KR100647880B1 - Method of installing injection connectors to a pcb - Google Patents

Method of installing injection connectors to a pcb Download PDF

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Publication number
KR100647880B1
KR100647880B1 KR1020060073911A KR20060073911A KR100647880B1 KR 100647880 B1 KR100647880 B1 KR 100647880B1 KR 1020060073911 A KR1020060073911 A KR 1020060073911A KR 20060073911 A KR20060073911 A KR 20060073911A KR 100647880 B1 KR100647880 B1 KR 100647880B1
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KR
South Korea
Prior art keywords
pcb
cream solder
injection connector
metal mask
injection
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KR1020060073911A
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Korean (ko)
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양영미
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양영미
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Priority to KR1020060073911A priority Critical patent/KR100647880B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method for installing an injection connector in a PCB(Printed Circuit Board) is provided to promptly perform the soldering process for fixing the injection connector to the PCB through an automatic production line, thereby achieving the improvement of productivity. A cream solder(20) is coated on an upper surface and a lower surface of a PCB(10) using a metal mask. An injection connector(30) is inserted into the PCB while pins(35) of the injection connector(30) are disposed correspondingly to the cream solder(20) coated on the PCB(10). The pins(35) of the injection connector(30) are fixed to the cream solder(20) of the PCB(10) by applying heat to the PCB(10), into which the injection connecter(30) is inserted, in a heating furnace(40).

Description

ＰＣＢ에 사출커넥터를 장착하는 방법{Method of installing injection connectors to a ＰＣＢ}Method of installing injection connectors to a PC}

도1 - 본 발명의 제1실시예에 의한 PCB에 사출커넥터를 장착하는 방법을 보여주는 개략적인 작업 공정도.1 is a schematic working flowchart showing a method of mounting an injection connector on a PCB according to a first embodiment of the present invention.

도2 - 본 발명의 제2실시예에 의한 PCB에 사출커넥터를 장착하는 방법을 보여주는 개략적인 작업 공정도.2 is a schematic working flowchart showing a method of mounting an injection connector on a PCB according to a second embodiment of the present invention.

<도면에 사용된 주요부호에 대한 설명><Description of Major Symbols Used in Drawings>

10 : PCB 20 : 크림솔더10: PCB 20: cream solder

30 : 사출커넥터 35 : 핀30: injection connector 35: pin

40 : 가열로 45 : 챔버40: heating furnace 45: chamber

46 : 컨베이어46: conveyor

본 발명은 PCB에 각종 전자부품을 용접하는 방법에 관련되는 것으로서, 특히 메탈마스크를 이용하여 PCB의 상하면 양측 모두에 크림솔더를 도포하고 열을 가해 전자부품의 핀을 동시에 용접되게 하는 기술에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of welding various electronic components on a PCB, and more particularly, to a technique of applying a cream solder to both upper and lower sides of a PCB using a metal mask and applying heat to weld the pins of the electronic component simultaneously. .

메탈마스크를 이용하여 크림솔더를 도포하는 것은 널리 알려진 기술로서 개략적으로 이에 대해 설명하기로 한다. 상기 크림솔더란, 솔더분말에 플럭스를 섞어서 적당한 점도로 한 뒤 솔더로 사용되는 것을 의미한다.Applying the cream solder using a metal mask is a well known technique and will be described schematically. The cream solder means that the flux is mixed with the solder powder to an appropriate viscosity and then used as a solder.

메탈마스크를 제작하는 방법으로는 몇 가지가 알려져 있는데, 부식을 이용하거나 레이저 가공을 통해 PCB와 동일한 위치에 천공된 개구부를 형성시키게 된다.There are several known methods of fabricating metal masks, which use perforation or laser processing to form perforated openings in the same location as the PCB.

이와 같은 메탈마스크를 이용하여 PCB에 크림솔더를 도포할 시에는 PCB를 메탈마스크 밑에 두며, 크림솔더를 메탈마스크 위에 공급한 후 스퀴지를 이용하여 균일하게 도포될 수 있도록 한다.When the cream solder is applied to the PCB using the metal mask, the PCB is placed under the metal mask, and the cream solder is supplied on the metal mask to be uniformly applied using a squeegee.

스퀴지를 이용하여 크림솔더를 메탈마스크 위에 도포하면 메탈마스크에 구비되는 개구부를 통해 크림솔더가 통과되어 PCB에 도포될 수 있다.When the cream solder is applied onto the metal mask using a squeegee, the cream solder may be applied to the PCB through an opening provided in the metal mask.

