KR100473777B1 - Preparation methods of resin compositions containing silver particles of nano size - Google Patents

Preparation methods of resin compositions containing silver particles of nano size Download PDF

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KR100473777B1
KR100473777B1 KR10-2001-0079073A KR20010079073A KR100473777B1 KR 100473777 B1 KR100473777 B1 KR 100473777B1 KR 20010079073 A KR20010079073 A KR 20010079073A KR 100473777 B1 KR100473777 B1 KR 100473777B1
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resin composition
acrylate
silver
methacrylate
silver particles
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KR10-2001-0079073A
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Korean (ko)
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KR20030049007A (en
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이호식
염태훈
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주식회사 트리코유니온
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/126—Polymer particles coated by polymer, e.g. core shell structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02—Making microcapsules or microballoons
    • B01J13/04—Making microcapsules or microballoons by physical processes, e.g. drying, spraying
    • B01J13/043—Drying and spraying
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/22—Emulsion polymerisation
    • C08F2/24—Emulsion polymerisation with the aid of emulsifying agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/12—Esters of monohydric alcohols or phenols
    • C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C08J2333/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters

Abstract

본 발명은 나노 크기의 은 입자를 함유하여 항균성, 대전 방지성, 전도성 등의 특성을 지니며 동시에 플라스틱 성형품, 도료, 잉크 등의 고분자 조성물에 상용성이 우수한 수지 조성물의 제조 방법에 관한 것으로, 나노미터 크기의 은 콜로이드 용액, 단량체, 유화제, 개시제 등을 혼합한 후 유화중합, 분산중합, 마이크로유화중합 등의 방법을 통하여 은 입자를 수지 조성물로 도포하여 주는 캡슐화 공정과 스프레이 건조, 응집 등의 방법을 통해 수지 조성물 분체를 얻는 분체화 공정으로 이루어진 것을 특징으로 한다.The present invention relates to a method for preparing a resin composition containing nano-sized silver particles having characteristics such as antimicrobial, antistatic and conductive properties and at the same time excellent in compatibility with polymer compositions such as plastic molded articles, paints and inks. Encapsulation process of spraying silver particles with resin composition through emulsion polymerization, dispersion polymerization, microemulsion polymerization, etc. after mixing metric silver colloid solution, monomer, emulsifier, initiator, etc. It is characterized by consisting of a powdering step of obtaining a resin composition powder through.

Description

나노 크기의 은 입자를 함유한 수지 조성물 및 그 제조 방법{Preparation methods of resin compositions containing silver particles of nano size}Preparation methods of resin compositions containing silver particles of nano size}

본 발명은 나노 크기의 은 입자를 함유한 수지 조성물 및 그 제조 방법에 관한 것으로, 보다 상세하게는 나노 크기의 은 입자를 함유하여 항균성, 대전 방지성, 전도성 등의 특성을 지니며 동시에 플라스틱 성형품, 도료, 잉크 등의 고분자 조성물에 상용성이 우수한 수지 조성물 및 그 제조 방법에 관한 것이다.The present invention relates to a resin composition containing nano-sized silver particles and a method of manufacturing the same, and more particularly, to nano-sized silver particles, having antimicrobial, antistatic and conductive properties, and at the same time plastic molded articles, The present invention relates to a resin composition excellent in compatibility with polymer compositions such as paints and inks and a method for producing the same.

은(銀)은 전도성, 항균성 등을 보유한 금속으로 오래 전부터 인류가 사용하고 있으나, 미세한 분말 형태로 얻는 것이 어렵기 때문에 실리카, 제오라이트 등의 다공성 물질에 담지하여 플라스틱 성형품, 도료, 잉크 등의 고분자 제품에 항균성 첨가제로 사용하여 왔다. 그러나, 이들 제품의 경우 고분자 수지와의 상용성, 투명성 등의 문제로 그 사용 범위 및 사용량이 제한되는 문제점을 가지고 있다.Silver is a metal that has conductivity and antimicrobial properties, but has been used by humans for a long time. However, since it is difficult to obtain in fine powder form, it is supported on porous materials such as silica and zeolite, and polymer products such as plastic molded products, paints and inks. It has been used as an antimicrobial additive. However, these products have a problem in that their use range and amount of use are limited due to compatibility with polymer resins, transparency, and the like.

은의 미립자화에 대한 연구는 오래 전부터 진행되어 산화환원 방법을 통해 수십 나노미터 크기의 은 콜로이드를 만드는 기술은 많이 알려져 있으나 이들 제품은 고분자 제품 또는 용제와의 상용성 문제로 인하여 수성 도료, 잉크 등으로 그 적용 범위가 제한되는 문제점이 있다. 또한 이들은 콜로이드로부터 은 분말을 제조하는 경우 수십 나노미터의 은 입자는 서로 응집하여 수 마이크로미터 이상의 입자로 성장하게 되므로 플라스틱 성형품, 도료, 잉크 등에 첨가제로 사용하는 경우 나노미터 크기로의 재 분산이 어려우며, 분산된 후 재 응집되는 등의 문제점이 있다.Since the research on silver granulation has been progressed for a long time, many techniques for producing silver colloids of several tens of nanometers through the redox method are known. There is a problem that the scope of application is limited. In addition, when they produce silver powder from colloids, tens of nanometers of silver particles agglomerate with each other and grow to particles of several micrometers or more. Therefore, when used as an additive in plastic moldings, paints, and ink, it is difficult to redistribute to nanometer size. , Dispersed and then reaggregated.

본 발명자들은 플라스틱 성형품, 도료, 잉크 등의 고분자 제품에 은 입자를 첨가하여 항균성, 대전 방지성, 전도성 등을 부여하기 위하여 예의 연구한 결과 은 콜로이드 입자에 대한 캡슐화을 통하여 고분자 제품에 대한 상용성이 우수하고 항균성, 대전 방지성 등이 우수한 나노 크기의 은 입자를 함유한 수지 조성물을 개발하게 되었다. The present inventors have studied diligently to impart antimicrobial, antistatic and conductivity by adding silver particles to polymer products such as plastic molded products, paints and inks, and have excellent compatibility with polymer products through encapsulation of silver colloidal particles. In addition, the present invention has developed a resin composition containing nano-sized silver particles having excellent antibacterial and antistatic properties.

