KR100613157B1 - Mg OR Mg-ALLOY HOUSING AND METHOD FOR PRODUCING THE SAME - Google Patents
Mg OR Mg-ALLOY HOUSING AND METHOD FOR PRODUCING THE SAME Download PDFInfo
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- KR100613157B1 KR100613157B1 KR1020040112677A KR20040112677A KR100613157B1 KR 100613157 B1 KR100613157 B1 KR 100613157B1 KR 1020040112677 A KR1020040112677 A KR 1020040112677A KR 20040112677 A KR20040112677 A KR 20040112677A KR 100613157 B1 KR100613157 B1 KR 100613157B1
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- South Korea
- Prior art keywords
- alloy
- housing
- alloy housing
- chemical conversion
- resin
- Prior art date
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- 229910000861 Mg alloy Inorganic materials 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 66
- 239000000126 substance Substances 0.000 claims abstract description 55
- 238000011282 treatment Methods 0.000 claims abstract description 47
- 238000006243 chemical reaction Methods 0.000 claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000005422 blasting Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 37
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 11
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- 239000011575 calcium Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 239000011572 manganese Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 6
- 238000007254 oxidation reaction Methods 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 6
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 229960005069 calcium Drugs 0.000 claims description 5
- 229910052791 calcium Inorganic materials 0.000 claims description 5
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 claims description 4
- CPSYWNLKRDURMG-UHFFFAOYSA-L hydron;manganese(2+);phosphate Chemical compound [Mn+2].OP([O-])([O-])=O CPSYWNLKRDURMG-UHFFFAOYSA-L 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 239000004640 Melamine resin Substances 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- YYRMJZQKEFZXMX-UHFFFAOYSA-L calcium bis(dihydrogenphosphate) Chemical compound [Ca+2].OP(O)([O-])=O.OP(O)([O-])=O YYRMJZQKEFZXMX-UHFFFAOYSA-L 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- -1 manganese fluoroborate Chemical compound 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 claims description 2
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 2
- 229940062672 calcium dihydrogen phosphate Drugs 0.000 claims description 2
- 229910000389 calcium phosphate Inorganic materials 0.000 claims description 2
- FAYYUXPSKDFLEC-UHFFFAOYSA-L calcium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [Ca+2].[O-]S([O-])(=O)=S FAYYUXPSKDFLEC-UHFFFAOYSA-L 0.000 claims description 2
- 239000011656 manganese carbonate Substances 0.000 claims description 2
- 229940093474 manganese carbonate Drugs 0.000 claims description 2
- 235000006748 manganese carbonate Nutrition 0.000 claims description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 claims description 2
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 claims description 2
- XMWCXZJXESXBBY-UHFFFAOYSA-L manganese(ii) carbonate Chemical compound [Mn+2].[O-]C([O-])=O XMWCXZJXESXBBY-UHFFFAOYSA-L 0.000 claims description 2
- 235000019691 monocalcium phosphate Nutrition 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- RAFRTSDUWORDLA-UHFFFAOYSA-N phenyl 3-chloropropanoate Chemical compound ClCCC(=O)OC1=CC=CC=C1 RAFRTSDUWORDLA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 29
- 239000011248 coating agent Substances 0.000 abstract description 27
- 238000012937 correction Methods 0.000 abstract description 4
- 239000011777 magnesium Substances 0.000 description 45
- 230000000052 comparative effect Effects 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
- 235000011007 phosphoric acid Nutrition 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 4
- 238000004512 die casting Methods 0.000 description 4
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009974 thixotropic effect Effects 0.000 description 4
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 description 3
- 229910001424 calcium ion Inorganic materials 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 229910001437 manganese ion Inorganic materials 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- FMONFPDCHXYHMY-UHFFFAOYSA-J P(=O)([O-])([O-])[O-].[Mn+2].P(=O)([O-])(O)O.[Ca+2] Chemical compound P(=O)([O-])([O-])[O-].[Mn+2].P(=O)([O-])(O)O.[Ca+2] FMONFPDCHXYHMY-UHFFFAOYSA-J 0.000 description 2
- 229940043430 calcium compound Drugs 0.000 description 2
- 150000001674 calcium compounds Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 150000002697 manganese compounds Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910018131 Al-Mn Inorganic materials 0.000 description 1
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018461 Al—Mn Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000567769 Isurus oxyrinchus Species 0.000 description 1
- 241000604742 Machilus thunbergii Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- WAEMQWOKJMHJLA-UHFFFAOYSA-N Manganese(2+) Chemical compound [Mn+2] WAEMQWOKJMHJLA-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- RMXTYBQNQCQHEU-UHFFFAOYSA-N ac1lawpn Chemical compound [Cr]#[Cr] RMXTYBQNQCQHEU-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ZSHHQOWEAFTSBF-UHFFFAOYSA-J calcium magnesium dihydrogen phosphate phosphate Chemical compound P(=O)([O-])([O-])[O-].[Mg+2].P(=O)([O-])(O)O.[Ca+2] ZSHHQOWEAFTSBF-UHFFFAOYSA-J 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010119 thixomolding Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
- B24C1/083—Deburring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
- B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
- C23C22/74—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process for obtaining burned-in conversion coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
본 발명의 Mg 또는 Mg 하우징은 Mg 또는 Mg 합금 하우징 표면을 화성(chemical conversion)처리액과 연마재를 첨가한 액을 사용해서 습식 블래스트 처리함으로써 Mg 또는 Mg 합금 하우징 표면에 화성막을 형성한다. 이에 따라, Mg 또는 Mg 합금으로 이루어지는 성형체의 표면에 간이하게 화성 처리막을 형성하고, 퍼티(putty) 도포에 의한 보정을 줄여 생산성 저하, 비용 상승을 개선하는 Mg 또는 Mg 합금 하우징을 제공한다. The Mg or Mg housing of the present invention forms a chemical film on the Mg or Mg alloy housing surface by wet blasting the surface of the Mg or Mg alloy housing using a chemical conversion treatment liquid and a liquid to which the abrasive is added. Thereby, an Mg or Mg alloy housing is provided which easily forms a chemical conversion film on the surface of a molded body made of Mg or Mg alloy, reduces correction by putty coating, thereby improving productivity and increasing cost.
