KR100453291B1 - Apparatus for inspecting of chip equipped steel belt and the same method - Google Patents

Apparatus for inspecting of chip equipped steel belt and the same method Download PDF

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Publication number
KR100453291B1
KR100453291B1 KR10-2002-0031486A KR20020031486A KR100453291B1 KR 100453291 B1 KR100453291 B1 KR 100453291B1 KR 20020031486 A KR20020031486 A KR 20020031486A KR 100453291 B1 KR100453291 B1 KR 100453291B1
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South Korea
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chip
steel belt
inspection
inspecting
camera
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KR10-2002-0031486A
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Korean (ko)
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KR20030093681A (en
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정용욱
윤상억
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(주)화인
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Priority to KR10-2002-0031486A priority Critical patent/KR100453291B1/en
Priority to JP2002313030A priority patent/JP2004012458A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

본 발명은 스틸벨트를 이용하여 칩을 직선으로 이동시켜 육면 모두 검사할 수 있고, 반전장치 및 조명장치를 사용하여 칩을 자동 선별할 수 있도록 된 스틸벨트가 구비된 칩 검사기를 제공하는 데 목적이 있다An object of the present invention is to provide a chip tester equipped with a steel belt that can be inspected on both sides by moving the chip in a straight line using a steel belt, and can automatically sort the chip using a reversing device and a lighting device. have

따라서 본 발명은 칩의 육면을 검사하는 칩 검사기에 있어서, 칩의 3면을 동시에 검사하는 제1검사부; 제1검사부에서 배출된 칩을 반전시키는 반전장치; 반전장치로부터 반전된 칩의 다른 3면을 동시에 검사하는 제2검사부를 포함하는 스틸벨트가 구비된 칩 검사기를 제공한다.Accordingly, the present invention provides a chip inspector for inspecting a six-sided surface of a chip, comprising: a first inspecting unit simultaneously inspecting three surfaces of a chip; An inversion device for inverting the chip discharged from the first inspection unit; Provided is a chip inspector equipped with a steel belt including a second inspector for simultaneously inspecting the other three sides of the chip inverted from the inverter.

또한 본 발명은 칩의 육면을 검사하는 칩 검사기를 이용하여 칩을 검사하는 칩 검사방법에 있어서, 칩의 3면을 동시에 검사하는 제1검사단계; 제1검사단계에서 검사가 완료되어 배출된 상기 칩을 반전장치에서 반전시키는 반전단계; 반전단계에서 반전된 상기 칩의 다른 3면을 동시에 검사하는 제2검사단계를 포함하는 스틸벨트가 구비된 칩 검사기를 이용하는 칩 검사방법을 제공한다.In another aspect, the present invention provides a chip inspection method for inspecting a chip using a chip inspector for inspecting a six surface of a chip, comprising: a first inspection step of simultaneously inspecting three surfaces of a chip; An inversion step of inverting the chip discharged after the inspection is completed in the first inspection step in an inversion device; The present invention provides a chip inspection method using a chip inspector equipped with a steel belt including a second inspection step of simultaneously inspecting three other surfaces of the chip inverted in the inversion step.

Description

스틸벨트가 구비된 칩 검사기 및 이를 이용한 칩 검사방법{Apparatus for inspecting of chip equipped steel belt and the same method}Chip inspector equipped with steel belt and chip inspection method using the same {Apparatus for inspecting of chip equipped steel belt and the same method}

본 발명은 칩의 표면상태 및 크기를 검사하는 칩 검사기에 관한 것으로, 더욱 상세하게는 콘데서칩(MLCC; Multi Layer Ceramic Condenser)을 포함하는 육면체형 칩의 모든 표면을 검사하는 칩 검사기 및 이를 이용하는 칩 검사방법에 관한 것이다.The present invention relates to a chip inspector for inspecting the surface state and size of a chip, and more particularly, a chip inspector for inspecting all surfaces of a hexahedral chip including a multi-layer ceramic condenser (MLCC) and a chip using the same. It is about an inspection method.

