KR100568070B1 - 접착제 조성물 및 접착 시이트 - Google Patents
접착제 조성물 및 접착 시이트 Download PDFInfo
- Publication number
- KR100568070B1 KR100568070B1 KR1019990026819A KR19990026819A KR100568070B1 KR 100568070 B1 KR100568070 B1 KR 100568070B1 KR 1019990026819 A KR1019990026819 A KR 1019990026819A KR 19990026819 A KR19990026819 A KR 19990026819A KR 100568070 B1 KR100568070 B1 KR 100568070B1
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- parts
- silver
- nickel
- aluminum
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4063—Mixtures of compounds of group C08G18/62 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249954—With chemically effective material or specified gas other than air, N, or carbon dioxide in void-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
- Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
- Y10T428/24997—Of metal-containing material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249985—Composition of adhesive or bonding component specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/249991—Synthetic resin or natural rubbers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
접착제 조성 (중량부) | 박리강도 (N/25mm) | ||||||||||||||||
A | B | C | D | E | F | G | SiC | PI | API | 평상시 | 50℃5일 방치후 | ||||||
B1 | B2 | B3 | D1 | D2 | E1 | E2 | G1 | G2 | |||||||||
실시예 1 | 10 | 24 | 10 | 0.05 | 6 | 1.5 | 1.5 | 10 | 1 | 26 | 24 | ||||||
실시예 2 | 10 | 24 | 10 | 0.05 | 6 | 1.5 | 1.5 | 10 | 1 | 28 | 28 | ||||||
실시예 3 | 10 | 24 | 10 | 0.05 | 6 | 5 | 1.5 | 1.5 | 1 | 30 | 29 | ||||||
실시예 4 | 10 | 24 | 10 | 0.05 | 6 | 5 | 1.5 | 1.5 | 1 | 32 | 30 | ||||||
실시예 5 | 10 | 24 | 10 | 0.05 | 6 | 1.5 | 1.5 | 5 | 0.2 | 1 | 24 | 22 | |||||
실시예 6 | 10 | 24 | 10 | 0.05 | 6 | 1.5 | 1.5 | 5 | 0.2 | 1 | 25 | 25 | |||||
실시예 7 | 10 | 24 | 10 | 0.05 | 10 | 1.5 | 1.5 | 500 | 1 | 36 | 35 | ||||||
실시예 8 | 10 | 24 | 10 | 0.05 | 1.5 | 1.5 | 5 | 0.2 | 1 | 20 | 18 | ||||||
실시예 9 | 10 | 24 | 10 | 0.05 | 1.5 | 1.5 | 10 | 1 | 21 | 18 | |||||||
실시예10 | 10 | 24 | 10 | 0.05 | 1.5 | 1.5 | 1 | 15 | 13 | ||||||||
비교예 1 | 10 | 24 | 10 | 6 | 1.5 | 1.5 | 10 | 0.05 | 1 | 24 | 9 | ||||||
비교예 2 | 10 | 24 | 10 | 6 | 5 | 1.5 | 1.5 | 0.05 | 1 | 33 | 11 | ||||||
비교예 3 | 10 | 24 | 10 | 6 | 1.5 | 1.5 | 5 | 0.05 | 0.2 | 1 | 23 | 7 | |||||
비교예 4 | 10 | 24 | 10 | 6 | 1.5 | 1.5 | 10 | 0.05 | 1 | 23 | 9 | ||||||
비교예 5 | 10 | 24 | 10 | 1.5 | 1.5 | 5 | 0.05 | 0.2 | 1 | 18 | 5 | ||||||
비교예 6 | 10 | 24 | 10 | 1.5 | 1.5 | 10 | 0.05 | 1 | 18 | 5 | |||||||
비교예 7 | 10 | 24 | 10 | 1.5 | 1.5 | 0.05 | 1 | 10 | <1 |
Claims (19)
- (A)아크릴계 점착제, 고무계 점착제 및 폴리에스테르계 점착제로 이루어진 군으로부터 선택되는 점착성분, (B)에폭시계 열경화형 접착성분, 및 (C)분자량 400~1200의 폴리실록산 올리고머에 실란 커플링제를 부가, 축합시켜서 되는 하기 화학식 1로 나타내어지는 화합물을 포함하며,(A)성분 100중량부에 대하여, (B)성분을 50~800중량부 포함하고,(B)성분 100중량부에 대하여, (C)성분을 0.05~5중량부 포함해서 되는 것을 특징으로 하는 접착제 조성물:1상기 식중, R은 메틸기 또는 에틸기이고, S는 R 또는 실란 커플링제에 의해 도입되는 기이며, 화합물(C) 1분자중에는 실란 커플링제에 의해 도입되는 기가 2개이상 포함되어 있다.
