JP6076217B2 - Substrate fixing structure and electronic device to which the substrate fixing structure is applied - Google Patents

Substrate fixing structure and electronic device to which the substrate fixing structure is applied Download PDF

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JP6076217B2
JP6076217B2 JP2013148457A JP2013148457A JP6076217B2 JP 6076217 B2 JP6076217 B2 JP 6076217B2 JP 2013148457 A JP2013148457 A JP 2013148457A JP 2013148457 A JP2013148457 A JP 2013148457A JP 6076217 B2 JP6076217 B2 JP 6076217B2
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substrate
boss
corners
fixing structure
housing member
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JP2015023087A (en
JP2015023087A5 (en
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健 宮島
健 宮島
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Description

この発明は、電子機器における基板固定構造に関する。   The present invention relates to a substrate fixing structure in an electronic device.

例えば、特許文献１には、基板の片面に１つ以上の突起物を接着して設置し、基板の周辺固定部をベース部材の周辺部に締着して固定する基板固定構造が開示されている。
この基板固定構造では、上記突起物の少なくとも一部をベース部材に接触させて、この突起物によって基板を凸状に反らせている。このように構成することで、基板に搭載された電子部品の耐振動性と耐久性を向上させることができる。 For example, Patent Document 1 discloses a substrate fixing structure in which one or more protrusions are bonded and installed on one side of a substrate, and the peripheral fixing portion of the substrate is fastened and fixed to the peripheral portion of the base member. Yes.
In this substrate fixing structure, at least a part of the protrusion is brought into contact with the base member, and the substrate is bent in a convex shape by the protrusion. With this configuration, the vibration resistance and durability of the electronic component mounted on the substrate can be improved.

特開２００９−１１１１７１号公報JP 2009-111171 A

特許文献１に代表される従来の技術では、突起物をベース部材に接触させて基板を凸状に反らせることにより、耐振動性と耐久性の向上を図っている。
しかしながら、基板が凸状に反った状態でベース部材に安定して固定するには、基板の周辺固定部をベース部材の周辺部に十分に締着しなければならず、ねじ止め箇所が増えることが予想される。
基板の周辺部におけるねじ締め箇所が増えると、周辺部において電子部品を実装可能な有効面積が減少する。また、ねじ締めに伴う金属屑が発生する箇所が増えるため、不具合の要因となる。さらに、ねじの本数分のコスト増加や、ねじ締め加工が増加する。 In the conventional technique represented by Patent Document 1, vibration resistance and durability are improved by bringing a protrusion into contact with a base member and bending the substrate in a convex shape.
However, in order to stably fix the substrate to the base member in a state where the substrate is warped, the peripheral fixing portion of the substrate must be sufficiently fastened to the peripheral portion of the base member, and the number of screwing points increases. Is expected.
As the number of screw tightening points in the peripheral part of the substrate increases, the effective area in which electronic components can be mounted in the peripheral part decreases. Moreover, since the location where the metal scrap accompanying screw fastening generate | occur | produces increases, it becomes a factor of a malfunction. Furthermore, the cost increases by the number of screws and screw tightening increases.

この発明は、上記のような課題を解決するためになされたもので、基板の固定に必要な締結箇所を減らすことができる基板固定構造を得ることを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate fixing structure that can reduce the number of fastening points necessary for fixing the substrate.

