KR100508329B1 - 레이저 가공장치 - Google Patents
레이저 가공장치 Download PDFInfo
- Publication number
- KR100508329B1 KR100508329B1 KR10-2003-7006691A KR20037006691A KR100508329B1 KR 100508329 B1 KR100508329 B1 KR 100508329B1 KR 20037006691 A KR20037006691 A KR 20037006691A KR 100508329 B1 KR100508329 B1 KR 100508329B1
- Authority
- KR
- South Korea
- Prior art keywords
- laser
- polarization
- beam splitter
- laser light
- angle
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (4)
- 하나의 레이저광을 제1의 편광수단으로 2개의 레이저광으로 분광하고, 한쪽은 미러를 경유하고, 다른 쪽은 제1의 갈바노 스캐너로 2축방향으로 주사하고, 2개의 레이저광을 제2의 편광수단으로 인도한 후, 제2의 갈바노 스캐너로 주사하고, 피가공물을 가공하는 레이저 가공장치에 있어서,제1의 편광수단으로 투과한 레이저광은 제2의 편광수단으로 반사시켜, 제1의 편광수단에서 반사한 레이저광은 제2의 편광수단으로 투과시키도록 광로를 구성하는 것을 특징으로 하는 레이저 가공장치.
- 제1항에 있어서, 2개의 편광수단의 반사면이 서로 마주보도록 배치하고, 분광한 각각의 레이저광의 광로 길이가 각각 같게 되는 광로를 형성하는 것을 특징으로 하는 레이저 가공장치.
- 제1항 또는 제2항에 있어서, 제1의 편광수단의 바로 앞에 각도조절가능한 제3의 편광각도조정용 편광수단을 배치한 것을 특징으로 하는 레이저 가공장치.
- 제3항에 있어서, 레이저광의 에너지를 측정할 수 있는 센서를 설치하고, 2개의 레이저광의 에너지를 측정하고, 소망하는 비율의 에너지로 2개의 레이저광이 인출할 수 있도록 제3의 편향각도조정용 변경수단의 각도를 조정하는 것을 특징으로 하는 레이저 가공장치.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2002/003088 WO2003082510A1 (en) | 2002-03-28 | 2002-03-28 | Laser machining apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030091940A KR20030091940A (ko) | 2003-12-03 |
KR100508329B1 true KR100508329B1 (ko) | 2005-08-17 |
Family
ID=28470391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2003-7006691A KR100508329B1 (ko) | 2002-03-28 | 2002-03-28 | 레이저 가공장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040104208A1 (ko) |
JP (1) | JP4093183B2 (ko) |
KR (1) | KR100508329B1 (ko) |
CN (1) | CN1232380C (ko) |
DE (1) | DE10296639B4 (ko) |
TW (1) | TW540194B (ko) |
WO (1) | WO2003082510A1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6984802B2 (en) * | 2001-11-15 | 2006-01-10 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining device |
JP3822188B2 (ja) * | 2002-12-26 | 2006-09-13 | 日立ビアメカニクス株式会社 | 多重ビームレーザ穴あけ加工装置 |
TWI275439B (en) * | 2003-05-19 | 2007-03-11 | Mitsubishi Electric Corp | Laser processing apparatus |
US6947454B2 (en) * | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
US20090011614A1 (en) * | 2004-06-18 | 2009-01-08 | Electro Scientific Industries, Inc. | Reconfigurable semiconductor structure processing using multiple laser beam spots |
DE102004050819B4 (de) * | 2004-10-19 | 2010-05-12 | Daimler Ag | Verfahren und Vorrichtung zum Laserstrahlbearbeiten |
DE102004062381B4 (de) * | 2004-12-23 | 2009-08-20 | Hitachi Via Mechanics, Ltd., Ebina | Vorrichtung zum Umschalten eines Laserstrahls, Laserbearbeitungsvorrichtung |
KR101511199B1 (ko) * | 2006-08-22 | 2015-04-10 | 캠브리지 테크놀로지 인코포레이티드 | 엑스-와이 고속 천공 시스템에서 공진 스캐너를 사용하기 위한 시스템 및 방법 |
DE102007056254B4 (de) * | 2007-11-21 | 2009-10-29 | Lpkf Laser & Electronics Ag | Vorrichtung zur Bearbeitung eines Werkstücks mittels paralleler Laserstrahlen |
JP5349406B2 (ja) * | 2010-06-01 | 2013-11-20 | 三菱電機株式会社 | 偏光方位角調整装置およびレーザ加工装置 |
CN102157890B (zh) * | 2011-03-21 | 2012-07-25 | 华中科技大学 | 一种偏振不敏感的空间折叠激光谐振腔 |
RU2492514C1 (ru) * | 2012-03-26 | 2013-09-10 | Общество С Ограниченной Ответственностью "Оптосистемы" | Лазерная сканирующая система на основе резонансного сканера |