일반적으로 칩은 출시되기 전에 크기 및 표면의 크랙유무, 도금량, 도금면적, 깨짐 등의 여부를 사용자의 요구에 맞도록 검사하여 출시하게 된다.In general, the chip is released to check the size and surface cracks, plating amount, plating area, cracking, etc. to meet the user's requirements before it is released.

이러한 종래의 칩 검사기는 도 1에 도시된 바와 같은 헐회전기구를 이용하여 칩의 표면을 검사하거나, 도 2에 도시된 바와 같은 원판을 이용한 회전테이블 방식의 칩 검사기가 널리 사용되었다.Such a conventional chip tester inspects the surface of the chip using a loose rotation mechanism as shown in FIG. 1, or a chip tester of a rotary table type using a disc as shown in FIG. 2.

그러나 이와같은 종래의 칩 검사기는 정형화된 동축조명을 사용하게됨에 따라 라운딩된 칩의 모서리는 외곽경계선이 뚜렷하게 나타나지 않는다. 따라서 칩의 정확한 크기를 검사할 수 없는 문제점이 있다.However, as the conventional chip tester uses standard coaxial illumination, the edges of the rounded chips do not have a clear boundary line. Therefore, there is a problem that can not check the exact size of the chip.

또한 종래의 칩 검사기는 칩이 직선으로 이동될 수 없으므로 육면 모두를 검사할 수 없는 문제점이 있다.In addition, the conventional chip checker has a problem that can not inspect all the six sides because the chip can not be moved in a straight line.

따라서 본 발명은 이와 같은 문제점을 해결하기 위하여 안출된 것으로, 스틸벨트를 이용하여 칩을 직선으로 이동시켜 육면 모두 검사할 수 있고, 반전장치 및 조명장치를 사용하여 칩을 자동 선별할 수 있도록 된 칩 검사기 및 이를 이용하는 칩 검사방법을 제공하는 데 있다.Therefore, the present invention has been made to solve the above problems, by using a steel belt to move the chip in a straight line to inspect all six sides, the chip that can automatically sort the chip using the inverting device and the lighting device The present invention provides a tester and a chip test method using the same.

도 1은 종래기술에 따른 간헐회전기구를 이용한 칩검사기를 개략적으로 나타내는 도면.1 is a view schematically showing a chip tester using an intermittent rotating mechanism according to the prior art.

도 2는 종래기술에 따른 원판을 이용한 회전테이블 방식의 검사기를 개략적으로 나타내는 도면.Figure 2 is a schematic view showing a checker of the rotary table method using a disc according to the prior art.

도 3은 육면체형 칩의 사시도.3 is a perspective view of a hexahedral chip.

도 4는 본 발명에 따른 스틸벨트가 구비된 칩 검사기를 나타내는 사시도.Figure 4 is a perspective view showing a chip inspector equipped with a steel belt according to the present invention.

도 5는 본 발명에 따른 제1검사부를 나타내는 사시도.5 is a perspective view showing a first inspection unit according to the present invention.

도 6는 본 발명에 따른 조명장치를 나타내는 사시도.Figure 6 is a perspective view of the lighting apparatus according to the present invention.

도 7은 본 발명에 따른 반전장치를 나타내는 사시도.7 is a perspective view showing an inverting device according to the present invention.

도 8은 본 발명에 따른 가이드 홈을 나타내기 위한 반전장치의 사시도.8 is a perspective view of an inverting device for showing a guide groove according to the present invention.

도 9은 본 발명에 따른 제2검사부를 나타내는 사시도.9 is a perspective view of a second inspection unit according to the present invention;