Mg 하우징, Mg 합금 하우징Mg Housing, Mg Alloy Housing
Description
도 1은 본 발명의 실시예 1의 플로를 나타내는 공정도. 1 is a process chart showing the flow of Example 1 of the present invention.
도 2는 비교예 1의 플로를 나타내는 공정도. 2 is a process chart showing a flow of Comparative Example 1;
도 3은 본 발명의 실시예 1의 노트북 하우징의 표면 관찰 사진. Figure 3 is a photograph of the surface observation of the notebook housing of Example 1 of the present invention.
도 4는 비교예 1의 노트북 하우징의 표면 관찰 사진. Figure 4 is a photograph of the surface observation of the notebook housing of Comparative Example 1.
도 5의 a 내지 c는 본 발명의 실시예 1의 크로스-컷(cross-cut) 시험의 결과를 나타내는 표면 관찰 사진. 5a to c are surface photographs showing the results of the cross-cut test of Example 1 of the present invention.
도 6의 a 내지 c는 비교예 1의 크로스-컷 시험의 결과를 나타내는 표면 관찰 사진. 6A to 6C are surface photographs showing the results of the cross-cut test of Comparative Example 1. FIG.
도 7의 a 내지 c는 본 발명의 실시예 1의 염수 분무 시험(SST)에 의한 내식성(耐蝕性)을 평가한 표면 관찰 사진. 7A to 7C are surface observation photographs evaluating corrosion resistance by the salt spray test (SST) of Example 1 of the present invention.
도 8의 a 내지 c는 비교예 1의 염수 분무 시험(SST)에 의한 내식성을 평가한 표면 관찰 사진. 8A to 8C are surface observation photographs evaluating the corrosion resistance by the salt spray test (SST) of Comparative Example 1. FIG.
본 발명은 Mg 또는 Mg 합금으로 이루어지는 성형체의 표면에 간단하게 화성(chemical conversion)처리막을 형성하고, 도장(塗裝)의 생산성을 개선하는 Mg 또는 Mg 합금 하우징 및 그 제조 방법에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an Mg or Mg alloy housing and a method for producing the same, which simply form a chemical conversion treatment film on the surface of a molded body made of Mg or Mg alloy and improve the productivity of coating.
최근, 노트북이나 PDA 등의 모바일 기기는 휴대와 옥외에서 사용하는 기회가 많아지고 있다. 이에 따라 기기의 소형 경량 및 박형(薄型)화가 요구되고 있고, 기기의 전체 질량의 30%를 차지하는 하우징의 박형화가 필요하게 된다. 그러나 박형화의 경우, 수지 하우징에서는 충분한 강도를 유지하기가 곤란하게 되어 오고 있다. 더욱이 노트북의 MPU의 발열량은 증대하여 오고 있다. 금후, AC 구동 시에 발열량 13∼16W가 되는 것이 예정되고 있어, 높은 냉각 성능을 갖는 하우징의 개발이 급선무가 되었다. In recent years, mobile devices such as laptops and PDAs have many opportunities to be used in portable and outdoors. As a result, small size, light weight and thinness of the device are required, and the housing, which occupies 30% of the total mass of the device, is required. In the case of thinning, however, it has become difficult to maintain sufficient strength in the resin housing. In addition, the heat generation of the MPU of the notebook has been increasing. In the future, it is expected that the heat generation amount will be 13 to 16 W during AC driving, and development of a housing having a high cooling performance has become a priority.
이 문제의 해결책으로서 비강도(比强度)가 높고, 저비중, 고열전도의 Al이나 Mg 또는 Mg 합금 등의 경금속이 하우징 재료로서 주목받고 있다. 특히 Mg 또는 Mg 합금은 비중이 Al의 약 70%로 가볍고, 재생성에도 뛰어나다. Mg 또는 Mg 합금으로서는, 이미 Mg-Al-Zn계, Mg-Al-Mn계, Mg 또는 Mg-Al-Si계, Mg-Al-희토류원소(稀土類元素)(RE)계 등이 실용화되어 있고, 다이캐스팅(die casting)이나 칙소 몰딩(Thixo molding), 판금 가공 등의 수단에 의해 성형 가공하고, 계속하여 상기 성형 가공품을 화성 처리하고, 계속해서 상기 화성 처리 물건을 도장 처리해서 제품화한다. 상기에서, 다이캐스팅이란 용해 금속에 압력을 가하여 금형(金型)에 주입하여 주조하는 방법이며, 칙소 몰딩이란 반용융 또는 용융 상태에서 약 600℃의 압출기로부터 약 250℃의 금형으로 압출 성형하는 방법을 말한다. As a solution for this problem, light metals such as Al, Mg or Mg alloys having high specific strength and low specific gravity and high thermal conductivity have attracted attention as housing materials. In particular, Mg or Mg alloy has a specific gravity of about 70% of Al, and is excellent in regeneration. As Mg or Mg alloy, Mg-Al-Zn type | system | group, Mg-Al-Mn type | system | group, Mg or Mg-Al-Si type | system | group, Mg-Al- rare earth element (RE) type, etc. are already practically used. And molding by means of die casting, thixo molding, sheet metal processing, and the like, followed by chemical conversion of the molded article, and subsequently coating the product to produce the product. In the above description, die casting is a method in which a molten metal is applied to a mold by applying pressure to a molten metal, and a thixotropic molding is a method of extrusion molding from an extruder of about 600 ° C. to a mold of about 250 ° C. in a semi-melt or molten state. Say.
