KR100507716B1 - 서모파일 센서 및 서모파일 센서가 구비된 복사 온도계 - Google Patents
서모파일 센서 및 서모파일 센서가 구비된 복사 온도계 Download PDFInfo
- Publication number
- KR100507716B1 KR100507716B1 KR10-1999-7008139A KR19997008139A KR100507716B1 KR 100507716 B1 KR100507716 B1 KR 100507716B1 KR 19997008139 A KR19997008139 A KR 19997008139A KR 100507716 B1 KR100507716 B1 KR 100507716B1
- Authority
- KR
- South Korea
- Prior art keywords
- thermopile sensor
- cold
- thermopile
- contact
- heat
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 45
- 239000010409 thin film Substances 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 6
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J5/14—Electrical features thereof
- G01J5/16—Arrangements with respect to the cold junction; Compensating influence of ambient temperature or other variables
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P13/00—Indicating or recording presence, absence, or direction, of movement
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Radiation Pyrometers (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
Description
Claims (17)
- 하우징과, 하나 이상의 냉접점(cold junction) 및 하나 이상의 열접점(hot junction)을 갖는 서모파일(thermopile)과, 상기 열접점 및 냉접점용의 지지 구조체를 구비하는 서모파일 센서에 있어서,상기 하우징에 대한 열접점(12) 및 냉접점(11)의 단열 특성은 실질적으로 동일하게 양호하며, 상기 열접점의 열용량과 냉접점의 열용량은 실질적으로 동일하고, 열접점용 지지 구조체의 열용량과 냉접점용 지지 구조체의 열용량은 실질적으로 동일한 것을 특징으로 하는 서모파일 센서.
- 제1항에 있어서, 상기 지지 구조체는 상기 냉접점 및 열접점이 배치된 하나 이상의 박막(3)을 포함하며, 상기 박막은 낮은 열용량 및 낮은 열 전도율을 갖는 것을 특징으로 하는 서모파일 센서.
- 제2항에 있어서, 상기 지지 구조체는 상기 박막(3)을 지지하는 프레임(2)을 더 포함하며, 상기 냉접점 및 열접점은 상기 프레임(2)과 접촉하지 않은 영역에서 박막(3)상에 위치하는 것을 특징으로 하는 서모파일 센서.
- 제3항에 있어서, 상기 냉접점(11)과 열접점(12) 사이에는 상기 프레임(2)에 열 전도식으로 연결되어 있거나 프레임(2)의 일부인 리브형 히트 싱크(20; rib-shaped heat sink)가 마련되는 것을 특징으로 하는 서모파일 센서.
- 제3항 또는 제4항에 있어서, 상기 박막(3)은 주로 산화 규소와 질화 규소 또는 실리콘 옥시니트라이드(silicon oxinitride)로 제조되며, 상기 프레임(2)은 실질적으로 실리콘으로 제조되며, 전자 회로가 프레임(2)에 배치되는 것을 특징으로 하는 서모파일 센서.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 열접점(12)에는 열 흡수층 또는 우수한 열 전도층이 도포되는 것을 특징으로 하는 서모파일 센서.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 냉접점(11)에는 열 반사층이 도포되는 것을 특징으로 하는 서모파일 센서.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 냉접점 및 열접점은 상기 하우징의 내부에서 대칭으로 배치되는 것을 특징으로 하는 서모파일 센서.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 냉접점 및 열접점과, 복사선 도입 창 중 어느 하나는 상기 하우징 내에 비대칭으로 배치되는 것을 특징으로 하는 서모파일 센서.
- 제9항에 있어서, 상기 냉접점(11)에는 열 흡수층 또는 우수한 열 전도층이 도포되는 것을 특징으로 하는 서모파일 센서.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 지지 구조체에는 주위 온도 센서(4)가 열 전도식으로 연결되는 것을 특징으로 하는 서모파일 센서.
- 제1항 내지 제4항 중 어느 한 항에 따른 서모파일 센서를 구비하는 것을 특징으로 하는 복사 온도계.
- 제12항에 있어서, 상기 서모파일 센서는 상기 열접점이 측정 대상 복사선에 대해 상기 냉접점보다 더 높은 정도로 노출되도록 상기 복사 온도계의 복사선 통로 내에 배치되거나, 그와 반대로 되는 것을 특징으로 하는 복사 온도계.
- 제13항에 있어서, 상기 복사 온도계의 복사선 통로 내에서 상기 냉접점을 덮는 수단이 마련되는 것을 특징으로 하는 복사 온도계.
- 제13항에 있어서, 상기 서모파일 센서는 상기 복사 온도계의 복사선 통로 내에 비대칭으로 배치되는 것을 특징으로 하는 복사 온도계.
- 제1항 내지 제4항 중 어느 한 항에 따른 하나 이상의 서모파일 센서를 구비하는 것을 특징으로 하는 이동 감지기.
