JP2002353612A - Equipment and method for reworking component - Google Patents
Equipment and method for reworking componentInfo
- Publication number
- JP2002353612A JP2002353612A JP2001158235A JP2001158235A JP2002353612A JP 2002353612 A JP2002353612 A JP 2002353612A JP 2001158235 A JP2001158235 A JP 2001158235A JP 2001158235 A JP2001158235 A JP 2001158235A JP 2002353612 A JP2002353612 A JP 2002353612A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hot air
- heating means
- heating
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、不良部品（リワー
ク対象部品）を加熱してはんだを溶融して基板から取り
外し、その取り外された部品を修理あるいは良品に交換
して基板に再びはんだ付けする部品のリワーク装置及び
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for heating defective parts (parts to be reworked), melting solder and removing the parts from the board, and repairing or replacing the removed parts with non-defective parts and soldering the boards again. The present invention relates to an apparatus and a method for reworking parts.
【０００２】[0002]
【従来の技術】図４は従来のリワーク装置１の側面図
を、図５は図４においてプリント基板２より下方側の構
成部分の平面図を示す。2. Description of the Related Art FIG. 4 is a side view of a conventional rework apparatus 1, and FIG. 5 is a plan view of a component below a printed circuit board 2 in FIG.
【０００３】図４に示すように、多数の部品を搭載した
プリント基板２を挟んで上側に第１加熱手段３が、下側
に第２加熱手段４が配設され、これら第１及び第２加熱
手段３、４でリワーク対象部品５とプリント基板２との
はんだ接合部を加熱する。ここでは、リワーク対象部品
５としては、はんだボール５ａを介してプリント基板２
に表面実装されるＢＧＡ（Ball Grid Array ）部品を例
として説明する。As shown in FIG. 4, a first heating means 3 is disposed above a printed circuit board 2 on which a large number of components are mounted, and a second heating means 4 is disposed below the printed circuit board 2. The heating means 3 and 4 heat the solder joint between the rework target component 5 and the printed circuit board 2. Here, as the rework target component 5, the printed circuit board 2 is connected via the solder ball 5a.
A BGA (Ball Grid Array) component that is surface-mounted on a surface will be described as an example.
【０００４】プリント基板２は、リワーク対象部品５の
搭載された面を上側にして、図５に示す基板支持手段６
ａ、６ｂによって支持される。基板支持手段６ａ、６ｂ
は、プリント基板２の平面と平行に延在して静止部に固
定された２本の板状部材からなり、それぞれの相対向す
る側面側に断面コ字状の溝７が形成されている。この溝
７にプリント基板２（図５において一点鎖線で示す）の
両側端部が挿入されてプリント基板２は支持される。[0004] The printed circuit board 2 has a substrate supporting means 6 shown in FIG.
a, 6b. Substrate support means 6a, 6b
Is composed of two plate-like members extending in parallel with the plane of the printed circuit board 2 and fixed to the stationary part, and has a U-shaped groove 7 formed on the opposing side surfaces. Both ends of the printed board 2 (indicated by a dashed line in FIG. 5) are inserted into the grooves 7, and the printed board 2 is supported.
【０００５】第１加熱手段３は熱風式ヒータであり、支
持柱８を介して設置面に固定された固定部９と、固定部
９に対して昇降する可動部１０とからなる。固定部９に
取り付けられたつまみ１１を回すことによって、可動部
１０は、そのロッド１２が固定部９に対して昇降する。
図示しないが、つまみ１１にはピニオンが連結され、ロ
ッド１２にはそのピニオンと係合するラックレールが形
成されている。[0005] The first heating means 3 is a hot-air heater, and comprises a fixed portion 9 fixed to the installation surface via a supporting column 8 and a movable portion 10 which moves up and down with respect to the fixed portion 9. By turning the knob 11 attached to the fixed part 9, the rod 12 of the movable part 10 moves up and down with respect to the fixed part 9.
Although not shown, a pinion is connected to the knob 11, and a rack rail is formed on the rod 12 to engage with the pinion.
【０００６】ロッド１２の下端には第１の熱風吹き出し
ノズル１３が取り付けられている。また、ロッド１２は
中空状であり、その中空部には吸着手段１４がロッド１
２内を昇降可能に内蔵されている。吸着手段１４はエア
配管部１５とこのエア配管部１５の下端に取り付けられ
たパッド部１６とからなる。パッド部１６内にはエア配
管部１５と連通する貫通孔が形成され、またパッド部１
６近傍のエア配管部１５周面にはエア配管部１５の内外
を連通させる複数の貫通孔１５ａが形成されている。熱
風はエア配管部１５内を通じて送られ貫通孔１５ａ及び
パッド部１６内の貫通孔からリワーク対象部品５に向け
て吹き出す。[0006] At the lower end of the rod 12, a first hot air blowing nozzle 13 is attached. The rod 12 is hollow, and the suction means 14 is provided in the hollow portion of the rod 1.
2 so that it can move up and down. The suction means 14 includes an air pipe section 15 and a pad section 16 attached to a lower end of the air pipe section 15. A through-hole communicating with the air pipe 15 is formed in the pad portion 16.
A plurality of through-holes 15a are formed in the peripheral surface of the air pipe 15 near 6 so as to communicate the inside and outside of the air pipe 15. The hot air is sent through the air pipe 15 and blows out from the through holes 15 a and the through holes in the pad 16 toward the component 5 to be reworked.
【０００７】第２加熱手段４も熱風式のヒータであり、
これは設置面に対して固定されている。図５に示すよう
に、第２加熱手段４の上面には多数の熱風吹き出し孔４
ａが形成され、これら孔４ａから、第２加熱手段４に対
向するプリント基板２の下面に向けて熱風が吹き出す。The second heating means 4 is also a hot-air heater,
It is fixed relative to the mounting surface. As shown in FIG. 5, a large number of hot air blowing holes 4 are provided on the upper surface of the second heating means 4.
a is formed, and hot air is blown from these holes 4 a toward the lower surface of the printed circuit board 2 facing the second heating means 4.
【０００８】また、プリント基板２は加熱されると重力
作用方向に反る（下に凸状に反る）傾向にあるので、こ
れを防止するため、プリント基板２の下面側に基板反り
防止部材１７が配設されている。基板反り防止部材１７
は、図５に示す基板支持手段６ａ、６ｂと平行に延在し
て静止部に固定されており、その上面にねじ込まれた例
えば３個のねじ１７ａの頭部がプリント基板２の下面に
当接してプリント基板２の下反りを規制するようにして
いる。When the printed circuit board 2 is heated, it tends to warp (warp downward) in the direction of gravitational action. 17 are provided. Board warpage prevention member 17
Is fixed to a stationary part extending parallel to the substrate supporting means 6a and 6b shown in FIG. 5, and the heads of, for example, three screws 17a screwed on the upper surface thereof correspond to the lower surface of the printed circuit board 2. The printed circuit board 2 is in contact with the printed circuit board 2 to restrict the warpage.
【０００９】従来のリワーク装置１は以上のように構成
され、次にその作用について説明する。The conventional rework apparatus 1 is configured as described above, and its operation will be described below.