이와 같은 솔더링 과정은 일반적으로 실시되고 있는 기술이며, 본 발명에서는 PCB에 크림솔더를 도포한 후 각종 전자부품의 핀을 크림솔더에 용접되게 하는 것과 관련된다.Such a soldering process is a technique that is generally performed, and the present invention relates to the application of the cream solder to the PCB and to welding the pins of various electronic components to the cream solder.

지금까지 PCB에 도포된 크림솔더에 전자부품의 핀을 용접하는 방법으로는 작업자가 일일이 수작업으로 용접을 실시하였다. 수작업에 의한 용접의 경우 작업자의 숙련도에 따라 품질의 편차가 많았으며 불량품의 발생율도 매우 높았다. 또한, 생산성도 낮아 가격경쟁력을 확보하는데 어려움도 많았다.Until now, as a method of welding the pins of the electronic components to the cream solder applied to the PCB, the worker manually performed welding. In the case of welding by hand, there were many variations in quality according to the skill of the operator and the incidence of defective products was also very high. In addition, productivity was low, and it was difficult to secure price competitiveness.

그리고 PCB에 결합되는 전자부품은 PCB의 상하면 모두에서 핀이 결합되는 경우가 많기 때문에 수작업에 의한 솔더링은 한층 많은 문제점을 나타내게 된다.And since the electronic components coupled to the PCB are often coupled to the pins on both the upper and lower surfaces of the PCB, manual soldering presents many more problems.

상술한 바와 같은 종래의 문제점을 해결하기 위한 본 발명은 PCB의 상하면에 크림솔더를 도포한 후 다수의 전자부품의 핀이 자동라인을 거치면서 동시에 용접이 이루어질 수 있도록 하는 방법을 제공하고자 한다.The present invention for solving the conventional problems as described above is to provide a method for allowing the welding of the pins of a plurality of electronic components through the automatic line at the same time after applying the cream solder on the upper and lower surfaces of the PCB.

또한, 자동용접시에 수반될 수 있는 제품의 변형이나 전자부품에 형성되는 핀의 위치가 변화되지 않도록 하는 방법을 제공하고자 한다.Another object of the present invention is to provide a method of preventing deformation of a product or position of a pin formed on an electronic component that may be involved in automatic welding.

상기와 같은 목적 달성을 위해 본 발명의 PCB에 사출커넥터를 장착하는 방법은, PCB에 크림솔더를 이용하여 사출커넥터를 장착하는 방법에 있어서, 메탈마스크를 이용하여 PCB의 상하면에 크림솔더를 도포하는 프린팅단계와; 크림솔더가 도포된 PCB에 사출커넥터의 핀이 크림솔더에 일치되게 결합하는 사출커넥터 삽입단계와; 상기 사출커넥터가 결합된 PCB를 가열로에서 열을 가해 상기 핀이 크림솔더에 고정되게 하는 솔더링단계;를 포함하여 구성되는 것을 특징으로 한다.Method for mounting the injection connector on the PCB of the present invention for achieving the above object, in the method for mounting the injection connector using a cream solder on the PCB, by applying a cream solder on the upper and lower surfaces of the PCB using a metal mask. A printing step; An injection connector insertion step of coupling the pins of the injection connector to the cream solder on the PCB to which the cream solder is applied; And a soldering step of applying the heat in the heating furnace to the PCB to which the injection connector is coupled, so that the pins are fixed to the cream solder.

또한, 본 발명의 PCB에 사출커넥터를 장착하는 방법은, 상기 프린팅단계가 상부 메탈마스크를 이용하여 PCB 상면에 대해 크림솔더를 도포하는 제1단계와; PCB 상면에 도포된 크림솔더의 파손을 방지키 위해 메탈마스크지그 위에 PCB상면을 올려 PCB의 배면이 상부에 위치되게 하는 제2단계와; 하부 메탈마스크를 이용하여 PCB 배면에 대해 크림솔더를 도포하는 제3단계;로 구성되는 것임을 또 다른 특징으로 한다.In addition, the method of mounting the injection connector on the PCB of the present invention, the printing step is a first step of applying a cream solder to the upper surface of the PCB using the upper metal mask; A second step of placing the upper surface of the PCB on the metal mask jig so as to prevent the damage of the cream solder applied to the upper surface of the PCB so that the rear surface of the PCB is positioned at the upper side; The third step of applying a cream solder to the back of the PCB by using a lower metal mask; it is another feature.