この発明に係る基板固定構造は、筐体部材に基板を締結して固定する基板固定構造であって、筐体部材における基板の取り付け面から突出して設けられて、少なくとも基板の四隅に対応する位置のそれぞれに配置された複数の第１のボス部と、筐体部材の取り付け面における対角の位置関係にある第１のボス部間に設けられて、当該取り付け面から第１のボス部よりも低く突出した第２のボス部と、基板の四隅のうちの基板の一辺側の二隅と、基板の一辺側の二隅に対応する位置に配置された第１のボス部の端部と、に設けられ、互いに係合して基板を取り付け面に位置決めする位置決め用係合部とを備え、基板は、取り付け面に配置された状態で、一辺側が、位置決め用係合部により取り付け面に位置決めされ、一辺側に対向する他辺側が、当該他辺側の二隅に対応する位置に配置された第１のボス部の端部に接触し、第２のボス部の端面に向けて凸に反って締結された状態で、四隅が第１のボス部の端部に圧接することを特徴とする。 The substrate fixing structure according to the present invention is a substrate fixing structure that fastens and fixes a substrate to a housing member, and is provided so as to protrude from the mounting surface of the substrate in the housing member and corresponds to at least four corners of the substrate. a plurality of first boss disposed on each, provided between the first boss in the positional relationship between the diagonal in Installing application surface of the housing member, the first boss from the mounting surface End of the first boss portion disposed at a position corresponding to the two corners on one side of the substrate and the two corners on one side of the substrate among the four corners of the substrate And a positioning engaging portion that engages with each other to position the substrate on the mounting surface, and the substrate is disposed on the mounting surface, and one side is attached by the positioning engaging portion. Is positioned on the surface and the other side facing one side is The four corners are in contact with the end portions of the first boss portion arranged at positions corresponding to the two corners on the other side, and are fastened in a convex manner toward the end surface of the second boss portion. It is characterized by being in pressure contact with the end of one boss .

この発明によれば、基板の固定に必要な締結箇所を減らすことができるという効果がある。   According to the present invention, there is an effect that the fastening points necessary for fixing the substrate can be reduced.

この発明の実施の形態１に係る基板固定構造を適用した電子機器を示す図である。It is a figure which shows the electronic device to which the board | substrate fixed structure concerning Embodiment 1 of this invention is applied. 実施の形態１に係る基板固定構造を示す分解斜視図である。2 is an exploded perspective view showing a substrate fixing structure according to Embodiment 1. FIG. 実施の形態１に係る基板固定構造における基板固定の概要を示す図である。It is a figure which shows the outline | summary of the board | substrate fixation in the board | substrate fixation structure which concerns on Embodiment 1. FIG. 従来の基板固定構造の一例を示す分解斜視図である。It is a disassembled perspective view which shows an example of the conventional board | substrate fixing structure. ボス部の端部の様々な態様を示す図である。It is a figure which shows the various aspects of the edge part of a boss | hub part.

実施の形態１．
図１は、この発明の実施の形態１に係る基板固定構造を適用した電子機器を示す図であり、電子機器として車載用ディスプレイを例に挙げている。なお、図１（ａ）は、電子機器を基板１側から見た図であり、図１（ｂ）は、図１（ａ）のＡ−Ａ線で切った断面図である。また、図２は、実施の形態１に係る基板固定構造を示す分解斜視図であり、図１の基板１と筐体部材２を概略的に記載している。図３は、実施の形態１に係る基板固定構造における基板固定の概要を示す図である。 Embodiment 1 FIG.
FIG. 1 is a diagram showing an electronic device to which a substrate fixing structure according to Embodiment 1 of the present invention is applied, and an in-vehicle display is taken as an example of the electronic device. 1A is a diagram of the electronic device viewed from the substrate 1 side, and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A. FIG. 2 is an exploded perspective view showing the substrate fixing structure according to the first embodiment, and schematically shows the substrate 1 and the housing member 2 of FIG. FIG. 3 is a diagram showing an outline of substrate fixing in the substrate fixing structure according to the first embodiment.

図１（ａ）に示すように、基板１は、中央部がねじ３で筐体部材２に締結される。
また、筐体部材２は、バックライト６を収納して保持する筐体部材であり、内枠材４を介して外枠材５に取り付けられる。内枠材４と外枠材５は、液晶パネル７を保持し、液晶パネル７は、バックライト６から発せられた光で背面から照明される。 As shown in FIG. 1A, the substrate 1 is fastened to the housing member 2 with a screw 3 at the center.
The housing member 2 is a housing member that houses and holds the backlight 6, and is attached to the outer frame member 5 via the inner frame member 4. The inner frame material 4 and the outer frame material 5 hold a liquid crystal panel 7, and the liquid crystal panel 7 is illuminated from the back with light emitted from the backlight 6.