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

1 : 칩 2 : 제 1 스틸벨트1: chip 2: first steel belt

4 : 조명장치 5, 6, 7 : 제1카메라4: lighting apparatus 5, 6, 7: first camera

8 : 센서 9 : 제1칩배출장치8: sensor 9: first chip ejection device

12 : 반전장치 13 : 직진피더12: inverter 13: straight feeder

14, 15, 16 : 제2카메라 18 : 핀조명14, 15, 16: second camera 18: pin lighting

19 : 핀홀더 20 : 샤프트19: pin holder 20: shaft

21 : 클램프 22 : 베이스21: Clamp 22: Base

22 : 제 2 스틸벨트 27 : 가이드홈22: second steel belt 27: guide groove

이와 같은 목적을 달성하기 위하여 본 발명은 칩의 육면을 검사하는 스틸벨트가 구비된 칩 검사기에 있어서, 칩의 3면을 동시에 검사하는 제1검사부; 제1검사부에서 배출된 칩을 반전시키는 반전장치; 반전장치로부터 반전된 칩의 다른 3면을 동시에 검사하는 제2검사부를 포함하는 스틸벨트가 구비된 칩 검사기를 제공한다.In order to achieve the above object, the present invention provides a chip inspector equipped with a steel belt for inspecting the six sides of the chip, the first inspection unit for inspecting three surfaces of the chip at the same time; An inversion device for inverting the chip discharged from the first inspection unit; Provided is a chip inspector equipped with a steel belt including a second inspector for simultaneously inspecting the other three sides of the chip inverted from the inverter.

또한 본 발명은 칩의 육면을 검사하는 스틸벨트가 구비된 칩 검사기를 이용하여 칩을 검사하는 검사방법에 있어서, 칩의 3면을 동시에 검사하는 제1검사단계; 제1검사단계에서 검사가 완료되어 배출된 상기 칩을 반전장치에서 반전시키는 반전단계; 반전단계에서 반전된 상기 칩의 다른 3면을 동시에 검사하는 제2검사단계를 포함하는 스틸벨트가 구비된 칩 검사기를 이용하는 칩 검사방법을 제공한다.The present invention also provides a method for inspecting a chip using a chip inspector equipped with a steel belt for inspecting a six surface of a chip, the method comprising: a first inspection step of simultaneously inspecting three surfaces of a chip; An inversion step of inverting the chip discharged after the inspection is completed in the first inspection step in an inversion device; The present invention provides a chip inspection method using a chip inspector equipped with a steel belt including a second inspection step of simultaneously inspecting three other surfaces of the chip inverted in the inversion step.

이하 본 발명의 바람직한 일실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

도 3은 육면체형 칩의 사시도이고, 도 4는 본 발명에 따른 칩 검사기를 나타내는 사시도이며, 도 5는 본 발명에 따른 제1검사부를 나타내는 사시도이고, 도 6은 본 발명에 따른 조명장치를 나타내는 사시도이며, 도 7은 본 발명에 따른 반전장치를 나타내는 사시도이고, 도 8은 본 발명에 따른 가이드 홈을 나타내기 위한 반전장치의 사시도이며, 도 9은 본 발명에 따른 제2검사부를 나타내는 사시도이다.Figure 3 is a perspective view of a hexahedral chip, Figure 4 is a perspective view showing a chip tester according to the present invention, Figure 5 is a perspective view showing a first inspection part according to the present invention, Figure 6 shows a lighting apparatus according to the present invention 7 is a perspective view showing a reversing device according to the present invention, FIG. 8 is a perspective view showing a reversing device for showing a guide groove according to the present invention, and FIG. 9 is a perspective view showing a second inspection part according to the present invention. .

본 발명에 따른 스틸벨트가 구비된 칩 검사기는 칩의 3면을 동시에 검사하는 제1검사부와, 제1검사부에서 배출된 칩을 반전시키는 반전장치와, 반전장치로부터 반전된 칩의 다른 3면을 동시에 검사하는 제2검사부로 이루어진다.The chip inspector provided with the steel belt according to the present invention includes a first inspection unit for inspecting three surfaces of the chip at the same time, an inversion device for inverting the chip discharged from the first inspection unit, and another three sides of the chip inverted from the inversion device. It consists of a 2nd inspection part which examines simultaneously.