【００１０】リワーク対象部品５を搭載したプリント基
板２が基板支持手段６ａ、６ｂにより所定の位置で位置
決めされて支持されると、第１加熱手段３のつまみ１１
を回すことによってロッド１２及び第１の熱風吹き出し
ノズル１３がリワーク対象部品５に向けて下降する。こ
の下降により、第１の熱風吹き出しノズル１３はリワー
ク対象部品５を覆うようにしてプリント基板２に密着す
る（実際はリワーク対象部品５の周辺に隣接して他の部
品があることが多く、それら部品と第１の熱風吹き出し
ノズル１３との干渉を防ぐため、第１の熱風吹き出しノ
ズル１３はプリント基板２から少し離した状態で使用す
ることが多い）。When the printed board 2 on which the component 5 to be reworked is mounted is positioned and supported at a predetermined position by the board supporting means 6a and 6b, the knob 11 of the first heating means 3 is used.
By turning, the rod 12 and the first hot air blowing nozzle 13 are lowered toward the component 5 to be reworked. Due to this lowering, the first hot-air blowing nozzle 13 closely adheres to the printed circuit board 2 so as to cover the component 5 to be reworked (in fact, there are many other components adjacent to the periphery of the component 5 to be reworked. In order to prevent interference between the first hot air blowing nozzle 13 and the first hot air blowing nozzle 13, the first hot air blowing nozzle 13 is often used in a state where it is slightly away from the printed circuit board 2).
【００１１】この状態で、エア配管１５内を送られてき
た熱風は、下端部の貫通孔１５ａ及びパッド部１６内の
貫通孔から吹き出し、リワーク対象部品５とプリント基
板２との接合部であるはんだボール５ａを加熱する。吹
き出した熱風は、第１の熱風吹き出しノズル１３に形成
された排出口１３ａより外部に排出される。In this state, the hot air sent through the air pipe 15 blows out from the through hole 15a at the lower end and the through hole in the pad portion 16 and forms a joint between the component 5 to be reworked and the printed circuit board 2. The solder ball 5a is heated. The blown hot air is discharged to the outside through a discharge port 13 a formed in the first hot air blow nozzle 13.
【００１２】なお、第１の熱風吹き出しノズル１３はロ
ッド１２に対して着脱自在となっており、リワーク対象
部品５のサイズに応じた大きさのものが選ばれる。The first hot-air blowing nozzle 13 is detachable from the rod 12, and the size thereof is selected according to the size of the rework target component 5.
【００１３】第１加熱手段３による加熱と同時に、第２
加熱手段４からも熱風がプリント基板２の下面に向けて
吹き出して加熱を行う。第１加熱手段３がはんだボール
５ａを直接的且つ局部的に加熱するのに対し、第２加熱
手段４はプリント基板２の下面側からはんだボール５ａ
を間接的に加熱する。また、熱風はプリント基板２の下
面の広範囲にわたって吹き付けられる。At the same time as the heating by the first heating means 3, the second
Hot air is also blown from the heating means 4 toward the lower surface of the printed circuit board 2 to perform heating. The first heating means 3 directly and locally heats the solder balls 5a, while the second heating means 4 heats the solder balls 5a from the lower surface side of the printed circuit board 2.
Is heated indirectly. Hot air is blown over a wide area on the lower surface of the printed circuit board 2.
【００１４】第１及び第２加熱手段３、４による加熱に
より、はんだボール５ａが溶融すると、熱風の吹き出し
は停止されて、吸着手段１４のエア配管１５内が真空引
きされると共にエア配管１５及びパッド部１６が下降す
る。これにより、パッド部１６でリワーク対象部品５を
真空吸着してリワーク対象部品５をプリント基板２から
取り外す。When the solder balls 5a are melted by the heating by the first and second heating means 3 and 4, the blowing of hot air is stopped, the air pipe 15 of the suction means 14 is evacuated, and the air pipe 15 and The pad section 16 descends. Thus, the rework target component 5 is vacuum-sucked by the pad portion 16 and the rework target component 5 is removed from the printed circuit board 2.
【００１５】その後、取り外されたリワーク対象部品５
を修理あるいは良品に交換して、はんだボール５ａをプ
リント基板２又は交換する部品に印刷し、部品を元の場
所に搭載し直し、取り外し時と同様に第１及び第２加熱
手段３、４ではんだボール５ａを加熱溶融させてプリン
ト基板２に対してはんだ付けを行う。After that, the removed rework target part 5
Is repaired or replaced with a non-defective product, the solder ball 5a is printed on the printed circuit board 2 or the component to be replaced, the component is mounted again in the original place, and the first and second heating means 3 and 4 are used as in the case of removal. The solder balls 5a are heated and melted and soldered to the printed circuit board 2.
【００１６】[0016]
【発明が解決しようとする課題】近年、環境保護の観点
から、はんだ材料として従来より用いられてきた有鉛共
晶はんだに代わって無鉛はんだが用いられるようになっ
てきている。有鉛共晶はんだの融点が約１８０℃であっ
たのに対して無鉛はんだの融点は約２２０℃であり、こ
のため第１及び第２加熱手段３、４による加熱の設定温
度も高くしなければならない。すなわち、加熱手段３、
４自体の温度（内蔵されている電熱線の温度）と風量を
大きくする必要がある。しかし、第２加熱手段４はプリ
ント基板２の下面を広範囲にわたって加熱するので、設
定温度の高温化はリワーク対象部品５以外の他の部品へ
の熱負荷も大きくしてしまう。In recent years, from the viewpoint of environmental protection, lead-free solders have been used as solder materials instead of leaded eutectic solders conventionally used as solder materials. The melting point of the lead-free eutectic solder was about 180 ° C., while the melting point of the lead-free solder was about 220 ° C. Therefore, the set temperature for heating by the first and second heating means 3 and 4 must be increased. Must. That is, the heating means 3,
It is necessary to increase the temperature of itself (the temperature of the built-in heating wire) and the air flow. However, since the second heating means 4 heats the lower surface of the printed circuit board 2 over a wide range, increasing the set temperature also increases the heat load on components other than the rework target component 5.
【００１７】また、有鉛共晶はんだを用いた場合には、
はんだ接合部の温度をはんだ融点の約１８０℃から部品
の耐熱温度である約２５０℃までの範囲内に制御すれば
よかったが、無鉛はんだの場合には、約２２０℃（はん
だ融点）〜約２５０℃（部品耐熱温度）というように狭
い温度範囲内に制御しなければならない。しかし、従来
は第２加熱手段４とプリント基板２との間での熱損失が
大きく、また外気温などの影響で熱風の温度も変動しや
すく、従来より作業温度範囲の狭くなった所望の温度に
制御することが困難であった。この影響を小さくするた
めに第２加熱手段４をプリント基板２に近づけようとし
ても第２加熱手段４は設置面に固定されているので不可
能であった。また、図５に示すように、基板反り防止部
材１７は、熱風吹き出し口４ａから吹き出す熱風の一部
を遮るようにして配設されているので、このことも第２
加熱手段４とプリント基板２間での熱風の熱損失や温度
変動をもたらす要因となっていた。When a leaded eutectic solder is used,
The temperature of the solder joint should be controlled within a range from the melting point of about 180 ° C. of the solder to the heat-resistant temperature of about 250 ° C. of the component. It must be controlled within a narrow temperature range such as ° C (part heat resistant temperature). However, conventionally, the heat loss between the second heating means 4 and the printed circuit board 2 is large, and the temperature of the hot air tends to fluctuate under the influence of the outside air temperature. It was difficult to control. In order to reduce this effect, it was impossible to bring the second heating means 4 closer to the printed circuit board 2 because the second heating means 4 was fixed to the installation surface. Further, as shown in FIG. 5, the substrate warpage preventing member 17 is provided so as to block a part of the hot air blown out from the hot air outlet 4a.