또한, 본 발명의 PCB에 사출커넥터를 장착하는 방법은, 상기 사출커넥터 삽입단계 후에, 인접한 사출커넥터들을 보호용캡으로 덮어 변형을 방지하는 보호용캡 결합단계를 더 포함하는 것을 또 다른 특징으로 한다.In addition, the method of mounting the injection connector on the PCB of the present invention, after the injection connector insertion step, characterized in that it further comprises a protective cap coupling step of preventing deformation by covering adjacent injection connectors with a protective cap.

그리고 본 발명의 PCB에 사출커넥터를 장착하는 방법에 있어 상기 가열로는, 무한궤도 운동하는 컨베이어가 구비되어 연속적으로 솔더링이 이루어지도록 한 것을 또 다른 특징으로 한다.And in the method of mounting the injection connector on the PCB of the present invention, the heating furnace is characterized in that the conveyor is provided with a crawler movement to be continuously soldered.

한편, 본 발명의 PCB에 사출커넥터를 장착하는 방법에 있어서, 상기 가열로는 온도가 상이하게 설정되는 다단가열구조를 갖추고 있음을 또 다른 특징으로 한다.On the other hand, in the method of mounting the injection connector on the PCB of the present invention, the heating furnace is characterized by having a multi-stage heating structure in which the temperature is set differently.

이하 첨부되는 관련도면을 참조하면서 본 발명의 최적 실시예에 대해 보다 구체적으로 설명하기로 하며, 첨부도면들은 본 발명의 이해를 돕기 위한 것으로 본 발명의 기술적 사상을 구체화한 하나의 실시예 임을 밝혀둔다.BEST MODE Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings, and the accompanying drawings are provided to help understanding of the present invention, and it is to be understood that one embodiment embodies the technical idea of the present invention. .

따라서, 본 발명의 기술적 사상 범위 내에서는 당업자에 의한 용이한 설계변경이나 구성요소의 단순치환 등도 본 발명의 권리범위에 포함된다 할 것이다.Therefore, within the technical scope of the present invention, easy design changes and simple replacement of components by those skilled in the art will also be included in the scope of the present invention.

본 발명에 따른 PCB에 사출커넥터를 장착하는 방법은 프린팅단계와, 사출커넥터 삽입단계 및 솔더링단계를 포함하여 구성된다. 여기서 프린팅단계는 메탈마스크를 이용하여 PCB의 상하면에 크림솔더를 도포하는 것이다.The method for mounting an injection connector on a PCB according to the present invention includes a printing step, an injection connector insertion step and a soldering step. Here, the printing step is to apply the cream solder on the upper and lower surfaces of the PCB using a metal mask.

그리고 사출커넥터 삽입단계는 크림솔더가 도포된 PCB에 준비된 사출커넥터를 결합하는 것으로 사출커넥터 핀이 크림솔더의 상부에 놓이도록 삽입한다. 상기 사출커넥터에는 다수개의 핀이 결합 되어있고 상부핀과 하부핀을 가지게 된다. 준비된 사출커넥터를 핀 부위가 PCB에 도포된 크림솔더를 향하게 삽입하면 상기 핀 은 크림솔더 위에 일치하게 된다. 이 단계에서는 아직 사출 커넥터 핀이 크림솔더에 완전히 고정된 것이 아니다.And the injection connector insertion step is to combine the injection connector prepared on the PCB with the cream solder is inserted so that the injection connector pin is placed on top of the cream solder. The injection connector is coupled to a plurality of pins and has an upper pin and a lower pin. When the prepared injection connector is inserted with the pin portion facing the cream solder applied to the PCB, the pin is aligned on the cream solder. At this stage, the injection connector pins are not yet fully secured to the cream solder.

따라서 이후 단계로서 핀과 크림솔더를 일체가 되게 용접해야 한다. 특히 핀의 갯수는 수개에서 수십개에 이를수 있기 때문에 본 발명에서는 적정한 열을 가하여 크림솔더와 핀이 자동용접이 행하여 지도록 하는 솔더링단계를 포함하게 된다.Therefore, as a later step, the pin and the cream solder must be integrally welded. In particular, since the number of pins can reach several to several tens, the present invention includes a soldering step in which the cream solder and the pins are automatically welded by applying appropriate heat.