基板１には、一方の端辺に位置決め用孔部１ａ，１ｂが形成され、中央部にねじ締結用孔部１ｃが形成されている。なお、位置決め用孔部は、基板１の四隅に設けてもよい。
また、位置決め用孔部１ｂは、図１（ａ）に示すように、位置決め用孔部１ａより横長の孔部である。このように横長の位置決め用孔部１ｂとすることによって、ねじ締結用孔部１ｃと後述するねじ穴２ｅ−１との寸法誤差を吸収している。
さらに、基板１の筐体部材２への取り付け側の各端辺部もしくはその四隅には、基板１に実装された電子部品のグランドラインに電気的に接続するグランドパターンが形成されているものとする。 In the substrate 1, positioning holes 1a and 1b are formed on one end side, and a screw fastening hole 1c is formed in the center. The positioning holes may be provided at the four corners of the substrate 1.
Further, as shown in FIG. 1A, the positioning hole 1b is a laterally longer hole than the positioning hole 1a. Thus, by using the horizontally long positioning hole 1b, a dimensional error between the screw fastening hole 1c and a screw hole 2e-1 described later is absorbed.
Furthermore, a ground pattern that is electrically connected to a ground line of an electronic component mounted on the substrate 1 is formed at each end side or four corners of the substrate 1 on the attachment side to the housing member 2. To do.

筐体部材２の基板１の取り付け面には、図２に示すように、四隅にボス部２ａ〜２ｄが形成され、中央部にボス部２ｅが形成されている。ボス部２ａ〜２ｄは、上記取り付け面から突出した第１のボス部であり、ボス部２ｅは、上記取り付け面からボス部２ａ〜２ｄよりも低く突出した第２のボス部である。
なお、ボス部２ｅは、少なくともボス部２ａ〜２ｄ間に配置される。例えば、図２に示すように、筐体部材２の上記取り付け面の中央、すなわち対角にあるボス部２ａ，２ｄとボス部２ｂ，２ｃの間に配置されている。 As shown in FIG. 2, boss portions 2 a to 2 d are formed at the four corners, and a boss portion 2 e is formed at the center portion of the attachment surface of the substrate 1 of the housing member 2. The boss portions 2a to 2d are first boss portions protruding from the mounting surface, and the boss portion 2e is a second boss portion protruding lower than the boss portions 2a to 2d from the mounting surface.
The boss 2e is disposed at least between the bosses 2a to 2d. For example, as shown in FIG. 2, the housing member 2 is disposed at the center of the mounting surface, that is, between the boss portions 2 a and 2 d and the boss portions 2 b and 2 c which are diagonally located.

ボス部２ａ，２ｂの端面２ａ−２，２ｂ−２には、位置決め用孔部１ａ，１ｂに嵌合して位置決め用突部２ａ−１，２ｂ−１が形成されている。
また、筐体部材２は金属材で形成されており、ボス部２ａ，２ｂの端面２ａ−２，２ｂ−２とボス部２ｃ，２ｄの端面２ｃ−１，２ｄ−１は接地されている。なお、筐体部材２を樹脂材で形成し、ボス部２ａ〜２ｄに金属メッキなどを施して導通をとってもよい。
ボス部２ｅの端面には、図１（ｂ）および図２に示すように、ねじ穴２ｅ−１が形成されている。 Positioning protrusions 2a-1 and 2b-1 are formed on the end faces 2a-2 and 2b-2 of the boss portions 2a and 2b so as to be fitted into the positioning holes 1a and 1b.
The casing member 2 is made of a metal material, and the end surfaces 2a-2 and 2b-2 of the boss portions 2a and 2b and the end surfaces 2c-1 and 2d-1 of the boss portions 2c and 2d are grounded. Note that the casing member 2 may be formed of a resin material, and the boss portions 2a to 2d may be subjected to metal plating or the like for electrical conduction.
A screw hole 2e-1 is formed in the end surface of the boss 2e as shown in FIGS.