화성 처리란, Mg 또는 Mg 합금의 표면에 내식 기능을 갖는 화성 피막을 형성하는 처리로, 6가(價) 크롬 용액을 주성분으로 하는 크롬산 용액이나 6가 크롬을 포함하지 않는 비크롬산 용액 등에 Mg 또는 Mg 합금을 침지함으로써, 상기 Mg 또는 Mg 합금의 표면에 크롬산 크롬 착염(錯鹽)의 피막(일반적으로 xCrO3ㆍyCr2O3 ㆍ2H2O나 Cr(OH)2ㆍHCrO4ㆍ2H2O 등)을 형성하는 것이다. 이 화성 처리 후, 도장 처리를 한다. 화성 처리의 방법으로는 일본국 특허공개공보 평11-131255호, 일본국 특허공개공보 2000-96255호가 제안되어 있다. The chemical conversion treatment is a process of forming a chemically resistant film on the surface of an Mg or Mg alloy, and includes Mg or the like in a chromic acid solution containing a hexavalent chromium solution or a non-chromic acid solution containing no hexavalent chromium. By immersing the Mg alloy, a coating of chromic chromium complex salt on the surface of the Mg or Mg alloy (generally xCrO 3 yCr 2 O 3 2H 2 O or Cr (OH) 2 HCrO 4 2H 2 O). And the like). After this chemical conversion treatment, a coating treatment is performed. Japanese Patent Laid-Open Publication No. Hei 11-131255 and Japanese Patent Laid-Open Publication No. 2000-96255 have been proposed as methods of chemical conversion.
Mg 또는 Mg 합금을 소재로 하여 제품을 제조하는 경우에는 하기와 같은 문제점이 있다. 다이캐스팅이나 칙소 몰딩 등의 성형 수단에 의해 얻은 성형 가공품에는 버어(burr)가 있다. 이 버어를 제거하기 위해서는, 현재의 상태에서는, 버어를 프레스로 펀칭하거나, 절삭 등의 기계 가공으로 제거하거나, 수작업 마감처리로 제거하고 있지만, 어느 경우나 문제점이 있다. 또한, 성형 가공품에 연마용 입자를 에어(Air)로 분사하는 쇼트 블래스트(Shot blast)로 버어를 제거하는 방법도 있지만, Mg 또는 Mg 합금이나 연마용 입자의 분진이 발생하여 비산하기 쉽고, 작업성이 나쁜 문제, 분진 폭발의 위험성이 높은 문제점이 있다. When manufacturing a product using Mg or Mg alloy as a material has the following problems. There is a burr in the molded article obtained by molding means such as die casting or thixotropic molding. In order to remove this burr, in the present state, the burr is punched out by a press, removed by machining such as cutting, or removed by manual finishing, but there are problems in either case. There is also a method of removing the burr with a shot blast that injects abrasive particles into the molded article by air, but it is easy to scatter due to the dust of Mg or Mg alloy or abrasive particles, and workability. This bad problem, there is a high risk of dust explosion.
또한 상기한 화성 처리를 실시할 때는 사전 처리가 필요하다. 일반적인 화성 처리 공정은, 상기 성형 가공품을 탈지(脫脂) 처리한 후, 다시 산으로 세정 처리하고, 계속하여 성형 가공품으로부터 성형 시에 사용한 이형제(異形劑)를 제거하기 위하여 에칭 처리하고, 계속하여 성형 가공품의 표면에 크롬산 크롬 착염(錯鹽) 의 피막이 형성되기 쉽도록 표면을 광택이 나는 형상으로 연마하는 표면 조정 처리를 하여(이상의 처리가 화성 처리의 전 처리가 된다.), 계속하여 상기 성형 가공품을 상기 크롬산 용액이나 비크롬산 용액 등에 침지하여 화성 처리를 하고, 계속하여 이 화성 처리품을 수세(水洗)하고, 다시 70℃ 전후에서 건조함으로써 화성 피막을 경화하는 것이다. 이와 같이, 화성 처리의 전처리(前處理)는 탈지 처리나 세정 처리나 에칭 처리 표면 조정 처리 등, 몇 개의 공정을 행하지 않으면 안되고, 작업이 성가셔서 처리 장치가 복잡해지거나 처리 비용이 높아진다. In addition, when performing the said chemical conversion treatment, preprocessing is required. In general chemical conversion treatment, after degreasing the molded article, it is washed again with acid, and subsequently etched to remove the release agent used during molding from the molded article, followed by molding. A surface adjustment treatment is performed in which the surface is polished to a glossy shape so that a film of chromium chromium complex salt is easily formed on the surface of the workpiece (the above treatment is a pretreatment before chemical conversion treatment). The chemical conversion film is immersed in the chromic acid solution, the non-chromic acid solution, and the like, followed by washing with water, followed by drying at about 70 ° C. to cure the chemical film. As described above, the pretreatment of the chemical conversion treatment has to be carried out several processes such as degreasing treatment, cleaning treatment, etching treatment surface adjustment treatment, and the work is cumbersome, resulting in complicated processing equipment and high processing costs.
다이캐스팅이나 칙소 몰딩 등의 성형에 의해 제작된 성형 가공품은, 드로우, 보이드(void), 온수 흐름 흔적 등의 성형 불량 부분이 발생한다. 이 성형 불량(드로우, 보이드, 흐름 등)의 검사 시에, 상기 성형 가공품을 보기 쉽게 하기 위해서 부분적으로 수작업으로 버핑(buffing)을 하고, 그 후에 육안으로 검사를 하고 있지만, 버핑을 수작업으로 행하기 위해서, 상기 검사가 성가시다고 하는 문제점이나, 버핑하는 경우에 분진이 발생한다는 문제점이 있다. 이 버핑 등의 표면 조정을 행하는 수단으로는, 습식 블래스트 처리하는 일본국 특허공개공보 2003-284457호가 제안되어 있다. 더욱이 상기 습식 블래스트를 화성 처리의 전 처리로서 연속하여 행하는 방법으로서 일본국 특허공개공보 2000-263442호가 제안되어 있다. In the molded article produced by molding such as die casting or thixotropic molding, mold defects such as draw, voids, and hot water flow traces occur. During the inspection of this molding defect (draw, void, flow, etc.), in order to make the molded article easier to see, it is partially buffed manually, and then visually inspected, but the buffing is performed manually. To this end, there is a problem that the inspection is cumbersome, or there is a problem that dust is generated when buffing. As a means for performing surface adjustment such as buffing, Japanese Patent Laid-Open No. 2003-284457 which is wet blasted is proposed. Furthermore, Japanese Patent Laid-Open No. 2000-263442 has been proposed as a method of continuously performing the wet blast as a pretreatment for chemical conversion.
