KR100597466B1 - Plating process of condutivity fiber - Google Patents

Plating process of condutivity fiber Download PDF

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KR100597466B1
KR100597466B1 KR1020040032920A KR20040032920A KR100597466B1 KR 100597466 B1 KR100597466 B1 KR 100597466B1 KR 1020040032920 A KR1020040032920 A KR 1020040032920A KR 20040032920 A KR20040032920 A KR 20040032920A KR 100597466 B1 KR100597466 B1 KR 100597466B1
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plating
silver
gold
nickel
copper
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KR1020040032920A
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KR20050107995A (en
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최철수
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최철수
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
    • F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
    • F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F21W2111/04—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for waterways
    • F21W2111/047—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00 for waterways for light-buoys

Abstract

본 발명은 니켈보다 환원력이 강한 은 또는 금의 환원력을 이용하여 전자파를 차폐하기 위한 섬유표면에 은 또는 금을 도금할 수 있도록 한 가스켓, 의류, 침구류 등으로 사용되는 전도성섬유의 치환도금방법에 관한 것으로서The present invention is a substitution plating method of the conductive fiber used as a gasket, clothing, bedding, etc. to plate the silver or gold on the surface of the fiber to shield the electromagnetic waves by using the reducing power of silver or gold which is stronger than nickel As

더욱 상세하게는 니켈을 무전해화학 동도금방식과 같은 방식을 사용하여 금속표면에 전착을 시킨 후 은 또는 금이온이 들어있는 용액에 담가두게 되면 은, 금이온은 원래 은 또는 금 그자체로 존재하려는 환원력이 니켈보다 매우 강하기 때문에 니켈내부의 전자를 은 또는 금이온이 강제적으로 빼앗아 니켈은 산화되어 이온화되고 은 또는 금은 니켈로부터의 전자를 받아 환원이 되어 섬유의 표면에 전착되도록하여 섬유의 표면에 은 또는 금도금을 할 수 있도록 한 것이다.More specifically, when nickel is deposited on a metal surface by using a method such as electroless chemical copper plating, and then immersed in a solution containing silver or gold ions, the silver and gold ions are originally intended to exist as silver or gold itself. Since the reducing power is much stronger than nickel, silver or gold ions are forcibly deprived of electrons in the nickel, and nickel is oxidized and ionized, and silver or gold receives electrons from nickel and is reduced to be electrodeposited on the surface of the fiber. Silver or gold can be plated.

종래에도 전자, 전기회로부품, 각종기기 등에서 발생되는 전자파를 차폐하기 위한 전도성섬유를 제조하기 위하여 섬유의 표면에 니켈, 동, 은, 금 등을 전해 혹은 비전해도금을 이용한 도금방법이 여러종류 공지되어 있으나 금과 은의 도금에 있어서는 고르게 도금이 되지않아 금과 은의 손실이 많고 상품가치가 떨어지게 되었을 뿐만 아니라 도금두께가 균일한 제품을 얻는데 많은 어려움이 따르게 되고 또한 이에 따라 생산단가가 상승하게 되는 문제가 따르게 되었다.Conventionally, various types of plating methods using electrolytic or non-electroplating are known for producing conductive fibers for shielding electromagnetic waves generated from electronics, electrical circuit parts, and various devices. However, the plating of gold and silver is not evenly plated, which leads to a lot of loss of gold and silver and a decrease in commodity value, as well as a lot of difficulties in obtaining a uniform coating thickness. Was followed.

본 발명은 상기와 같은 문제점을 해결하기 위하여The present invention to solve the above problems

니켈과 은 또는 금의 산화 및 환원작용에 의한 치환도금방법에 의하여 섬유표면에 두께가 균일한 은 또는 금도금을 할 수 있도록 함으로서 차폐효율과 상품가치의 향상 및 생산단가를 대폭 절감시킬 수 있도록 한 전도성섬유의 치환도금방법을 제공할 수 있도록 한 것에 그 목적이 있다.The conductive plating allows the silver or gold plating with a uniform thickness on the surface of the fiber by the substitution plating method by oxidation and reduction of nickel and silver or gold, which greatly improves shielding efficiency, product value, and production cost. It is an object of the present invention to provide a substitution plating method of fibers.