This causes heat loss and temperature fluctuation of hot air between the heating means 4 and the printed circuit board 2.
【００１８】本発明は上述の問題に鑑みてなされ、他の
部品に余計な熱負荷を与えることなく、また熱風の熱損
失を抑えてリワーク対象部品のみを効率よく加熱できる
部品のリワーク装置及び方法を提供することを課題とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has an apparatus and method for reworking a part which can efficiently heat only a part to be reworked without giving an unnecessary heat load to other parts and suppressing heat loss of hot air. The task is to provide
【００１９】[0019]
【課題を解決するための手段】本発明の請求項１による
部品のリワーク装置では、基板とこの基板に搭載された
リワーク対象部品との接合部を基板を介して間接的に加
熱する第２加熱手段を、基板に対して移動自在として基
板に対する距離を調整可能とした。これにより、第２加
熱手段と基板との距離を縮めて熱風の熱損失を抑制でき
る。また、基板の厚さの違いや下面側に実装された部品
の突出量の違いに応じて柔軟に第２加熱手段と基板との
距離を調整可能である。According to a first aspect of the present invention, there is provided a component rework apparatus for heating a joint between a substrate and a component to be rework mounted on the substrate indirectly through the substrate. The means is movable relative to the substrate so that the distance to the substrate can be adjusted. Thereby, the distance between the second heating means and the substrate can be reduced, and the heat loss of the hot air can be suppressed. Further, the distance between the second heating means and the substrate can be flexibly adjusted according to the difference in the thickness of the substrate or the difference in the amount of protrusion of the component mounted on the lower surface side.
【００２０】本発明の請求項２による部品のリワーク装
置では、基板とこの基板に搭載されたリワーク対象部品
との接合部を基板を介して間接的に加熱する第２加熱手
段に第２の熱風吹き出しノズルを設け、この第２の熱風
吹き出しノズルからの熱風で基板の第２加熱手段との対
向面側から接合部を局部的に加熱するようにした。これ
により、他の部品へ熱ダメージを与えることなく、加熱
すべき部分であるリワーク対象部品のはんだ接合部のみ
を効率的に加熱できる。In the component rework apparatus according to a second aspect of the present invention, the second heating means for indirectly heating the joint between the substrate and the component to be rework mounted on the substrate via the substrate is provided with the second hot air. A blow nozzle is provided, and the joint is locally heated from the side of the substrate facing the second heating means by hot air from the second hot wind blow nozzle. Thereby, it is possible to efficiently heat only the solder joint portion of the rework target component, which is a portion to be heated, without causing thermal damage to other components.
【００２１】本発明の請求項３による部品のリワーク装
置では、基板とこの基板に搭載されたリワーク対象部品
との接合部を基板を介して間接的に加熱する第２加熱手
段を基板に対して移動自在として基板に対する距離を調
整可能とし、且つ、第２加熱手段に第２の熱風吹き出し
ノズルを設け、この第２の熱風吹き出しノズルからの熱
風で基板の第２加熱手段との対向面側から接合部を局部
的に加熱するようにした。これにより、第２加熱手段と
基板との距離を縮めて熱風の熱損失を抑制できると共に
基板の厚さの違いや下面側に実装された部品の突出量の
違いに応じて柔軟に第２加熱手段と基板との距離を調整
可能である。更に、他の部品へ熱ダメージを与えること
なく、加熱すべき部分であるリワーク対象部品のはんだ
接合部のみを効率的に加熱できる。According to a third aspect of the present invention, a second heating means for indirectly heating a joint between a substrate and a component to be rework mounted on the substrate via the substrate is provided on the substrate. It is movable so that the distance to the substrate can be adjusted, and the second heating means is provided with a second hot-air blowing nozzle, and the hot air from the second hot-air blowing nozzle is used to move the substrate from the side facing the second heating means. The joint was locally heated. Thereby, the distance between the second heating means and the substrate can be reduced to suppress the heat loss of the hot air, and the second heating can be flexibly performed according to the difference in the thickness of the substrate and the difference in the protrusion amount of the component mounted on the lower surface side. The distance between the means and the substrate is adjustable. Furthermore, it is possible to efficiently heat only the solder joint of the rework target component, which is the portion to be heated, without causing thermal damage to other components.
【００２２】本発明の請求項５による部品のリワーク方
法では、基板とこの基板に搭載されたリワーク対象部品
との接合部側に配設された第１加熱手段で接合部に局部
的に熱風を与えて接合部を加熱すると共に、第１加熱手
段との間で基板を挟むようにして配設された第２加熱手
段を基板に対して移動自在として、第２加熱手段の基板
に対する距離を調整して第２加熱手段にて接合部を基板
を介して間接的に加熱する。これにより、第２加熱手段
と基板との距離を縮めて熱風の熱損失を抑制できる。ま
た、基板の厚さの違いや下面側に実装された部品の突出
量の違いに応じて柔軟に第２加熱手段と基板との距離を
調整可能である。In the method for reworking a component according to a fifth aspect of the present invention, hot air is locally applied to the joint by a first heating means provided on the joint side between the substrate and the component to be rework mounted on the substrate. The second heating means provided so as to sandwich the substrate between the first heating means and the second heating means is movable with respect to the substrate, and the distance between the second heating means and the substrate is adjusted. The joint is indirectly heated by the second heating means via the substrate. Thereby, the distance between the second heating means and the substrate can be reduced, and the heat loss of the hot air can be suppressed. Further, the distance between the second heating means and the substrate can be flexibly adjusted according to the difference in the thickness of the substrate or the difference in the amount of protrusion of the component mounted on the lower surface side.
【００２３】本発明の請求項６による部品のリワーク方
法では、基板とこの基板に搭載されたリワーク対象部品
との接合部側に配設された第１加熱手段で接合部に局部
的に熱風を与えて接合部を加熱すると共に、第１加熱手
段との間で基板を挟むようにして配設された第２加熱手
段から、基板の第２加熱手段との対向面に局部的に熱風
を与えて接合部を局部的に加熱する。これにより、他の
部品へ熱ダメージを与えることなく、加熱すべき部分で
あるリワーク対象部品のはんだ接合部のみを効率的に加
熱できる。In the method for reworking a component according to a sixth aspect of the present invention, hot air is locally applied to the joint by a first heating means provided on the joint side between the substrate and the component to be rework mounted on the substrate. And heating the joint portion, and joining the substrate by locally applying hot air from a second heating means disposed so as to sandwich the substrate between the first heating means and the second heating means. Heat the section locally. Thereby, it is possible to efficiently heat only the solder joint portion of the rework target component, which is a portion to be heated, without causing thermal damage to other components.