상기 종래 기술은 어느 것이나 모두 화성 처리의 전처리로서 습식 블래스트를 사용하는 방법이며, 공정 회수 등은 종래의 화학 처리를 사용한 처리와 동등하고, 비용 등의 개선 효과는 작다. 또한 성형 불량품은 화성 처리 전에, 퍼티 (putty) 도포에 의한 보정이 필요하게 되고 생산성 저하, 비용 상승의 원인이 되고 있다. All of the above prior arts are methods of using wet blasting as a pretreatment of chemical conversion treatment, and the number of processes and the like are equivalent to those using conventional chemical treatments, and the improvement effect of cost and the like is small. In addition, the defective molding product requires correction by putty coating before chemical treatment, which causes a decrease in productivity and an increase in cost.
본 발명은 Mg 합금으로 이루어지는 성형체의 표면에, 간이하게 화성 처리막을 형성하여 퍼티 도포에 의한 보정을 줄이고, 도장의 생산성을 개선하며, 비용 절감이 가능한 Mg 또는 Mg 합금 하우징 및 그 제조 방법을 제공한다. The present invention provides an Mg or Mg alloy housing and a method of manufacturing the same, which are formed on the surface of a molded body made of Mg alloy to reduce the correction by putty coating, improve the productivity of coating, and reduce the cost. .
본 발명의 Mg 또는 Mg 하우징은, Mg 또는 Mg 합금 하우징 표면을 화성 처리액과 연마재를 첨가한 액을 사용해서 습식 블래스트 처리함으로써, Mg 또는 Mg 합금 하우징 표면에 화성막을 형성한 것을 특징으로 한다. The Mg or Mg housing of the present invention is formed by forming a chemical film on the Mg or Mg alloy housing surface by wet blasting the surface of the Mg or Mg alloy housing using a liquid to which a chemical conversion treatment liquid and an abrasive are added.
본 발명의 Mg 또는 Mg 합금 하우징의 제조 방법은 Mg 또는 Mg 합금 표면에 화성 처리액과 연마재를 첨가한 액을 사용해서 습식 블래스트 처리함으로써, Mg 또는 Mg 합금 하우징 표면에 블래스트에 의한 요철과 화성막을 동시에 형성한 것을 특징으로 한다. In the manufacturing method of the Mg or Mg alloy housing of the present invention, wet blasting is performed using a liquid obtained by adding a chemical conversion treatment liquid and an abrasive to the Mg or Mg alloy surface, thereby simultaneously forming the unevenness and the chemical conversion film by the blast on the Mg or Mg alloy housing surface. Characterized in that formed.
본 발명에 의하면, Mg 또는 Mg 합금 하우징 표면에 화성 처리액과 연마재를 첨가한 액을 습식 블래스트 처리하고, Mg 또는 Mg 합금 하우징 표면에 블래스트에 의한 요철과 화성막을 동시에 형성함으로써, 화성 처리막을 형성하고, 퍼티 도포에 의한 보수를 줄이고, 생산성 저하와 비용을 개선할 수 있다. 즉, 화성 처리액과 연마재의 혼합액을 습식 블래스트에 의해 Mg 또는 Mg 합금 하우징 표면에 분사하면, 연마재에 의해 표면이 깎이는 동시에 Mg와 화성 처리액이 반응에 의해 적당한 막 두께로 또한 치밀한 인산칼슘―인산마그네슘의 복합 피막이 생성된다. 따라서, Mg 또는 Mg 합금 하우징 표면에 나내식성(裸耐蝕性), 방청성(rust prevention), 도막(塗膜) 밀착성 및 도막 내식성을 열화시키는 산화물이나 수산화물 막을 생성하지 않고, 칼슘 및 인은 화성막의 나내식성의 향상, 망간은 도막 밀착성의 향상에 기여하는 인산칼슘―인산마그네슘의 복합 피막이 가능하다. 또한 화성물의 표면의 드로우, 보이드, 흐름 등이 없어지고, 도장 전의 퍼티 수정의 필요가 없어 비용 절감이 가능해 진다. According to the present invention, a chemical treatment film is formed by wet blasting a liquid obtained by adding a chemical treatment solution and an abrasive to a surface of an Mg or Mg alloy housing, and simultaneously forming an unevenness and a chemical film by blasting on the surface of the Mg or Mg alloy housing. It can reduce the maintenance by applying putty, and reduce the productivity and cost. That is, when the mixed liquid of the chemical conversion solution and the abrasive is sprayed onto the surface of the Mg or Mg alloy housing by wet blasting, the surface is shaved by the abrasive and at the appropriate film thickness by the reaction between the Mg and the chemical conversion solution, the dense calcium phosphate-phosphate A composite film of magnesium is produced. Therefore, without forming an oxide or hydroxide film on the surface of the Mg or Mg alloy housing that degrades corrosion resistance, rust prevention, coating adhesion, and coating corrosion resistance, calcium and phosphorus may not Improved corrosion resistance and manganese can be a composite film of calcium phosphate-magnesium phosphate, which contributes to improvement of coating film adhesion. In addition, the draw, voids, flow, etc. of the surface of the chemicals are eliminated, and there is no need to correct the putty before coating, thereby reducing costs.
본 발명자들은 상기한 과제를 해결하기 위해서 진지하게 연구한 결과, Mg 또는 Mg 합금으로 이루어지는 하우징의, 예를 들면 방청 처리, 도장의 전처리로서 Mg 또는 Mg 합금에 화성 처리와 습식 블래스트 처리를 동시에 함으로써 상기 문제를 해결하는 방법을 찾아냈다. 여기서 습식 블래스트 처리란, 액체와 연마재를 혼합해서 0.1∼0.3 MPa 범위의 압력으로 분사하는 처리를 한다. MEANS TO SOLVE THE PROBLEM As a result of earnestly researching in order to solve the said subject, the present inventors performed the chemical conversion treatment and the wet blast treatment simultaneously to Mg or Mg alloy as a pretreatment of a housing | casing which consists of Mg or Mg alloy, for example, antirust process and coating. I found a way to solve the problem. Here, the wet blast treatment is a treatment in which a liquid and an abrasive are mixed and sprayed at a pressure in the range of 0.1 to 0.3 MPa.