언급한 사출커넥터는 일반적으로 이러한 소형의 전자부품들이 사출로 성형되는 경우가 많기 때문에 이름붙인 것이고 그 형태나 종류 등은 다양한 변화가 가능한 부분이다.The injection connector mentioned is generally named because these small electronic parts are often molded by injection, and its shape and type can be changed in various ways.

보다 구체적인 본 발명의 실시예는 이하 설명하는 바와 같다.More specific embodiments of the present invention are as described below.

<제1실시예>First Embodiment

본 실시예에서는 독립한 부품이 되는 PCB가 서로 연속적으로 연결되어 있는 것으로 동시에 솔더링을 실시할 수 있도록 한 것이며, 그 작업과정은 기본적으로 프린팅단계(Ⅰ), 사출커넥터 삽입단계(Ⅱ) 및 솔더링단계(Ⅲ)로 구성된다.In this embodiment, the PCBs, which are independent components, are continuously connected to each other so that soldering can be performed at the same time. The work process is basically a printing step (I), an injection connector insertion step (II), and a soldering step. (III).

도1은 본 발명의 제1실시예에 의한 PCB에 사출커넥터를 장착하는 방법을 보여주는 개략적인 작업 공정도에 해당된다.1 is a schematic work flow diagram showing a method of mounting an injection connector on a PCB according to a first embodiment of the present invention.

PCB의 상면에는 한개소에 사출커넥터의 핀이 연결되며 하면에는 3개소에서 사출커넥터의 핀이 연결되는 경우를 보여준다. 따라서 프린팅단계(Ⅰ)에서는 메탈마스크를 이용하여 PCB(10)의 상하면 특정위치에 크림솔더(20)를 도포하게 된다.It shows the case where the pins of the injection connector are connected at one place on the upper surface of the PCB and the pins of the injection connector are connected at the three places on the bottom. Accordingly, in the printing step (I), the cream solder 20 is applied to the upper and lower specific positions of the PCB 10 using a metal mask.

상기 프린팅단계(Ⅰ)의 보다 구체적인 작업과정은 다음과 같다.A more specific working process of the printing step (I) is as follows.

즉, 프린팅단계는 다시 크게 3단계로 구분될 수 있다. 이를 위해서는 미리 상부 메탈마스크, 하부메탈마스크 및 메탈마스크지그를 제조해야 한다. 메탈마스크의 제작은 일반적인 기술이므로 이에 대한 구체적인 언급은 생략하기로 한다.In other words, the printing step may be further divided into three steps. To this end, the upper metal mask, the lower metal mask and the metal mask jig should be manufactured in advance. Fabrication of the metal mask is a general technique, so a detailed description thereof will be omitted.

프린팅단계에서의 제1단계는 준비된 상부메탈마스크를 이용하여 PCB 상면에 대해 크림솔더를 도포하는 것이다. 크림솔더의 도포는 스퀴지를 이용하여 공급된 크림솔더를 균일하게 문지름에 의해 메탈마스크에 구비되는 개구부에 크림솔더가 투입되어 PCB 상면 특정부위에만 크림솔더가 도포 된다.The first step in the printing step is to apply the cream solder to the upper surface of the PCB using the prepared upper metal mask. In the application of the cream solder, the cream solder is injected into the opening provided in the metal mask by uniformly rubbing the cream solder supplied using the squeegee, and the cream solder is applied only to a specific portion of the upper surface of the PCB.

제1단계로서 PCB 상면에 대한 크림솔더의 도포 후에는 하면에 대한 크림솔더의 도포를 시행해야 한다. 이를 위해서는 제2단계로서 PCB 상면이 크림솔더로 도포된 것을 뒤집어 메탈마스크지그 위에 올려 놓아 PCB의 하면이 상부에 위치되게 한다. 이때 본 발명에서는 PCB의 상면에 미리 크림솔더가 도포된 부위를 보호하기 위해 메탈마스크지그를 사용하는데 상기 메탈마스크지그는 크림솔더가 도포된 영역에 상응하는 위치가 역시 개구 되어있어 도포된 크림솔더가 손상되지 않도록 한다.As a first step, after applying the cream solder to the upper surface of the PCB, the cream solder should be applied to the lower surface. To this end, as the second step, the upper surface of the PCB is coated with a cream solder and placed on the metal mask jig so that the lower surface of the PCB is positioned on the upper side. At this time, in the present invention, a metal mask jig is used to protect a portion where the cream solder is applied on the upper surface of the PCB. The metal mask jig has a position corresponding to the area where the cream solder is applied, and thus the cream solder is applied. Do not damage it.