먼저 제1검사부는 구동모터(23)에 구동되는 구동축풀리(11)와 종동축풀리(17) 사이에 장착되어 칩(1)을 이송시키는 제1스틸벨트(2), 제1스틸벨트(2)의 경로에 설치되어 칩(1)을 정렬하는 제1정렬기구(3), 칩(1)의 진입여부를 감지하는 센서(8), 칩(1)을 촬영하도록 설치된 제1카메라(5, 6, 7), 칩(1)을 제1카메라(5, 6, 7)가 촬영할 수 있도록 빛을 조사하는 조명장치(4), 제1카메라(5, 6, 7)에 의해 촬영되어 검사된 칩(1)을 배출하는 제1칩배출장치(9)로 이루어진다.First, the first inspection unit is mounted between the drive shaft pulley 11 and the driven shaft pulley 17 driven by the driving motor 23 to transfer the chip 1 to the first steel belt 2 and the first steel belt 2. The first alignment mechanism 3 for aligning the chip 1, the sensor 8 for detecting the entry of the chip 1, and the first camera 5 for photographing the chip 1. 6, 7) and the first device (5, 6, 7), the illumination device 4 for irradiating light so that the first camera (5, 6, 7) can be photographed and photographed by the first camera (5, 6, 7) It consists of the 1st chip discharge apparatus 9 which discharges the chip 1.

이 때 제1스틸벨트(2)의 이동시 제1스틸벨트(2)가 경로를 벗어나지 않도록 직선정렬기구(10)가 설치된다.At this time, the linear alignment mechanism 10 is installed so that the first steel belt 2 does not deviate from the path when the first steel belt 2 moves.

여기서 조명장치(4)는 빛을 조사하는 핀조명(18)과, 핀조명(18)을 고정시키는 핀홀더(19)와, 핀홀더(19)를 고정시키는 샤프트(20)와, 샤프트(20)를 축방향으로 고정시키는 클램프(21)와, 클램프(21)가 고정되는 베이스(22)로 이루어진다.Here, the lighting device 4 includes a pin light 18 for irradiating light, a pin holder 19 for fixing the pin light 18, a shaft 20 for fixing the pin holder 19, and a shaft 20. ) And the base 22 to which the clamp 21 is fixed.

이러한 조명장치(4)는 제1카메라(5, 6, 7)의 회전축을 중심으로 회전되므로5자유도 이상으로 이동되도록 구비된 것이다.Since the lighting device 4 is rotated about the rotation axis of the first cameras 5, 6, and 7, the illumination device 4 is provided to be moved beyond 5 degrees of freedom.

다음으로 반전장치(12)는 칩(1)의 크기와 동일한 직선 및 곡선 구간으로 홈이 형성되고 이 홈에 칩이 자유낙하되어 반전된다.Next, the inverter 12 has a groove formed in a straight line and a curved section equal to the size of the chip 1, and the chip is freely dropped in the groove to be inverted.

다음으로 제2검사부는 반전장치로부터 반전된 칩(1)을 이송시키는 제2스틸벨트(24)와, 제2스틸벨트(24)의 경로에 설치되어 칩(1)을 정렬하는 제2정렬기구(25), 칩(1)의 진입여부를 감지하는 센서(8), 칩(1)을 촬영하도록 설치된 제2카메라(14, 15, 16)와, 칩(1)을 제2카메라(14, 15, 16)가 촬영할 수 있도록 빛을 조사하는 조명장치(4)와, 제2카메라(14, 15, 16)에 의해 촬영되어 검사된 칩(1)을 배출하는 제2칩배출장치(26)로 이루어진다.Next, the second inspection unit is provided with a second steel belt 24 for transferring the chip 1 inverted from the inverting device, and a second alignment mechanism installed in the path of the second steel belt 24 to align the chip 1. 25, a sensor 8 for detecting entry of the chip 1, second cameras 14, 15, and 16 installed to photograph the chip 1, and a chip 1 to the second camera 14. An illumination device 4 for irradiating light to be photographed by the 15 and 16, and a second chip discharge device 26 for discharging the chip 1 photographed and inspected by the second cameras 14, 15 and 16. Is made of.

여기서 조명장치(4)는 빛을 조사하는 핀조명(18)과, 핀조명(18)을 고정시키는 핀홀더(19)와, 핀홀더(19)를 고정시키는 샤프트(20)와, 샤프트(20)를 축방향으로 고정시키는 클램프(21)와, 클램프(21)가 고정되는 베이스(22)로 이루어진다.Here, the lighting device 4 includes a pin light 18 for irradiating light, a pin holder 19 for fixing the pin light 18, a shaft 20 for fixing the pin holder 19, and a shaft 20. ) And the base 22 to which the clamp 21 is fixed.