基板１を筐体部材２に固定する手順としては、まず、基板１を筐体部材２の取り付け面に配置する。このとき、基板１の位置決め用孔部１ａ，１ｂに位置決め用突部２ａ−１，２ｂ−１が嵌合係合して、基板１と筐体部材２の相対的な取り付け位置が決定される。
また、基板１と筐体部材２の相対的な取り付け位置を決定することで、ねじ締結用孔部１ｃとねじ穴２ｅ−１とが連通した状態となる。この状態で、図２に示すように、ねじ３をねじ締結用孔部１ｃに挿通してねじ穴２ｅ−１に締結する。 As a procedure for fixing the substrate 1 to the housing member 2, first, the substrate 1 is arranged on the mounting surface of the housing member 2. At this time, the positioning projections 2a-1 and 2b-1 are fitted and engaged with the positioning holes 1a and 1b of the substrate 1, and the relative mounting position of the substrate 1 and the housing member 2 is determined. .
Further, by determining the relative mounting position of the substrate 1 and the housing member 2, the screw fastening hole 1c and the screw hole 2e-1 are in communication with each other. In this state, as shown in FIG. 2, the screw 3 is inserted into the screw fastening hole 1c and fastened to the screw hole 2e-1.

基板１をねじ３でボス部２ｅの端面に締結した場合、ボス部２ｅが四隅のボス部２ａ〜２ｄよりも低いことから、図３に示すように、基板１は、お椀状、すなわち下に凸に反った状態となる。この発明では、下に凸に反った基板１が元の形状に戻ろうとする復元力を筐体部材２への締結力として利用している。すなわち、基板１をねじ３でボス部２ｅの端面に締結したとき、基板１の四隅は、ボス部２ａ〜２ｄの端面２ａ−２，２ｂ−２，２ｃ−１，２ｄ−１に圧接され、強固な固定が実現される。   When the substrate 1 is fastened to the end surface of the boss 2e with the screw 3, the boss 2e is lower than the bosses 2a to 2d at the four corners. Therefore, as shown in FIG. It becomes a state of warping convexly. In the present invention, a restoring force that causes the substrate 1 warped downward to return to its original shape is used as a fastening force to the housing member 2. That is, when the substrate 1 is fastened to the end surface of the boss portion 2e with the screw 3, the four corners of the substrate 1 are pressed against the end surfaces 2a-2, 2b-2, 2c-1, and 2d-1 of the boss portions 2a to 2d, Strong fixation is realized.

また、ボス部２ａ〜２ｄの端面２ａ−２，２ｂ−２，２ｃ−１，２ｄ−１は接地されていることから、下に凸に反った基板１が元の形状に戻ろうとする復元力は、図３に示すように、基板１のグランドパターンと筐体部材２におけるグランド（ＧＮＤ）接点との接続を保証する力にもなる。すなわち、基板１をねじ３でボス部２ｅの端面に締結すると、基板１の四隅がボス部２ａ〜２ｄの端面２ａ−２，２ｂ−２，２ｃ−１，２ｄ−１にそれぞれ圧接し、基板１の四隅のグランドパターンとのグランドとの電気的な接続を強固にすることができる。   Further, since the end faces 2a-2, 2b-2, 2c-1, and 2d-1 of the boss portions 2a to 2d are grounded, the restoring force that the substrate 1 that is warped downward returns to its original shape. As shown in FIG. 3, this also serves to ensure the connection between the ground pattern of the substrate 1 and the ground (GND) contact of the housing member 2. That is, when the substrate 1 is fastened to the end surface of the boss portion 2e with the screw 3, the four corners of the substrate 1 are pressed against the end surfaces 2a-2, 2b-2, 2c-1, and 2d-1 of the boss portions 2a to 2d, respectively. The electrical connection with the ground pattern of the four corners of 1 can be strengthened.

図４は、従来の基板固定構造の一例を示す分解斜視図である。図４に示すように、基板１００を筐体部材１０１に締結固定する基板固定構造では、基板１００の四隅と中央でねじ締結して筐体部材１０１に固定することが一般的であった。例えば、基板１００には、その四隅にねじ締結用孔部１００ａ〜１００ｄが形成され、中央部にねじ締結用孔部１００ｅが形成されており、これらの孔部とは別に位置決め用孔部１００ｆ，１００ｇが形成されている。筐体部材１０１には、その四隅にボス部１０１ａ〜１０１ｄが形成され、中央部にボス部１０１ｅが形成されており、これらのボス部とは別に位置決め用突部１０１ｆ−１，１０１ｇ−１を端面に有する位置決め用ボス部１０１ｆ，１０１ｇが形成されている。   FIG. 4 is an exploded perspective view showing an example of a conventional substrate fixing structure. As shown in FIG. 4, in the substrate fixing structure in which the substrate 100 is fastened and fixed to the housing member 101, it is general that screws are fastened at the four corners and the center of the substrate 100 and fixed to the housing member 101. For example, the substrate 100 has screw fastening holes 100a to 100d formed at the four corners thereof, and a screw fastening hole 100e formed at the center, and the positioning holes 100f, 100 g is formed. The casing member 101 is formed with boss portions 101a to 101d at the four corners thereof and a boss portion 101e is formed at the center portion, and positioning protrusions 101f-1 and 101g-1 are provided separately from these boss portions. Positioning boss portions 101f and 101g on the end face are formed.