【００２４】本発明の請求項７による部品のリワーク方
法では、基板とこの基板に搭載されたリワーク対象部品
との接合部側に配設された第１加熱手段で接合部に局部
的に熱風を与えて接合部を加熱すると共に、第１加熱手
段との間で基板を挟むようにして配設された第２加熱手
段を基板に対して移動自在として、第２加熱手段の基板
に対する距離を調整し、且つ、第２加熱手段から、基板
の第２加熱手段との対向面に局部的に熱風を与えて接合
部を局部的に加熱する。これにより、第２加熱手段と基
板との距離を縮めて熱風の熱損失を抑制できると共に基
板の厚さの違いや下面側に実装された部品の突出量の違
いに応じて柔軟に第２加熱手段と基板との距離を調整可
能である。更に、他の部品へ熱ダメージを与えることな
く、加熱すべき部分であるリワーク対象部品のはんだ接
合部のみを効率的に加熱できる。In the method for reworking a component according to a seventh aspect of the present invention, hot air is locally applied to the joint by a first heating means provided on the joint side between the substrate and the component to be rework mounted on the substrate. While applying and heating the joining portion, the second heating means disposed so as to sandwich the substrate between the first heating means and the first heating means is movable with respect to the substrate, and the distance of the second heating means to the substrate is adjusted. In addition, hot air is locally applied from the second heating means to the surface of the substrate facing the second heating means to locally heat the joint. Thereby, the distance between the second heating means and the substrate can be reduced to suppress the heat loss of the hot air, and the second heating can be flexibly performed according to the difference in the thickness of the substrate and the difference in the protrusion amount of the component mounted on the lower surface side. The distance between the means and the substrate is adjustable. Furthermore, it is possible to efficiently heat only the solder joint of the rework target component, which is the portion to be heated, without causing thermal damage to other components.
【００２５】[0025]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。なお、従来と同じ構成部分
には同一の符号を付しその詳細な説明は省略する。Embodiments of the present invention will be described below with reference to the drawings. The same components as those in the related art are denoted by the same reference numerals, and detailed description thereof will be omitted.
【００２６】図１は本発明の第１の実施の形態によるリ
ワーク装置２０の要部側面図を、図２は図１においてプ
リント基板２より下方側の構成部分の平面図を示す。FIG. 1 is a side view of a main part of a rework apparatus 20 according to a first embodiment of the present invention, and FIG. 2 is a plan view of a component below the printed circuit board 2 in FIG.
【００２７】多数の部品を搭載したプリント基板２を挟
んで上側に第１加熱手段３が、下側に第２加熱手段２１
が配設され、これら第１及び第２加熱手段３、２１でリ
ワーク対象部品５とプリント基板２とのはんだ接合部を
加熱する。ここでも、リワーク対象部品５としては、は
んだボール５ａを介してプリント基板２に表面実装され
るＢＧＡ部品を例として説明する。The first heating means 3 is located above the printed circuit board 2 on which many components are mounted, and the second heating means 21 is located below the printed circuit board 2.
The first and second heating means 3 and 21 heat the solder joint between the component 5 to be reworked and the printed circuit board 2. Here, as the rework target component 5, a BGA component that is surface-mounted on the printed board 2 via the solder ball 5a will be described as an example.
【００２８】プリント基板２は、リワーク対象部品５の
搭載された面を上側にして、従来と同様、図５に示す基
板支持手段６ａ、６ｂのコ字状溝７内に両側端部が挿入
されて支持される。The printed circuit board 2 has both sides inserted into the U-shaped grooves 7 of the substrate supporting means 6a and 6b shown in FIG. Supported.
【００２９】第１加熱手段３の構成及び作用は、従来と
同様であり、プリント基板２に対して昇降するロッド１
２の下端には第１の熱風吹き出しノズル１３が取り付け
られており、吸着手段１４がロッド１２内を昇降可能に
内蔵されている。吸着手段１４はエア配管部１５とこの
エア配管部１５の下端に取り付けられたパッド部１６と
からなり、エア配管部１５内を通じて送られる熱風は貫
通孔１５ａ及びパッド部１６内の貫通孔からリワーク対
象部品５に向けて吹き出す。The structure and operation of the first heating means 3 are the same as those of the prior art, and the rod 1 which moves up and down with respect to the printed circuit board 2
A first hot-air blowing nozzle 13 is attached to a lower end of 2, and a suction means 14 is built in so as to be able to move up and down in the rod 12. The suction means 14 comprises an air pipe section 15 and a pad section 16 attached to the lower end of the air pipe section 15. Hot air sent through the air pipe section 15 reworks through the through-hole 15a and the through-hole in the pad section 16. It blows out toward the target part 5.
【００３０】次に、本発明に係る第２加熱手段２１につ
いて説明する。第２加熱手段２１は熱風式のヒータであ
り、後述する作用にて設置面に立設された支持柱２５に
対して固定され所望の高さで保持される。Next, the second heating means 21 according to the present invention will be described. The second heating means 21 is a hot-air heater, and is fixed to a support column 25 erected on the installation surface by an operation described later and held at a desired height.
【００３１】図２も参照して、第２加熱手段２１の保持
作用について説明すると、第２加熱手段２１の一側面２
１ａには雄ねじ２６が突出して一体的に形成されてお
り、この雄ねじ２６が支持柱２５の長孔２５ａを貫通し
ている。その貫通した雄ねじ２６にレバー付き止めねじ
（雌ねじ）２７が螺合し、このレバー付き止めねじ２７
を雄ねじ２６に対して締め込むことで、レバー付き止め
ねじ２７と第２加熱手段２１の側面２１ａとの間で支持
柱２５を堅く挟み込んでいる。これにより、支持柱２５
に対して第２加熱手段２１が固定保持される。長孔２５
ａに対する雄ねじ２６の上下方向の位置を変えることで
第２加熱手段２１の保持高さ、すなわちプリント基板２
の下面に対する第２加熱手段２１の距離を調整できる。
なお、レバー付き止めねじ２７を雄ねじとして、これと
螺合する雌ねじを第２加熱手段２１の側面２１ａに形成
する構成であってもよい。The holding action of the second heating means 21 will now be described with reference to FIG.
A male screw 26 protrudes from and is formed integrally with 1a. The male screw 26 passes through the long hole 25a of the support column 25. A set screw (female screw) 27 with a lever is screwed into the penetrated male screw 26, and the set screw 27 with a lever is
Is tightened against the male screw 26, whereby the support column 25 is firmly sandwiched between the set screw 27 with lever and the side surface 21 a of the second heating means 21. Thereby, the support column 25
, The second heating means 21 is fixedly held. Slot 25
a holding height of the second heating means 21, that is, the printed board 2
The distance of the second heating means 21 to the lower surface of the device can be adjusted.