따라서 본 발명의 목적은 폴리에틸렌, 폴리프로필렌, 폴리염화비닐, 폴리스티렌, ABS, PMMA, 폴리카보네이트, 폴리에스테르, 폴리우레탄, 폴리아미드 등의 고분자와 상용성이 우수하여, 동 플라스틱 성형품, 섬유, 도료, 잉크 등의 제품에 나노 크기의 은 입자를 분산시킴으로써 항균성, 대전 방지성, 전도성 등을 부여할 수 있는 수지조성물 및 그 제조 방법을 제공하는데 있다.Therefore, the object of the present invention is excellent compatibility with polymers such as polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS, PMMA, polycarbonate, polyester, polyurethane, polyamide, etc. The present invention provides a resin composition capable of imparting antimicrobial activity, antistatic property and conductivity by dispersing nano-sized silver particles in a product such as an ink, and a method of manufacturing the same.

상기의 본 발명의 목적은 나노 크기의 은 콜로이드 용액, 단량체, 유화제, 개시제 등을 혼합한 후 유화중합, 분산중합, 마이크로유화중합 등의 방법을 통하여 은 입자를 수지 조성물로 도포하여 주는 캡슐화 공정과 스프레이 건조, 응집 등의 방법을 통해 수지 조성물 분체를 얻는 분체화 공정으로 이루어지는 나노 크기의 은 입자를 함유하는 수지 조성물의 제조방법 및 그 제조방법에 의해 제조된 조성물에 의해 달성된다. The above object of the present invention is to encapsulate a nano-sized silver colloidal solution, a monomer, an emulsifier, an initiator, and the like, followed by an encapsulation process of applying the silver particles to the resin composition through emulsion polymerization, dispersion polymerization, microemulsion polymerization, and the like. It is achieved by the manufacturing method of the resin composition containing the nano size silver particle which consists of a powdering process which obtains a resin composition powder by the method of spray drying, agglomeration, etc., and the composition manufactured by the manufacturing method.

이하 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.

본 발명의 수지 조성물은 입자경이 수나노미터에서 수백나노미터 크기를 가지는 은입자을 내부에 함유하고 있는 적어도 하나 이상의 단량체로 구성된 수지 조성물이다.The resin composition of the present invention is a resin composition composed of at least one monomer containing silver particles having a particle diameter of several nanometers to several hundred nanometers therein.

본 발명을 통하여 얻어진 수지조성물의 단량체 조성은,The monomer composition of the resin composition obtained through the present invention,

1) 하나 이상의 탄소수 1~4의 아크릴레이트 또는 메타크릴레이트계 단량체 0~90wt%,1) 0-90 wt% of one or more acrylate or methacrylate monomers having 1 to 4 carbon atoms,

2) 하나 이상의 탄소수 5~20의 아크릴레이트 또는 메타크릴레이트계 단량체 0~50wt%, 2) 0-50 wt% of one or more acrylate or methacrylate monomers having 5 to 20 carbon atoms,

3) 하나 이상의 비닐계 단량체 0~90wt%3) 0 ~ 90wt% of one or more vinyl monomers

4) 하나 이상의 비닐에테르계단량체 0~90wt%4) 0 ~ 90wt% of one or more vinyl ether monomers

5) 2관능 이상의 가교제 0~20wt% 로 구성된다.5) 0-20 wt% bifunctional or higher crosslinking agent.

본 발명을 통하여 얻어진 수지조성물의 은 함유량은 0.01~90wt%, 수지조성물의 크기는 1~1,000 나노미터, 평균중합도는 100~100,000의 범위에서 용도에 따라 조절할 수 있다.Silver content of the resin composition obtained through the present invention is 0.01 ~ 90wt%, the size of the resin composition is 1 ~ 1,000 nanometers, the average degree of polymerization can be adjusted according to the use in the range of 100 ~ 100,000.

보다 바람직하게는, 은 함유량 0.1~50wt%, 수지조성물의 크기는 100~500 나노미터, 평균중합도는 1,000~50,000 이다.More preferably, the silver content is 0.1 to 50 wt%, the size of the resin composition is 100 to 500 nanometers, and the average degree of polymerization is 1,000 to 50,000.

본 발명을 통하여 얻어진 수지 조성물의 유리전이온도는 25℃~100℃의 범위로 조절하여 주는 것이 바람직하다. 25℃보다 낮은 경우에는 분체로 상온에서 취급하기 어려우며, 100℃ 이상인 경우에는 분체로 얻는 후 공정에서 어려움이 있다.It is preferable to adjust the glass transition temperature of the resin composition obtained through this invention in the range of 25 to 100 degreeC. When the temperature is lower than 25 ° C., it is difficult to handle the powder at room temperature, and when the temperature is 100 ° C. or higher, there is a difficulty in the process after obtaining the powder.

본 발명에 사용된 단량체에 대해 자세히 설명하면 다음과 같다.Hereinafter, the monomers used in the present invention will be described in detail.

탄소수 1~4의 아크릴레이트 또는 메타크릴레이트계 단량체로는 아크릴산, 메틸아크릴레이트, 에틸아크릴레일, 이소프로필아크릴레이트, 부틸아크릴레이트, 히드록시에틸아크릴레이트, 히드록시프로필아크릴레이트, 히드록시부틸아크릴레이트, 아미노에틸아크릴레이트, 아미노프로필아크릴레이트, 아미노부틸아크릴레이트, 메타크릴산, 메틸메타크릴레이트, 에틸메타크릴레일, 이소프로필메타크릴레이트, 부틸메타크릴레이트, 히드록시에틸메타크릴레이트, 히드록시프로필메타크릴레이트, 히드록시부틸메타크릴레이트, 아미노에틸메타크릴레이트, 아미노프로필메타크릴레이트, 아미노부틸메타크릴레이트 등을 사용할 수 있다.As the acrylate or methacrylate monomer having 1 to 4 carbon atoms, acrylic acid, methyl acrylate, ethyl acrylate, isopropyl acrylate, butyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxybutyl acryl Acrylate, aminoethyl acrylate, aminopropyl acrylate, aminobutyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, butyl methacrylate, hydroxyethyl methacrylate, hydrate Hydroxypropyl methacrylate, hydroxybutyl methacrylate, aminoethyl methacrylate, aminopropyl methacrylate, aminobutyl methacrylate and the like can be used.