- 제1항에 있어서, 열가소성수지 및 열가소성 엘라스토머로 이루어진 군으로부터 선택되는 가요성 성분(D)를, (B)성분 100중량부에 대하여 1~40중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, 열활성형 잠재성 에폭시수지 경화제(E)를, (B)성분 100중량부에 대하여 0.1~20중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제2항에 있어서, 열활성형 잠재성 에폭시수지 경화제(E)를, (B)성분 100중량부에 대하여 0.1~20중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, 에너지선 중합성 화합물로 되는 매트릭스형성 성분(F)를, (A), (B), (C)성분의 합계 100중량부에 대하여 1~30중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제2항에 있어서, 에너지선 중합성 화합물로 되는 매트릭스형성 성분(F)를, (A), (B), (C)성분의 합계 100중량부에 대하여 1~30중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제3항에 있어서, 에너지선 중합성 화합물로 되는 매트릭스형성 성분(F)를, (A), (B), (C)성분의 합계 100중량부에 대하여 1~30중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제4항에 있어서, 에너지선 중합성 화합물로 되는 매트릭스형성 성분(F)를, (A), (B), (C)성분의 합계 100중량부에 대하여 1~30중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제1항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제2항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제3항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제4항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제5항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제6항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제7항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제8항에 있어서, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 카본, 또는 세라믹, 또는, 니켈 또는 알루미늄을 은으로 피복한 도전성 충진제 또는, 금, 은, 동, 니켈, 알루미늄, 스텐레스 철, 실리콘, 게르마늄 또는 이들의 함금으로 되는 열전도성 충진제로 되는 충진제(G)를, (A), (B), (C)성분의 합계 100중량부에 대하여 5~950중량부, 더욱 포함하는 것을 특징으로 하는 접착제 조성물.
- 제9항 내지 제16항중 어느 한 항에 있어서, 충진제(G)가 도전성 충진제인 것을 특징으로 하는 접착제 조성물.
- 제1항 내지 제16항중 어느 한 항에 따른 접착제 조성물을 포함하는 것을 특징으로 하는 접착시이트.
- 제17항에 따른 접착제 조성물을 포함하는 것을 특징으로 하는 접착시이트.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1998-190491 | 1998-07-06 | ||
JP19049198A JP4275221B2 (ja) | 1998-07-06 | 1998-07-06 | 粘接着剤組成物および粘接着シート |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000011479A KR20000011479A (ko) | 2000-02-25 |
KR100568070B1 true KR100568070B1 (ko) | 2006-04-05 |
Family
ID=16258988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990026819A KR100568070B1 (ko) | 1998-07-06 | 1999-07-05 | 접착제 조성물 및 접착 시이트 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6277481B1 (ko) |
EP (1) | EP0971011B1 (ko) |
JP (1) | JP4275221B2 (ko) |
KR (1) | KR100568070B1 (ko) |
DE (1) | DE69930351T2 (ko) |
HK (1) | HK1024498A1 (ko) |
MY (1) | MY117586A (ko) |
SG (1) | SG79263A1 (ko) |
TW (1) | TW568945B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101787728B1 (ko) | 2016-10-07 | 2017-10-18 | 한국생산기술연구원 | 폴리티올 및 올리고실록산 경화제를 포함하는 접착제 조성물 |
Families Citing this family (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080087045A (ko) * | 2000-02-15 | 2008-09-29 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치 |
JP2001257220A (ja) * | 2000-03-13 | 2001-09-21 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
US6750301B1 (en) * | 2000-07-07 | 2004-06-15 | National Starch And Chemical Investment Holding Corporation | Die attach adhesives with epoxy compound or resin having allyl or vinyl groups |
US6531340B2 (en) * | 2001-02-23 | 2003-03-11 | Micron Technology, Inc. | Low temperature die attaching material for BOC packages |
JP2003055632A (ja) * | 2001-08-21 | 2003-02-26 | Lintec Corp | 粘接着テープ |