Note that a configuration may be employed in which the set screw 27 with a lever is a male screw and a female screw to be screwed with the male screw is formed on the side surface 21 a of the second heating means 21.
【００３２】第２加熱手段２１に内蔵された電熱線に電
力を供給する電気配線２４や熱風を形成するためにエア
を供給するエア配管２３はフレキシブルチューブ２２内
を通されている。An electric wiring 24 for supplying electric power to a heating wire built in the second heating means 21 and an air pipe 23 for supplying air for forming hot air are passed through the flexible tube 22.
【００３３】第２加熱手段２１の上面には多数の熱風吹
き出し口２１ｂが形成されており、この上面に第２の熱
風吹き出しノズル２８が被せられている。第２の熱風吹
き出しノズル２８は、図２に示すように、中央のみ四角
形状に開口され、この開口がノズル口２８ａを形成して
いる。従って、ノズル口２８ａ以外の箇所に位置する熱
風吹き出し口２１ｂは第２の熱風吹き出しノズル２８の
フランジ部２８ｂで塞がれ、熱風はノズル口２８ａのみ
からプリント基板２に向けて供給される。A plurality of hot air outlets 21b are formed on the upper surface of the second heating means 21, and a second hot air outlet nozzle 28 is covered on the upper surface. As shown in FIG. 2, the second hot-air blowing nozzle 28 is opened in a square shape only at the center, and this opening forms a nozzle port 28a. Therefore, the hot air outlet 21b located at a position other than the nozzle opening 28a is closed by the flange portion 28b of the second hot air outlet nozzle 28, and the hot air is supplied toward the printed circuit board 2 only from the nozzle opening 28a.
【００３４】第２加熱手段２１は、ノズル口２８ａの上
端がプリント基板２に接近した位置で保持され、更に、
ノズル口２８ａの平面寸法はリワーク対象部品５の平面
寸法とほぼ同じ大きさとされているので、プリント基板
２の下面において、リワーク対象部品５の搭載位置に対
応する部分のみに局部的に熱風が吹き付けられる。な
お、プリント基板２は両面実装基板であって、リワーク
対象部品５の真裏にも他の部品が実装され、これら部品
にもノズル口２８ａから熱風が吹き付けられるが、これ
ら部品の温度はその部品の耐熱温度及びはんだ溶融温度
よりも低い温度となるように制御され、その部品の熱損
傷やはんだ溶融によるプリント基板２からの脱落を防い
でいる。このための温度設定は、ノズル口２８ａのプリ
ント基板２に対する距離や熱風の風量や電熱線自体の温
度の調節で制御される。The second heating means 21 is held at a position where the upper end of the nozzle opening 28a is close to the printed circuit board 2.
Since the plane size of the nozzle opening 28a is substantially the same as the plane size of the component 5 to be reworked, hot air is locally blown only to the portion corresponding to the mounting position of the component 5 to be reworked on the lower surface of the printed circuit board 2. Can be The printed circuit board 2 is a double-sided mounting board, and other components are mounted directly behind the component 5 to be reworked, and hot air is blown from these nozzles 28a to these components. The temperature is controlled so as to be lower than the heat resistance temperature and the solder melting temperature, thereby preventing the component from being thermally damaged and falling off from the printed circuit board 2 due to the solder melting. The temperature setting for this is controlled by adjusting the distance of the nozzle port 28a to the printed circuit board 2, the amount of hot air, and the temperature of the heating wire itself.
【００３５】また、図２に示すように、基板反り防止部
材１７は熱風の吹き出すノズル口２８ａを避けるように
して、ノズル口２８ａを挟んで対称的位置に２本配設さ
れている。基板反り防止部材１７自体の構成及びその作
用は従来と同様であり、ねじ１７ａの頭部がプリント基
板２の下面に当接してプリント基板２の下反りを規制す
る。As shown in FIG. 2, the two substrate warpage preventing members 17 are disposed symmetrically with respect to the nozzle port 28a so as to avoid the nozzle port 28a from which the hot air blows. The structure and operation of the board warpage preventing member 17 itself are the same as those in the related art.
【００３６】本実施の形態によるリワーク装置２０は以
上のように構成され、次にその作用について説明する。The rework apparatus 20 according to the present embodiment is configured as described above, and its operation will be described next.
【００３７】リワーク対象部品５を搭載したプリント基
板２が基板支持手段６ａ、６ｂにより所定の位置で位置
決めされて支持されると、ロッド１２及び第１の熱風吹
き出しノズル１３がリワーク対象部品５に向けて下降
し、第１の熱風吹き出しノズル１３はリワーク対象部品
５を覆うようにしてプリント基板２に密着する。あるい
は、リワーク対象部品５の周辺に隣接して他の部品があ
る場合には、それら部品と第１の熱風吹き出しノズル１
３との干渉を防ぐため、第１の熱風吹き出しノズル１３
はプリント基板２から少し離した状態にする。When the printed board 2 on which the component 5 to be reworked is mounted is positioned and supported at a predetermined position by the board supporting means 6a, 6b, the rod 12 and the first hot air blowing nozzle 13 are directed toward the component 5 to be reworked. The first hot-air blowing nozzle 13 comes into close contact with the printed circuit board 2 so as to cover the rework target component 5. Alternatively, when there are other components adjacent to the periphery of the component 5 to be reworked, those components and the first hot air blowing nozzle 1
3 to prevent interference with the first hot air blowing nozzle 13.
Is slightly separated from the printed circuit board 2.
【００３８】この状態で、エア配管１５内を送られてき
た熱風は、下端部の貫通孔１５ａ及びパッド部１６内の
貫通孔から吹き出し、リワーク対象部品５とプリント基
板２との接合部となるはんだボール５ａを加熱する。吹
き出された熱風は、第１の熱風吹き出しノズル１３に形
成された排出口１３ａより外部に排出される。In this state, the hot air sent through the air pipe 15 blows out from the through hole 15a at the lower end and the through hole in the pad portion 16 to form a joint between the component 5 to be reworked and the printed circuit board 2. The solder ball 5a is heated. The blown hot air is discharged to the outside through a discharge port 13 a formed in the first hot air blow nozzle 13.
【００３９】第１加熱手段３による加熱と同時に、第２
加熱手段２１の第２の熱風吹き出しノズル２８から吹き
出す熱風によってもはんだボール５ａはプリント基板２
の下面側から間接的に且つ局部的に加熱される。The heating by the first heating means 3 and the second
The solder balls 5a are also heated by the hot air blown out from the second hot air blowing nozzle 28 of the heating means 21 so that the printed circuit board 2
Is heated indirectly and locally from the lower surface side of the substrate.