또한 조명장치(4)는 제2카메라(14, 15, 16)의 회전축을 중심으로 회전되므로 5자유도 이상으로 이동되도록 구비된 것이다.In addition, since the illumination device 4 is rotated about the rotation axis of the second cameras 14, 15, and 16, the illumination device 4 is provided to be moved beyond 5 degrees of freedom.

본 발명에 따른 스틸벨트가 구비된 칩 검사기를 이용하는 침 검사방법은 칩(1)의 3면을 동시에 검사하는 제1검사단계와 제1검사단계에서 검사가 완료되어 배출된 칩(1)을 반전장치(12)에서 반전시키는 반전단계와, 반전단계에서 반전된 칩(1)의 다른 3면을 동시에 검사하는 제2검사단계로 이루어진다.In the needle inspection method using a chip inspector equipped with a steel belt according to the present invention, the first inspection step and the first inspection step of simultaneously inspecting three surfaces of the chip 1 are completed and the chip 1 inverted is inverted. An inverting step of inverting in the device 12 and a second inspecting step of simultaneously inspecting the other three sides of the chip 1 inverted in the inverting step.

먼저 제1검사단계는 칩(1)을 제1스틸벨트(2)를 이용하여 이송시키며, 제1스틸벨트(2)의 상부에서 이동되는 칩(1)을 제1정렬기구(3)로 정렬시키고, 제1정렬기구(3)에서 정렬되어 이동된 칩(1)이 검사구역에 진입하면 센서(8)가 진입여부를 판단하여 조명장치(4) 및 제1카메라(5, 6, 7)를 이용하여 칩(1)을 검사하고, 검사가 완료된 칩(1)을 제1칩배출장치(9)를 이용하여 배출한다.First, the first inspection step transfers the chip 1 using the first steel belt 2, and aligns the chip 1 moved on the upper part of the first steel belt 2 with the first alignment mechanism 3. When the chip 1 aligned and moved by the first alignment mechanism 3 enters the inspection area, the sensor 8 determines whether the lighting device 4 has entered the lighting device 4 and the first cameras 5, 6, and 7. The chip 1 is inspected using, and the inspected chip 1 is discharged using the first chip ejection apparatus 9.

다음으로 반전단계는 제1검사단계에서 검사가 완료되어 배출된 상기 칩을 반전장치(12)에서 반전시킨다.Next, the inversion step inverts the chip discharged after the inspection is completed in the first inspection step in the inversion device 12.

여기서 상기 칩(1)은 반전장치를 통하여 자유낙하 하여 직진피더(13)에 모이게 되고 직진피더(13)에 모인 칩(1)은 직선 및 곡선으로 칩(1)의 크기와 동일한 크기로 형성된 홈을 따라 이동하며 반전된다.Here, the chip 1 is freely dropped through the inverting device and collected in the straight feeder 13, and the chips 1 gathered in the straight feeder 13 are grooves formed in the same size as the size of the chip 1 in a straight line and a curve. It moves along and inverts.

다음으로 제2검사단계는 반전단계에서 반전된 칩(1)을 제2스틸벨트(24)를 이용하여 칩(1)을 이송시키며, 제2스틸벨트(24)의 상부에서 이동되는 칩(1)을 제2정렬기구(25)로 정렬시키고, 제2정렬기구(25)에서 정렬되어 이동된 칩(1)이 검사구역에 진입하면 센서(8)가 진입여부를 판단하여 조명장치(4) 및 제2카메라(14, 15, 16)를 이용하여 칩(1)을 검사하고, 검사가 완료된 칩(1)을 제2칩배출장치(26)를 이용하여 배출한다.Next, in the second inspection step, the chip 1 inverted in the inversion step is transferred using the second steel belt 24, and the chip 1 is moved on the upper portion of the second steel belt 24. ) Is aligned with the second alignment mechanism 25, and when the chip 1, which is aligned and moved in the second alignment mechanism 25, enters the inspection area, the sensor 8 determines whether or not the lighting device 4 enters the inspection area. And inspecting the chip 1 using the second cameras 14, 15, and 16, and discharging the inspected chip 1 using the second chip discharging device 26.