CN103529507B (zh) * | 2012-07-06 | 2016-05-25 | 三菱电机株式会社 | 偏振光相位差板以及激光加工机 |
WO2016002036A1 (ja) * | 2014-07-03 | 2016-01-07 | 新日鐵住金株式会社 | レーザ加工装置 |
WO2016002043A1 (ja) | 2014-07-03 | 2016-01-07 | 新日鐵住金株式会社 | レーザ加工装置 |
JP6430790B2 (ja) * | 2014-11-25 | 2018-11-28 | 株式会社ディスコ | レーザー加工装置 |
CN104785779B (zh) * | 2015-03-20 | 2017-08-18 | 徐州奕创光电科技有限公司 | 一种激光扫描头、三维打印装置及打印方法 |
JP6395681B2 (ja) * | 2015-08-28 | 2018-09-26 | 三菱電機株式会社 | レーザ加工装置 |
KR102104782B1 (ko) | 2016-01-18 | 2020-04-27 | 미쓰비시덴키 가부시키가이샤 | 레이저 광을 위한 파워 밸런스 장치, 레이저 가공 장치 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3945951B2 (ja) * | 1999-01-14 | 2007-07-18 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工機 |
DE19983939B4 (de) * | 1999-03-05 | 2005-02-17 | Mitsubishi Denki K.K. | Laserstrahlmaschine |
JP4459530B2 (ja) * | 2000-08-29 | 2010-04-28 | 三菱電機株式会社 | レーザ加工装置 |
US6984802B2 (en) * | 2001-11-15 | 2006-01-10 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining device |
-
2002
- 2002-03-28 CN CNB028029798A patent/CN1232380C/zh not_active Expired - Lifetime
- 2002-03-28 JP JP2003546636A patent/JP4093183B2/ja not_active Expired - Lifetime
- 2002-03-28 US US10/432,289 patent/US20040104208A1/en not_active Abandoned
- 2002-03-28 WO PCT/JP2002/003088 patent/WO2003082510A1/ja active IP Right Grant
- 2002-03-28 KR KR10-2003-7006691A patent/KR100508329B1/ko active IP Right Grant
- 2002-03-28 DE DE10296639T patent/DE10296639B4/de not_active Expired - Fee Related
- 2002-03-29 TW TW091106285A patent/TW540194B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4093183B2 (ja) | 2008-06-04 |
JPWO2003082510A1 (ja) | 2005-08-04 |
US20040104208A1 (en) | 2004-06-03 |
CN1232380C (zh) | 2005-12-21 |
TW540194B (en) | 2003-07-01 |
WO2003082510A1 (en) | 2003-10-09 |
CN1474730A (zh) | 2004-02-11 |
DE10296639T5 (de) | 2004-04-29 |
KR20030091940A (ko) | 2003-12-03 |
DE10296639B4 (de) | 2007-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100508329B1 (ko) | 레이저 가공장치 | |
KR100731799B1 (ko) | 레이저 가공장치 | |
KR100578949B1 (ko) | 레이저 가공장치 | |
KR100500343B1 (ko) | 레이저 가공 장치 | |
KR100841426B1 (ko) | 다중빔 레이저 구멍뚫기 가공장치 | |
KR100955150B1 (ko) | 레이저 가공 장치 | |
KR101265843B1 (ko) | 편광 방위각 조정 장치 및 레이저 가공 장치 | |
KR102429862B1 (ko) | 이종파장의 레이저 빔을 이용한 레이저 가공 장치 및 그 방법 | |
CN116275475A (zh) | 激光指向改变时校正路径偏离的方法及其装置和机床 | |
JPH08141769A (ja) | レーザ加工装置 | |
CN111565881B (zh) | 激光加工头、激光加工装置以及激光加工头的调整方法 | |
KR100819616B1 (ko) | 레이저 가공 장치 | |
WO2021187042A1 (ja) | ビーム分岐装置及び分岐比調整方法 | |
JPH06277867A (ja) | レーザ加工装置 | |
JP3006348B2 (ja) | レーザ加工装置 | |
JPH05305473A (ja) | レーザ加工装置 | |
JP2002254191A (ja) | レーザ加工方法およびレーザ加工装置 | |
JPH05337673A (ja) | レーザ加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120724 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20130719 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20140721 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20150716 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20160701 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20170720 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20180719 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20190722 Year of fee payment: 15 |