【００４０】本実施の形態では、第２加熱手段２１は、
プリント基板２に近い位置で且つリワーク対象部品５の
みを局部的に加熱するので、第２の熱風吹き出しノズル
２８から吹き出す熱風は外気温の影響や、更には基板反
り防止部材１７もノズル口２８ａから外れているので基
板反り防止部材１７の影響も受けることなく、よって熱
損失量を小さくして、また他の部品に熱ダメージも与え
ることなくリワーク対象部品５のみを効率的に加熱する
ことができる。また、加熱効率の向上により、加熱時間
の短縮や、第２加熱手段２１側の設定温度と風量の低下
も図ることができ、このことによっても部品やプリント
基板２への熱ダメージを減少させることができる。更
に、第２加熱手段２１側の設定温度に対するはんだボー
ル５ａの温度の追従性も向上し、無鉛はんだのような加
熱温度条件の厳しいものへの条件出しも容易となり、安
定した繰り返し作業性が得られる。In the present embodiment, the second heating means 21
Since only the part 5 to be reworked is locally heated at a position close to the printed circuit board 2, the hot air blown from the second hot air blowing nozzle 28 is affected by the outside air temperature, and the board warpage preventing member 17 is also moved from the nozzle port 28 a. Since it is off, it is not affected by the substrate warpage preventing member 17, so that the heat loss is reduced, and only the rework target component 5 can be efficiently heated without causing thermal damage to other components. . In addition, by improving the heating efficiency, the heating time can be shortened, and the set temperature and the air volume of the second heating means 21 can be reduced, thereby also reducing the heat damage to the components and the printed circuit board 2. Can be. Further, the followability of the temperature of the solder ball 5a to the set temperature of the second heating means 21 is also improved, and it becomes easy to set conditions to severe heating temperature conditions such as lead-free solder, and stable repetitive workability is obtained. Can be
【００４１】なお、第１の熱風吹き出しノズル１３及び
第２の熱風吹き出しノズル２８は、それぞれ、第１、第
２加熱手段３、２１に対して着脱自在に取り付けられる
ので、種々の部品や基板に対して幅広く対応することが
できる。Since the first hot air blowing nozzle 13 and the second hot air blowing nozzle 28 are detachably attached to the first and second heating means 3 and 21, respectively, the first hot air blowing nozzle 13 and the second hot air blowing nozzle 28 can be attached to various parts and substrates. It can respond to a wide range.
【００４２】以上のような第１及び第２加熱手段３、２
１による加熱により、はんだボール５ａが溶融すると、
熱風の吹き出しは停止されて、吸着手段１４のエア配管
１５内が真空引きされると共にエア配管１５及びパッド
部１６が下降する。これにより、パッド部１６でリワー
ク対象部品５を真空吸着してリワーク対象部品５をプリ
ント基板２から取り外す。The first and second heating means 3 and 2 as described above
When the solder ball 5a is melted by the heating by 1,
The blowing of the hot air is stopped, the inside of the air pipe 15 of the suction means 14 is evacuated, and the air pipe 15 and the pad section 16 are lowered. Thus, the rework target component 5 is vacuum-sucked by the pad portion 16 and the rework target component 5 is removed from the printed circuit board 2.
【００４３】その後、取り外されたリワーク対象部品５
を修理あるいは良品に交換して、はんだボール５ａをプ
リント基板２又は交換する部品に印刷し、部品を元の場
所に搭載し直し、取り外し時と同様に第１及び第２加熱
手段３、２１ではんだボール５ａを加熱溶融させてプリ
ント基板２に対してはんだ付けを行う。このときの加熱
時にも、上述したプリント基板２からの取り外し時と同
様な効果が得られる。Thereafter, the rework target part 5 removed
Is repaired or replaced with a non-defective product, the solder ball 5a is printed on the printed circuit board 2 or the component to be replaced, the component is mounted again in the original place, and the first and second heating means 3 and 21 are used as in the case of removal. The solder balls 5a are heated and melted and soldered to the printed circuit board 2. At the time of heating at this time, the same effect as that at the time of removal from the printed circuit board 2 described above can be obtained.
【００４４】次に、図３を参照して本発明の第２の実施
の形態によるリワーク装置３０について説明する。な
お、上記従来例や第１の実施の形態と同じ構成部分には
同一の符号を付しその詳細な説明は省略する。Next, a rework apparatus 30 according to a second embodiment of the present invention will be described with reference to FIG. The same components as those in the conventional example and the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
【００４５】本実施の形態のリワーク装置３０では、第
２加熱手段２１は、従来と同様、設置面に固定されてい
るが、この上面に被せられる第２の熱風吹き出しノズル
３１のノズル口３１ａ上端をプリント基板２に接近させ
て上方に延在させている。第２の熱風吹き出しノズル３
１の構成及び作用は上記第１の実施の形態と同じであ
る。本実施の形態では、第２加熱手段２１を上方に移動
させてプリント基板２との距離を短くするのではなく、
単に開口部の縦方向の長さが長い第２の熱風吹き出しノ
ズル３１を第２加熱手段２１上面に被せるだけで、すな
わち、図４示す従来のリワーク装置１に対して何ら改造
する必要はなく、容易且つコストを抑えて上記第１の実
施の形態と同様な効果が得られる。In the rework apparatus 30 of the present embodiment, the second heating means 21 is fixed to the installation surface as in the prior art, but the upper end of the nozzle opening 31a of the second hot air blowing nozzle 31 which is put on the upper surface Are extended close to the printed circuit board 2. Second hot air blowing nozzle 3
The configuration and operation of the first embodiment are the same as those of the first embodiment. In the present embodiment, instead of moving the second heating means 21 upward to shorten the distance from the printed circuit board 2,
It is not necessary to modify the conventional rework apparatus 1 shown in FIG. 4 by simply covering the second heating means 21 with the second hot-air blowing nozzle 31 having a long longitudinal length of the opening. The same effect as that of the first embodiment can be obtained easily and at a reduced cost.
【００４６】以上、本発明の各実施の形態について説明
したが、勿論、本発明はこれらに限定されることなく、
本発明の技術的思想に基づいて種々の変形が可能であ
る。Although the embodiments of the present invention have been described above, the present invention is, of course, not limited to these embodiments.
Various modifications are possible based on the technical idea of the present invention.
【００４７】上記第１の実施の形態で、第２加熱手段２
１を所望の高さに保持する、支持柱２５、レバー付き止
めねじ２７、雄ねじ２６の構成を１つに限らず、第２加
熱手段２１に対して対角的位置に配設したり、四隅に配
設すれば、より安定して第２加熱手段２１を保持するこ
とができる。また、第１加熱手段３と同様にピニオンと
ラックの組み合わせによって第２加熱手段２１を昇降可
能としたり、あるいは空圧や油圧シリンダなどを用いて
昇降させるようにしてもよい。In the first embodiment, the second heating means 2
1 is held at a desired height, the configuration of the support column 25, the set screw 27 with lever, and the male screw 26 is not limited to one, and may be disposed at a diagonal position with respect to the second heating means 21, , The second heating means 21 can be held more stably. Further, similarly to the first heating means 3, the second heating means 21 may be moved up and down by a combination of a pinion and a rack, or may be moved up and down by using a pneumatic or hydraulic cylinder.
