KR100427023B1 - Adhesive composition and adhesive sheet using the same - Google Patents
Adhesive composition and adhesive sheet using the same Download PDFInfo
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- KR100427023B1 KR100427023B1 KR1019970015395A KR19970015395A KR100427023B1 KR 100427023 B1 KR100427023 B1 KR 100427023B1 KR 1019970015395 A KR1019970015395 A KR 1019970015395A KR 19970015395 A KR19970015395 A KR 19970015395A KR 100427023 B1 KR100427023 B1 KR 100427023B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
Abstract
본 발명은 에너지선의 조사 전에는 충분한 감압접착성과 초기접착성을 가지며, 조사 후에는 고무탄성을 유지하면서 접착력이 격감하고, 다이싱후의 확장공정에 있어서 칩 정렬성이 우수한 점착제조성물 및 그와 같은 점착제조성물을 이용한 점착시트, 특히 웨이퍼가공용 또는 표면 보호용 점착시트를 제공하는 것을 목적으로 한다.The present invention has sufficient pressure-sensitive adhesiveness and initial adhesiveness before irradiation of energy rays, adhesive strength is reduced while maintaining rubber elasticity after irradiation, and excellent pressure-aligned adhesive composition and such pressure-sensitive adhesive composition in the expansion step after dicing. An object of the present invention is to provide an adhesive sheet, in particular, an adhesive sheet for wafer processing or surface protection.
아크릴계 공중합체 (A)와, 에너지선 중합성 우레탄아크릴레이트올리고머 (B)와, 분자내에 1개의 아크릴로일기 또는 메타아크릴로일기를 갖는 에너지선 중합성화합물 (C)로부터 얻어지는 것을 특징으로 하며, 필요에 따라 가소제 (D), 가교제 (E), 광중합개시제(F)를 더 함유할 수 있다.It is obtained from an acryl-type copolymer (A), an energy-beam polymerizable urethane acrylate oligomer (B), and an energy-beam polymerizable compound (C) which has one acryloyl group or a methacryloyl group in a molecule | numerator, As needed, a plasticizer (D), a crosslinking agent (E), and a photoinitiator (F) can be contained further.
Description
본 발명은 점착제 조성물 및 이를 이용한 층을 갖는 점착시트에 관한 것으로, 더욱 상세하게는 충분한 고무 탄성을 나타내고, 에너지선을 조사(照射)하기 전에는 피착체에 대해 충분한 감압(感壓) 접착성과 초기 접착성을 가지며, 에너지선을 조사한 후에는 고무 탄성을 유지하면서 피착체에 대한 접착력이 격감하고, 점착체의 잔류 없이 제거하는 것이 가능하며, 웨이퍼(wafer)로부터 작은 조각(chip)으로 절단, 분리(dicing)한 후의 칩 정렬성이 우수한 점착시트 및 이와같은 점착시트를 제공하는 점착제 조성물에 관한 것이다.The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet having a layer using the same, and more particularly, exhibit sufficient rubber elasticity, and sufficient pressure-sensitive adhesiveness and initial adhesion to the adherend before irradiating energy rays After irradiating energy rays, the adhesive force to the adherend decreases while maintaining the rubber elasticity, and it is possible to remove the residue without remaining the adhesive, and to cut and separate into small chips from the wafer ( The present invention relates to an adhesive sheet having excellent chip alignment after dicing) and an adhesive composition for providing such an adhesive sheet.
실리콘, 갈륨 또는 비소같은 반도체 웨이퍼는 큰 직경을 갖는 상태로 제조되고, 이 웨이퍼는 작은 칩으로 절단, 분리 된 후에 다음 공정인 마운팅 공정으로 보내어진다. 이때 반도체 웨이퍼는 미리 점착시트에 첩착된 상태로 다이싱, 세정, 건조, 확장, 픽업, 마운팅의 각 공정을 거치게 된다.Semiconductor wafers such as silicon, gallium, or arsenic are manufactured with large diameters, which are then cut into small chips, separated, and sent to the next process, the mounting process. At this time, the semiconductor wafer is subjected to each process of dicing, cleaning, drying, expanding, picking up, and mounting in a state of being adhered to the adhesive sheet in advance.