基板１００を筐体部材１０１の取り付け面に配置したときに、位置決め用孔部１００ｆ，１００ｇに位置決め用突部１０１ｆ−１，１０１ｇ−１が嵌合係合して、基板１００と筐体部材１０１の相対的な取り付け位置が決定される。このとき、基板１００に形成したねじ締結用孔部１００ａ〜１００ｅと、ボス部１０１ａ〜１０１ｅの端面に形成したねじ穴１０１ａ−１〜１０１ｅ−１とがそれぞれ連通した状態となる。
この状態で、図４に示すように、ねじ１０２ａ〜１０２ｅをねじ締結用孔部１００ａ〜１００ｅにそれぞれ挿通してねじ穴１０１ａ−１〜１０１ｅ−１に締結する。 When the substrate 100 is disposed on the mounting surface of the housing member 101, the positioning protrusions 101f-1 and 101g-1 are fitted and engaged with the positioning holes 100f and 100g, so that the substrate 100 and the housing member 101 are engaged. The relative mounting position is determined. At this time, the screw fastening holes 100a to 100e formed in the substrate 100 and the screw holes 101a-1 to 101e-1 formed in the end faces of the bosses 101a to 101e are in communication with each other.
In this state, as shown in FIG. 4, the screws 102a to 102e are respectively inserted into the screw fastening holes 100a to 100e and fastened to the screw holes 101a-1 to 101e-1.

従来の基板固定構造においては、基板１００を締結するためのボス部と位置決め用のボス部とが別に形成される。このため、基板１００に形成する孔部の数が不可避的に多くなり、基板１００の有効実装面積が狭くなることから、回路設計上の自由度が低い。   In the conventional substrate fixing structure, a boss portion for fastening the substrate 100 and a positioning boss portion are formed separately. For this reason, the number of holes formed in the substrate 100 is inevitably increased, and the effective mounting area of the substrate 100 is reduced, so that the degree of freedom in circuit design is low.

これに対して、実施の形態１に係る基板固定構造では、ボス部２ｅでのみ基板１を締結することから、ボス部２ａ〜２ｄの一部に位置決め用係合部を形成すればよく（図１〜３の例では、ボス部２ａ，２ｂ）、基板１に形成すべき孔部の数を従来よりも格段に少なくて済む。これにより、基板１の有効実装面積が広くなって、回路設計上の自由度を向上させることができる。   On the other hand, in the substrate fixing structure according to the first embodiment, the substrate 1 is fastened only at the boss portion 2e, and therefore, a positioning engagement portion may be formed on a part of the boss portions 2a to 2d (see FIG. In the examples 1 to 3, the number of the bosses 2a and 2b) and the number of holes to be formed in the substrate 1 can be remarkably smaller than in the prior art. Thereby, the effective mounting area of the board | substrate 1 becomes wide, and the freedom degree in circuit design can be improved.

また、車載用の電子機器では、一定の水準を超えるＥＭＣ（Ｅｌｅｃｔｒｏｍａｇｎｅｔｉｃ Ｃｏｍｐａｔｉｂｉｌｉｔｙ）の耐力が要求される。
従来の基板固定構造では、ＥＭＣの耐力を確保するために、金属製の筐体部材１０１に基板１００を締結する箇所を増やしてグランド接点の数を増やしていた。例えば、図４に示すように、１５０ｍｍ×７５ｍｍ程度の大きさの基板１００においても、四隅と中央の計５点でねじ締結していた。 In addition, in-vehicle electronic devices are required to have EMC (Electromagnetic Compatibility) strength exceeding a certain level.
In the conventional substrate fixing structure, in order to ensure the strength of EMC, the number of ground contacts is increased by increasing the number of locations where the substrate 100 is fastened to the metal casing member 101. For example, as shown in FIG. 4, even in a substrate 100 having a size of about 150 mm × 75 mm, screws are fastened at a total of five points at the four corners and the center.