【００４８】また、上記各実施の形態では、表面実装の
部品に対してのリワークについて説明したが、挿入実装
の部品に対しても本発明は適用可能である。挿入実装部
品がリワーク対象部品である場合には、部品実装面とは
反対側の電極リードが突出した面を上側（第１加熱手段
３側）にしてプリント基板２は支持される。Further, in each of the above embodiments, rework for a component mounted on a surface has been described. However, the present invention can be applied to a component mounted and mounted. When the inserted mounting component is a component to be reworked, the printed circuit board 2 is supported with the surface on which the electrode leads protrude opposite to the component mounting surface facing upward (to the first heating means 3 side).
【００４９】[0049]
【発明の効果】本発明の請求項１又は請求項５によれ
ば、第２加熱手段と基板との距離を短くすることで、第
２加熱手段から供給される熱風の熱損失を防いで加熱効
率の向上が図れると共に外気温による熱風温度の変動も
抑制でき熱風を所望の温度に制御しやすくなる。According to the first or fifth aspect of the present invention, the distance between the second heating means and the substrate is shortened, thereby preventing the heat loss of the hot air supplied from the second heating means and heating the substrate. Efficiency can be improved and the fluctuation of the hot air temperature due to the outside air temperature can be suppressed, so that the hot air can be easily controlled to a desired temperature.
【００５０】本発明の請求項２又は請求項６によれば、
リワーク対象部品のみを局部的に加熱することで加熱効
率の向上や熱風温度の変動の抑制が図れ、更に他の部品
への熱ダメージを防げる。According to claim 2 or claim 6 of the present invention,
By heating only the parts to be reworked locally, heating efficiency can be improved and fluctuations in hot air temperature can be suppressed, and heat damage to other parts can be prevented.
【００５１】本発明の請求項３又は請求項７によれば、
第２加熱手段から供給される熱風の熱損失を防いで加熱
効率の向上が図れると共に外気温による熱風温度の変動
も抑制でき熱風を所望の温度に制御しやすくなる。更に
他の部品への熱ダメージを防げる。According to claim 3 or claim 7 of the present invention,
The heat loss of the hot air supplied from the second heating means is prevented, the heating efficiency is improved, the fluctuation of the hot air temperature due to the outside air temperature is suppressed, and the hot air can be easily controlled to a desired temperature. Furthermore, heat damage to other parts can be prevented.
【００５２】本発明の請求項４又は請求項８によれば、
基板反り防止部材による熱風の遮断及び温度変動を防げ
る。According to claim 4 or claim 8 of the present invention,
Blocking of hot air and temperature fluctuation by the substrate warpage preventing member can be prevented.
【図１】本発明の第１の実施の形態によるリワーク装置
の要部側面図である。FIG. 1 is a side view of a main part of a rework apparatus according to a first embodiment of the present invention.
【図２】図１において基板より下方側を見た平面図であ
る。FIG. 2 is a plan view of FIG. 1 as viewed from below a substrate.
【図３】本発明の第２の実施の形態によるリワーク装置
の要部側面図である。FIG. 3 is a main part side view of a rework device according to a second embodiment of the present invention.
【図４】従来のリワーク装置の側面図である。FIG. 4 is a side view of a conventional rework apparatus.
【図５】図４において基板より下方側を見た平面図であ
る。FIG. 5 is a plan view of the lower side of the substrate in FIG.
【符号の説明】 ２……プリント基板、３……第１加熱手段、５……リワ
ーク対象部品、５ａ……はんだボール、６ａ、６ｂ……
基板支持手段、１３……第１の熱風吹き出しノズル、１
４……吸着手段、１７……基板反り防止部材、２０……
リワーク装置、２１……第２加熱手段、２８……第２の
熱風吹き出しノズル、２８ａ……ノズル口、３０……リ
ワーク装置、３１……第２の熱風吹き出しノズル、３１
ａ……ノズル口。[Description of Signs] 2 ... Printed circuit board, 3 ... First heating means, 5 ... Parts to be reworked, 5a ... Solder balls, 6a, 6b ...
Substrate support means, 13... First hot air blowing nozzle, 1
4 ... suction means, 17 ... substrate warpage prevention member, 20 ...
Reworking device, 21 second heating means, 28 second hot air blowing nozzle, 28a nozzle opening, 30 reworking device, 31 second hot air blowing nozzle, 31
a ... Nozzle port.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｂ２３Ｋ 101:42 Ｂ２３Ｋ 101:42 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42 B23K 101: 42
Claims (8)
基板に搭載されたリワーク対象部品との接合部を局部的
に加熱可能な熱風吹き出しノズルを有する第１加熱手段
と、 前記第１加熱手段との間で前記基板を挟むようにして配
設され、前記基板を介して前記接合部を間接的に加熱す
る第２加熱手段とを備えた部品のリワーク装置におい
て、 前記第２加熱手段を前記基板に対して移動自在とし、前
記基板に対する距離を調整可能としたことを特徴とする
部品のリワーク装置。1. A substrate supporting means for supporting a substrate, a hot air movably disposed with respect to the substrate, and capable of locally heating a joint between the substrate and a rework target component mounted on the substrate. A first heating unit having a blowing nozzle; and a second heating unit disposed so as to sandwich the substrate between the first heating unit and the indirectly heating the bonding portion via the substrate. In the component rework apparatus, the second heating means is movable with respect to the substrate, and a distance to the substrate is adjustable.
基板に搭載されたリワーク対象部品との接合部を局部的
に加熱可能な第１の熱風吹き出しノズルを有する第１加
熱手段と、 前記第１加熱手段との間で前記基板を挟むようにして配
設され、前記基板を介して前記接合部を間接的に加熱す
る第２加熱手段とを備えた部品のリワーク装置におい
て、 前記第２加熱手段に第２の熱風吹き出しノズルを設け、
この第２の熱風吹き出しノズルからの熱風で前記基板の
前記第２加熱手段との対向面側から前記接合部を局部的
に加熱するようにしたことを特徴とする部品のリワーク
装置。2. A substrate supporting means for supporting a substrate, a substrate supporting means for movably disposed with respect to the substrate, and capable of locally heating a joint between the substrate and a rework target component mounted on the substrate. A first heating unit having one hot air blowing nozzle, a second heating unit disposed so as to sandwich the substrate between the first heating unit, and indirectly heating the bonding portion via the substrate. In a component reworking apparatus comprising: a second hot air blowing nozzle is provided in the second heating means;
A reworking apparatus for a component, wherein the joining portion is locally heated from the side of the substrate facing the second heating means by hot air from the second hot air blowing nozzle.
