태를 유지한다.At this time, the case (100, 110) of both sides is elastically supported by one side portion (100a) of the hook 102, the one side case 100 providing the coupling hole 112 is assembled without the flow of the hook (102) Keep the form intact.

여기서, 상기 회로기판(120)은 상기 탄력부(122)를 형성하는 절곡통공(132)을 포함하고, 상기 탄력부(122)는 상기 회로기판(120)의 상부에 제공되며, 상기 가압부(125)는 상기 탄력부(122)에 대해 수직으로 상기 일측 케이스(100)에 배치되고, 상기 지지부(130)는 상기 가압부(125)의 하부에서 상기 회로기판(120)에 대해 수직으로 상기 타측 케이스(110)에 배치된다.Here, the circuit board 120 includes a bent through hole 132 to form the elastic portion 122, the elastic portion 122 is provided on the circuit board 120, the pressing portion ( 125 is disposed in the one side case 100 perpendicular to the elastic part 122, and the support part 130 is perpendicular to the circuit board 120 at the lower portion of the pressing part 125. It is disposed in the case 110.

또한, 상기 가압부(125)와 상기 지지부(130)의 수평거리(d)는 상기 회로기판(120)의 두께보다 얇게 형성됨으로써, 상기 회로기판(120)이 상기 양측 케이스(100, 110) 사이에 배치될 때, 상기 회로기판(120)의 탄력부(122)는 상기 가압부(125)에 의해 가압되어 탄력을 발생시킨다. In addition, the horizontal distance (d) of the pressing unit 125 and the support 130 is formed thinner than the thickness of the circuit board 120, so that the circuit board 120 between the case 100, 110 When disposed in the, the elastic portion 122 of the circuit board 120 is pressed by the pressing portion 125 to generate elasticity.

따라서 상기와 같이 구성된 본 발명은 케이스의 내부로 회로기판이 배치되고 케이스가 조립될 때, 양측 케이스가 서로 반대방향으로 가압되는 힘을 상기 회로기판이 제공하여 케이스의 후크결합이 강화되고, 케이스의 외력에 의한 체결력을 감 소시켜 후크결합의 훼손을 방지하는 효과를 얻을 수 있다.Therefore, in the present invention configured as described above, when the circuit board is disposed inside the case and the case is assembled, the circuit board provides the force that both sides press in opposite directions to each other to strengthen the hook coupling of the case, By reducing the fastening force by the external force can be obtained to prevent the damage of the hook coupling.

Claims (4)

양측의 케이스가 후크에 의해 서로 결합되고, 상기 케이스 사이에 회로기판이 포함되는 조립구조에 있어서,In the assembling structure in which the cases on both sides are coupled to each other by a hook, a circuit board is included between the cases, 상기 회로기판의 일측부에 배치되며, 상기 회로기판에 대해 일면부만 연결되어 소정의 외력에 의해 탄력적으로 가압되는 탄력부;An elastic part disposed on one side of the circuit board and connected only to one surface part with respect to the circuit board to be elastically pressed by a predetermined external force; 상기 양측의 케이스 중 일측 케이스의 내면에 돌출되도록 형성되어 상기 탄력부를 가압하는 가압부; 및A pressurizing part which is formed to protrude on an inner surface of one case of the case on both sides to press the elastic part; And 상기 가압부에 대해 엇갈리면서 상기 회로기판을 지지하도록 상기 양측의 케이스 중 타측 케이스에 구비된 지지부를 포함하는 것을 특징으로 하는 회로기판의 조립구조.And a support part provided in the other case of the case on both sides so as to support the circuit board while being staggered with respect to the pressing part. 삭제delete 제 1 항에 있어서,The method of claim 1, 상기 탄력부는 상기 회로기판의 상부에 구비되며, 상기 가압부는 상기 탄력부에 대해 수직으로 상기 일측 케이스에 배치되고, 상기 지지부는 상기 가압부의 하부에서 상기 회로기판에 대해 수직으로 상기 타측 케이스에 배치되는 것을 특징으로 하는 회로기판의 조립구조.The elastic portion is provided on the upper portion of the circuit board, the pressing portion is disposed in the one case perpendicular to the elastic portion, the support portion is disposed in the other case perpendicular to the circuit board in the lower portion of the pressing portion Assembly structure of a circuit board, characterized in that. 제 1 항에 있어서,The method of claim 1, 상기 가압부와 상기 지지부의 수평거리는 상기 회로기판의 두께보다 얇게 형성되는 것을 특징으로 하는 회로기판의 조립구조.The horizontal distance between the pressing portion and the support portion is formed thinner than the thickness of the circuit board assembly structure.
KR1020050079630A 2005-08-29 2005-08-29 Assembly structure for printed circuit board KR100683224B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020050079630A KR100683224B1 (en) 2005-08-29 2005-08-29 Assembly structure for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050079630A KR100683224B1 (en) 2005-08-29 2005-08-29 Assembly structure for printed circuit board