これに対して、実施の形態１に係る基板固定構造では、基板１の中央のみをボス部２ｅの端面に締結し、基板１の四隅がボス部２ａ〜２ｄに圧接して固定されるので、ねじ締結用の孔部を設けなくても十分にグランド接点を得ることができ、ＥＭＣの耐力を確保することができる。   On the other hand, in the substrate fixing structure according to the first embodiment, only the center of the substrate 1 is fastened to the end surface of the boss portion 2e, and the four corners of the substrate 1 are fixed by being pressed against the boss portions 2a to 2d. Even without providing a screw fastening hole, a ground contact can be obtained sufficiently, and the proof stress of EMC can be ensured.

なお、位置決め用係合部を設けないボス部２ｃ，２ｄについては、基板１のグランドパターンと強固に接続できればよい。
従って、図５（ａ）に示す筐体部材２Ａのように、ボス部２ｄの端部２ｄ１−１を半球状に形成してもよく、図５（ｂ）に示す筐体部材２Ｂのように、ボス部２ｄの端部２ｄ２−１を円錐状に形成してもよい。
このような形状とすることで、ボス部２ｃ，２ｄの端部２ｄ１−１，２ｄ２−１が基板１に点接触して圧接するので、強固な接続を実現することができる。 It should be noted that the boss portions 2c and 2d that do not have the positioning engagement portion only need to be firmly connected to the ground pattern of the substrate 1.
Accordingly, the end 2d1-1 of the boss 2d may be formed in a hemispherical shape as in the case 2A shown in FIG. 5A, and as shown in the case 2B shown in FIG. 5B. The end portion 2d2-1 of the boss portion 2d may be formed in a conical shape.
By adopting such a shape, the end portions 2d1-1 and 2d2-1 of the boss portions 2c and 2d are brought into point contact with the substrate 1 and pressed, so that a strong connection can be realized.

上記説明では、基板１をボス部２ｅの端面にねじ３で締結する場合を示したが、これに限定されるものではない。例えば、超音波溶着、圧入、熱溶着、接着、スナップフィットなどを用いて、基板１をボス部２ｅの端面に締結してもよい。   Although the case where the board | substrate 1 was fastened with the screw 3 to the end surface of the boss | hub part 2e was shown in the said description, it is not limited to this. For example, you may fasten the board | substrate 1 to the end surface of the boss | hub part 2e using ultrasonic welding, press-fit, heat welding, adhesion | attachment, snap fit, etc.

また、基板１のグランド接点を保証するため、筐体部材２が導電体である場合を示したが、基板１を筐体部材２に締結することによるグランド接点を保証する必要がない場合には、筐体部材２が導電体でなくてもよい。   Further, in order to guarantee the ground contact of the substrate 1, the case where the housing member 2 is a conductor has been shown. However, when it is not necessary to guarantee the ground contact by fastening the substrate 1 to the housing member 2. The casing member 2 may not be a conductor.

図１〜３では、基板１の中央をねじ締結し、基板１の四隅がボス部２ａ〜２ｄの端面に圧接することにより筐体部材２に固定する場合を示したが、これに限定されるものではない。例えば、筐体部材２の周辺部に沿って内側を囲むように複数の第１のボス部を配置し、これら第１のボス部間に第２のボス部を配置し、基板１の第２のボス部に対応する位置にねじ締結用孔部を形成して、基板１を第２のボス部の端面に締結する。このように構成することでも、第２のボス部に隣接する第１のボス部の端面と、これに対応する基板１の部分とが圧接し、上記と同様に強固な固定が可能である。   Although the center of the board | substrate 1 is screw-fastened in FIGS. 1-3, the four corners of the board | substrate 1 showed the case where it fixes to the housing member 2 by press-contacting to the end surface of the boss | hub parts 2a-2d, but it is limited to this. It is not a thing. For example, a plurality of first boss portions are arranged so as to surround the inner side along the peripheral portion of the housing member 2, a second boss portion is arranged between the first boss portions, and the second of the substrate 1 is arranged. A screw fastening hole is formed at a position corresponding to the boss, and the substrate 1 is fastened to the end face of the second boss. Even with this configuration, the end surface of the first boss portion adjacent to the second boss portion and the portion of the substrate 1 corresponding to the end surface are in pressure contact with each other, and strong fixation is possible as described above.