이와 같이 반도체 웨이퍼의 다이싱 공정으로부터 픽업 공정에 이르는 공정에 사용되는 점착시트로서는 다이싱 공정으로부터 건조공정까지는 웨이퍼 및/또는 칩에 대해 충분한 접착력을 가지고, 픽업공정에서 픽업된 웨이퍼 및/또는 칩에 점착제가 부착되지 않을 정도의 접착력을 갖는 것이 요구된다.As such, the pressure-sensitive adhesive sheet used in the process from the dicing step of the semiconductor wafer to the pick-up step has sufficient adhesive strength to the wafer and / or chip from the dicing step to the drying step, and to the wafer and / or chip picked up in the pick-up step. It is required to have an adhesive force such that the pressure-sensitive adhesive does not adhere.
이와 같은 점착시트로서 일본공개특허 60(1985)-196,956호 공보 및 일본공개특허 60(1985)-223,139호 공보에는, 기재면에 광조사로 3차원 망상화할 수 있는, 분자내에 광중합성 탄소-탄소 2중 결합을 적어도 2종 이상 갖는 저분자량 화합물로부터 이루어지는 점착제를 도포한 점착시트가 제안되어 있다. 이들의 제안은 방사선 투과성의 기재상에 방사선 경화성 점착제를 도포한 점착테프의 점착제 중에 포함된 방사선 경화성 화합물을 방사선 조사에 의해 경화시키고, 점착제에 3차원 망상화 구조를 부여하여 그 유동성을 현저하게 저하시키는 원리에 기초를 두고 있다. 그렇지만 상기 공보류에 기재된 점착제로는 경화 반응에 의해 점착제층의 고무 탄성이 소실되는 경우가 많고, 점착시트의 확장시 충분한 확장을 얻을 수가 없다. 이로 인해 웨이퍼 칩의 간격을 충분히 넓힐 수 없고, 칩의 간격이 불균일해지며, 픽업공정에서 오동작을 일으키는 원인이 되는 등의 문제점이 있다.As such an adhesive sheet, JP-A-60 (1985) -196,956 and JP-A-60 (1985) -223,139 disclose photopolymerizable carbon-carbon in a molecule that can be three-dimensionally networked by light irradiation on a substrate surface. A pressure-sensitive adhesive sheet coated with a pressure-sensitive adhesive made of a low molecular weight compound having at least two or more double bonds has been proposed. These proposals cure a radiation curable compound contained in a pressure sensitive adhesive of a pressure sensitive adhesive tape coated with a radiation curable pressure sensitive adhesive on a radiation-permeable substrate and give the pressure sensitive adhesive a three-dimensional network structure to significantly reduce its fluidity. It is based on the principle of letting. However, as the pressure-sensitive adhesive described in the above publication, the rubber elasticity of the pressure-sensitive adhesive layer is often lost due to the curing reaction, and sufficient expansion cannot be obtained when the pressure-sensitive adhesive sheet is expanded. As a result, there is a problem that the gap between the wafer chips cannot be widened sufficiently, the chip intervals become uneven, and cause a malfunction in the pick-up process.