프린팅단계의 마지막 과정은 하부메탈마스크를 이용하여 PCB 하면에 대해 크림솔더를 도포하는 제3단계가 수행된다. 상기 하부메탈마스크 역시 미리 준비된 것이므로 제1단계와 마찬가지로 스퀴지를 이용하여 크림솔더를 문지르면 메탈마스크의 개구부를 통해 크림솔더가 통과되어 PCB의 하면에 대한 크림솔더의 도포가 완료된다.The final process of the printing step is a third step of applying the cream solder to the lower surface of the PCB using a lower metal mask. Since the lower metal mask is also prepared in advance, rubbing the cream solder using the squeegee as in the first step, the cream solder is passed through the opening of the metal mask to complete the application of the cream solder to the lower surface of the PCB.

프린팅단계(Ⅰ)가 완료되면 이어서는 사출커넥터 삽입단계(Ⅱ)가 이루어진 다.When the printing step (I) is completed, then the injection connector insertion step (II) is performed.

도1에 보이는 것처럼 사출커넥터 삽입단계(Ⅱ)에서는 준비된 사출커넥터(30)를 크림솔더 도포된 PCB에 결합하는 것이다. 상기 사출커넥터(30)에는 다수의 핀(35)이 결합되어 있으며 상기 핀이 PCB에 형성된 크림솔더(20)의 상면에 접촉되도록 끼워 넣게 된다.In the injection connector insertion step (II), as shown in FIG. 1, the prepared injection connector 30 is coupled to a cream solder-coated PCB. A plurality of pins 35 are coupled to the injection connector 30, and the pins are inserted into contact with the upper surface of the cream solder 20 formed on the PCB.

PCB에 사출커넥터들을 정위치에 삽입시킨 후에는 솔더링단계(Ⅲ)가 수행된다. 상기 솔더링단계(Ⅲ)를 위해 본 실시예에서는 가열로(40)를 준비하며 상기 가열로에서 열을 가하면 사출커넥터의 핀은 크림솔더에 용접된다.After inserting the injection connectors into the PCB, the soldering step (III) is performed. In this embodiment, the heating furnace 40 is prepared for the soldering step (III), and when the heating is applied, the pins of the injection connector are welded to the cream solder.

그리고 상기 가열로(40)를 구성함에 있어서는, 길다란 챔버(45) 내부에 히팅수단(미도시)을 배치하고 상기 히팅수단의 하부로 사출커넥터가 결합된 PCB의 자동이송을 위한 컨베이어(46)를 두도록 한다. 컨베이어에 올려진 PCB는 천천히 이동되면서 열을 받게 되고, 이에 따라 크림솔더는 융점에 이르고 사출커넥터 핀은 용접이 이루어진다.In the construction of the heating furnace 40, a heating means (not shown) is disposed inside the elongated chamber 45, and a conveyor 46 for automatic transfer of the PCB to which the injection connector is coupled to the lower portion of the heating means is provided. Put it there. The PCB on the conveyor moves slowly and heats up, so that the cream solder reaches its melting point and the injection connector pins are welded.

한편, 상기 가열로를 구성함에 있어 더욱 바람직하게는 여러 구간으로 구분되어 각 구간마다 온도조절을 개별적으로 실시할 수 있도록 함이 적합하다. 따라서 각 구간마다의 온도를 상이하게 조절하여 솔더링이 가장 최적의 조건하에서 수행될 수 있도록 한다.On the other hand, in the configuration of the heating furnace is more preferably divided into several sections it is suitable to be able to individually perform the temperature control for each section. Therefore, the temperature of each section is adjusted differently so that soldering can be performed under the most optimal conditions.

