KR100540913B1 - 액상 에폭시 수지 조성물 - Google Patents
액상 에폭시 수지 조성물 Download PDFInfo
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- KR100540913B1 KR100540913B1 KR1020020087839A KR20020087839A KR100540913B1 KR 100540913 B1 KR100540913 B1 KR 100540913B1 KR 1020020087839 A KR1020020087839 A KR 1020020087839A KR 20020087839 A KR20020087839 A KR 20020087839A KR 100540913 B1 KR100540913 B1 KR 100540913B1
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- epoxy resin
- formula
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- resin composition
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- SQLANTQAVAEXNQ-UHFFFAOYSA-N C(C1OC1)Oc1ccc2C(OCC3OC3)=CCCc2c1 Chemical compound C(C1OC1)Oc1ccc2C(OCC3OC3)=CCCc2c1 SQLANTQAVAEXNQ-UHFFFAOYSA-N 0.000 description 1
- DPNYQVNPVDUNBJ-UHFFFAOYSA-N CC(CC12)(C=CCC1[NH+]([O-])O[NH+]2[O-])N Chemical compound CC(CC12)(C=CCC1[NH+]([O-])O[NH+]2[O-])N DPNYQVNPVDUNBJ-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3227—Compounds containing acyclic nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
- C08K5/1539—Cyclic anhydrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
구 성 성 분 | 실시예 1 | 실시예 2 | 비교예 1 | 비교예 2 | 비교예 3 | |
에폭시수지 | 1)나프탈렌계 에폭시 수지 | 6.9 | 5.9 | 7.1 | 4.1 | 6.9 |
2)아민계 에폭시 수지 | 4.0 | 3.5 | 4.0 | 2.0 | 4.0 | |
경화제 | 3)트리알킬테트라하이드로 프탈산 무수물 | 9.0 | 8.0 | 9.0 | 7.0 | 9.0 |
4)메틸테트라하이드로 프탈산 무수물 | 4.0 | 3.7 | 4.0 | 4.0 | 4.0 | |
1-벤질-2-메틸이미다졸 | 0.3 | 0.3 | 0.3 | 0.3 | 0.3 | |
카본블랙 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | |
무기충전제 | 75.0 | 75.0 | 75.0 | 75.0 | 75.0 | |
γ-글리시톡시프로필트리메톡시실란 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | |
접착력 향상제 | 6) 부가반응 생성물 | 0.2 | 3.0 | - | 7.0 | - |
5)감마머켑토실란 | - | - | - | - | 0.2 | |
합계 | 100.0 | 100.0 | 100.0 | 100.0 | 100.0 | |
물성 평가결과 | 점도(cps, 25℃) | 27,000 | 25,000 | 30,000 | 23,000 | 32,000 |
유리전이온도 Tg(℃) | 159 | 155 | 161 | 142 | 160 | |
구리 접착력(kgf/㎠) | 65 | 70 | 20 | 75 | 72 | |
금 접착력(kgf/㎠) | 73 | 78 | 40 | 82 | 80 | |
경시변화(%, 25℃,24hr) | 18 | 20 | 18 | 22 | 75 | |
흡수율 (%) | 0.6 | 0.6 | 0.9 | 0.6 | 0.7 | |
프리콘시험결과 | 0/30 | 0/30 | 15/30 | 2/30 | 0/30 | |
열충격시험결과 | 0/30 | 0/30 | 20/30 | 15/30 | 0/30 |
Claims (2)
- (a) 하기 화학식 1로 표현되는 나프탈렌계 에폭시 수지; (b) 하기 화학식 2로 표현되는 아민계 에폭시 수지; (c) 하기 화학식 3으로 표현되는 트리알킬테트라하이드로프탈산 무수물; (d) 하기 화학식 4로 표현되는 메틸테트라하이드로프탈산 무수물; (e) 하기 화학식 5로 표현되는 이미다졸계 촉매 0.1~0.5중량%; (f) 무기충전제 70~80중량%; 및 (g) 하기 반응식 1의 부가반응물인 황을 포함하는 접착력 향상제 0.1~5중량%를 포함하는 수지 조성물로서,상기 나프탈렌계 에폭시 수지와 상기 아민계 에폭시 수지의 함량의 합이 9~15중량%이고, 상기 트리알킬테트라하이드로프탈산 무수물과 상기 메틸테트라하이드로프탈산 무수물의 함량의 합이 10~15중량%인 것을 특징으로 하는 볼그리드어레이 패키지용 무용매 액상 에폭시 수지 조성물:[화학식 1][화학식 2][화학식 3](상기 화학식에서, R1, R2 및 R3는 알킬 혹은 알케닐기이며, R1+R2+R3의 총 탄소수 및 수소수의 합은 C6H15 를 만족한다)[화학식 4][화학식 5](상기 화학식에서, R1, R2 및 R3는 각각 독립적으로 수소원자, 메틸기, 에틸기, 페닐기, 시아노에틸기 또는 벤질기이다)[반응식 1](상기 반응식에서, R1은 메톡시 혹은 에톡시기, R2,R3는 각각 독립적으로 수소 혹은 메틸기이다).
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020020087839A KR100540913B1 (ko) | 2002-12-31 | 2002-12-31 | 액상 에폭시 수지 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020020087839A KR100540913B1 (ko) | 2002-12-31 | 2002-12-31 | 액상 에폭시 수지 조성물 |
Publications (2)
Publication Number | Publication Date |
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KR20040061567A KR20040061567A (ko) | 2004-07-07 |
KR100540913B1 true KR100540913B1 (ko) | 2006-01-11 |
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KR1020020087839A KR100540913B1 (ko) | 2002-12-31 | 2002-12-31 | 액상 에폭시 수지 조성물 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4799883B2 (ja) * | 2005-03-01 | 2011-10-26 | 日東電工株式会社 | エポキシ樹脂組成物硬化体およびその製法ならびにそれを用いた光半導体装置 |
KR100830775B1 (ko) * | 2005-03-01 | 2008-05-20 | 닛토덴코 가부시키가이샤 | 광반도체 소자 봉지용 에폭시 수지 조성물 및 이를 이용한 광반도체 장치 |
KR100696880B1 (ko) * | 2005-12-30 | 2007-03-20 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
KR101234848B1 (ko) * | 2008-12-31 | 2013-02-19 | 제일모직주식회사 | 반도체 소자 밀봉용 액상 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
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KR20040061567A (ko) | 2004-07-07 |
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