본 발명에서 사용하는 화성액으로서는 칼슘 이온, 망간 이온 및 인산 이온을 포함하는 것이 바람직하고, 또한 산화 촉진제를 함유하는 수성액제와 알루미나 등의 연마재를 첨가한 액을 이용하여 습식 블래스트 처리하는 것이 바람직하다. 습식 블래스트 처리는, 하우징의 표면 연마와 화성 피막을 동시에 행하기 때문에, 형성된 피막도 연마되지만 상기한 조건을 만족시킴으로써 충분한 피막을 얻을 수 있다. The chemical liquid used in the present invention preferably contains calcium ions, manganese ions and phosphate ions, and wet blasting is preferably performed using a liquid containing an aqueous accelerator and an abrasive such as alumina. . In the wet blasting process, the surface polishing of the housing and the chemical conversion coating are performed at the same time, but the formed coating is also polished, but a sufficient coating can be obtained by satisfying the above conditions.
상기 연마재로서는, 알루미나, 지르코늄, 유리 및 수지로부터 선택되는 적어도 하나의 입자를 쓰는 것이 바람직하다. 또한 수지는 멜라민 수지, 요소 수지, 폴리에스테르 수지, 페놀 수지, 에폭시 수지, 우레탄 수지 등을 사용할 수 있다. 연마재 입자의 평균 입자 지름은 10∼300㎛의 범위가 바람직하다. As the abrasive, at least one particle selected from alumina, zirconium, glass and resin is preferably used. As the resin, melamine resin, urea resin, polyester resin, phenol resin, epoxy resin, urethane resin and the like can be used. The average particle diameter of the abrasive particles is preferably in the range of 10 to 300 µm.
이 분사하는 화성 처리액에 쓰는 칼슘 이온원(源)으로서, 질산칼슘, 아질산칼슘, 티오황산 칼슘, 인산 2수소칼슘 등의 1종류 또는 2종류 이상을 배합할 수 있다. 또한, 망간 이온원으로서, 탄산 망간, 질산 망간, 인산수소 망간, 중인산 망간, 플루오로 붕산 망간 등의 1종류 또는 2종류 이상을 배합할 수 있다. 또한, 인산 이온원으로서 오르소(ortho)인산, 축합인산, 아인산, 차아인산 등의 1종류 또는 2종류 이상을 배합할 수 있다. As a calcium ion source used for this chemical treatment liquid sprayed, one kind or two or more kinds of calcium nitrate, calcium nitrite, calcium thiosulfate and calcium dihydrogen phosphate can be blended. As the manganese ion source, one or two or more kinds of manganese carbonate, manganese nitrate, manganese hydrogen phosphate, manganese phosphate, manganese fluoroborate and the like can be blended. As the phosphoric acid ion source, one kind or two or more kinds such as ortho phosphoric acid, condensed phosphoric acid, phosphorous acid and hypophosphorous acid can be blended.
또한, 산화 촉진제로서 염소산나트륨, 차아염소산 나트륨 등을 사용할 수 있다. 이 산화 촉진제는 화성 처리 시에 Mg 또는 Mg 합금과 상기의 각 성분 이온과의 반응성을 높이고, 나내식성 등이 양호한 화성 피막을 한층 좋은 상태로 형성할 수 있다. 또한, 이 산화 촉진제의 바람직한 배합량은 상기한 성능의 화성 피막을 안정적으로 얻기 위해서 O.02∼2g/L의 범위의 비율이다. Moreover, sodium chlorate, sodium hypochlorite, etc. can be used as an oxidation promoter. This oxidation promoter can raise the reactivity of Mg or Mg alloy and said each component ion at the time of chemical conversion treatment, and can form the chemical conversion film with favorable corrosion resistance etc. in a better state. Moreover, the preferable compounding quantity of this oxidation promoter is the ratio of the range of 0.2-2 g / L in order to acquire the chemical conversion film of the above-mentioned performance stably.
본 발명에 있어서는, 화성 처리액과 연마재의 혼합액을 습식 블래스트에 의해 Mg 또는 Mg 합금 표면에 분사하면, 연마재에 의해 표면이 깎이는 동시에 Mg 또는 Mg와 화성 처리액이 반응에 의해 적당한 막 두께로 또한 치밀하게 인산칼슘―인산 망간의 복합 피막이 생성한다. 따라서, Mg 또는 Mg 표면에 산화물이나 수산화물의 막을 생성하지 않고 인산칼슘―인산 망간의 복합 피막을 할 수 있다. 상기 화성 처리에 의해 형성되는 복합 피막의 부착량은 Ca 중량으로 5㎎/㎡ 이상 50㎎/㎡ 이하, Mn중량으로 3㎎/㎡ 이상 25㎎/㎡ 이하, 인 중량으로 3O㎎/㎡ 이상 10O㎎/㎡ 이하인 것이 바람직하다. In the present invention, when the mixed liquid of the chemical conversion treatment liquid and the abrasive is sprayed onto the surface of the Mg or Mg alloy by wet blasting, the surface is crushed by the abrasive, and the Mg or Mg and the chemical conversion treatment liquid are further compacted to an appropriate film thickness by reaction. Thus, a composite film of calcium phosphate-manganese phosphate is formed. Therefore, a composite film of calcium phosphate-manganese phosphate can be formed without forming an oxide or hydroxide film on Mg or Mg surface. The adhesion amount of the composite film formed by the said chemical conversion treatment is 5 mg / m <2> or more and 50 mg / m <2> or less by Ca weight, 3 mg / m <2> or more and 25 mg / m <2> or less by Mn weight, and 30 mg / m <2> or more by phosphorus weight It is preferable that it is / m <2> or less.
또한, 화성 처리액과 연마재의 비율은 화성 처리액 70∼90 질량%와 연마재 10∼30 질량%의 범위로 하는 것이 바람직하다. Moreover, it is preferable to make the ratio of a chemical conversion treatment liquid and an abrasive into the range of 70-90 mass% of chemical conversion treatment liquids, and 10-30 mass% of abrasives.