탄소수 5~20의 아크릴레이트 또는 메타크릴레이트계 단량체로는 헥실아크릴레이트, 2-에틸헥실아크릴레이트, 옥틸아크릴레이트, 도데실아크릴레이트, 옥타데실아크릴레이트, 시클로헥실아크릴레이트, 이소보닐아크릴레이트, 페녹시에틸아크릴레이트, 폴리옥시에틸렌아크릴레이트, 헥실메타크릴레이트, 2-에틸헥실메타크릴레이트, 옥틸메타크릴레이트, 도데실메타크릴레이트, 옥타데실메타크릴레이트, 시클로헥실메타크릴레이트, 이소보닐메타크릴레이트, 페녹시에틸메타크릴레이트, 폴리옥시에틸렌아크릴레이트 등을 사용할 수 있다.Examples of the acrylate or methacrylate monomer having 5 to 20 carbon atoms include hexyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, dodecyl acrylate, octadecyl acrylate, cyclohexyl acrylate, isobornyl acrylate, Phenoxyethyl acrylate, polyoxyethylene acrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, cyclohexyl methacrylate, isobonyl Methacrylate, phenoxyethyl methacrylate, polyoxyethylene acrylate and the like can be used.

비닐계 단량체로는 염화비닐, 이염화비닐, 비닐아세테이트, 스티렌, 알파메틸스티렌, 에틸렌, 프로필렌, 부틸렌, 부타디엔, 아크릴로니트릴 등을 사용할 수 있다.Vinyl chloride, vinyl dichloride, vinyl acetate, styrene, alpha methyl styrene, ethylene, propylene, butylene, butadiene, acrylonitrile and the like can be used as the vinyl monomer.

비닐에테르계 단량체로는 메틸비닐에테르, 에틸비닐에테르, 이소프로필비닐에테르, 부틸비닐에테르, 2-에틸헥실비닐에테르, 시클로헥실비닐에테르, 도데실비닐에테를, 옥타데실비닐에테르, 히드록시에틸비닐에테르, 히드록시프로필비닐에테르, 히드록시부틸비닐에테르 등을 사용할 수 있다.As the vinyl ether monomer, methyl vinyl ether, ethyl vinyl ether, isopropyl vinyl ether, butyl vinyl ether, 2-ethylhexyl vinyl ether, cyclohexyl vinyl ether, dodecyl vinyl ether, octadecyl vinyl ether, hydroxyethyl Vinyl ether, hydroxypropyl vinyl ether, hydroxybutyl vinyl ether, etc. can be used.

또한, 필요에 따라 가교제로서 2관능성의 에틸렌글리콜디아크릴레이트, 디에틸렌글리콜디아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 폴리에틸렌글리콜디아크릴레이트, 1,4-부탄디올디아크릴레이트, 1,6-헥산디올디아크릴레이트, 네오펜틸글리콜디아크릴레이트, 에틸렌글리콜디메타크릴레이트, 디에틸렌글리콜디메타크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 폴리에틸렌글리콜디메타크릴레이트, 1,4-부탄디올디메타크릴레이트, 1,6-헥산디올디메타크릴레이트, 네오펜틸글리콜디메타크릴레이트, 디비닐벤젠, 알릴메타크릴레이트, 3관능성의 트리메틸롤프로판트리아크릴레이트, 에톡실레이티드 트리메틸롤프로판트리아크릴레이트, 펜타에리트리톨트리아크릴레이트, 트리메틸롤프로판트리메타크릴레이트, 엑톡실레이티드 트리메틸롤프로판트리메타크릴레이트, 펜타에리트리톨트리메타크릴레이트 등을 사용할 수 있다.Moreover, as needed, as a crosslinking agent, bifunctional ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, 1, 4- butanediol diacrylate, 1, 6-hexane Diol diacrylate, neopentyl glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, 1,4-butanediol dimethacryl Rate, 1,6-hexanediol dimethacrylate, neopentylglycol dimethacrylate, divinylbenzene, allyl methacrylate, trifunctional trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate , Pentaerythritol triacrylate, trimethylolpropane trimethacrylate, ethoxylated trimethylolph Ropantrimethacrylate, pentaerythritol trimethacrylate, etc. can be used.

발명의 수지 조성물의 제조 공정은 캡슐화 공정과 분체화 공정으로 이루어진다. The manufacturing process of the resin composition of this invention consists of an encapsulation process and a powdering process.

캡슐화 공정에서는 은 콜로이드 용액과 상기의 단량체 혼합물, 개시제, 유화제, 이온교환수를 혼합한 후 유화중합, 현탁중합, 마이크로유화중합 등의 방법을 통하여 은 입자를 수지 조성물로 도포하여 준다.In the encapsulation process, the silver colloidal solution is mixed with the monomer mixture, initiator, emulsifier, and ion-exchanged water, and then silver particles are applied to the resin composition through emulsion polymerization, suspension polymerization, and microemulsion polymerization.

캡슐화 공정을 보다 상세히 설명하면 다음과 같다.The encapsulation process will be described in more detail as follows.

1) 이온교환수와 계면활성제를 반응조에 넣고, 교반하면서 서서히 은 콜로이드 용액을 넣어준 후 콜로이드를 안정화시켜 준다. 1) Add ion-exchanged water and surfactant to the reaction tank and slowly add silver colloid solution while stirring to stabilize the colloid.

이 때, 은 콜로이드 용액 중의 은 입자의 크기는 1~100나노미터의 범위이며, 용액 중의 은 농도는 1~90%의 범위인 것을 사용하며, 유화제로는 음이온계 또는 비이온계의 계면활성제를 단독 또는 혼합하여 사용한다.At this time, the size of the silver particles in the silver colloidal solution is in the range of 1 to 100 nanometers, and the silver concentration in the solution is in the range of 1 to 90%, and an emulsifier may be anionic or nonionic surfactant. Used alone or in combination.