전도성섬유, 치환도금Conductive Fiber, Substituted Plating

Description

전도성섬유의 치환도금방법{PLATING PROCESS OF CONDUTIVITY FIBER}Plating process of conductive fiber {PLATING PROCESS OF CONDUTIVITY FIBER}

본 발명은 니켈보다 환원력이 강한 은 또는 금의 환원력을 이용하여 전자파를 차폐하기 위한 섬유표면에 은 또는 금을 도금할 수 있도록 한 가스켓, 의류, 침구류 등으로 사용되는 전도성섬유의 치환도금방법에 관한 것으로서The present invention is a substitution plating method of the conductive fiber used as a gasket, clothing, bedding, etc. to plate the silver or gold on the surface of the fiber to shield the electromagnetic waves by using the reducing power of silver or gold which is stronger than nickel As

더욱 상세하게는 니켈을 무전해화학 동도금방식과 같은 방식을 사용하여 금속표면에 전착을 시킨 후 은 또는 금이온이 들어있는 용액에 담가두게 되면 은, 금이온은 원래 은 또는 금 그자체로 존재하려는 환원력이 니켈보다 매우 강하기 때문에 니켈내부의 전자를 은 또는 금이온이 강제적으로 빼앗아 니켈은 산화되어 이온화되고 은 또는 금은 니켈로부터의 전자를 받아 환원이 되어 섬유의 표면에 전착되도록하여 섬유의 표면에 은 또는 금도금을 할 수 있도록 한 것이다.More specifically, when nickel is deposited on a metal surface by using a method such as electroless chemical copper plating, and then immersed in a solution containing silver or gold ions, the silver and gold ions are originally intended to exist as silver or gold itself. Since the reducing power is much stronger than nickel, silver or gold ions are forcibly deprived of electrons in the nickel, and nickel is oxidized and ionized, and silver or gold receives electrons from nickel and is reduced to be electrodeposited on the surface of the fiber. Silver or gold can be plated.

종래에도 전자, 전기회로부품, 각종기기 등에서 발생되는 전자파를 차폐하기 위한 전도성섬유를 제조하기 위하여 섬유의 표면에 니켈, 동, 은, 금 등을 전해 혹은 비전해도금을 이용한 도금방법이 여러종류 공지되어 있으나 금과 은의 도금에 있어서는 고르게 도금이 되지않아 금과 은의 손실이 많고 상품가치가 떨어지게 되었을 뿐만 아니라 도금두께가 균일한 제품을 얻는데 많은 어려움이 따르게 되고 또한 이에 따라 생산단가가 상승하게 되는 문제가 따르게 되었다.Conventionally, various types of plating methods using electrolytic or non-electroplating are known for producing conductive fibers for shielding electromagnetic waves generated from electronics, electrical circuit parts, and various devices. However, the plating of gold and silver is not evenly plated, which leads to a lot of loss of gold and silver and a decrease in commodity value, as well as a lot of difficulties in obtaining a uniform coating thickness. Was followed.

본 발명은 상기와 같은 문제점을 해결하기 위하여The present invention to solve the above problems

니켈과 은 또는 금의 산화 및 환원작용에 의한 치환도금방법에 의하여 섬유표면에 두께가 균일한 은 또는 금도금을 할 수 있도록 함으로서 차폐효율과 상품가치의 향상 및 생산단가를 대폭 절감시킬 수 있도록 한 전도성섬유의 치환도금방법을 제공할 수 있도록 한 것에 그 목적이 있다.The conductive plating allows the silver or gold plating with a uniform thickness on the surface of the fiber by the substitution plating method by oxidation and reduction of nickel and silver or gold, which greatly improves shielding efficiency, product value, and production cost. It is an object of the present invention to provide a substitution plating method of fibers.