以上のように、この実施の形態１によれば、筐体部材２の基板１の取り付け面から突出して設けられたボス部２ａ〜２ｄと、筐体部材２の基板１の取り付け面におけるボス部２ａ〜２ｄ間に設けられて、当該取り付け面からボス部２ａ〜２ｄよりも低く突出したボス部２ｅとを備え、基板１をボス部２ｅの端面に締結する。
このように構成することで、筐体部材２に対して基板１を固定する際に必要な締結箇所を減らすことができる。これにより、締結箇所が減った分だけ基板１の有効実装面積が広くなって、回路設計上の自由度を向上させることができる。 As described above, according to the first embodiment, the boss portions 2a to 2d provided so as to protrude from the mounting surface of the substrate 1 of the housing member 2 and the boss portions on the mounting surface of the substrate 1 of the housing member 2 A boss portion 2e provided between 2a to 2d and projecting lower than the boss portions 2a to 2d from the mounting surface, and the substrate 1 is fastened to the end surface of the boss portion 2e.
By comprising in this way, the fastening location required when fixing the board | substrate 1 with respect to the housing member 2 can be reduced. Thereby, the effective mounting area of the board | substrate 1 becomes large by the part which the fastening location reduced, and the freedom degree on a circuit design can be improved.

また、この実施の形態１によれば、基板１をボス部２ｅに締結したときに基板１が圧接するボス部２ａ〜２ｄの端部を接地したので、ＥＭＣの耐力を向上させることができる。   Further, according to the first embodiment, when the substrate 1 is fastened to the boss portion 2e, the end portions of the boss portions 2a to 2d to which the substrate 1 is pressed are grounded, so that the proof strength of the EMC can be improved.

さらに、この実施の形態１によれば、ボス部２ａ〜２ｄの一部の端面および基板１に設けられ、筐体部材２に基板１を配置したときに互いに係合して筐体部材２に対する基板１の位置決めを行う位置決め用係合部である、位置決め用孔部１ａ，１ｂおよび位置決め用突部２ａ−１，２ｂ−１を備える。このように構成することで、基板１に形成すべき位置決め用孔部の数を減らすことができるため、基板１の有効実装面積が広くなって、回路設計上の自由度を向上させることができる。   Further, according to the first embodiment, the boss portions 2a to 2d are provided on a part of the end surfaces and the substrate 1 and are engaged with each other when the substrate 1 is disposed on the housing member 2 with respect to the housing member 2. Positioning holes 1a and 1b and positioning protrusions 2a-1 and 2b-1 which are positioning engaging portions for positioning the substrate 1 are provided. With this configuration, since the number of positioning holes to be formed in the substrate 1 can be reduced, the effective mounting area of the substrate 1 is widened, and the degree of freedom in circuit design can be improved. .

さらに、この実施の形態１によれば、ボス部２ｃ，２ｄの端部２ｄ１−１，２ｄ２−１が、基板１に点接触して圧接する形状であるので、ボス部２ｃ，２ｄの端部２ｄ１−１，２ｄ２−１と基板１との強固な接続を実現することができる。   Furthermore, according to the first embodiment, the end portions 2d1-1 and 2d2-1 of the boss portions 2c and 2d are in a shape of being in point contact with the substrate 1 and being in pressure contact therewith, so that the end portions of the boss portions 2c and 2d A strong connection between 2d1-1 and 2d2-1 and the substrate 1 can be realized.

なお、本発明はその発明の範囲内において、実施の形態の任意の構成要素の変形、もしくは実施の形態の任意の構成要素の省略が可能である。   In the present invention, any component of the embodiment can be modified or any component of the embodiment can be omitted within the scope of the invention.