2) 중합 방법에 따라, 예를 들어 하기에 기재한 i) 내지 iv)의 여러 가지 방법으로, 단량체 혼합물과 개시제를 첨가하여 중합반응을 진행한다.2) Depending on the polymerization method, for example, the polymerization reaction is carried out by adding the monomer mixture and the initiator by various methods of i) to iv) described below.

i) 단량체 혼합물을 상기 1)의 반응조에 넣고 교반하여 안정한 에멀젼을 만들어 준다. 서서히 교반하면서 적정 온도까지 승온하여 준 후 개시제를 넣고 중합반응을 진행한다.i) The monomer mixture is put into the reactor of 1) and stirred to form a stable emulsion. The temperature is raised to the appropriate temperature while gradually stirring, and then the initiator is added to proceed with the polymerization reaction.

ii) 단량체 혼합물 중 일부를 상기 1)의 반응조에 넣고 교반하여 안정한 에멀젼을 만들어 준다. 서서히 교반하면서 적정 온도까지 승온하여 준 후 개시제를 넣고 중합반응을 시작한다. 나머지 단량체를 연속적 또는 단속적으로 투입하며 중합반응을 진행한다.ii) A portion of the monomer mixture is added to the reaction tank of 1) and stirred to form a stable emulsion. After slowly stirring, the temperature was raised to an appropriate temperature, and an initiator was added to start the polymerization reaction. The remaining monomer is added continuously or intermittently to proceed with the polymerization reaction.

iii) 상기 1)의 반응조에 개시제를 넣고 서서히 교반하면서 적정온도까지 승온하여 준다. 일정 온도에 도달하면 단량체 혼합물은 연속적 또는 단속적으로 서서히 투입하며 중합반응을 진행한다. iii) The initiator is added to the reaction tank of 1), and the temperature is raised to a proper temperature while gradually stirring. When a certain temperature is reached, the monomer mixture is slowly or continuously injected into the polymerization reaction.

iv) 단량체와 개시제를 혼합한 후 상기 1)의 반응조에 넣고 교반하여 안정한 에멀젼을 만들어 준다. 서서히 교반하면서 적정 온도까지 승온한 후 온도를 유지시키면서 중합반응을 진행한다.iv) After mixing the monomer and the initiator, it is put in the reactor of 1) and stirred to form a stable emulsion. After the temperature was raised to a proper temperature while stirring gradually, the polymerization reaction was carried out while maintaining the temperature.

본 발명에 사용하는 유화제로는 음이온계 또는 비이온계 유화제를 단독 또는 혼합하여 사용하여 준다.As an emulsifier used in the present invention, an anionic or nonionic emulsifier is used alone or in combination.

음이온계 유화제로는 도데실벤젠술폰산의 나트륨(칼륨, 암모늄)염, 도데실황산의 나트륨(칼륨, 암모늄)염, 올레일황산의 나트륨(칼륨, 암모늄)염, 도데실술포숙신산의 나트륨(칼륨, 암모늄)염, 도데실에테르황산의 나트륨(칼륨, 암모늄)염, 알파올레핀술폰산의 나트륨(칼륨, 암모늄)염 등을 사용할 수 있다.Anionic emulsifiers include sodium (potassium and ammonium) salts of dodecylbenzenesulfonic acid, sodium (potassium and ammonium) salts of dodecyl sulfate, sodium (potassium and ammonium) salts of oleyl sulfate, and sodium (potassium of dodecylsulfosuccinic acid). , Ammonium) salt, sodium (potassium, ammonium) salt of dodecyl ether sulfate, sodium (potassium, ammonium) salt of alpha olefin sulfonic acid and the like can be used.

비이온계 유화제로는 솔비탄모노라우레이트, 솔비탄모노팔미테이트, 솔비탄모노올레이트, 솔비탄모노스테아레이트, 폴리옥시에틸렌 솔비탄모노라우레이트, 폴리옥시에틸렌 솔비탄모노팔미테이트, 폴리옥시에틸렌 솔비탄모노올레이트, 폴리옥시에틸렌 솔비탄모노스테아레이트, 글리세롤 모노라우레이트, 글리세롤 모노팔미테이트, 글리세롤 모노올레이트, 글리세롤 모노스테아레이트, 폴리옥시에틸렌 옥틸페닐에테르, 폴리옥시에틸렌 노닐페닐에테르 등을 사용할 수 있다.Nonionic emulsifiers include sorbitan monolaurate, sorbitan monopalmitate, sorbitan monooleate, sorbitan monostearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxy Ethylene sorbitan monooleate, polyoxyethylene sorbitan monostearate, glycerol monolaurate, glycerol monopalmitate, glycerol monooleate, glycerol monostearate, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, etc. Can be used.

개시제는 반감기가 10시간이 되는 온도가 30~80℃범위인 것을 사용할 수 있다.The initiator may use a temperature in which the half-life of 10 hours is 30 ~ 80 ℃ range.

본 발명에서의 개시제로는 이소부티릴퍼옥시드, 큐밀퍼옥시네오데카노에이트, 디이소프로필퍼옥시디카르보네이트, 디알릴퍼옥시디카르보네이트, 디프로필퍼옥시디카르보네이트, 디미리스틸퍼옥시디카르보네이트, 큐밀퍼옥시네오헥사노에이트, 디(2-에톡시에틸)퍼옥시디카르보네이트, 디(메톡시이소프로필)퍼옥시디카르보네이트, 디(2-에틸헥실)퍼옥시디카르보네이트, t-헥실퍼옥시네오헥사노에이트, 디(3-메톡시-3메톡시부틸)퍼옥시디카르보네이트, t-부틸퍼옥시네오데카노에이트, t-헥실퍼옥시네오헥사노에이트, t-부틸퍼옥시네오헥사노에이트, 2,4-디클로로벤조일퍼옥시드, t-헥실퍼옥시피발레이트, t-부틸퍼옥시피발레이트, 3,5,5-트리메틸엑사노일퍼옥시드, 라우로일퍼옥시드, 큐밀퍼옥시옥토에이트, 숙신산퍼옥시드, t-부틸퍼옥시 2-에틸헥사노에이트, m-톨루오일퍼옥시드, t-부틸퍼옥시 2-에틸헥사노에이트, 아세틸퍼옥시드, 벤조일퍼옥시드, t-부틸퍼옥시이소부티레이트 등의 유기과산화물계 개시제를 사용할 수 있다. As an initiator in this invention, isobutyryl peroxide, cumyl peroxy neodecanoate, diisopropyl peroxy dicarbonate, diallyl peroxy dicarbonate, dipropyl peroxy dicarbonate, dimyristylper Oxydicarbonate, cumylperoxy neohexanoate, di (2-ethoxyethyl) peroxydicarbonate, di (methoxyisopropyl) peroxydicarbonate, di (2-ethylhexyl) peroxydica Carbonate, t-hexyl peroxy neohexanoate, di (3-methoxy-3methoxybutyl) peroxydicarbonate, t-butyl peroxy neodecanoate, t-hexyl peroxy neohexanoate , t-butylperoxy neohexanoate, 2,4-dichlorobenzoyl peroxide, t-hexyl peroxy pivalate, t-butyl peroxy pivalate, 3,5,5-trimethylexanoyl peroxide, lau Loylperoxide, cumylperoxyoctoate, persuccinate, t-butylperoxy 2-ethylhexano Byte, it is possible to use m- toluoyl peroxide, t- butyl peroxy-2-ethylhexanoate, acetyl peroxide, benzoyl peroxide, t- butyl peroxy isopropyl butyrate-based initiators such as organic peroxides.