일본특허공개 5(1993)-214,298호 공보에는 고무 탄성을 유지하기 위해 비교적 저분자량의 비닐에테르 화합물을 첨가하고, 또한 방사선 경화성을 부여하기 위해 비교적 저분자량의 불포화올리고머를 첨가하여 이루어지는 점착제층을 구비한 점착시트가 개시되어 있다. 또한 일본특허공개 6(1994)-49,420호 공보에는 다관능 우레탄아크릴레이트계 올리고머와 폴리에스테르 화합물 등의 가소제를 첨가하여 이루어지는 점착제층을 구비한 점착시트가 개시되어 있다. 그렇지만 이들 점착제에는 저분자량 성분이나 가소제의 첨가량이 과다하면 초기접착력이 저하되고, 관련된 저분자량 성분이나 가소제가 반도체 웨이퍼 및/또는 칩의 이면에 잔류하는 문제점이 있다. 또한 저분자량 성분이나 가소제의 첨가량이 너무 적으면 방사선을 조사해도 접착력이 충분하게 저하되지 않거나 또는 고무 탄성을 얻을 수 없는 등의 문제점이 있다. 이로 인해 방사선의 조사 전후에 점착특성을 조절하는 것이 상당히 까다롭다.Japanese Patent Laid-Open No. 5 (1993) -214,298 includes a pressure-sensitive adhesive layer formed by adding a relatively low molecular weight vinyl ether compound to maintain rubber elasticity, and by adding a relatively low molecular weight unsaturated oligomer to impart radiation curability. One adhesive sheet is disclosed. In addition, Japanese Patent Laid-Open No. 6 (1994) -49,420 discloses an adhesive sheet having an adhesive layer formed by adding a plasticizer such as a polyfunctional urethane acrylate oligomer and a polyester compound. However, in these adhesives, when the addition amount of a low molecular weight component or a plasticizer is excessive, the initial adhesive force falls, and there exists a problem that the related low molecular weight component or plasticizer remains on the back surface of a semiconductor wafer and / or a chip | tip. Moreover, when the addition amount of a low molecular weight component or a plasticizer is too small, there exists a problem that adhesive force does not fall enough or rubber elasticity cannot be obtained even if it irradiates radiation. For this reason, it is very difficult to control the adhesive properties before and after irradiation of radiation.
본 발명은 상기와 같은 종래기술에 비춰보아 에너지선을 조사하기 전에는 충분한 감압 접착성과 초기접착력을 갖고, 조사한 후에는 고무 탄성을 유지하면서 접착력이 격감하며, 또한 다이싱 후의 확장공정에 있어서 칩 정렬성이 우수한 점착시트 및 점착시트를 형성할 수 있는 점착제 조성물을 제공하는 것을 목적으로 한다.In view of the prior art as described above, the present invention has sufficient pressure-sensitive adhesiveness and initial adhesive strength before irradiation with energy rays, and after irradiation, the adhesive force decreases while maintaining rubber elasticity, and chip alignment property in the expansion process after dicing. It is an object of the present invention to provide a pressure-sensitive adhesive composition capable of forming this excellent pressure-sensitive adhesive sheet and pressure-sensitive adhesive sheet.
본 발명의 점착제 조성물은,The pressure-sensitive adhesive composition of the present invention,
아크릴계 공중합체 (A)와,An acrylic copolymer (A),
에너지선 중합성 우레탄아크릴레이트올리고머 (B)와,Energy ray-polymerizable urethane acrylate oligomer (B),
분자 내에 1개의 아크릴로일기 또는 메타아크릴로일기를 갖는 에너지선 중합성 화합물 (C)를 포함하는 것을 특징으로 한다.It is characterized by including the energy-beam polymerizable compound (C) which has one acryloyl group or a methacryloyl group in a molecule | numerator.
본 발명의 점착제 조성물은 가소제 (D)를 더 함유할 수 있다.The adhesive composition of this invention can contain a plasticizer (D) further.
본 발명의 점착제 조성물은 가교제 (E)를 더 함유할 수 있다.The pressure-sensitive adhesive composition of the present invention may further contain a crosslinking agent (E).
본 발명의 점착제 조성물은 광중합 개시제(F)를 더 함유할 수 있다.The adhesive composition of this invention can contain a photoinitiator (F) further.
본 발명의 점착시트는 상기의 점착제 조성물로부터 얻어진 점착제층을 기재상에 형성시켜 얻는 것을 특징으로 한다.The adhesive sheet of this invention is obtained by forming the adhesive layer obtained from the said adhesive composition on a base material.
이하, 본 발명의 점착제 조성물 및 점착시트에 대해 구체적으로 설명한다.Hereinafter, the adhesive composition and the adhesive sheet of this invention are demonstrated concretely.
본 발명의 점착제 조성물은,The pressure-sensitive adhesive composition of the present invention,
아크릴계 공중합체 (A)와,An acrylic copolymer (A),
에너지선 중합성 우레탄아크릴레이트올리고머 (B)와,Energy ray-polymerizable urethane acrylate oligomer (B),
분자내에 1개의 아크릴로일기 또는 메타아크릴로일기를 갖는 에너지선 중합성 화합물 (C)를 포함하는 것을 특징으로 한다.It is characterized by including the energy-beam polymerizable compound (C) which has one acryloyl group or a methacryloyl group in a molecule | numerator.