상기 가열로에서 이루어지는 온도설정은 크게 2구간으로 분류할 수 있다. 즉, 프리히트(preheat)와 본가열로 분류되며 상기 프리히트 구간에서는 상온에서부터 점진적으로 온도를 상승시키게 된다. 대략 프리히트 구간은 60-120초 정도가 적절한데, 프리히트가 불충분하면 큰 솔더볼이 발생되기 쉬우며, 과잉되는 경우에는 젖음불량과 미용융이 발생될 수 있다. 따라서, 프리히트의 종료온도는 150-200℃가 적당하다.The temperature setting made in the heating furnace can be largely classified into two sections. That is, it is classified into preheat and main heating, and gradually raises the temperature from room temperature in the preheat section. Approximately 60-120 seconds is appropriate for the preheat section. If insufficient preheat is caused, large solder balls are easily generated, and if excessive, excessive wetting and unmelting may occur. Therefore, the end temperature of the preheat is suitably 150-200 ° C.

프리히트 후에는 본가열이 실시되는데, 급격한 온도 상승은 솔더크림의 번짐성을 악화시키므로 본 가열에서도 서서히 온도를 상승시켜야 한다. 본 가열에서의 최고온도는 230~240℃ 정도로 함이 적당하다.After preheating, the main heating is carried out. The rapid rise in temperature deteriorates the spreading of the solder cream, so the temperature should be gradually increased even in the main heating. The maximum temperature in this heating is suitable to be 230 ~ 240 ℃.

이처럼, 가열로에서의 솔더링이 끝나면 적절한 속도로 냉각하도록 한다.As such, after soldering in the furnace, cool down to an appropriate speed.

<제2실시예>Second Embodiment

다음으로는 본 발명에 대한 제2실시예에 관해 설명하기로 한다.Next, a second embodiment of the present invention will be described.

본 제2실시예에서는 제1실시예를 기본으로 하되, 사출커넥터 삽입단계 후에 보호용캡 결합단계가 더 포함되는 것이 특징이다.The second embodiment is based on the first embodiment, characterized in that it further comprises a protective cap coupling step after the injection connector insertion step.

즉, 전체적인 공정은 프린팅단계(Ⅰ), 사출커넥터 삽입단계(Ⅱ), 보호용캡 결합단계(Ⅱ-1) 및 솔더링단계(Ⅲ)로 구성된다. 도2는 제2실시예의 작업공정도를 보여주는 것이다.That is, the overall process consists of a printing step (I), an injection connector insertion step (II), a protective cap coupling step (II-1) and a soldering step (III). 2 shows a working flowchart of the second embodiment.

상기 프린팅단계(Ⅰ)는 언급한 바와 같이 PCB의 상하면에 메탈마스크를 이용하여 크림솔더를 도포하는 것이다. 이어서 준비된 사출커넥터를 PCB에 삽입하여 도포된 크림솔더에 사출커넥터 핀이 접촉되게 한다(Ⅱ).The printing step (I) is to apply the cream solder using a metal mask on the upper and lower surfaces of the PCB as mentioned. Then, the prepared injection connector is inserted into the PCB so that the injection connector pins come into contact with the applied cream solder (II).

보호용캡 결합단계(Ⅱ-1)는 연속적으로 배치되는 다수의 사출커넥터(30)를 하나의 보호용캡(C)으로 덮어 고정되게 하는 것이다. 본 실시예에서는 상기 보호 용캡(C)으로 알미늄캡을 사용하였으며 일측이 개방되어 사출커넥터를 끼워넣을 수 있도록 한 것이다.Protective cap coupling step (II-1) is to cover and secure a plurality of injection connectors 30 arranged in succession with one protective cap (C). In this embodiment, the aluminum cap is used as the protective cap (C), and one side is opened to insert the injection connector.

보호용캡 결합단계(Ⅱ-1) 후에는 가열로(40)에서 열을 가해 솔더링을 실시하게 되며, 이것은 언급한 바와 같다.After the protective cap coupling step (II-1), the heating is applied to the furnace 40 to perform soldering, as mentioned above.

상기와 같은 보호용캡을 사출커넥터에 결합한 후, 솔더링을 실시하면 열에 의한 크림솔더의 용융이 발생될 때 사출커넥터의 핀들이 제 위치를 벗어나는 것을 방지할 수 있고, 사출커넥터의 위치변형도 방지할 수 있게 된다. 이로 인해 제품의 불량 등을 줄일 수 있게 된다. 또한, 상기 보호용캡을 사용하면 열에 의한 사출커넥터의 색상변색을 방지할 수 있게 되는 특성도 가지게 된다.If the above-mentioned protective cap is coupled to the injection connector and soldered, the pins of the injection connector can be prevented from being out of position when the cream solder is melted by heat, and the deformation of the injection connector can be prevented. Will be. This can reduce product defects. In addition, the use of the protective cap has a characteristic that can prevent color discoloration of the injection connector by heat.