유기과산화물계 이외에도 아조비스이소부티로니트릴, 아조비스 2-메틸부티로니트릴 등 아조니트릴계 개시제, 암모늄(또는 나트륨, 칼륨)퍼설페이트/나트륨 바이설페이트 로 이루어진 산화-환원계 개시제 등을 사용할 수 있다.In addition to the organic peroxide system, azonitrile initiators such as azobisisobutyronitrile and azobis 2-methylbutyronitrile, redox initiators including ammonium (or sodium and potassium) persulfate / sodium bisulfate, and the like can be used. .

분체화 공정은 상기의 캡슐화 공정을 통해 얻어진 수지 조성물 라텍스로부터 수지 조성물 분체를 얻는 공정으로 스프레이 건조 또는 응집 공정이 있다.The powdering step is a step of obtaining a resin composition powder from the resin composition latex obtained through the above encapsulation step, and there is a spray drying or agglomeration step.

스프레이 건조는 노즐은 통해 분사된 라텍스 입자의 수분을 열풍으로 건조함으로써 수지 분말을 얻는 방법이다. 노즐의 크기, 열풍 온도, 라텍스 분사 속도 등을 통해 수지 조성물 분체의 크기를 조절할 수 있다.Spray drying is a method of obtaining resin powder by drying the moisture of the latex particle sprayed through the nozzle with hot air. The size of the resin composition powder can be adjusted through the size of the nozzle, hot air temperature, latex spray rate, and the like.

응집 공정은 1) 수지 조성물 라텍스에 응집제 용액을 첨가하거나, 또는 응집제 용액에 수지조성물 라텍스를 첨가하여 라텍스의 안정성을 깨어줌으로써 수지 조성물 응집체를 얻는 응집공정, 2) 응집된 수지 조성물과 물을 분리하여 주는 탈수 공정, 3) 수지 조성물 응집체의 수용성 불순물을 제거하여 주는 세척 공정, 및 4) 수지 조성물 응집체의 수분을 제거하는 건조 공정으로 구성된다.The coagulation process is performed by 1) adding a coagulant solution to the resin composition latex, or adding a resin composition latex to the coagulant solution to break the stability of the latex to obtain a resin composition aggregate, and 2) separating the agglomerated resin composition and water. The liquor comprises a dehydration step, a washing step for removing water-soluble impurities in the resin composition aggregate, and a drying step for removing water in the resin composition aggregate.

응집 공정에 사용되는 응집제로는 1가, 2가, 3가의 무기산 또는 그의 염, 1가, 2가, 3가의 유기산 또는 그의 염이 사용될 수 있으며, 응집제의 종류에 따라 응집 임계 농도 이상의 양을 사용하여야 한다. 응집 공정은 수지 조성물의 연화점 부근에서 진행하며 응집 온도와 응집제 농도, 첨가 속도 등을 조절함으로써 얻어진 수지조성물 응집체의 크기를 조절할 수 있다.As the flocculant used in the flocculation process, monovalent, divalent, trivalent inorganic acids or salts thereof, monovalent, divalent, trivalent organic acids or salts thereof may be used, and an amount of more than a critical threshold concentration may be used depending on the type of flocculant. shall. The aggregation process proceeds in the vicinity of the softening point of the resin composition and can adjust the size of the resin composition aggregate obtained by adjusting the aggregation temperature, the flocculant concentration, the addition rate, and the like.

상기의 방법으로 제조된 수지 조성물은 그 내부에 수~수백 나노미터 크기의 은 입자를 함유하고 있으며, 폴리에틸렌, 폴리프로필렌, 폴리염화비닐, 폴리스티렌, ABS, PMMA, 폴리카보네이트, 폴리에스테르, 폴리우레탄, 폴리아미드 등의 고분자와 상용성이 우수하여, 동 플라스틱 성형품, 섬유, 도료, 잉크 등의 제품에 나노 크기의 은 입자를 분산시킴으로써 항균성, 대전방지성, 전도성 등을 부여할 수 있다.The resin composition prepared by the above method contains silver particles of several hundreds to several hundred nanometers in size, and includes polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS, PMMA, polycarbonate, polyester, polyurethane, It is excellent in compatibility with polymers such as polyamide, and antimicrobial properties, antistatic properties, conductivity and the like can be imparted by dispersing nano-sized silver particles in products such as plastic molded articles, fibers, paints, and inks.

이하 본 발명의 실시예 및 비교예를 통하여 본 발명을 보다 상세히 설명하지만, 하기의 예에 본 발명의 범주가 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the scope of the present invention is not limited to the following Examples.

[실시예 1]Example 1

은 입자의 크기가 50나노미터, 은 함유량이 5wt%인 은 콜로이드 용액 80중량부, 이온교환수 600중량부, 도데실황산나트륨 0.5중량부를 반응기에 넣고 교반하였다. 콜로이드가 안정화된 후 반응기 온도가 40℃에 도달하면 부틸아크릴레이트 40중량부, 메틸메타크릴레이트 34중량부, 1,6-헥산디올디아크릴레이트 2중량부를 주입하여 충분시 교반시켜 단량체를 유화시켰다.80 parts by weight of silver colloidal solution having a particle size of 50 nanometers and a content of 5 wt% of silver, 600 parts by weight of ion-exchanged water, and 0.5 parts by weight of sodium dodecyl sulfate were put into a reactor and stirred. After the colloid was stabilized, when the reactor temperature reached 40 ° C., 40 parts by weight of butyl acrylate, 34 parts by weight of methyl methacrylate, and 2 parts by weight of 1,6-hexanediol diacrylate were injected and stirred to sufficiently emulsify the monomer. .