이 점착제 조성물은 필요에 따라 가소제 (D), 가교제 (E), 광중합 개시제 (F)를 더 함유할 수 있다.This adhesive composition can further contain a plasticizer (D), a crosslinking agent (E), and a photoinitiator (F) as needed.
아크릴계 공중합체 (A)Acrylic Copolymer (A)
아크릴계 공중합체 (A)는 종래부터 점착제로서 범용되어 오고 있으며, 구체적으로 (메타)아크릴산에스테르를 주된 구성 단량체 단위로 하는 단독 중합체 및 공중합체 또는 이들의 혼합물이 사용될 수 있다. 여기서 (메타)아크릴산에스테르로서는 알킬기의 탄소수가 1~18인 (메타)아크릴산알킬에스테르가 바람직하다. 또한 이들 단량체 외에도 초산비닐, 스티렌, 염화비닐 등이 공중합될 수 있다.Acrylic copolymer (A) has conventionally been used as a pressure-sensitive adhesive, and specifically, homopolymers and copolymers or mixtures thereof having (meth) acrylic acid ester as the main constituent monomer unit can be used. As (meth) acrylic acid ester, the (meth) acrylic-acid alkylester whose carbon number of an alkyl group is 1-18 here is preferable. In addition to these monomers, vinyl acetate, styrene, vinyl chloride, and the like may be copolymerized.
아크릴계 공중합체 (A)의 분자량은 20만 이상, 바람직하게는 40만~200만, 특히 바람직하게는 120만~170만이다. 또한 아크릴계 공중합체 (A)의 글래스 전이온도는 통상 -10℃이하, 바람직하게는 -70~-20℃ 정도이며, 상온(23℃)에서는 점착성을 갖는다.The molecular weight of an acrylic copolymer (A) is 200,000 or more, Preferably it is 400,000-2 million, Especially preferably, it is 1.2 million-1.7 million. Moreover, the glass transition temperature of an acryl-type copolymer (A) is usually -10 degrees C or less, Preferably it is about -70--20 degreeC, and has adhesiveness at normal temperature (23 degreeC).
상기의 아크릴계 공중합체는 1종 단독 또는 2종 이상을 조합하여 사용할 수 있다.Said acrylic copolymer can be used individually by 1 type or in combination of 2 or more types.
에너지선 중합성 우레탄아크릴레이트올리고머 (B)Energy-ray polymerizable urethane acrylate oligomer (B)
본 발명에서 사용될 수 있는 에너지선 중합성 우레탄아크릴레이트올리고머 (B)는 에너지선 중합성의 이중결합을 갖는 우레탄아크릴레이트올리고머이며, 구체적으로는 폴리에스테르형 또는 폴리에테르형 등의 폴리올 화합물과 다가 이소시아네이트 화합물 예를 들어 2,4-토릴렌디이소시아네이트, 2,6-토릴렌디이소시아네이트, 1,3-크실리렌디이소시아네이트, 1,4-크실리렌디이소시아네이트, 디페닐메탄-4,4-디이소시아네이트 등을 반응시켜 얻을 수 있는 말단 이소시아네이트우레탄프리폴리머에 히드록실기를 갖는 아크릴레이트 또는 메타아크릴레이트 예를 들어 2-히드록시에틸아크릴레이트 또는 2-히드록시에틸메타아크릴레이트, 2-히드록시프로필아크릴레이트, 2-히드록시프로필메타아크릴레이트, 폴리에틸렌글리콜아크릴레이트, 폴리에틸렌글리콜메타아크릴레이트 등을 반응시켜 얻을 수 있다.The energy ray-polymerizable urethane acrylate oligomer (B) which can be used in the present invention is a urethane acrylate oligomer having an energy ray-polymerizable double bond, and specifically, a polyol compound such as polyester type or polyether type and a polyhydric isocyanate compound For example, 2, 4- toylene diisocyanate, 2, 6- toylene diisocyanate, 1, 3- xylene diisocyanate, 1, 4- xylene diisocyanate, diphenylmethane-4, 4- diisocyanate, etc. are reacted. Acrylates or methacrylates having hydroxyl groups in the terminal isocyanateurethane prepolymers obtainable by, for example, 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2- Hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol By reacting such as other acrylates it can be obtained.