基板に搭載されたリワーク対象部品との接合部を局部的
に加熱可能な第１の熱風吹き出しノズルを有する第１加
熱手段と、 前記第１加熱手段との間で前記基板を挟むようにして配
設され、前記基板を介して前記接合部を間接的に加熱す
る第２加熱手段とを備えた部品のリワーク装置におい
て、 前記第２加熱手段を前記基板に対して移動自在とし、前
記基板に対する距離を調整可能とし、 且つ、前記第２加熱手段に第２の熱風吹き出しノズルを
設け、この第２の熱風吹き出しノズルからの熱風で前記
基板の前記第２加熱手段との対向面側から前記接合部を
局部的に加熱するようにしたことを特徴とする部品のリ
ワーク装置。3. A substrate supporting means for supporting a substrate, a substrate supporting means for movably disposed with respect to the substrate, and capable of locally heating a joint between the substrate and a rework target component mounted on the substrate. A first heating unit having one hot air blowing nozzle, a second heating unit disposed so as to sandwich the substrate between the first heating unit, and indirectly heating the bonding portion via the substrate. In the component rework apparatus, the second heating means is movable with respect to the substrate, the distance to the substrate is adjustable, and a second hot air blowing nozzle is provided in the second heating means, A reworking apparatus for a component, wherein the joining portion is locally heated from the side of the substrate facing the second heating means by hot air from the second hot air blowing nozzle.
前記第２の熱風吹き出しノズルの熱風吹き出し口に重な
らないように基板反り防止部材を配設し、この基板反り
防止部材を前記基板の前記第２加熱手段との対向面に当
接させて前記基板の反りを防止するようにしたことを特
徴とする請求項２又は請求項３に記載の部品のリワーク
装置。4. Between the second heating means and the substrate,
A substrate warp preventing member is provided so as not to overlap with the hot air outlet of the second hot air blowing nozzle, and the substrate warp preventing member is brought into contact with a surface of the substrate facing the second heating means, and The component reworking device according to claim 2 or 3, wherein warpage of the component is prevented.
象部品との接合部側に配設された第１加熱手段で、前記
接合部に局部的に熱風を与えて前記接合部を加熱すると
共に、 前記第１加熱手段との間で前記基板を挟むようにして配
設された第２加熱手段で、前記基板を介して前記接合部
を間接的に加熱するようにした部品のリワーク方法にお
いて、 前記第２加熱手段を前記基板に対して移動自在とし、前
記第２加熱手段の前記基板に対する距離を調整して前記
接合部を加熱するようにしたことを特徴とする部品のリ
ワーク方法。5. A first heating means provided on a side of a joint between a substrate and a component to be rework mounted on the substrate, wherein the joint is heated by locally applying hot air to the joint. A reheating method for components in which the bonding unit is indirectly heated via the substrate by a second heating unit disposed so as to sandwich the substrate between the first heating unit and the first heating unit; (2) A method for reworking a part, wherein a heating means is movable with respect to the substrate, and a distance between the second heating means and the substrate is adjusted to heat the joint.
象部品との接合部側に配設された第１加熱手段で、前記
接合部に局部的に熱風を与えて前記接合部を加熱すると
共に、 前記第１加熱手段との間で前記基板を挟むようにして配
設された第２加熱手段で、前記基板を介して前記接合部
を間接的に加熱するようにした部品のリワーク方法にお
いて、 前記第２加熱手段から、前記基板の前記第２加熱手段と
の対向面に局部的に熱風を与えて前記接合部を局部的に
加熱するようにしたことを特徴とする部品のリワーク方
法。6. A first heating means disposed on a joint side between a substrate and a component to be rework mounted on the substrate to locally apply hot air to the joint to heat the joint. A reheating method for components in which the bonding unit is indirectly heated via the substrate by a second heating unit disposed so as to sandwich the substrate between the first heating unit and the first heating unit; 2. A method for reworking a component, wherein a hot air is locally applied to a surface of the substrate facing the second heating means from the second heating means to locally heat the joint.
象部品との接合部側に配設された第１加熱手段で、前記
接合部に局部的に熱風を与えて前記接合部を加熱すると
共に、 前記第１加熱手段との間で前記基板を挟むようにして配
設された第２加熱手段で、前記基板を介して前記接合部
を間接的に加熱するようにした部品のリワーク方法にお
いて、 前記第２加熱手段を前記基板に対して移動自在とし、前
記第２加熱手段の前記基板に対する距離を調整し、 且つ、前記第２加熱手段から、前記基板の前記第２加熱
手段との対向面に局部的に熱風を与えて前記接合部を局
部的に加熱するようにしたことを特徴とする部品のリワ
ーク方法。7. A first heating means disposed on a joint side between a substrate and a component to be rework mounted on the substrate, locally applying hot air to the joint to heat the joint. A reheating method for components in which the bonding unit is indirectly heated via the substrate by a second heating unit disposed so as to sandwich the substrate between the first heating unit and the first heating unit; (2) The heating means is movable with respect to the substrate, the distance of the second heating means to the substrate is adjusted, and a local portion is provided from the second heating means to a surface of the substrate facing the second heating means. A method for reworking a part, characterized in that the joint is locally heated by applying hot air locally.
合部の加熱時に、前記第２加熱手段からの熱風を遮らな
いように、基板反り防止部材を前記基板の前記第２加熱
手段との対向面に当接させて前記基板の反りを防止する
ようにしたことを特徴とする請求項６又は請求項７に記
載の部品のリワーク方法。8. When the first and second heating means heat the joint, the substrate warp preventing member is connected to the second heating means so as not to block hot air from the second heating means. 8. The component rework method according to claim 6, wherein the substrate is prevented from warping by contacting the opposing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001158235A JP2002353612A (en) | 2001-05-28 | 2001-05-28 | Equipment and method for reworking component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001158235A JP2002353612A (en) | 2001-05-28 | 2001-05-28 | Equipment and method for reworking component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002353612A true JP2002353612A (en) | 2002-12-06 |
Family
ID=19001988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001158235A Pending JP2002353612A (en) | 2001-05-28 | 2001-05-28 | Equipment and method for reworking component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002353612A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1732118A1 (en) * | 2004-03-30 | 2006-12-13 | Tamura Corporation | Heater, reflow apparatus, and solder bump forming method and apparatus |
| JP2011009303A (en) * | 2009-06-23 | 2011-01-13 | Fujitsu Ltd | Solder removing device and solder removing method |
| KR200490249Y1 (en) * | 2018-12-17 | 2019-11-08 | (주)리젠아이 | Rework device |
| US11574888B2 (en) | 2017-12-15 | 2023-02-07 | Panasonic Intellectual Property Management Co., Ltd. | Component joining apparatus, component joining method and mounted structure |
-
2001
- 2001-05-28 JP JP2001158235A patent/JP2002353612A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1732118A1 (en) * | 2004-03-30 | 2006-12-13 | Tamura Corporation | Heater, reflow apparatus, and solder bump forming method and apparatus |
| EP1732118A4 (en) * | 2004-03-30 | 2009-04-15 | Tamura Seisakusho Kk | Heater, reflow apparatus, and solder bump forming method and apparatus |
| US8042727B2 (en) | 2004-03-30 | 2011-10-25 | Tamura Corporation | Heater, reflow apparatus, and solder bump forming method and apparatus |
| JP2011009303A (en) * | 2009-06-23 | 2011-01-13 | Fujitsu Ltd | Solder removing device and solder removing method |
| US11574888B2 (en) | 2017-12-15 | 2023-02-07 | Panasonic Intellectual Property Management Co., Ltd. | Component joining apparatus, component joining method and mounted structure |
| KR200490249Y1 (en) * | 2018-12-17 | 2019-11-08 | (주)리젠아이 | Rework device |
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