PCB가 가열로를 통과하여 제품이 완성되면 작업자가 확대경 등을 이용하여 제품의 외관검사(미납, 과납, 쇼트, 이물질, 사출커넥터 핀의 기울어짐 등)를 실시함이 바람직하고, 외관검사에서 용접 불량이 있는 것은 선별하여 수작업으로 수정용접을 하도록 한다.When the PCB is passed through the heating furnace and the product is completed, it is desirable for the worker to perform an external inspection of the product (eg, unpaid, overpaid, short, foreign matter, inclination of the injection connector pin, etc.) by using a magnifying glass. If there are any defects, they are sorted by manual welding.

상술한 바와 같은 본 발명의 방법에 의하면, 종래의 수작업에 의한 솔더링작업을 자동라인을 통해 신속하게 수행할 수 있어 생산성 향상을 달성할 수 있게 되는 효과가 있다.According to the method of the present invention as described above, it is possible to quickly perform the conventional manual soldering operation through the automatic line has the effect that it is possible to achieve productivity improvement.

그리고, 자동화에 의한 대량생산이 가능하고 제품 품질이 균일하므로 불량품의 발생을 줄일 수 있고, 가격경쟁력뿐 아니라 품질적인 측면에서도 높은 신뢰성을 확보할 수 있다는 효과도 제공할 수 있게 된다.In addition, mass production by automation and uniform product quality can reduce the occurrence of defective products, and can provide an effect of ensuring high reliability in terms of quality as well as price competitiveness.

또한, 본 발명에서는 보호용캡을 사용하므로 솔더링시에 유발될 수 있는 사출커넥터 핀의 위치변화로 인한 여러 문제점을 해결할 수 있게 된다는 효과도 있다.In addition, the present invention also has the effect that it is possible to solve a number of problems due to the change in the position of the injection connector pin that can be caused during soldering because the use of a protective cap.

그리고 상기 보호용캡을 사용함에 따라 가열에 의한 사출커넥터의 색상 변색을 방지할 수 있게 되는 효과도 있다.And by using the protective cap has the effect of being able to prevent color discoloration of the injection connector by heating.

Claims (5)