이와 같은 에너지선 중합성 우레탄아크릴레이트올리고머 (B)의 분자량은 500이상, 바람직하게는 3,000~30,000, 특히 바람직하게는 5,000~20,000이다. 더욱이 에너지선 중합성 우레탄아크릴레이트올리고머 (B)중에는 1 분자 내에 통상 2~10개, 바람직하게는 2~6개, 특히 바람직하게는 2~4개의 에너지선 중합성 불포화기가 함유되어 있다.The molecular weight of such energy ray-polymerizable urethane acrylate oligomer (B) is 500 or more, Preferably it is 3,000-30,000, Especially preferably, it is 5,000-20,000. Furthermore, in the energy ray polymerizable urethane acrylate oligomer (B), usually 2 to 10, preferably 2 to 6, and particularly preferably 2 to 4 energy ray polymerizable unsaturated groups are contained in one molecule.
에너지선 중합성 화합물 (C)Energy ray polymerizable compound (C)
본 발명에서 사용되는 에너지선 중합성 화합물 (C)는 분자 내에 1개의 아크릴로일기 또는 메타아크릴로일기를 갖는 모노머 또는 올리고머이고 구체적으로는 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 벤질(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 부톡시에틸(메타)아크릴레이트, N,N-디메틸아미노에틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴레이트, 메톡시에틸렌글리콜(메타)아크릴레이트, 글리시딜(메타)아크릴레이트, 이소데실(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 테트라히드로푸르푸릴(메타)아크릴레이트, 메틸롤(메타)아크릴아미드, (메타)아크릴아미드, 폴리스티릴에틸(메타)아크릴레이트, 몰포릴(메타)아크릴레이트 등을 예로 들 수 있다.The energy ray-polymerizable compound (C) used in the present invention is a monomer or oligomer having one acryloyl group or methacryloyl group in the molecule, and specifically methyl (meth) acrylate, ethyl (meth) acrylate, benzyl (Meth) acrylate, cyclohexyl (meth) acrylate, butoxyethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxy Ethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate, glycidyl (meth) acrylate, isodecyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, Tetrahydrofurfuryl (meth) acrylate, methylol (meth) acrylamide, (meth) acrylamide, polystyrylethyl (meth) acrylate, morpholyl (meth) acrylate, and the like.
점착제조성물에 있어서 성분 (A)~(C)의 사용량은 임의로 설정할 수 있다. 이하 고형분의 중량부로 나타내면 성분 (A) 100중량부에 대해 성분 (B)는 예를 들어 10~300중량부, 바람직하게는 60~200중량부, 특히 바람직하게는 90~150중량부이다. 성분 (C)는 성분 (A) 100중량부에 대해 예를 들어 10~300중량부, 바람직하게는 20~150중량부, 특히 바람직하게는 60~120중량부이다.The usage-amount of components (A)-(C) in an adhesive composition can be set arbitrarily. In the following description, the component (B) is, for example, 10 to 300 parts by weight, preferably 60 to 200 parts by weight, and particularly preferably 90 to 150 parts by weight based on 100 parts by weight of the component (A). The component (C) is, for example, 10 to 300 parts by weight, preferably 20 to 150 parts by weight, particularly preferably 60 to 120 parts by weight based on 100 parts by weight of the component (A).