US20030092246A1 (en) * | 2001-10-11 | 2003-05-15 | Wanat Stanley F. | Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer |
JP4726383B2 (ja) * | 2002-02-15 | 2011-07-20 | 信越化学工業株式会社 | 放射線硬化性シリコーンゴム組成物および接着性シリコーンエラストマーフィルム |
JP4185292B2 (ja) * | 2002-02-15 | 2008-11-26 | 信越化学工業株式会社 | 放射線硬化性シリコーンゴム組成物および接着性シリコーンエラストマーフィルム |
US7060798B2 (en) * | 2002-05-13 | 2006-06-13 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Modified protein adhesives and lignocellulosic composites made from the adhesives |
US7252735B2 (en) * | 2002-05-13 | 2007-08-07 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives |
US20040132888A1 (en) * | 2002-12-16 | 2004-07-08 | Ube Industries, Ltd. | Electronic device packaging and curable resin composition |
US7265169B2 (en) * | 2003-03-20 | 2007-09-04 | State of Oregon Acting by and trhough the State Board of Higher Education on Behalf of Oregon State University | Adhesive compositions and methods of using and making the same |
CA2458159A1 (en) * | 2004-01-22 | 2005-07-22 | The State Of Oregon Acting By And Through The State Board Of Higher Educ Ation On Behalf Of Oregon State University | Formaldehyde-free adhesives and lignocellulosic composites made from the adhesives |
US8076353B2 (en) | 2004-03-15 | 2011-12-13 | Ptc Therapeutics, Inc. | Inhibition of VEGF translation |
CA2559408C (en) | 2004-03-15 | 2014-05-13 | Ptc Therapeutics, Inc. | Carboline derivatives useful in the inhibition of angiogenesis |
US7767689B2 (en) | 2004-03-15 | 2010-08-03 | Ptc Therapeutics, Inc. | Carboline derivatives useful in the treatment of cancer |
US8076352B2 (en) | 2004-03-15 | 2011-12-13 | Ptc Therapeutics, Inc. | Administration of carboline derivatives useful in the treatment of cancer and other diseases |
TWI384043B (zh) * | 2004-04-22 | 2013-02-01 | Nitto Denko Corp | An adhesive composition, a method for producing the same, and a use thereof |
JP4754185B2 (ja) * | 2004-05-27 | 2011-08-24 | リンテック株式会社 | 半導体封止用樹脂シートおよびこれを用いた半導体装置の製造方法 |
JP2007109952A (ja) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | 接着剤付補強板及びフレキシブルプリント基板 |
JP2007109950A (ja) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | 接着剤付補強板及びフレキシブルプリント基板 |
JP2007109951A (ja) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | 接着剤付補強板及びフレキシブルプリント基板 |
EP1940368A2 (en) * | 2005-10-25 | 2008-07-09 | Dow Corning Corporation | Transdermal drug delivery system with acrylate or methacrylate functional pressure sensitive adhesive composition |
KR101370245B1 (ko) | 2006-05-23 | 2014-03-05 | 린텍 가부시키가이샤 | 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 |
CN101517029B (zh) | 2006-07-31 | 2013-10-16 | 汉高股份及两合公司 | 可固化的环氧树脂-基粘合剂组合物 |
US9764351B2 (en) * | 2006-09-29 | 2017-09-19 | Airbus Operations Gmbh | Method of coating a substrate |
KR20090080956A (ko) | 2006-10-06 | 2009-07-27 | 헨켈 아게 운트 코. 카게아아 | 발수성의 펌핑가능한 에폭시 페이스트 접착제 |
JP2008112972A (ja) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置 |
KR100802812B1 (ko) | 2006-10-31 | 2008-02-14 | 현대자동차주식회사 | 고강성 시트용 조성물 |
KR20080047990A (ko) | 2006-11-27 | 2008-05-30 | 린텍 가부시키가이샤 | 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법 |
JP2008247936A (ja) * | 2007-03-29 | 2008-10-16 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