반응기의 온도를 80℃로 승온한 후 이온교환수 50중량부에 칼륨퍼설페이트 0.3중량부를 녹인 용액을 투입하여 반응을 시작하여 미반응 단량체가 없어지는 3시간 후에 반응을 종결하고 서서히 냉각하였다.After the temperature of the reactor was raised to 80 ° C., a solution of 0.3 parts by weight of potassium persulfate was added to 50 parts by weight of ion-exchanged water to start the reaction. The reaction was terminated 3 hours after the unreacted monomer disappeared and gradually cooled.

염화칼슘 수용액을 응집제로 사용하여 50℃에서 상기의 라텍스 입자를 응집한 후 상온에서 탈수, 건조하여 은 함유량 5wt%인 분말형태의 수지 조성물을 얻었다.The latex particles were aggregated at 50 ° C. using an aqueous calcium chloride solution as a flocculant, followed by dehydration and drying at room temperature to obtain a resin composition in powder form having a silver content of 5 wt%.

이상과 같이 제조한 수지 조성물은 메틸에틸케톤, 아세톤 등의 유기 용제에 가용성이며, 디옥틸프탈레이트와 같은 가소제에도 상용성이우수한 것을 확인하였다.It was confirmed that the resin composition prepared as described above was soluble in organic solvents such as methyl ethyl ketone and acetone, and was compatible with a plasticizer such as dioctyl phthalate.

[실시예 2]Example 2

은입자의 크기가 10나노미터, 은함유량이 5wt%인 은 콜로이드 용액 160중량부, 이온교환수 500중량부, 도데실벤젠술폰산나트륨 0.6중량부, 칼륨퍼설페이트 0.3중량부를 반응기에 넣고 교반하여 준다. 반응조 내부를 질소로 치환하여 준 후 반응기 내부 온도가 40℃에 도달하면 메틸메타크릴레이트 5중량부, 스티렌 5중량부를 주입한 후 충분히 교반시켜 단량체를 유화시킨 다음 나트륨피로설페이트 0.03중량부를 주입하여 1시간동안 중합을 진행하였다.The silver particles are 10 nanometer in size, 160 parts by weight of a silver colloidal solution containing 5 wt% silver, 500 parts by weight of ion-exchanged water, 0.6 parts by weight of sodium dodecylbenzenesulfonate, and 0.3 parts by weight of potassium persulfate are added to the reactor and stirred. . After replacing the inside of the reactor with nitrogen, when the temperature inside the reactor reached 40 ° C, 5 parts by weight of methyl methacrylate and 5 parts by weight of styrene were injected, and the mixture was sufficiently stirred to emulsify the monomer, and then 0.03 parts by weight of sodium pyrosulfate was injected. The polymerization proceeded for a time.

메틸메타크릴레이트 21중량부, 스티렌 21중량부, 도데실아크릴레이트 20중량부를 혼합하여 반응기 내에 연속적으로 서서히 주입하며 반응을 진행하였다.21 parts by weight of methyl methacrylate, 21 parts by weight of styrene, and 20 parts by weight of dodecyl acrylate were mixed and slowly injected into the reactor to proceed with the reaction.

단량체가 모두 주입된 후 반응기 내부 온도를 80℃로 승온하여 미반응 단량체의 반응을 완결시킨 후 서서히 냉각하였다. After all the monomers were injected, the temperature inside the reactor was raised to 80 ° C. to complete the reaction of the unreacted monomers, and then gradually cooled.

황산마그네슘 수용액을 응집제로 사용하여 60℃에서 상기의 라텍스 입자를 응집한 후 상온에서 탈수, 건조하여 은 함유량 10wt%인 분말형태의 수지 조성물을 얻었다.Magnesium sulfate aqueous solution was used as a flocculant to agglomerate the latex particles at 60 ° C., and then dehydrated and dried at room temperature to obtain a resin composition in powder form having a silver content of 10 wt%.

이상과 같이 제조한 수지 조성물은 메틸에틸케톤, 아세톤, 톨루엔 등의 유기 용제에 가용성이며, 디옥틸프탈레이트와 같은 가소제에도 상용성이 우수한 것을 확인하였다.It was confirmed that the resin composition prepared as described above was soluble in organic solvents such as methyl ethyl ketone, acetone, toluene, and also excellent in compatibility with a plasticizer such as dioctylphthalate.

[실시예 3]Example 3

은입자의 크기가 10나노미터, 은함유량이 5wt%인 은 콜로이드 용액 320중량부, 이온교환수 340중량부, 도데실황산나트륨 0.5중량부를 반응기에 넣고 교반하였다. 콜로이드가 안정화된 후 부틸메타크릴레이트 20중량부, 메틸메타크릴레이트 20중량부, 스티렌 24중량부, 아조비스이소부티로니트릴 0.2중량부를 반응기에 넣고 교반하여 단량체를 유화시켰다. 반응기의 온도를 80℃까지 서서히 승온하면서 반응을 시작하여 미반응 단량체가 없어질 때까지 80℃를 유지한 후 반응을 종결하고 서서히 냉각하였다.A silver nanoparticle size of 10 nanometers, silver content of 5 wt%, 320 parts by weight of silver colloidal solution, 340 parts by weight of ion-exchanged water, 0.5 parts by weight of sodium dodecyl sulfate were put into the reactor and stirred. After the colloid was stabilized, 20 parts by weight of butyl methacrylate, 20 parts by weight of methyl methacrylate, 24 parts by weight of styrene, and 0.2 parts by weight of azobisisobutyronitrile were added to the reactor and stirred to emulsify the monomer. The reaction was started while gradually raising the temperature of the reactor to 80 ° C. and maintained at 80 ° C. until the unreacted monomer disappeared, and then the reaction was terminated and cooled slowly.

황산알루미늄 수용액을 응집제로 사용하여 50℃에서 상기의 라텍스 입자를 응집한 후 상온에서 탈수, 건조하여 은 함유량 20wt%인 분말형태의 수지 조성물을 얻었다.An aqueous solution of aluminum sulfate was used to aggregate the latex particles at 50 ° C., followed by dehydration and drying at room temperature to obtain a resin composition in powder form having a silver content of 20 wt%.

이상과 같이 제조한 수지 조성물은 메틸에틸케톤, 아세톤 등의 유기 용제에 가용성이며, 디옥틸프탈레이트와 같은 가소제에도 상용성이우수한 것을 확인하였다.It was confirmed that the resin composition prepared as described above was soluble in organic solvents such as methyl ethyl ketone and acetone, and was compatible with a plasticizer such as dioctyl phthalate.