본 발명의 목적달성을 위한 전도성섬유의 치환도금방법의 특징은Features of the substitution plating method of the conductive fiber for achieving the object of the present invention

폴리에스테르섬유 또는 아크릴계원단으로 된 기재섬유체를 초음파세척에 의하여 이물질을 깨끗하게 제거하고 75℃의 가성소다 100g/ℓ 에 침적한 후 엣칭처리 및 수세를 행한 다음 10%의 염산용액을 거친 후 염화파라듐과 염화주석의 혼합액으로 된 도금촉매조에 침적하고Substrate fibers of polyester fiber or acrylic fabrics are cleaned by ultrasonic cleaning, and then they are immersed in 100g / l caustic soda at 75 ℃, etched and washed with water, and then subjected to 10% hydrochloric acid solution. Was deposited in a plating catalyst bath made of a mixture of radium and tin chloride,

수세를 거친 후 10％의 황산용액에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거시키고 황산니켈 30g/ℓ, 차아인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 용액에 침적하여 니켈금속을 코팅 건조한 다음 표면의 이물질을 수세하여 제거시킨 후 동 3.5g/ℓ, 가성소다 9g/ℓ, 포르마린 4.5g/ℓ의 혼합용액에 침적하여 동금속을 코팅한 다음 동코팅표면을 황산니켈 30g/ℓ, 안인산나트륨 22g/ℓ,구연산소다 45g/ℓ의 혼합용액에 침적하여 니켈금속을 재코팅하고 이물질을 수세하여 제거하는 도금법에 있어서
니켈금속이 재코팅된 상기 기재섬유체를 온도 80∼95℃의 시안화금칼륨 750g/ℓ, 구연산암모늄 75g/ℓ의 금도금용액에 침적하여 습식도금에 의한 니켈과 동의 석출층위에 니켈이온과 금이온의 치환도금에 의하여 금도금을 하는 것을 특징으로 하는 것이고
또한 동금속을 코팅한 동코팅표면을 황산니켈 30g/ℓ, 안인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 혼합용액에 침적하여 니켈금속을 재코팅하고 이물질을 수세하여 제거하는 도금법에 있어서
니켈금속이 재코팅된 상기 기재섬유체를 온도 80∼95℃의 시안화칼륨 60g/ℓ, 시안화은칼륨 40g/ℓ의 은도금용액에 침적하여 습식도금에 의한 니켈과 동의 석출층위에 동이온, 은이온의 치환도금에 의하여 은도금을 할수 있도록 한 것이다.After washing with water, it is immersed in 10% sulfuric acid solution to remove the remaining tin, and then it is dipped in a solution of nickel sulfate 30g / ℓ, sodium hypophosphite 22g / ℓ and sodium citrate 45g / ℓ to coat and dry nickel metal. The foreign substances on the surface were washed with water, and then, copper 3.5g / ℓ, caustic soda 9g / ℓ, and formarin 4.5g / ℓ were mixed and copper copper was coated.The copper coated surface was nickel sulfate 30g / ℓ, and phosphoric acid In the plating method in which the nickel metal is recoated by dipping in a mixed solution of 22 g / l sodium and 45 g / l sodium citrate, and the foreign matter is washed with water and removed.
The base fiber body recoated with the nickel metal was deposited in a gold plating solution of 750 g / l potassium potassium cyanide and 75 g / l ammonium citrate at a temperature of 80 to 95 ° C., and nickel and gold ions were deposited on the precipitated layer of nickel and copper by wet plating. It is characterized in that the gold plating by the substitution plating of
In the plating method in which the copper-coated surface coated with copper metal is dipped in a mixed solution of nickel sulfate 30g / l, sodium phosphate 22g / l and sodium citrate 45g / l, recoating nickel metal and washing off the foreign matter by washing with water.
The base fiber body recoated with the nickel metal was deposited in a silver plating solution of 60 g / l potassium cyanide and 40 g / l potassium cyanide at a temperature of 80 to 95 ° C., and copper and silver ions were deposited on the precipitation layer of nickel and copper by wet plating. Silver plating can be performed by substitution plating.