JP4778472B2 (ja) * | 2007-05-08 | 2011-09-21 | 日東電工株式会社 | 粘着型光学フィルムおよび画像表示装置 |
TWI421319B (zh) | 2007-06-28 | 2014-01-01 | Lintec Corp | 黏接著劑組成物、黏接著片及半導體裝置之製造方法 |
KR100910672B1 (ko) * | 2007-08-03 | 2009-08-04 | 도레이새한 주식회사 | 내열성 점착시트 |
US20100221533A1 (en) * | 2007-10-15 | 2010-09-02 | Hitachi Chemical Company, Ltd. | Circuit connecting adhesive film and circuit connecting structure |
JP5291326B2 (ja) * | 2007-11-16 | 2013-09-18 | 積水化学工業株式会社 | 接着剤組成物 |
JP5467720B2 (ja) | 2007-12-28 | 2014-04-09 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
US8980388B2 (en) * | 2008-01-18 | 2015-03-17 | Xerox Corporation | Use of silane promoter to modify pressure sensitive adhesive for use in pressure seal mailers printed on IGEN3 |
JP4806815B2 (ja) | 2008-03-31 | 2011-11-02 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
JP2009242605A (ja) * | 2008-03-31 | 2009-10-22 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
JP5500787B2 (ja) * | 2008-06-03 | 2014-05-21 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
JP5258466B2 (ja) * | 2008-09-08 | 2013-08-07 | 日東電工株式会社 | 熱硬化型接着剤組成物および熱硬化型接着テープ又はシート、フレキシブル回路基板 |
JP5089560B2 (ja) | 2008-11-28 | 2012-12-05 | リンテック株式会社 | 半導体チップ積層体および半導体チップ積層用接着剤組成物 |
US20100247973A1 (en) * | 2009-03-27 | 2010-09-30 | Magnum Magnetics Corporation | Reduced-environmental-impact magnetic sheet systems |
US8703726B2 (en) | 2009-05-27 | 2014-04-22 | Ptc Therapeutics, Inc. | Methods for treating prostate conditions |
HUE052510T2 (hu) | 2009-05-27 | 2021-05-28 | Ptc Therapeutics Inc | Módszerek a rák és a nem daganatos állapotok kezelésére |
MX2011012517A (es) | 2009-05-27 | 2012-01-27 | Ptc Therapeutics Inc | Procesos para la preparacion de tetrahidro beta - carbolina sustituidas. |
WO2010138652A1 (en) | 2009-05-27 | 2010-12-02 | Ptc Therapeutics, Inc. | Methods for treating kaposi sarcoma |
DE102009028180A1 (de) * | 2009-08-03 | 2011-02-10 | Henkel Ag & Co. Kgaa | Verfahren zum Befestigen eines Magneten auf oder in einem Rotor oder Stator |
JP5395585B2 (ja) * | 2009-09-14 | 2014-01-22 | 積水化学工業株式会社 | 後硬化テープ及び接合部材の接合方法 |
JP5716339B2 (ja) | 2010-01-08 | 2015-05-13 | 大日本印刷株式会社 | 粘接着シートおよびそれを用いた接着方法 |
JP5654900B2 (ja) * | 2010-03-03 | 2015-01-14 | 大日本印刷株式会社 | 接着組成物および硬化性感圧接着シートの製造方法 |
US9624411B2 (en) * | 2010-07-01 | 2017-04-18 | David W. Carnahan | Vacuum infusion adhesive and methods related thereto |
US9000086B2 (en) * | 2010-07-12 | 2015-04-07 | Lg Chem, Ltd. | Thermally curable resin composition for protective film |
KR101261621B1 (ko) * | 2010-07-12 | 2013-05-07 | 주식회사 엘지화학 | 열경화성 보호막 수지 조성물 |
JP5632336B2 (ja) * | 2010-07-29 | 2014-11-26 | 大日本印刷株式会社 | 接着組成物および熱硬化性接着シートの製造方法 |
JP5660443B2 (ja) * | 2010-08-06 | 2015-01-28 | 大日本印刷株式会社 | 粘接着シートおよびそれを用いた接着方法 |
KR101861600B1 (ko) * | 2010-11-15 | 2018-05-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 챔버 구성부품들을 연결하기 위해 이용되는 접착제 재료 |
JP5774322B2 (ja) * | 2011-01-28 | 2015-09-09 | リンテック株式会社 | 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法 |
JP5969217B2 (ja) * | 2011-03-09 | 2016-08-17 | 日東電工株式会社 | 両面接着テープ |
TWI481684B (zh) * | 2011-06-13 | 2015-04-21 | Nanya Plastics Corp | Heat resistant antistatic adhesive film |
