KR100605422B1 - 액체 순환식 냉각 시스템 - Google Patents

액체 순환식 냉각 시스템 Download PDF

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Publication number
KR100605422B1
KR100605422B1 KR1020040055356A KR20040055356A KR100605422B1 KR 100605422 B1 KR100605422 B1 KR 100605422B1 KR 1020040055356 A KR1020040055356 A KR 1020040055356A KR 20040055356 A KR20040055356 A KR 20040055356A KR 100605422 B1 KR100605422 B1 KR 100605422B1
Authority
KR
South Korea
Prior art keywords
liquid
cooling system
reservoir
heat exchanger
heat
Prior art date
Application number
KR1020040055356A
Other languages
English (en)
Korean (ko)
Other versions
KR20050080722A (ko
Inventor
기따지마히로노리
사까요리히또시
다까하시다다시
Original Assignee
히다치 덴센 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 덴센 가부시끼가이샤 filed Critical 히다치 덴센 가부시끼가이샤
Publication of KR20050080722A publication Critical patent/KR20050080722A/ko
Application granted granted Critical
Publication of KR100605422B1 publication Critical patent/KR100605422B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/08—Fluid driving means, e.g. pumps, fans
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020040055356A 2004-02-10 2004-07-16 액체 순환식 냉각 시스템 KR100605422B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004033761A JP3897024B2 (ja) 2004-02-10 2004-02-10 液循環型冷却装置
JPJP-P-2004-00033761 2004-02-10

Publications (2)

Publication Number Publication Date
KR20050080722A KR20050080722A (ko) 2005-08-17
KR100605422B1 true KR100605422B1 (ko) 2006-07-31

Family

ID=34824264

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040055356A KR100605422B1 (ko) 2004-02-10 2004-07-16 액체 순환식 냉각 시스템

Country Status (5)

Country Link
US (1) US20050173097A1 (ja)
JP (1) JP3897024B2 (ja)
KR (1) KR100605422B1 (ja)
CN (1) CN100559924C (ja)
TW (1) TW200526913A (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070252499A1 (en) * 2004-10-18 2007-11-01 Leica Microsystems Cms Gmbh Scanning microscope
JP2007103633A (ja) * 2005-10-04 2007-04-19 Matsushita Electric Ind Co Ltd 冷却装置及びそれを備えた電子機器
JP2009088051A (ja) * 2007-09-28 2009-04-23 Hitachi Ltd 電子機器用の冷却装置
US8327654B2 (en) * 2008-03-17 2012-12-11 Denso International America, Inc. Condenser, radiator, and fan module with Rankine cycle fan
US20090272144A1 (en) * 2008-05-02 2009-11-05 Thermaltake Technology Co., Ltd. Computer cooling apparatus
KR20090122157A (ko) * 2008-05-23 2009-11-26 송세흠 온도 구배와 물을 이용한 공기 소스의 열교환 시스템 및 방법
CN101730436B (zh) * 2008-10-24 2012-05-23 南京理工大学 用于临近空间飞行器电子设备温控的对流散热***
TWM380493U (en) * 2009-12-30 2010-05-11 Man Zai Ind Co Ltd Water-cooling heat-dissipating device
US20120298339A1 (en) * 2010-02-10 2012-11-29 Naoki Masuda Liquid cooling system and electronic device including the same
US9010141B2 (en) * 2010-04-19 2015-04-21 Chilldyne, Inc. Computer cooling system and method of use
CN102486940A (zh) * 2010-12-06 2012-06-06 大连市铭源全科技开发有限公司 一种循环冷却水***
CN102592686B (zh) * 2011-01-18 2015-09-30 台达电子工业股份有限公司 热交换机
US8711563B2 (en) 2011-10-25 2014-04-29 International Business Machines Corporation Dry-cooling unit with gravity-assisted coolant flow
JP2014053467A (ja) * 2012-09-07 2014-03-20 Fujitsu Ltd 冷却システム
US9861012B2 (en) 2014-10-21 2018-01-02 International Business Machines Corporation Multifunction coolant manifold structures
EP3104009B1 (en) * 2015-05-12 2018-09-19 Cooler Master Co., Ltd. Liquid supply mechanism and liquid cooling system
US9992910B2 (en) 2015-06-11 2018-06-05 Cooler Master Co., Ltd. Liquid supply mechanism and liquid cooling system
CN105072872A (zh) * 2015-08-08 2015-11-18 衢州昀睿工业设计有限公司 一种用于功率器件的散热***
NL2015841B1 (en) * 2015-11-23 2017-06-07 Aecorsis B V A device comprising heat producing components with liquid submersion cooling.
CN105841534A (zh) * 2016-05-11 2016-08-10 华南理工大学 一种集成电流体动力微泵的反重力环路热管与方法
JP6593252B2 (ja) * 2016-05-25 2019-10-23 富士通株式会社 冷却装置及び電子機器
CN108019726A (zh) * 2018-01-23 2018-05-11 广东工业大学 一种led液冷散热循环***
JP7225666B2 (ja) * 2018-10-18 2023-02-21 日本電産株式会社 冷却ユニット
CN109618530B (zh) * 2018-12-05 2020-04-07 西安石油大学 一种井下工具的发热电子设备的冷却***
CN114040665B (zh) * 2021-12-01 2022-07-26 博浩数据信息技术(广州)有限公司 用于数据中心的箱式液冷设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2200620A (en) * 1938-05-12 1940-05-14 Eaton Mfg Co Heat exchanger
US2264945A (en) * 1939-08-07 1941-12-02 Stewart Warner Corp Pump
US5794692A (en) * 1993-10-28 1998-08-18 Modine Manufacturing Co. Header and tank construction for a heat exchanger
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation
US7084931B2 (en) * 2000-08-28 2006-08-01 Matsushita Electric Industrial Co., Ltd. Projection video device

Also Published As

Publication number Publication date
TW200526913A (en) 2005-08-16
JP2005228810A (ja) 2005-08-25
CN1655666A (zh) 2005-08-17
US20050173097A1 (en) 2005-08-11
JP3897024B2 (ja) 2007-03-22
KR20050080722A (ko) 2005-08-17
CN100559924C (zh) 2009-11-11
TWI302980B (ja) 2008-11-11

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