이하 본 발명을 실시예에 따라 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to Examples.

(실시예1)Example 1

폴리에스테르섬유 또는 아크릴계원단으로 된 기재섬유체를 초음파세척에 의하여 이물질을 깨끗하게 제거하고 75℃의 가성소다 100g/ℓ에 침적한 후 엣칭처리 및 수세를 행한 다음 10％의 염산용액을 거친 후 염화파라듐과 염화주석의 혼합액으로 된 도금촉매조에 침적하고Substrate fibers of polyester fiber or acrylic fabrics are cleaned by ultrasonic cleaning, and then they are immersed in 100g / l caustic soda at 75 ℃, etched and washed with water, and then subjected to 10% hydrochloric acid solution. Was deposited in a plating catalyst bath made of a mixture of radium and tin chloride,

수세를 거친 후 10％의 황산용액에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거시키고 황산니켈 30g/ℓ, 차아인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 용액에 침적하여 니켈금속을 코팅 건조한 다음 표면의 이물질을 수세하여 제거시킨 후 동 3.5g/ℓ, 가성소다 9g/ℓ, 포르마린 4.5g/ℓ의 혼합용액에 침적하여 동금속을 코팅한 다음 동코팅표면을 황산니켈 30g/ℓ, 안인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 혼합용액에 침적하여 니켈금속을 재코팅하고 이물질을 수세하여 제거하는 도금법에 있어서
니켈금속이 재코팅된 상기 기재섬유체를 온도 80∼95℃의 시안화금칼륨 750g/ℓ, 구연산암모늄 75g/ℓ의 금도금용액에 침적하여 니켈내부에 이온 전자를 금이온이 강제적으로 빼앗아 니켈은 산화가 되어 이온화시키고 니켈금속의 전자를 받아 금이온으로 환원되고 전착되어 치환금도금되도록 한 것이다.After washing with water, it is immersed in 10% sulfuric acid solution to remove the remaining tin, and then it is dipped in a solution of nickel sulfate 30g / ℓ, sodium hypophosphite 22g / ℓ and sodium citrate 45g / ℓ to coat and dry nickel metal. The foreign substances on the surface were washed with water, and then, copper 3.5g / ℓ, caustic soda 9g / ℓ, and formarin 4.5g / ℓ were mixed and copper copper was coated.The copper coated surface was nickel sulfate 30g / ℓ, and phosphoric acid In the plating method in which a nickel metal is recoated by dipping in a mixed solution of 22 g / l sodium and 45 g / l sodium citrate, and the foreign matter is washed with water and removed.
The base fiber body recoated with the nickel metal was deposited in a gold plating solution of 750 g / l potassium potassium cyanide and 75 g / l ammonium citrate at a temperature of 80 to 95 ° C., thereby forcibly depriving ionic electrons of gold ions. It is ionized to receive electrons of nickel metal, reduced to gold ions, and electrodeposited to substitute gold plating.

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(실시예2)Example 2

폴리에스테르섬유 또는 아크릴계원단으로 된 기재섬유체를 초음파세척에 의하여 이물질을 깨끗하게 제거하고 75℃의 가성소다 100g/ℓ에 침적한 후 엣칭처리 및 수세를 행한 다음 10％의 염산용액을 거친 후 염화파라듐과 염화주석의 혼합액으로 된 도금촉매조에 침적하고
수세를 거친 후 10％의 황산용액에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거시키고 황산니켈 30g/ℓ, 차아인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 용액에 침적하여 니켈금속을 코팅 건조한 다음 표면의 이물질을 수세하여 제거시킨 후 동 3.5g/ℓ, 가성소다 9g/ℓ, 포르마린 4.5g/ℓ의 혼합용액에 침적하여 동금속을 코팅한 다음 동코팅표면을 황산니켈 30g/ℓ, 안인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 혼합용액에 침적하여 니켈금속을 재코팅하고 이물질을 수세하여 제거하는 도금법에 있어서
니켈금속이 재코팅된 상기 기재섬유체를 온도 80∼95℃의 시안화칼륨 60g/ℓ, 시안화은칼륨 40g/ℓ의 은도금용액에 침적하여 습식도금에 의한 니켈과 동의 석출층위에 동이온, 은이온의 치환도금에 의하여 은도금되도록 한 것이다.Substrate fibers of polyester fiber or acrylic fabrics are cleaned by ultrasonic cleaning, and then they are immersed in 100g / l caustic soda at 75 ℃, etched and washed with water, and then subjected to 10% hydrochloric acid solution. Was deposited in a plating catalyst bath made of a mixture of radium and tin chloride,
After washing with water, it is immersed in 10% sulfuric acid solution to remove the remaining tin, and then it is dipped in a solution of nickel sulfate 30g / ℓ, sodium hypophosphite 22g / ℓ and sodium citrate 45g / ℓ to coat and dry nickel metal. The foreign substances on the surface were washed with water, and then, copper 3.5g / ℓ, caustic soda 9g / ℓ, and formarin 4.5g / ℓ were mixed and copper copper was coated.The copper coated surface was nickel sulfate 30g / ℓ, and phosphoric acid In the plating method in which a nickel metal is recoated by dipping in a mixed solution of 22 g / l sodium and 45 g / l sodium citrate, and the foreign matter is washed with water and removed.
The base fiber body recoated with the nickel metal was deposited in a silver plating solution of 60 g / l potassium cyanide and 40 g / l potassium cyanide at a temperature of 80 to 95 ° C., and copper and silver ions were deposited on the precipitation layer of nickel and copper by wet plating. It is to be silver plated by the substitution plating.

이와 같이 된 본 발명은 니켈과 은 또는 금의 산화 및 환원작용을 이용한 치환도금방법에 의하여 섬유표면에 두께가 균일한 은 또는 금도금을 하게 됨으로 차폐효율과 상품가치의 향상 및 생산단가를 대폭 절감할 수 있는 효과가 있다.In the present invention as described above, the plating of silver or gold with a uniform thickness on the surface of the fiber is performed by a substitution plating method using oxidation and reduction of nickel and silver or gold, which greatly improves shielding efficiency, product value, and greatly reduces production cost. It can be effective.

Claims (2)