JP6124614B2 (ja) * | 2012-02-17 | 2017-05-10 | 日本合成化学工業株式会社 | アクリル系粘着剤組成物、アクリル系粘着剤および粘着シートならびに基材レス粘着シート |
JP5917215B2 (ja) * | 2012-03-16 | 2016-05-11 | リンテック株式会社 | 接着剤組成物、接着シートおよび半導体装置の製造方法 |
CN106947409B (zh) * | 2012-06-29 | 2018-12-11 | 大自达电线股份有限公司 | 导电胶组成物、导电胶膜、黏合方法及线路基板 |
JP5644896B2 (ja) * | 2012-07-04 | 2014-12-24 | 大日本印刷株式会社 | 粘接着層及び粘接着シート |
JP6027812B2 (ja) * | 2012-08-06 | 2016-11-16 | デクセリアルズ株式会社 | 回路接続材料 |
DE102012018630A1 (de) * | 2012-09-21 | 2014-03-27 | Lohmann Gmbh & Co. Kg | Hitzeaktivierbares strukturelles Haftklebeband |
WO2014084357A1 (ja) * | 2012-11-30 | 2014-06-05 | リンテック株式会社 | 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法 |
KR102140470B1 (ko) | 2012-11-30 | 2020-08-03 | 린텍 가부시키가이샤 | 칩용 수지막 형성용 시트 및 반도체 장치의 제조 방법 |
KR101955241B1 (ko) * | 2012-12-27 | 2019-03-08 | 도레이첨단소재 주식회사 | 계면접착 특성이 우수한 실리콘 이형 조성물, 그를 이용한 실리콘 이형 필름 및 그의 제조방법 |
DE102013201958A1 (de) * | 2013-02-06 | 2014-08-07 | Vacuumschmelze Gmbh & Co. Kg | Zusammensetzung für eine Klebstoffmasse |
JP6064937B2 (ja) * | 2014-03-31 | 2017-01-25 | 信越化学工業株式会社 | 粘着剤組成物、粘着偏光板及び液晶表示装置 |
JP6488554B2 (ja) | 2014-04-23 | 2019-03-27 | 大日本印刷株式会社 | コンクリートの剥落防止工事の作業時間短縮化方法 |
JP6182174B2 (ja) | 2015-03-31 | 2017-08-16 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、粘着剤層付偏光フィルム、及び画像表示装置 |
JP6332764B2 (ja) * | 2016-11-17 | 2018-05-30 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
KR20200035292A (ko) | 2017-08-01 | 2020-04-02 | 피티씨 테라퓨틱스, 인크. | 혈액 암 치료에 사용하기 위한 dhodh 억제제 |
CN109651999A (zh) * | 2018-12-19 | 2019-04-19 | 同光(江苏)新材料科技有限公司 | 一种耐黄变耐候性高强度聚氨酯胶及其制备方法 |
CN110277559B (zh) * | 2019-06-17 | 2022-02-01 | 南开大学 | 用于锂离子电池硅基负极的聚亚胺导电粘结剂 |
CN112226197B (zh) * | 2020-09-17 | 2022-04-22 | 重庆重交再生资源开发股份有限公司 | 一种用于沥青路面裂缝处治的改性硅酮密封胶及其制备方法 |
CN112552854A (zh) * | 2020-12-18 | 2021-03-26 | 山东万圣博化工有限公司 | 一种导电粘合剂及其制备方法 |
WO2023224073A1 (ja) * | 2022-05-20 | 2023-11-23 | 富士フイルム株式会社 | 圧着シート及びその製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09100450A (ja) * | 1995-10-03 | 1997-04-15 | Lintec Corp | 粘接着テープおよびその使用方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1053242A (ko) * | 1962-05-18 | 1900-01-01 | ||
US3753755A (en) * | 1971-04-26 | 1973-08-21 | Minnesota Mining & Mfg | Sheet material coated with heat hardenable tacky adhesive |
JPH0616524B2 (ja) | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
JPS60223139A (ja) | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | 半導体ウエハ固定用接着薄板 |
JPH0715087B2 (ja) | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JP3226065B2 (ja) | 1993-06-28 | 2001-11-05 | キヤノン株式会社 | 単一波長半導体レーザ |
JP3492769B2 (ja) * | 1994-08-04 | 2004-02-03 | 鐘淵化学工業株式会社 | 熱硬化性粘着テープの製造方法 |
JP3483161B2 (ja) | 1994-08-11 | 2004-01-06 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JP3506519B2 (ja) | 1995-03-06 | 2004-03-15 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
EP0771835B1 (en) * | 1995-10-06 | 2005-03-30 | Mitsubishi Chemical Corporation | Polyalkoxysiloxane and process for its production |
CN1157310A (zh) * | 1995-11-22 | 1997-08-20 | 琳得科株式会社 | 粘合剂组合物和粘合片 |
JP4094080B2 (ja) | 1995-11-22 | 2008-06-04 | リンテック株式会社 | 接着剤組成物および接着シート |
JP3411748B2 (ja) | 1996-05-09 | 2003-06-03 | 日立化成工業株式会社 | 接着剤付き金属箔、接着シート及び多層配線板 |
-
1998
- 1998-07-06 JP JP19049198A patent/JP4275221B2/ja not_active Expired - Lifetime