PCB에 크림솔더를 이용하여 사출커넥터를 장착하는 방법에 있어서,In the method of mounting the injection connector using a cream solder on the PCB, 메탈마스크를 이용하여 PCB의 상하면에 크림솔더를 도포하는 프린팅단계와;A printing step of applying a cream solder on the upper and lower surfaces of the PCB using a metal mask; 크림솔더가 도포된 PCB에 사출커넥터의 핀이 크림솔더에 일치되게 결합하는 사출커넥터 삽입단계와;An injection connector insertion step of coupling the pins of the injection connector to the cream solder on the PCB to which the cream solder is applied; 상기 사출커넥터가 결합된 PCB를 가열로에서 열을 가해 상기 핀이 크림솔더에 고정되게 하는 솔더링단계;를 포함하여 구성되는 것을 특징으로 하는 PCB에 사출커넥터를 장착하는 방법.And a soldering step in which the pin is fixed to the cream solder by applying heat to the PCB to which the injection connector is coupled, in a heating furnace. 제1항에 있어서,The method of claim 1, 상기 프린팅단계는,The printing step, 상부 메탈마스크를 이용하여 PCB 상면에 대해 크림솔더를 도포하는 제1단계와;Applying a cream solder to the upper surface of the PCB using the upper metal mask; PCB 상면에 도포된 크림솔더의 파손을 방지키 위해 메탈마스크지그 위에 PCB상면을 올려 PCB의 배면이 상부에 위치되게 하는 제2단계와;A second step of placing the upper surface of the PCB on the metal mask jig so as to prevent the damage of the cream solder applied to the upper surface of the PCB so that the rear surface of the PCB is positioned at the upper side; 하부 메탈마스크를 이용하여 PCB 배면에 대해 크림솔더를 도포하는 제3단계;로 구성되는 것임을 특징으로 하는 PCB에 사출커넥터를 장착하는 방법.The third step of applying a cream solder to the back of the PCB using a lower metal mask; Method for mounting the injection connector on the PCB, characterized in that consisting of. 제1항에 있어서,The method of claim 1, 상기 PCB에 사출커넥터를 장착하는 방법은,Mounting the injection connector on the PCB, 상기 사출커넥터 삽입단계 후에,After the injection connector insertion step, 인접한 사출커넥터들을 보호용캡으로 덮어 변형을 방지하는 보호용캡 결합단계를 더 포함하는 것을 특징으로 하는 PCB에 사출커넥터를 장착하는 방법.And a protective cap coupling step of preventing deformation by covering adjacent injection connectors with a protective cap. 제1항 내지 제3항 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 3, 상기 가열로는,The heating furnace, 무한궤도 운동하는 컨베이어가 구비되어 연속적으로 솔더링이 이루어지도록 한 것을 특징으로 하는 PCB에 사출커넥터를 장착하는 방법.Method for mounting the injection connector on the PCB, characterized in that the conveyor is provided with a crawler movement so that the soldering is made continuously. 제4항에 있어서,The method of claim 4, wherein 상기 가열로는,The heating furnace, 온도가 상이하게 설정되는 다단가열구조를 갖추고 있음을 특징으로 하는 PCB에 사출커넥터를 장착하는 방법.A method of mounting an injection connector on a PCB, characterized in that it has a multi-stage heating structure with different temperatures.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100892139B1 (en) * 2007-08-10 2009-04-09 성암전기 주식회사 Manufacturing method of electric current plate bus using printed circuit board and the electric current plate bus
CN108513440A (en) * 2018-04-20 2018-09-07 深圳市动力飞扬自动化设备有限公司 A kind of encapsulated equipment of upper PIN for pcb board
CN108925047A (en) * 2018-07-12 2018-11-30 深圳智慧者机器人科技有限公司 A kind of pcb board automatically beats the encapsulated production line of pin
KR102549578B1 (en) * 2022-12-15 2023-06-28 김철호 A method of manufacturing plug-connector in the form of a PCB board inserted into the side of contact

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KR19980071790A (en) * 1997-02-28 1998-10-26 닥터 헤이너 패크너 Protective plug
KR19990084206A (en) * 1999-09-28 1999-12-06 김낙현 Connection methods of coil for thin sheet buzzer using spot welding
KR200232255Y1 (en) 2001-02-14 2001-09-29 박영태 plug for connector
KR20030049185A (en) * 2001-12-14 2003-06-25 타이코에이엠피 주식회사 a soldering method for the pcb of the junction box
KR20060024117A (en) * 2004-09-13 2006-03-16 삼성전자주식회사 Method of forming solder ball and related fabrication and structure of semiconductor package using the method

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KR19980071790A (en) * 1997-02-28 1998-10-26 닥터 헤이너 패크너 Protective plug
KR19990084206A (en) * 1999-09-28 1999-12-06 김낙현 Connection methods of coil for thin sheet buzzer using spot welding
KR200232255Y1 (en) 2001-02-14 2001-09-29 박영태 plug for connector
KR20030049185A (en) * 2001-12-14 2003-06-25 타이코에이엠피 주식회사 a soldering method for the pcb of the junction box
KR20060024117A (en) * 2004-09-13 2006-03-16 삼성전자주식회사 Method of forming solder ball and related fabrication and structure of semiconductor package using the method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100892139B1 (en) * 2007-08-10 2009-04-09 성암전기 주식회사 Manufacturing method of electric current plate bus using printed circuit board and the electric current plate bus
CN108513440A (en) * 2018-04-20 2018-09-07 深圳市动力飞扬自动化设备有限公司 A kind of encapsulated equipment of upper PIN for pcb board
CN108513440B (en) * 2018-04-20 2023-11-21 深圳市动力飞扬智能装备有限公司 A go up PIN rubber coating equipment for PCB board
CN108925047A (en) * 2018-07-12 2018-11-30 深圳智慧者机器人科技有限公司 A kind of pcb board automatically beats the encapsulated production line of pin
CN108925047B (en) * 2018-07-12 2023-07-25 深圳智慧者机器人科技有限公司 Full-automatic pin punching and encapsulation production line for PCB (printed circuit board)
KR102549578B1 (en) * 2022-12-15 2023-06-28 김철호 A method of manufacturing plug-connector in the form of a PCB board inserted into the side of contact

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