[실험예 1]Experimental Example 1

실시예 1에서 제조한 분말을 메틸에틸케톤에 용해한 후 은 함유량이 2,000ppm이 되도록 2액형 우레탄 도료에 첨가하여 도막두께 20㎛으로 도장한 PET 필름을 제조하였다. 암갈색을 띠는 투명성이 우수한 필름을 얻을 수 있었다.After dissolving the powder prepared in Example 1 in methyl ethyl ketone, a PET film coated with a 20-μm thick film was added to a two-component urethane paint so that the silver content was 2,000 ppm. The film excellent in dark brown transparency was obtained.

항균성의 측정방법은 필름밀착법을 이용하였으며, 35±1℃, RH90%에서 24시간 방치후 세균수의 변화를 표준 필름과 비교하였다. 표준 필름은 STOMACHER 400 POLY-BAG을 사용하였으며, 시편의 크기는 25㎠로 하였다. 측정 세균은 대장균(Escherichia coli)와 스타필로코커스 아우레우스(Staphylococcus aureus)를 사용하였다.The antimicrobial activity was measured using film adhesion method. Changes in bacterial count after 24 hours at 35 ± 1 ° C and RH90% were compared with standard films. STOMACHER 400 POLY-BAG was used as the standard film, and the size of the specimen was 25 cm 2. The bacteria used were Escherichia coli and Staphylococcus aureus.

세균감소율은 표준필름 대비 시료의 균수로 측정하였으며, E. coli의 경우 99%, S. aureus의 경우 98%의 결과를 얻었다.The bacterial reduction rate was measured by the number of bacteria in the sample compared to the standard film. The results were 99% for E. coli and 98% for S. aureus.

[실험예 2]Experimental Example 2

실시예 2에서 제조한 분말은 폴리카르보네이트 수지와 혼합하여 은 함유량이 100ppm이 되도록 조절한 후 유아용 젖병을 성형하였다. The powder prepared in Example 2 was mixed with a polycarbonate resin, adjusted to have a silver content of 100 ppm, and a baby bottle was molded.

항균성의 측정방법은 젖병 내에 멸균생리식염수 200ml를 넣은 후 상온에서 세균수의 증감을 5시간후에 측정하여, 일반 유리비이커의 결과와 비교하였으며, 측정 세균은 대장균(Escherichia coli)와 스타필로코커스 아우레우스(Staphylococcus aureus)를 사용하였다.Antimicrobial activity was measured by adding 200ml of sterile physiological saline solution into the bottle and measuring the increase and decrease of the bacterial count at room temperature after 5 hours, and comparing it with the results of the general glass beaker. The measured bacteria were Escherichia coli and Staphylococcus aurea. Wood (Staphylococcus aureus) was used.

세균 감소율을 대비 균수에 대한 시료의 균수로 측정하였으며, E. coli의 경우 50%, S. aureus의 경우 67%의 결과를 얻었다.The bacterial reduction rate was determined by the number of bacteria in the sample against the number of bacteria, and 50% for E. coli and 67% for S. aureus.

[실험예 3]Experimental Example 3

실시예 3에서 제조한 분말을 헥산디올디아크릴레이트에 용해하여 은 함유량이 5,000ppm이 되도록 상재용 자외선 경화도료를 제조하였다. 마루 바닥에 도막두께 20㎛으로 도장한 결과 투명성이 우수한 보호 코팅을 얻을 수 있었다.The powder prepared in Example 3 was dissolved in hexanediol diacrylate to prepare a UV curing paint for commercial use so that the silver content was 5,000 ppm. As a result of coating the coating floor with a film thickness of 20 µm, a protective coating having excellent transparency was obtained.

항균성의 측정방법은 필름밀착법을 이용하였으며, 35±1℃, RH90%에서 24시간 방치후 세균수의 변화를 표준 필름과 비교하였다. 표준 필름은 STOMACHER 400 POLY-BAG을 사용하였으며, 시편의 크기는 25㎠로 하였다. 측정 세균은 대장균(Escherichia coli)와 스타필로코커스 아우레우스(Staphylococcus aureus)를 사용하였다.The antimicrobial activity was measured using film adhesion method. Changes in bacterial count after 24 hours at 35 ± 1 ° C and RH90% were compared with standard films. STOMACHER 400 POLY-BAG was used as the standard film, and the size of the specimen was 25 cm 2. The bacteria used were Escherichia coli and Staphylococcus aureus.

세균감소율은 표준필름 대비 시료의 균수로 측정하였으며, E. coli의 경우 99.9%, S. aureus의 경우 99.9%의 결과를 얻었다.The bacterial reduction rate was measured by the number of bacteria in the sample compared to the standard film. The results were 99.9% for E. coli and 99.9% for S. aureus.

또한 제품의 표면 저항을 측정한 결과 4X1010Ω으로 대전 방지성이 우수한 제품임을 확인할 수 있었다.In addition, as a result of measuring the surface resistance of the product was confirmed that the product excellent in antistatic properties with 4X10 10 Ω.

상기 본 발명의 실시예 및 실험예에서 알 수 있는 바와 같이, 본 발명의 은 입자를 캡슐 상태로 함유한 수지 조성물은 다른 고분자 조성물에 상용성이 우수하며, 은 입자를 함유하여 항균성, 대전방지성, 전도성 등의 특성을 지닌다. As can be seen in the Examples and Experimental Examples of the present invention, the resin composition containing the silver particles of the present invention in a capsule state has excellent compatibility with other polymer compositions, and contains silver particles to have antibacterial and antistatic properties. , Conductivity and the like.