-
1999
- 1999-07-02 MY MYPI99002804A patent/MY117586A/en unknown
- 1999-07-05 TW TW088111351A patent/TW568945B/zh not_active IP Right Cessation
- 1999-07-05 KR KR1019990026819A patent/KR100568070B1/ko not_active IP Right Cessation
- 1999-07-05 SG SG9903213A patent/SG79263A1/en unknown
- 1999-07-06 US US09/347,634 patent/US6277481B1/en not_active Expired - Lifetime
- 1999-07-06 EP EP99305379A patent/EP0971011B1/en not_active Expired - Lifetime
- 1999-07-06 DE DE69930351T patent/DE69930351T2/de not_active Expired - Fee Related
-
2000
- 2000-05-14 HK HK00103569A patent/HK1024498A1/xx not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09100450A (ja) * | 1995-10-03 | 1997-04-15 | Lintec Corp | 粘接着テープおよびその使用方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101787728B1 (ko) | 2016-10-07 | 2017-10-18 | 한국생산기술연구원 | 폴리티올 및 올리고실록산 경화제를 포함하는 접착제 조성물 |
Also Published As
Publication number | Publication date |
---|---|
EP0971011A3 (en) | 2000-11-22 |
JP2000017246A (ja) | 2000-01-18 |
HK1024498A1 (en) | 2000-10-13 |
EP0971011A2 (en) | 2000-01-12 |
MY117586A (en) | 2004-07-31 |
US6277481B1 (en) | 2001-08-21 |
KR20000011479A (ko) | 2000-02-25 |
DE69930351T2 (de) | 2006-10-12 |
EP0971011B1 (en) | 2006-03-15 |
SG79263A1 (en) | 2001-03-20 |
DE69930351D1 (de) | 2006-05-11 |
TW568945B (en) | 2004-01-01 |
JP4275221B2 (ja) | 2009-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100568070B1 (ko) | 접착제 조성물 및 접착 시이트 | |
KR100755175B1 (ko) | 점착테이프 | |
JP5473262B2 (ja) | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 | |
JP3739488B2 (ja) | 粘接着テープおよびその使用方法 | |
KR101370245B1 (ko) | 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 | |
KR100850772B1 (ko) | 다이싱·다이 본딩용 점접착 시트 및 반도체 장치의 제조방법 | |
KR20060043767A (ko) | 반도체용 점접착(粘接着) 시트 및 반도체 장치의 제조 방법 | |
KR101847526B1 (ko) | 반도체용 접착제 조성물, 반도체용 접착 시트 및 반도체 장치의 제조 방법 | |
KR20080088487A (ko) | 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법 | |
KR20080047990A (ko) | 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법 | |
KR20130105435A (ko) | 접착제 조성물, 접착 시트 및 반도체 장치의 제조 방법 | |
US8247503B2 (en) | Adhesive composition and adhesive sheet | |
JPWO2014155756A1 (ja) | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 | |
JP2003055632A (ja) | 粘接着テープ | |
JPH09100450A (ja) | 粘接着テープおよびその使用方法 | |
KR102105515B1 (ko) | 다이싱ㆍ다이 본딩 시트 | |
JP5237647B2 (ja) | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 | |
JP5414256B2 (ja) | 接着剤組成物、接着シートおよび半導体装置の製造方法 | |
JP5500787B2 (ja) | 接着剤組成物、接着シートおよび半導体装置の製造方法 | |
JP3601443B2 (ja) | 接着フィルムとその製造方法、半導体搭載用配線基板及び半導体装置 | |
JP5234594B2 (ja) | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 | |
JP5426831B2 (ja) | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 | |
KR20240079207A (ko) | 열경화성 필름, 복합 시트, 및 반도체 장치의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130304 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140228 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150302 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160304 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20170302 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180316 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20190318 Year of fee payment: 14 |
|
EXPY | Expiration of term |