Mg 또는 Mg 합금 표면에 상기한 소정량의 칼슘, 망간 및 인을 함유하도록 화성 피막이 형성됨으로써, 일정한 나내식성, 방청성, 도막 밀착성 및 도막 내식성을 유지하는 화성 피막을 얻을 수 있다. 특히, 칼슘 및 인은 화성 피막의 나내식성의 향상, 또한 망간은 도막 밀착성의 향상에 기여하는 것이라고 생각된다. By forming the chemical conversion film on the surface of Mg or Mg alloy so as to contain the predetermined amount of calcium, manganese, and phosphorus, a chemical conversion film that maintains constant corrosion resistance, rust resistance, coating adhesion, and coating corrosion resistance can be obtained. In particular, it is thought that calcium and phosphorus contribute to the improvement of the corrosion resistance of a chemical film, and that manganese contributes to the improvement of coating-film adhesiveness.
또한 연마재에 의해 Mg 또는 Mg 표면은, 연마됨으로써 Mg 또는 Mg 하우징 제품의 표면의 드로우, 보이드, 흐름 등이 없어지고, 도장 전의 퍼티 수정의 필요가 없어 비용 절감이 가능해 진다. 상기 습식 블래스트 액에 포함되는 연마재의 연마 작용에 의해, Mg 또는 Mg 합금 하우징의 표면 조도는, 10점 평균 표면 조도로 0.5㎛ 이상 100㎛ 이하의 범위로 하는 것이 바람직하다. In addition, the Mg or Mg surface is polished by the abrasive to eliminate the draw, voids, flow, etc. of the surface of the Mg or Mg housing product, it is possible to reduce the cost without the need to modify the putty before coating. By the grinding | polishing action of the abrasive | polishing agent contained in the said wet blast liquid, it is preferable to make surface roughness of Mg or Mg alloy housing into the range of 0.5 micrometer or more and 100 micrometers or less with a 10-point average surface roughness.
상기의 처리 공정에 계속하여, 수세하고 건조시키는 것이 바람직하다. 또한 다시 습식 블래스트 처리, 수세한 후에, 습식 블래스트 처리 시에 사용한 화성 처리액과 동등한 칼슘 이온, 망간 이온 및 인산 이온을 포함하고, 또한 산화 촉진제를 함유하는 수성액제를 샤워 분사하면 피막의 막 두께를 두껍게 할 수 있어 내식성이 향상된다.It is preferable to wash with water and to dry after following the said process process. Furthermore, after wet blasting and washing with water, the film thickness of the film is further reduced by shower spraying an aqueous liquid solution containing calcium ions, manganese ions and phosphate ions which are the same as the chemical treatment solution used in the wet blasting treatment, and containing an oxidation accelerator. Can be thickened, improving corrosion resistance.
그 후에 도장(塗裝) 처리를 실시할 수 있다. 이 도장 처리로서, 분사 도장이나 전착 도장 등의 방법에 의해 에폭시 수지 등의 도료를 밑칠하고, 다시 이것에 멜라민수지 등의 도료를 덧칠할 수 있다. 그 밖에도, 각종 수지에 의한 분체 도료를 정전(靜電) 도장할 수 있다. After that, a coating process can be performed. As this coating process, paints, such as an epoxy resin, can be coat | covered by methods, such as spray coating and electrodeposition coating, and this can be again coated with paints, such as a melamine resin. In addition, the powder coating by various resins can be electrostatically coated.
[실시예]EXAMPLE
이하, 실시예 및 비교예에 의거하여 본 발명을 더 구체적으로 설명한다. Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples.
<실시예 1><Example 1>
처리 대상 부재로서, ASTM AZ 91D의 Mg 또는 Mg 합금을 칙소 몰딩해서 제작한 노트북 하우징(가로:329㎜, 세로:274㎜, 높이:2㎜)을 사용했다. 칙소 몰딩은, Mg 또는 Mg 합금을 반용융 또는 용융 상태에서 약 600℃의 압출기로부터 약 250℃의 금형에 압출 성형했다. 표면 처리 공정을 도 1에 나타낸다. As the member to be treated, a notebook housing (width: 329 mm, length: 274 mm, height: 2 mm) produced by thixotropically molding Mg or Mg alloy of ASTM AZ 91D was used. The thixotropic molding extruded the Mg or Mg alloy from the extruder at about 600 ° C. into the mold at about 250 ° C. in a semi-melt or molten state. The surface treatment process is shown in FIG.
화성 처리액으로서 "그랜더파이너- MC1000"(밀리온가가꾸가부시키가이샤제 상품명, 인산 15∼25질량%, 망간 화합물 10∼15질량%, 칼슘 화합물 10∼20질량%)을 포함하는 수용액 80질량%와, 연마재로서 평균 입경 40㎛의 알루미나(마코(주)제품 상품명 "마코랜덤 A#320")를 20질량% 혼합해서 사용했다. 습식 블래스트는, 마코제품 상품명 "WFB-2-2C"를 사용하고, 압축 에어압은 O.2 MPa, 펌프압을 0.12 MPa로 하여 하우징과 노즐의 거리를 30㎜로 하여, 하우징을 40㎜/s로 이송하였다. 화성 처리액, 연마재 제거를 위해 수세하여 다시 탈이온수로 수세하고, 그 후 건조시켰다. Aqueous solution containing "Grander finer MC1000" (trade name, product made by Million Chemical Co., Ltd., 15-25 mass% of phosphoric acid, 10-15 mass% of manganese compounds, 10-20 mass% of calcium compounds) as a chemical conversion treatment liquid 80 mass% and 20 mass% of alumina (Mako Co., Ltd. product name "Mako random A # 320") of an average particle diameter of 40 micrometers were mixed and used as an abrasive. The wet blast uses the Makko product name "WFB-2-2C", the compressed air pressure is 0.2 MPa, the pump pressure is 0.12 MPa, and the housing and nozzle distance are 30 mm, and the housing is 40 mm / transferred to s. In order to remove a chemical treatment liquid and an abrasive, it washed with water and washed with deionized water again, and it dried after that.