１ 基板、１ａ，１ｂ 位置決め用孔部、１ｃ ねじ締結用孔部、２，２Ａ，２Ｂ 筐体部材、２ａ〜２ｄ ボス部（第１のボス部）、２ｅ ボス部（第２のボス部、２ａ−１，２ｂ−１ 位置決め用突部、２ａ−２，２ｂ−２，２ｃ−１，２ｄ−１ 端面、２ｄ１−１，２ｄ２−１ 端部、２ｅ−１ ねじ穴、３ ねじ、４ 内枠材、５ 外枠材、６ バックライト、７ 液晶パネル。   DESCRIPTION OF SYMBOLS 1 Board | substrate, 1a, 1b Positioning hole part, 1c Screw fastening hole part, 2, 2A, 2B Housing member, 2a-2d Boss part (1st boss part), 2e Boss part (2nd boss part, 2a-1, 2b-1 positioning protrusion, 2a-2, 2b-2, 2c-1, 2d-1 end face, 2d1-1, 2d2-1 end, 2e-1 screw hole, 3 screw, 4 inside Frame material, 5 outer frame material, 6 backlight, 7 liquid crystal panel.

Claims (4)

筐体部材に基板を締結して固定する基板固定構造であって、
前記筐体部材における前記基板の取り付け面から突出して設けられて、少なくとも前記基板の四隅に対応する位置のそれぞれに配置された複数の第１のボス部と、
前記筐体部材の前記取り付け面における対角の位置関係にある第１のボス部間に設けられて、当該取り付け面から前記第１のボス部よりも低く突出した第２のボス部と、
前記基板の四隅のうちの前記基板の一辺側の二隅と、前記基板の一辺側の二隅に対応する位置に配置された前記第１のボス部の端部と、に設けられ、互いに係合して前記基板を前記取り付け面に位置決めする位置決め用係合部とを備え、
前記基板は、
前記取り付け面に配置された状態で、一辺側が、前記位置決め用係合部により前記取り付け面に位置決めされ、一辺側に対向する他辺側が、当該他辺側の二隅に対応する位置に配置された前記第１のボス部の端部に接触し、
前記第２のボス部の端面に向けて凸に反って締結された状態で、四隅が前記第１のボス部の端部に圧接すること
を特徴とする基板固定構造。 A substrate fixing structure for fastening and fixing a substrate to a housing member,
Provided to protrude from the mounting surface of the substrate in the housing member, and a plurality disposed in respective positions corresponding to four corners of at least the substrate first boss portion,
Wherein provided between the first boss in the positional relationship between the diagonal before Quito Ri application surface of the housing member, a second boss portion protruding lower than the from the mounting surface first boss ,
Of the four corners of the substrate, two corners on one side of the substrate and ends of the first boss portions disposed at positions corresponding to the two corners on the one side of the substrate are connected to each other. And a positioning engagement portion for positioning the substrate on the mounting surface ,
The substrate is
In a state of being arranged on the attachment surface, one side is positioned on the attachment surface by the positioning engaging portion, and the other side opposite to the one side is arranged at a position corresponding to two corners on the other side. Contacting the end of the first boss,
The substrate fixing structure, wherein the four corners are in pressure contact with the end portion of the first boss portion in a state where the second boss portion is fastened in a convex manner toward the end surface of the second boss portion . 前記第１のボス部は、接地されていることを特徴とする請求項１記載の基板固定構造。 The substrate fixing structure according to claim 1, wherein the first boss portion is grounded . 前記基板の他辺側の二隅に対応する位置に配置された前記第１のボス部の端部は、前記基板に点接触する形状であることを特徴とする請求項１または請求項２記載の基板固定構造。 3. The end portion of the first boss portion disposed at a position corresponding to two corners on the other side of the substrate has a shape that makes point contact with the substrate. PCB fixing structure. 前記筐体部材と前記基板とを有する電子機器において、
前記筐体部材に前記基板を締結して固定する請求項１から請求項３のうちのいずれか１項記載の基板固定構造を備えたことを特徴とする電子機器。 An electronic device having said substrate and said housing member,
An electronic apparatus comprising the substrate fixing structure according to any one of claims 1 to 3 , wherein the substrate is fastened and fixed to the housing member.
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