- 삭제
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19710946A DE19710946A1 (de) | 1997-03-15 | 1997-03-15 | Thermopile-Sensor und Strahlungsthermometer mit einem Thermopile-Sensor |
DE19710946.2 | 1997-03-15 | ||
PCT/EP1998/001247 WO1998041828A1 (de) | 1997-03-15 | 1998-03-05 | Thermopile-sensor und strahlungsthermometer mit einem thermopile-sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000076051A KR20000076051A (ko) | 2000-12-26 |
KR100507716B1 true KR100507716B1 (ko) | 2005-08-17 |
Family
ID=7823597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-1999-7008139A KR100507716B1 (ko) | 1997-03-15 | 1998-03-05 | 서모파일 센서 및 서모파일 센서가 구비된 복사 온도계 |
Country Status (12)
Country | Link |
---|---|
US (1) | US6203194B1 (ko) |
EP (2) | EP0966660B1 (ko) |
JP (1) | JP2001527644A (ko) |
KR (1) | KR100507716B1 (ko) |
CN (1) | CN1104634C (ko) |
AT (2) | ATE457447T1 (ko) |
AU (1) | AU6827498A (ko) |
DE (3) | DE19710946A1 (ko) |
ES (1) | ES2221162T3 (ko) |
HK (1) | HK1024053A1 (ko) |
TW (1) | TW384395B (ko) |
WO (1) | WO1998041828A1 (ko) |
Cited By (2)
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KR100759013B1 (ko) | 2006-03-02 | 2007-09-17 | 주식회사 이노칩테크놀로지 | 비접촉식 적외선 온도 센서 및 이의 제조 방법 |
KR100769587B1 (ko) | 2006-04-25 | 2007-10-23 | 주식회사 이노칩테크놀로지 | 비접촉식 적외선 온도 센서 |
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US5824947A (en) * | 1995-10-16 | 1998-10-20 | Macris; Chris | Thermoelectric device |
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1997
- 1997-03-15 DE DE19710946A patent/DE19710946A1/de not_active Ceased
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1998
- 1998-03-05 US US09/180,811 patent/US6203194B1/en not_active Expired - Lifetime
- 1998-03-05 KR KR10-1999-7008139A patent/KR100507716B1/ko not_active IP Right Cessation
- 1998-03-05 DE DE59811385T patent/DE59811385D1/de not_active Expired - Lifetime
- 1998-03-05 AT AT03009102T patent/ATE457447T1/de not_active IP Right Cessation
- 1998-03-05 JP JP54007898A patent/JP2001527644A/ja active Pending
- 1998-03-05 WO PCT/EP1998/001247 patent/WO1998041828A1/de active IP Right Grant
- 1998-03-05 DE DE59814433T patent/DE59814433D1/de not_active Expired - Lifetime
- 1998-03-05 CN CN98803219A patent/CN1104634C/zh not_active Expired - Lifetime
- 1998-03-05 AU AU68274/98A patent/AU6827498A/en not_active Abandoned
- 1998-03-05 EP EP98913649A patent/EP0966660B1/de not_active Expired - Lifetime
- 1998-03-05 AT AT98913649T patent/ATE266858T1/de not_active IP Right Cessation
- 1998-03-05 ES ES98913649T patent/ES2221162T3/es not_active Expired - Lifetime
- 1998-03-05 EP EP03009102A patent/EP1333259B1/de not_active Expired - Lifetime
- 1998-03-10 TW TW087103506A patent/TW384395B/zh not_active IP Right Cessation
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2000
- 2000-05-25 HK HK00103120A patent/HK1024053A1/xx not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100759013B1 (ko) | 2006-03-02 | 2007-09-17 | 주식회사 이노칩테크놀로지 | 비접촉식 적외선 온도 센서 및 이의 제조 방법 |
KR100769587B1 (ko) | 2006-04-25 | 2007-10-23 | 주식회사 이노칩테크놀로지 | 비접촉식 적외선 온도 센서 |
Also Published As
Publication number | Publication date |
---|---|
TW384395B (en) | 2000-03-11 |
EP0966660A1 (de) | 1999-12-29 |
EP1333259A1 (de) | 2003-08-06 |
ATE457447T1 (de) | 2010-02-15 |
EP1333259B1 (de) | 2010-02-10 |
DE19710946A1 (de) | 1998-09-24 |
KR20000076051A (ko) | 2000-12-26 |
CN1250519A (zh) | 2000-04-12 |
AU6827498A (en) | 1998-10-12 |
DE59811385D1 (de) | 2004-06-17 |
DE59814433D1 (de) | 2010-03-25 |
EP0966660B1 (de) | 2004-05-12 |
US6203194B1 (en) | 2001-03-20 |
CN1104634C (zh) | 2003-04-02 |
HK1024053A1 (en) | 2000-09-29 |
JP2001527644A (ja) | 2001-12-25 |
WO1998041828A1 (de) | 1998-09-24 |
ATE266858T1 (de) | 2004-05-15 |
ES2221162T3 (es) | 2004-12-16 |
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