Publications (1)

Publication Number Publication Date
KR100683224B1 true KR100683224B1 (en) 2007-02-15

Family

ID=38106464

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050079630A KR100683224B1 (en) 2005-08-29 2005-08-29 Assembly structure for printed circuit board

Country Status (1)

Country Link
KR (1) KR100683224B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019186366A (en) * 2018-04-09 2019-10-24 株式会社デンソーテン Electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786769A (en) * 1993-07-19 1995-03-31 Stanley Electric Co Ltd Box body for electric device
JPH07231181A (en) * 1994-02-18 1995-08-29 Daiyamondo Denki Kk Wiring substrate fixing method
JPH08145019A (en) * 1994-11-17 1996-06-04 Sumitomo Wiring Syst Ltd Structure for fixing planar article in case

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786769A (en) * 1993-07-19 1995-03-31 Stanley Electric Co Ltd Box body for electric device
JPH07231181A (en) * 1994-02-18 1995-08-29 Daiyamondo Denki Kk Wiring substrate fixing method
JPH08145019A (en) * 1994-11-17 1996-06-04 Sumitomo Wiring Syst Ltd Structure for fixing planar article in case

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019186366A (en) * 2018-04-09 2019-10-24 株式会社デンソーテン Electronic equipment
JP7164966B2 (en) 2018-04-09 2022-11-02 株式会社デンソーテン Electronics

Similar Documents

Publication Publication Date Title
US7755883B2 (en) Connection structure and data processing apparatus therewith
US8625258B2 (en) Mounting apparatus for expansion card
CN101754636B (en) Circuit board and electronic device with the same
EP3763111B1 (en) Electronic device including a vibration-proof fixing structure for vibration-generating component
KR100683224B1 (en) Assembly structure for printed circuit board
US7864536B2 (en) Circuit board assembly
JP2005142215A (en) Deformation preventing structure of cabinet lid
JP6076217B2 (en) Substrate fixing structure and electronic device to which the substrate fixing structure is applied
JP2009295738A (en) Fitting structure of mounted board and method for fitting the same
JP2023085368A (en) Bracket for electronic control component
JP5065226B2 (en) Electronic circuit board housing case
JP6006025B2 (en) Controller unit
KR100842704B1 (en) Socket for backlight lamp unit
US20130115503A1 (en) Mounting device for battery
JP4607229B2 (en) Electronics
KR100811344B1 (en) A pcb fixture with chassis bending
US20110006650A1 (en) Shielding structure for housing
TWI775598B (en) Fixing structure for circuit board
KR100751812B1 (en) Printed circuit board fixations frame for display apparatus
CN110543218B (en) Fixing structure
KR200189956Y1 (en) Rear sound case and vibratign proof structure in speaker
US20130169123A1 (en) Enclosure assembly
KR100669429B1 (en) Plasma display device
KR20080055092A (en) Socket for backlight lamp unit
JP2017028206A (en) Shield case

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee