KR100586278B1 - 본딩 와이어 차폐 구조를 가지는 고속 반도체 패키지용인쇄 회로 기판 - Google Patents
본딩 와이어 차폐 구조를 가지는 고속 반도체 패키지용인쇄 회로 기판 Download PDFInfo
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- KR100586278B1 KR100586278B1 KR1020040102368A KR20040102368A KR100586278B1 KR 100586278 B1 KR100586278 B1 KR 100586278B1 KR 1020040102368 A KR1020040102368 A KR 1020040102368A KR 20040102368 A KR20040102368 A KR 20040102368A KR 100586278 B1 KR100586278 B1 KR 100586278B1
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- printed circuit
- circuit board
- signal transmission
- semiconductor package
- speed semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 230000008054 signal transmission Effects 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims description 10
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
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- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910001020 Au alloy Inorganic materials 0.000 claims description 2
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- 230000008878 coupling Effects 0.000 abstract description 12
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- 230000004048 modification Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (11)
- 절연 기저층과;상기 절연 기저층의 제1 표면에 형성되는 다수의 신호 전송선과;상기 절연 기저층의 제1 표면에 형성되며, 각각 상기 신호 전송선의 사이에 위치하는 다수의 접지 패턴; 및상기 절연 기저층의 제2 표면에 형성되는 접지층을 포함하며,각각 상기 신호 전송선 위를 가로지르면서, 이웃하는 상기 접지 패턴을 서로 연결하는 다수의 본딩 와이어를 더 포함하는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 다수의 본딩 와이어는 상기 신호 전송선의 길이 방향을 따라 일정한 간격을 두고 주기적으로 배치되는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 다수의 본딩 와이어는 상기 신호 전송선의 길이 방향을 따라 일정하지 않은 간격을 두고 비주기적으로 배치되는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 다수의 본딩 와이어는 서로 평행하게 배치되는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 다수의 본딩 와이어는 적어도 한 쌍씩 서로 엇갈리게 배치되는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 다수의 본딩 와이어는 적어도 두 가지 이상의 복합 형태로 배치되는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,각각의 상기 신호 전송선은 한 쌍의 차동 신호선인 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,각각의 상기 신호 전송선은 구부러진 형태를 가지는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 본딩 와이어는 금, 은, 알루미늄, 구리 중에서 선택된 소재로 이루어지는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 본딩 와이어는 구리 또는 베릴륨이 첨가된 금 합금 소재로 이루어지는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
- 제1 항에 있어서,상기 본딩 와이어는 실리콘 또는 마그네슘이 첨가된 알루미늄 합금 소재로 이루어지는 것을 특징으로 하는 고속 반도체 패키지용 인쇄 회로 기판.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040102368A KR100586278B1 (ko) | 2004-12-07 | 2004-12-07 | 본딩 와이어 차폐 구조를 가지는 고속 반도체 패키지용인쇄 회로 기판 |
US11/296,769 US7330084B2 (en) | 2004-12-07 | 2005-12-06 | Printed circuit board having a bond wire shield structure for a signal transmission line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040102368A KR100586278B1 (ko) | 2004-12-07 | 2004-12-07 | 본딩 와이어 차폐 구조를 가지는 고속 반도체 패키지용인쇄 회로 기판 |
Publications (1)
Publication Number | Publication Date |
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KR100586278B1 true KR100586278B1 (ko) | 2006-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040102368A KR100586278B1 (ko) | 2004-12-07 | 2004-12-07 | 본딩 와이어 차폐 구조를 가지는 고속 반도체 패키지용인쇄 회로 기판 |
Country Status (2)
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US (1) | US7330084B2 (ko) |
KR (1) | KR100586278B1 (ko) |
Cited By (1)
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KR101086856B1 (ko) | 2008-04-16 | 2011-11-25 | 주식회사 하이닉스반도체 | 반도체 집적 회로 모듈 및 이를 구비하는 pcb 장치 |
Families Citing this family (13)
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US20100085130A1 (en) * | 2008-10-03 | 2010-04-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Manufacturable tunable matching network for wire and ribbon bond compensation |
KR101309864B1 (ko) * | 2010-02-02 | 2013-09-16 | 엘지디스플레이 주식회사 | 마스크 어셈블리 |
KR101133732B1 (ko) * | 2010-07-06 | 2012-04-09 | (주)기가레인 | 연질의 신호 전송 기판 |
US9647310B2 (en) * | 2014-03-04 | 2017-05-09 | Raytheon Company | Coplanar waveguide transmission line structure configured into non-linear paths to define inductors which inhibit unwanted signals and pass desired signals |
JP5835392B2 (ja) * | 2014-03-31 | 2015-12-24 | 住友大阪セメント株式会社 | 光導波路素子モジュール |
JP6569417B2 (ja) * | 2015-09-16 | 2019-09-04 | 三菱電機株式会社 | 増幅器 |
TWI690043B (zh) * | 2016-02-17 | 2020-04-01 | 瑞昱半導體股份有限公司 | 積體電路裝置 |
CN107123636B (zh) * | 2016-02-25 | 2020-01-10 | 瑞昱半导体股份有限公司 | 集成电路装置 |
AT518281B1 (de) * | 2016-03-01 | 2017-09-15 | Zkw Group Gmbh | Verfahren zum Herstellen einer Schirmung |
US11127689B2 (en) | 2018-06-01 | 2021-09-21 | Qorvo Us, Inc. | Segmented shielding using wirebonds |
US11219144B2 (en) | 2018-06-28 | 2022-01-04 | Qorvo Us, Inc. | Electromagnetic shields for sub-modules |
US11114363B2 (en) | 2018-12-20 | 2021-09-07 | Qorvo Us, Inc. | Electronic package arrangements and related methods |
US11515282B2 (en) | 2019-05-21 | 2022-11-29 | Qorvo Us, Inc. | Electromagnetic shields with bonding wires for sub-modules |
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JPH0946008A (ja) * | 1995-07-27 | 1997-02-14 | Shinko Electric Ind Co Ltd | 高周波用配線基板 |
JP2001015880A (ja) | 1999-06-30 | 2001-01-19 | Kyocera Corp | 配線基板とその接続構造 |
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US5194833A (en) * | 1991-11-15 | 1993-03-16 | Motorola, Inc. | Airbridge compensated microwave conductors |
US5942957A (en) * | 1994-09-26 | 1999-08-24 | Endgate Corporation | Flip-mounted impedance |
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US6867668B1 (en) * | 2002-03-18 | 2005-03-15 | Applied Micro Circuits Corporation | High frequency signal transmission from the surface of a circuit substrate to a flexible interconnect cable |
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2004
- 2004-12-07 KR KR1020040102368A patent/KR100586278B1/ko active IP Right Grant
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2005
- 2005-12-06 US US11/296,769 patent/US7330084B2/en not_active Expired - Fee Related
Patent Citations (2)
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JPH0946008A (ja) * | 1995-07-27 | 1997-02-14 | Shinko Electric Ind Co Ltd | 高周波用配線基板 |
JP2001015880A (ja) | 1999-06-30 | 2001-01-19 | Kyocera Corp | 配線基板とその接続構造 |
Cited By (1)
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KR101086856B1 (ko) | 2008-04-16 | 2011-11-25 | 주식회사 하이닉스반도체 | 반도체 집적 회로 모듈 및 이를 구비하는 pcb 장치 |
Also Published As
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US7330084B2 (en) | 2008-02-12 |
US20060119448A1 (en) | 2006-06-08 |
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