<비교예 1>Comparative Example 1
비교예로서, 에칭한 뒤 화성 처리를 행하는 공정을 도 2에 나타낸다. 도 2의 표면 조정 1∼2는 에칭 처리를 나타낸다. As a comparative example, the process of performing a chemical conversion process after etching is shown in FIG. Surface adjustment 1-2 of FIG. 2 shows an etching process.
탈지제로서 "GFMg 15SX"(밀리온가가꾸가부시키가이샤제 상품명)를 사용하고, 그 액체의 온도를 70℃로 유지하고, 그 속에 상기 Mg 또는 Mg 합금 하우징을 5분간 침지해서 탈지 처리한 뒤 수세한다. 에칭제로서 "그랜더파이너-Mg l04S"(밀리온가가꾸가부시키가이샤제 상품명, 인산 30∼40질량%, 계면활성제 0.1질량% 미만, 잔부는 물)를 농도 5%, 액체 온도 60℃로 유지하고, 60초간 침지하여 에칭 처리한 뒤 수세한다. 그 후에 에칭 처리한 부재를, 액체 온도 60℃로 유지한 상기 "GFMg 15SX"(밀리온가가꾸가부시키가이샤제 상품명)에 7분간 침지하여 처리하고, 그 후 수세한다. 화성 처리액으로서 "그랜더파이너-MC1000"(밀리온가가꾸가부시키가이샤제 상품명, 인산 15∼25질량%, 망간화합물 10∼15질량%, 칼슘화합물 10∼20질량%)을 사용하고, 35℃로 유지해서 그 중에 상기한 바와 같이 처리한 Mg 또는 Mg 합금 하우징을 40초간 침지하여 화성 처리한 뒤 수세하고, 다시 탈이온수로 수세한뒤 건조시켰다. Using "GFMg 15SX" (trade name, manufactured by Million Chemical Co., Ltd.) as a degreasing agent, the temperature of the liquid is maintained at 70 ° C, and the Mg or Mg alloy housing is immersed therein for 5 minutes to degrease and washed with water. do. As an etchant, "Grander Finer-Mg01S" (trade name, product made by Million Chemical Co., Ltd., 30-40 mass% of phosphoric acid, less than 0.1 mass% of surfactant, water remainder) concentration 5%, liquid temperature 60 degreeC It is kept as it is, it is immersed for 60 second, an etching process, and it washes with water. Subsequently, the member subjected to the etching treatment is immersed in the above-mentioned "GFMg 15SX" (trade name, manufactured by Million Chemical Co., Ltd.) held at a liquid temperature of 60 ° C for 7 minutes, and then washed with water. "Grander Finer-MC1000" (trade name, manufactured by Million Chemical Co., Ltd., 15-25 mass% of phosphoric acid, 10-15 mass% of manganese compound, 10-20 mass% of calcium compound) is used as a chemical conversion treatment liquid, The Mg or Mg alloy housing treated as described above was maintained at 35 ° C, immersed for 40 seconds, chemically treated, washed with water, washed with deionized water, and dried.
실시예 1 및 비교예 1에 대해서, 외관 평가하고, 또한 Mg 또는 Mg 합금 하우징 표면의 원소 부착량은 형광 X선에 의한 정량 방법에 의해 측정했다. 하우징 표면의 5개소를 상정하여 그 편차를 조사했다. 전기 저항율은, (주)다이아 인스트루먼트사제 "로레스타-MP"(4단자 2탐침 방식)로 측정했다. 이 결과를 표 1과 도 3∼4에 나타낸다. 도 3은 실시예 1의 외관을 나타내는 사진이며, 도 4는 비교예 1의 외관을 나타내는 사진이다. 실시예 1의 외관은 균일 표면이었지만, 비교예 1의 외관은 얼룩이 보였다.In Example 1 and Comparative Example 1, the external appearance was evaluated, and the amount of element deposition on the surface of the Mg or Mg alloy housing was measured by a quantitative method by fluorescent X-rays. Five places of the housing surface were assumed and the deviation was investigated. The electrical resistivity was measured by "Loresta-MP" (4-terminal two-probe system) by Diamond Instruments. This result is shown in Table 1 and FIGS. 3 is a photograph showing the appearance of Example 1, and FIG. 4 is a photograph showing the appearance of Comparative Example 1. FIG. Although the external appearance of Example 1 was a uniform surface, the external appearance of Comparative Example 1 had a stain.
[표 1]TABLE 1
비고 1: 스맷(smut)은, 가루가 부착되어서 외관불량이 되는 것을 말함. Note 1: Smut refers to poor appearance due to the adhesion of powder.
또한 Mg 또는 Mg 합금 하우징에 에폭시계의 2코트 도장(two-coat coating)(150℃에서 베이킹)을, 고온 고습 환경(60℃, 상대습도 95%RH)에 100시간 유지 후, 크로스 컷(crosscut) 시험(시료 표면에 바둑판 모양을 그려서 100개의 부분으로 구분하고, 테이프 업(tape-up)한 후의 격자 잔존수를 계수하여, 다음 기준에 의해 판단했다. 즉, 그 잔존수가 100일 때 합격, 그것 미만일 때 불합격)으로 했다. In addition, an epoxy-based two-coat coating (baking at 150 ° C.) is applied to the Mg or Mg alloy housing for 100 hours in a high temperature and high humidity environment (60 ° C., 95% RH of 95% RH). ) Test (Draw the checkerboard shape on the sample surface, divide it into 100 parts, and count the remaining grids after tape-up, and judged them by the following criteria: Passed when the remaining counts were 100, Failed when it was less than that.
이 결과를 실시예 1에 관해서는 도 5의 a 내지 c의 외관 사진으로 나타내고, 또 비교예 1에 관해서는 도 6의 a 내지 c의 외관 사진에 나타낸다. 도 5 및 도 6에 있어서, 「OH」는 테스트 전, 「2㎜」와 「1㎜」는 각각 크로스 컷의 크기를 나타낸다. This result is shown with the external photograph of FIG. 5 a-c about Example 1, and the comparative example 1 is shown with the external photograph of a-c of FIG. In FIG. 5 and FIG. 6, before the test, "OH" and "2 mm" and "1 mm" show the magnitude | size of a cross cut, respectively.