폴리에스테르섬유 또는 아크릴계원단으로 된 기재섬유체를 초음파세척에 의하여 이물질을 깨끗하게 제거하고 75℃의 가성소다 100g/ℓ에 침적한 후 엣칭처리 및 수세를 행한 다음 10％의 염산용액을 거친 후 염화파라듐과 염화주석의 혼합액으로 된 도금촉매조에 침적하고Substrate fibers of polyester fiber or acrylic fabrics are cleaned by ultrasonic cleaning, and then they are immersed in 100g / l caustic soda at 75 ℃, etched and washed with water, and then subjected to 10% hydrochloric acid solution. Was deposited in a plating catalyst bath made of a mixture of radium and tin chloride, 수세를 거친 후 10％의 황산용액에 침적세척하여 잔존하고 있는 주석을 깨끗하게 제거시키고 황산니켈 30g/ℓ, 차아인산나트륨 22g/ℓ, 구연산소다 45g/ℓ의 용액에 침적하여 니켈금속을 코팅 건조한 다음 표면의 이물질을 수세하여 제거시킨 후 동 3.5g/ℓ, 가성소다 9g/ℓ, 포르마린 4.5g/ℓ의 혼합용액에 침적하여 동금속을 코팅한 다음 동코팅표면을 황산니켈 30g/ℓ, 안인산나트륨 22g/ℓ, 구연산소다 45g/ℓ, 의 혼합용액에 침적하여 니켈금속을 재코팅하고 이물질을 수세하여 제거하는 도금법에 있어서After washing with water, it is immersed in 10% sulfuric acid solution to remove the remaining tin, and then it is dipped in a solution of nickel sulfate 30g / ℓ, sodium hypophosphite 22g / ℓ and sodium citrate 45g / ℓ to coat and dry nickel metal. The foreign substances on the surface were washed with water, and then, copper 3.5g / ℓ, caustic soda 9g / ℓ, and formarin 4.5g / ℓ were mixed and copper copper was coated.The copper coated surface was nickel sulfate 30g / ℓ, and phosphoric acid In the plating method of dipping in a mixed solution of 22 g / l sodium and 45 g / l sodium citrate, recoating nickel metal, and washing off water with water. 니켈금속이 재코팅된 상기 기재섬유체를 온도 80∼95℃의 시안화금칼륨 750g/ℓ, 구연산암모늄 75g/ℓ의 금도금용액에 침적하여 습식도금에 의한 니켈과 동의 석출층위에 니켈이온과 금이온의 치환도금에 의하여 금도금을 하는것을 특징으로 하는 것을 특징으로 하는 전도성섬유의 치환도금방법,The base fiber body recoated with the nickel metal was deposited in a gold plating solution of 750 g / l potassium potassium cyanide and 75 g / l ammonium citrate at a temperature of 80 to 95 ° C., and nickel and gold ions were deposited on the precipitated layer of nickel and copper by wet plating. Substituted plating method of the conductive fiber, characterized in that the gold plating by the substitution plating of, 제 1 항에 있어서The method of claim 1 동코팅표면을 황산니켈 30g/ℓ, 안인산나트륨 22g/ℓ,구연산소다 45g/ℓ, 의 혼합용액에 침적하여 니켈금속을 재코팅하고 이물질을 수세하여 제거하는 도금법에 있어서In the plating method, the copper coating surface is immersed in a mixed solution of nickel sulfate 30g / l, sodium phosphate 22g / l, sodium citrate 45g / l, recoated nickel metal and washed with water to remove foreign substances. 니켈금속이 재코팅된 상기 기재섬유체를 온도 80∼95℃의 시안화칼륨 60g/ℓ, 시안화은칼륨 40g/ℓ의 은도금용액에 침적하여 습식도금에 의한 니켈과 동의 석출층위에 동이온과 은이온의 치환도금에 의하여 은도금을 하는 것을 특징으로 하는 전도성섬유의 치환도금방법.The base fiber body recoated with nickel metal was deposited in a silver plating solution of potassium cyanide 60g / l and 40g / l potassium cyanide at a temperature of 80 to 95 ° C., and copper and silver ions were deposited on the precipitation layer of nickel and copper by wet plating. Substitution plating method of the conductive fiber, characterized in that the silver plating by substitution plating.
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KR20200041799A (en) 2018-10-12 2020-04-22 주식회사 플렉시오 Conductive Fiber and the Fabrication Method Thereof

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KR100894904B1 (en) * 2007-07-27 2009-04-30 조희욱 Plating method of metal to textile
KR100935182B1 (en) * 2007-11-22 2010-01-06 (주)메인일렉콤 Method for manufacturing conductive fiber for electromagetic waves insulition for preventing surface corrosion and oxidation and the conductive fiber
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KR102077426B1 (en) * 2019-07-01 2020-04-08 최철수 Manufacturing method for thin conductive nonwoven fabric and thin conductive nonwoven fabric manufactured using the same

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