Claims (15)

a) 은 콜로이드 용액 80-320 중량부;a) 80-320 parts by weight of the silver colloidal solution; 하나 또는 둘 이상의 탄소수 1~4의 아크릴레이트, 메타크릴레이트계 또는 비닐계 단량체 1~90wt%,   1 to 90 wt% of one or more acrylate, methacrylate or vinyl monomers having 1 to 4 carbon atoms, 하나 또는 둘 이상의 탄소수 5~20의 아크릴레이트 또는 메타크릴레이트계 단량체 1~50wt%, 1 to 50 wt% of one or two or more acrylate or methacrylate monomers having 5 to 20 carbon atoms, 관능기 둘 이상을 갖는 가교제 1~20wt%로 구성된 단량체 조성물 50-100중량부;  50-100 parts by weight of a monomer composition composed of 1 to 20 wt% of a crosslinking agent having two or more functional groups; 개시제 0.03 내지 2 중량부; 유화제 0.5-1.0 중량부; 및 이온교환수 340-600 중량부를 혼합한 후 유화중합, 현탁중합, 또는 마이크로유화중합으로 은 입자를 수지 조성물로 도포하여 주는 캡슐화 공정과  0.03 to 2 parts by weight of initiator; 0.5-1.0 parts by weight of emulsifier; And 340-600 parts by weight of ion-exchanged water and then encapsulating the silver particles with the resin composition by emulsion polymerization, suspension polymerization or microemulsion polymerization. b) 상기 캡슐화된 수지조성물을 스프레이 건조 또는 응집을 통해 수지 조성물 분체를 얻는 분체화 공정으로 이루어지는 것을 특징으로 하는 은 입자를 함유하는 아크릴계 및/또는 비닐계 수지조성물의 제조방법. b) a powdering step of obtaining the resin composition powder by spray drying or agglomeration of the encapsulated resin composition; and a method for producing an acrylic and / or vinyl resin composition containing silver particles. 제 1 항에 있어서, 상기 수지조성물의 평균 중합도는 100~100,000인 것을 특징으로 하는 제조방법. The method of claim 1, wherein the average degree of polymerization of the resin composition is 100 to 100,000. 삭제delete 제 1 항에 있어서, 상기 은 콜로이드 용액 중의 은 입자의 크기는 1~100나노미터의 크기이며, 용액 중의 은 농도는 1~90%의 범위인 것을 특징으로 하는 제조방법.         The method according to claim 1, wherein the silver particles in the silver colloidal solution have a size of 1 to 100 nanometers, and the silver concentration in the solution is in the range of 1 to 90%. 제 1 항에 있어서, 상기 유화제는 음이온계 또는 비이온계의 계면활성제인 것을 특징으로 하는 제조방법.The method of claim 1, wherein the emulsifier is an anionic or nonionic surfactant. 제 1 항에 있어서, 상기 개시제는 유기과산화물계 개시제인 것을 특징으로 하는 제조방법.The method of claim 1, wherein the initiator is an organic peroxide-based initiator. 제 1 항에 있어서, 캡슐화 공정이 이온교환수와 계면활성제를 반응조에 넣고, 교반하면서 서서히 은 콜로이드 용액을 넣어준 후 콜로이드를 안정화시켜 준 뒤 단량체 혼합물과 개시제를 첨가하여 중합반응을 진행하는 공정인 것을 특징으로 하는 제조방법.The method of claim 1, wherein the encapsulation is a process in which ion-exchanged water and a surfactant are put in a reaction tank, a silver colloid solution is gradually added while stirring, and the colloid is stabilized, and then a polymerization reaction is performed by adding a monomer mixture and an initiator. Manufacturing method characterized in that. 제 1 항에 있어서, 분체화 공정이 스프레이건조 공정인 것을 특징으로 하는 제조방법.The method according to claim 1, wherein the powdering step is a spray drying step. 제 1 항에 있어서, 분체화 공정이 a) 수지 조성물 라텍스에 응집제 용액을 첨가하거나, 또는 응집제 용액에 수지조성물 라텍스를 첨가하여 라텍스의 안정성을 깨어줌으로써 수지 조성물 응집체를 얻는 응집공정, b) 응집된 수지 조성물과 물을 분리하여 주는 탈수 공정, c) 수지 조성물 응집체의 수용성 불순물을 제거하여 주는 세척 공정 및 d) 수지 조성물 응집체의 수분을 제거하는 건조 공정으로 구성된 것을 특징으로 하는 제조 방법.The agglomeration process according to claim 1, wherein the powdering step is performed by a) adding a coagulant solution to the resin composition latex or adding a resin composition latex to the coagulant solution to break the stability of the latex, and b) agglomerated. A dehydration step of separating the resin composition and water, c) a washing step of removing water-soluble impurities of the resin composition aggregate, and d) a drying step of removing moisture of the resin composition aggregate. 제 9 항에 있어서, 상기 응집제는 무기산, 유기산 또는 그 염인 것을 특징으로 하는 제조 방법.The method according to claim 9, wherein the flocculant is an inorganic acid, an organic acid or a salt thereof. 제 1 항의 방법에 의해 제조된 은 입자를 함유하는 수지 조성물.The resin composition containing silver particle manufactured by the method of Claim 1. 제 11 항에 있어서, 상기 은 입자의 크기가 1~500나노미터, 은 함유량이 0.01~90wt%인 것을 특징으로 하는 수지 조성물.The resin composition according to claim 11, wherein the silver particles have a size of 1 to 500 nanometers and a silver content of 0.01 to 90 wt%. 제 11 항 또는 제 12 항에 있어서, 은 입자의 크기가 10~200 나노미터, 은 함유량이 0.1~50wt%인 것을 특징으로 하는 수지 조성물.The resin composition according to claim 11 or 12, wherein the silver particles have a size of 10 to 200 nanometers and a silver content of 0.1 to 50 wt%. 제 1 항에 있어서, 상기 탄소수 1~4의 아크릴레이트, 메타크릴레이트계 또는 비닐계 단량체는 메틸아크릴레이트, 메틸메타크릴레이트, 에틸아크릴레이트, 이소프로필아아크릴레이트, 부틸아크릴레이트. 스티렌, 아크릴로니트릴, 염화비닐, 부타디엔 중의 적어도 하나인 것을 특징으로 하는 제조 방법.According to claim 1, wherein the acrylate, methacrylate or vinyl monomer having 1 to 4 carbon atoms are methyl acrylate, methyl methacrylate, ethyl acrylate, isopropyl acrylate, butyl acrylate. It is at least one of styrene, acrylonitrile, vinyl chloride, butadiene. 제 1 항에 있어서, 상기 탄소수 5~20의 아크릴레이트 또는 메타크릴레이트계 단량체는 2-에틸헥실아크릴레이트, 옥틸아크릴레이트, 도데실아크릴레이트, 옥타데실아크릴레이트 중의 적어도 하나인 것을 특징으로 하는 제조 방법.The method of claim 1, wherein the acrylate or methacrylate monomer having 5 to 20 carbon atoms is at least one of 2-ethylhexyl acrylate, octyl acrylate, dodecyl acrylate, octadecyl acrylate Way.
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