또한 JIS Z 2371을 따른 염수 분무 시험(SST)을 8 시간과 24 시간 실시하여 내식성을 평가했다. 이 결과를 실시예 1에 관해서는 도 7의 a 내지 c의 외관사진에 나타내고, 또 비교예 1에 관해서는 도 8의 a 내지 c의 외관 사진에 나타낸다. 도 7 및 도 8에 있어서, 「OH」는 테스트 전, 「8H」와 「24H」는 각각 시험 처리 시간을 나타낸다. In addition, the salt spray test (SST) according to JIS Z 2371 was carried out for 8 hours and 24 hours to evaluate corrosion resistance. This result is shown in the external photograph of FIG. 7 a-c about Example 1, and the comparative example 1 is shown in the external photograph of a-c of FIG. In FIG. 7 and FIG. 8, "OH" shows the test processing time before "8H" and "24H", respectively.
이상의 결과로부터, 실시예 1은 비교예 1에 비교하여, 균일한 색조를 얻을 수 있고 평활한 것을 확인할 수 있었다. 또한 성형품 표면의 드로우, 보이드, 흐름 등이 없어졌다. 이에 따라 처리 후에 행하는 도장의 제품 비율이 향상되고 도장 전의 퍼티 등의 보수도 필요하지 않기 때문에 비용 절감이 이루어졌다. From the above result, in Example 1, compared with the comparative example 1, the uniform color tone was obtained and it was confirmed that it was smooth. In addition, there is no draw, voids, or flow on the surface of the molded article. As a result, the product ratio of the coating to be performed after the treatment is improved, and the maintenance such as the putty before the coating is not necessary, thereby reducing the cost.
실시예 1은, 피막 부착량은 비교예와 비교해서 적은 물건의 편차가 작았다. 그 밖의 피막 특성인 저항, 도장성, 내식성은 실시예와 비교예에서 동등한 값을 나 타냈다. In Example 1, the coating amount was small compared with the comparative example, and the variation of the article was small. Other coating properties, such as resistance, paintability, and corrosion resistance, were shown to be equivalent in Examples and Comparative Examples.
또한 실시예 1은, 전체의 공정수가 적기 때문에 간이하게 피막 처리가 가능하여 비용 절감을 할 수 있다.In addition, in Example 1, since the total number of processes is small, it is possible to simply coat the film, thereby reducing the cost.
본 발명은 Mg 합금으로 이루어지는 성형체의 표면에, 간이하게 화성 처리막을 형성하여 퍼티 도포에 의한 보정을 줄이고, 도장의 생산성을 개선하며, 비용 절감을 가능하게 한다. The present invention makes it easy to form a chemical conversion film on the surface of a molded body made of Mg alloy to reduce correction by putty coating, to improve the productivity of coating, and to reduce cost.
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| JPJP-P-2004-00264400 | 2004-09-10 | ||
| JP2004264400A JP4124761B2 (en) | 2004-09-10 | 2004-09-10 | Mg or Mg alloy casing and manufacturing method thereof |
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| CN101530015B (en) | 2006-10-31 | 2011-05-18 | 富士通株式会社 | Electronic equipment housing and process for manufacturing the same |
| CN101373651B (en) * | 2007-08-23 | 2011-12-07 | 北京中科三环高技术股份有限公司 | Surface pretreating method of wet method spray sand type neodymium iron boron permanent magnetic material |
| CN102463501A (en) * | 2010-11-18 | 2012-05-23 | 神基科技股份有限公司 | Surface processing method for magnesium alloy object and structure thereof |
| TWI448570B (en) * | 2010-11-29 | 2014-08-11 | Hon Hai Prec Ind Co Ltd | Articles and method for making the same |
| CN104233247B (en) * | 2014-07-21 | 2016-08-24 | 上海翔圣化工有限公司 | High anti-corrosion low resistance magnesium alloy passivating solution |
| CN104959564A (en) * | 2014-11-28 | 2015-10-07 | 东莞市晋益电子科技有限公司 | Method for manufacturing bimetallic seamless plastic insert casting piece |
| WO2017019039A1 (en) * | 2015-07-28 | 2017-02-02 | Hewlett-Packard Development Company, L.P. | Magnesium alloy substrate |
| WO2017219372A1 (en) * | 2016-06-24 | 2017-12-28 | 深圳市恒兆智科技有限公司 | Zinc-manganese series phosphating agent, metal piece and surface phosphating treatment method therefor |
| WO2017219368A1 (en) * | 2016-06-24 | 2017-12-28 | 深圳市恒兆智科技有限公司 | Manganese series phosphating agent, metal piece and surface phosphating treatment method therefor |
| CN109605227A (en) * | 2018-11-23 | 2019-04-12 | 中国航发沈阳黎明航空发动机有限责任公司 | A kind of minimizing technology of inorganic sealant after metal surface worst hot case |
| CN110205618B (en) * | 2019-07-10 | 2021-11-26 | 福建坤孚股份有限公司 | Method for preparing high-hardness film layer on surface of magnesium alloy in short process |
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| JPH1161054A (en) | 1997-08-12 | 1999-03-05 | Makoo Kk | Method for pretreating resin member bonding surface of electronic component |
| JP2000263443A (en) | 1999-03-19 | 2000-09-26 | Makoo Kk | Treatment method of magnesium product |
| JP2001212760A (en) | 2000-02-01 | 2001-08-07 | Tokai Rika Co Ltd | Design face forming method for metallic material |
| JP2003013255A (en) | 2001-07-02 | 2003-01-15 | Japan Steel Works Ltd:The | Surface treatment method for magnesium compact |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1161054A (en) | 1997-08-12 | 1999-03-05 | Makoo Kk | Method for pretreating resin member bonding surface of electronic component |
| JP2000263443A (en) | 1999-03-19 | 2000-09-26 | Makoo Kk | Treatment method of magnesium product |
| JP2001212760A (en) | 2000-02-01 | 2001-08-07 | Tokai Rika Co Ltd | Design face forming method for metallic material |
| JP2003013255A (en) | 2001-07-02 | 2003-01-15 | Japan Steel Works Ltd:The | Surface treatment method for magnesium compact |
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| TWI285580B (en) | 2007-08-21 |
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