이와 같이 본 발명에 따른 스틸벨트가 구비된 칩 검사기 및 이를 이용하는 칩 검사방법에 의하면 스틸벨트를 이용하여 칩의 직선이송을 구현하므로 칩의 6면 모두를 검사할 수 있으며, 조명장치는 칩의 실제크기를 용이하게 검사할 수 있다.As described above, according to the chip inspector equipped with the steel belt and the chip inspection method using the same, the linear movement of the chip is implemented using the steel belt, so that all six surfaces of the chip can be inspected. The size can be easily checked.

또한 고품질의 칩이 자동 선별되고 표면검사의 정밀도가 향상된다.In addition, high quality chips are automatically screened and the accuracy of surface inspection is improved.

따라서 칩 검사의 정밀도가 향상되므로 칩 생산공정의 자동화가 가능하다.As a result, the accuracy of chip inspection is improved, which enables automation of the chip production process.

Claims (4)

칩의 육면을 검사하는 스틸벨트가 구비된 칩 검사기에 있어서,In the chip inspector equipped with a steel belt for inspecting the six sides of the chip, 상기 칩을 이송시키는 제1스틸벨트, 상기 제1스틸벨트의 경로에 설치되어 상기 칩을 정렬하는 제1정렬기구, 상기 칩의 진입여부를 감지하는 센서, 상기 칩을 촬영하도록 설치된 제1카메라, 상기 칩을 상기 제1카메라가 촬영할 수 있도록 빛을 조사하는 조명장치, 상기 제1카메라에 의해 촬영되어 검사된 칩을 배출하는 제1칩배출장치로 이루어지는 제1검사부;A first steel belt for transferring the chip, a first alignment mechanism installed in a path of the first steel belt to align the chips, a sensor for detecting whether the chip enters, a first camera installed to photograph the chip, A first inspection unit comprising an illumination device for irradiating light so that the first camera can photograph the chip, and a first chip discharge device for discharging the chip photographed and inspected by the first camera; 상기 제1검사부에서 배출된 칩을 반전시키는 반전장치;An inversion device for inverting the chip discharged from the first inspection unit; 상기 반전장치로부터 반전된 칩을 이송시키는 제2스틸벨트, 상기 제2스틸벨트의 경로에 설치되어 상기 칩을 정렬하는 제2정렬기구, 상기 칩의 진입여부를 감지하는 센서, 상기 칩을 촬영하도록 설치된 제2카메라, 상기 칩을 상기 제2카메라가 촬영할 수 있도록 빛을 조사하는 조명장치, 상기 제2카메라에 의해 촬영되어 검사된 칩을 배출하는 제2칩배출장치로 이루어지는 제2검사부를 포함하는 것을 특징으로 하는 스틸벨트가 구비된 칩 검사기.A second steel belt for transferring the inverted chip from the inverting device, a second alignment mechanism installed in the path of the second steel belt to align the chips, a sensor for detecting whether the chip enters, and photographing the chip And a second inspection unit comprising a second camera installed, an illumination device for irradiating light so that the second camera can photograph the chip, and a second chip discharge device for discharging the chip photographed and inspected by the second camera. Chip checker provided with a steel belt, characterized in that. 제 1 항에 있어서,The method of claim 1, 상기 조명장치는 빛을 조사하는 핀조명, 상기 핀조명을 고정시키는 핀홀더, 상기 핀홀더를 고정시키는 샤프트, 상기 샤프트를 축방향으로 고정시키는 클램프, 상기 클램프가 고정되는 베이스로 이루어져 카메라의 회전축을 중심으로 회전되므로 5자유도가 가능한 것을 특징으로 하는 스틸벨트가 구비된 칩 검사기.The lighting device includes a pin light for irradiating light, a pin holder for fixing the pin light, a shaft for fixing the pin holder, a clamp for fixing the shaft in the axial direction, and a base to which the clamp is fixed. The chip checker with a steel belt, characterized in that 5 degrees of freedom is possible because it rotates around. 제 1 항에 있어서,The method of claim 1, 상기 반전장치는 상기 칩의 크기와 동일한 직선 및 곡선 구간으로 홈이 형성되어 이 홈에 상기 칩이 자유낙하되어 반전되는 것을 특징으로 하는 스틸벨트가 구비된 칩 검사기.The reversing device is a chip tester provided with a steel belt, characterized in that the groove is formed in a straight line and a curved section equal to the size of the chip so that the chip is free fall in the groove is reversed. 칩의 육면을 검사하는 스틸벨트가 구비된 칩 검사기를 이용하는 칩 검사방법에 있어서,In the chip inspection method using a chip inspector equipped with a steel belt for inspecting the six sides of the chip, 상기 칩을 제1스틸벨트를 이용하여 이송시키며, 상기 제1스틸벨트의 상부에서 이동되는 상기 칩을 제1정렬기구로 정렬시키고, 상기 제1정렬기구에서 정렬되어 이동된 칩이 검사구역에 진입하면 센서가 진입여부를 판단하여 조명장치 및 제1카메라를 이용하여 상기 칩을 검사하고, 검사가 완료된 칩을 제1칩배출장치를 이용하여 배출하는 제1검사단계;The chip is transferred using a first steel belt, the chips moved from the upper part of the first steel belt are aligned with a first alignment mechanism, and the chips aligned and moved by the first alignment mechanism enter the inspection area. A first inspection step of inspecting the chip by using a lighting device and a first camera to determine whether the sensor enters the surface, and discharging the completed chip using the first chip ejection apparatus; 상기 제1검사단계에서 검사가 완료되어 배출된 상기 칩을 반전장치에서 반전시키는 반전단계;An inversion step of inverting the chip discharged after the inspection is completed in the first inspection step in an inversion device; 상기 반전단계에서 반전된 상기 칩을 제2스틸벨트를 이용하여 칩을 이송시키며, 상기 제2스틸벨트의 상부에서 이동되는 상기 칩을 제2정렬기구로 정렬시키고, 상기 제2정렬기구에서 정렬되어 이동된 칩이 검사구역에 진입하면 센서가 진입여부를 판단하여 조명장치 및 제2카메라를 이용하여 상기 칩을 검사하고, 검사가 완료된 칩을 제2칩배출장치를 이용하여 배출하는 제2검사단계를 포함하는 것을 특징으로 하는 스틸벨트가 구비된 칩 검사기를 이용하는 칩 검사방법.The chip inverted in the inverting step is transferred to the chip using a second steel belt, and the chip moved from the upper portion of the second steel belt is aligned with a second alignment mechanism, and aligned with the second alignment mechanism. When the moved chip enters the inspection zone, the sensor determines whether the entry is made, inspects the chip using a lighting device and a second camera, and discharges the completed chip using the second chip ejection device. Chip inspection method using a chip checker provided with a steel belt comprising a.
KR10-2002-0031486A 2002-06-05 2002-06-05 Apparatus for inspecting of chip equipped steel belt and the same method KR100453291B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325178A (en) * 1991-04-18 1994-06-28 Isover Saint-Gobain Method of measuring the dimensions of moving objects
JP2000157935A (en) * 1998-11-26 2000-06-13 Yamato Kk Method of inspecting parts and device therefor
JP2000337843A (en) * 1999-05-31 2000-12-08 Okano Denki Kk Appearance inspecting device
JP2001039536A (en) * 1999-07-30 2001-02-13 Lintec Corp Workpiece inspection device and inspection method
KR20020090656A (en) * 2001-05-29 2002-12-05 (주)윈텍 시스템 Six face inspection apparatus of chips using belts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325178A (en) * 1991-04-18 1994-06-28 Isover Saint-Gobain Method of measuring the dimensions of moving objects
JP2000157935A (en) * 1998-11-26 2000-06-13 Yamato Kk Method of inspecting parts and device therefor
JP2000337843A (en) * 1999-05-31 2000-12-08 Okano Denki Kk Appearance inspecting device
JP2001039536A (en) * 1999-07-30 2001-02-13 Lintec Corp Workpiece inspection device and inspection method
KR20020090656A (en) * 2001-05-29 2002-12-05 (주)윈텍 시스템 Six face inspection apparatus of chips using belts

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