이와 같이 본 발명의 점착제 조성물은 에너지선을 조사한 후에는 고무탄성을 유지하면서도 점착력이 격감한다. 에너지선으로는 구체적으로 자외선, 전자선 등을 사용할 수 있다. 그 조사량은 에너지선의 종류에 따라 달라지며, 예를 들어 자외선을 사용하는 경우에는 40~200W/cm 정도가 바람직하고, 전자선을 사용하는 경우에는 10~1,000krad 정도가 바람직하다. 이와 같은 에너지선의 조사에 의해 접착력은 겸감한다. 예를 들면 반도체 웨이퍼 경면에 대한 접착력은 에너지선의 조사 전에는 100~2,000g/25mm 정도인 것에 비해, 조사 후에는 조사 전의 1~50% 정도로 조절이 가능하다. 한편 탄성률은 에너지선을 조사하기 전에는 105~106dyne/cm2정도인 것에 비해, 조사 후에는 106~108dyne/cm2정도이고, 에너지선을 조사한 후에도 탄성을 유지할수 있게 된다.Thus, after the adhesive composition of this invention irradiates an energy ray, adhesive force falls significantly, maintaining rubber elasticity. Specifically, an ultraviolet ray, an electron beam, etc. can be used as an energy ray. The dose varies depending on the type of energy ray, for example, about 40 to 200 W / cm is preferable when using ultraviolet rays, and about 10 to 1,000 krad is preferable when using electron beams. By the irradiation of such energy rays, the adhesive force is modest. For example, the adhesive force to the mirror surface of the semiconductor wafer is about 100 to 2,000 g / 25 mm before the irradiation of the energy ray, but can be adjusted to about 1 to 50% after the irradiation. On the other hand, the modulus of elasticity is about 10 5 to 10 6 dyne / cm 2 before the irradiation with energy rays, and about 10 6 to 10 8 dyne / cm 2 after the irradiation, and the elasticity can be maintained even after irradiation with the energy rays.
가소제 (D)Plasticizer (D)
본 발명에는 (A)~(C)에 첨가하여 가소제 (D)를 더 함유할 수 있다. 이 가소제는 분자 내에 광중합성 불포화결합을 함유하지 않고, 경화 후의 점착제 탄성을 낮게하는 화합물이며, 구체적으로는In addition to (A)-(C), this invention can contain a plasticizer (D) further. This plasticizer is a compound which does not contain a photopolymerizable unsaturated bond in a molecule | numerator, and lowers the adhesive elasticity after hardening, Specifically,
프탈산디메틸, 프탈산디에틸, 프탈산디-2-에틸헥실, 프탈산디-n-옥틸, 프탈산디노닐 등의 프탈산에스테르계 가소제,Phthalate ester plasticizers such as dimethyl phthalate, diethyl phthalate, di-2-ethylhexyl phthalate, di-n-octyl phthalate and dinonyl phthalate,
숙신산디이소데실, 아디핀산디옥틸, 세바신산디옥틸 등의 지방산 2염기산에스테르계 가소제,Fatty acid dibasic ester plasticizers, such as succinic acid diisodecyl, dioctyl adipic acid, and dioctyl sebacinate,
디에틸렌글리콜디벤조에이트, 디펜타에리스리톨헥사에스테르 등의 글리콜 에스테르계 가소제,Glycol ester plasticizers such as diethylene glycol dibenzoate and dipentaerythritol hexaester;
폴리에틸렌글리콜-디-2-에틸헥소에이트, 폴리에틸렌글리콜-디-2-스테아레이트 등의 폴리에테르-에스테르계 가소제,Polyether ester plasticizers such as polyethylene glycol-di-2-ethylhexate and polyethylene glycol-di-2-stearate;
올레인산부틸, 아세틸리시놀산메틸 등의 지방산 에스테르계 가소제,Fatty acid ester plasticizers such as butyl oleate, methyl acetyl ricinoleate,
인산트리옥틸, 인산트리페닐 등의 인산에스테르계 가소제,Phosphate ester plasticizers, such as trioctyl phosphate and triphenyl phosphate,
에폭시대두유, 에폭시아마니유, 에폭시스테아린산부틸 등의 에폭시계 가소제, 아디핀산폴리프로필렌, 세바신산폴리프로필렌 등의 폴리에스테르계 가소제,Epoxy plasticizers such as epoxy soybean oil, epoxy armani oil, epoxy butyl stearate, polyester plasticizers such as adipic acid polypropylene, sebacic acid polypropylene,
그 외, 트리메리트산트리옥틸, 피로메리트산테트라옥틸 등의 가소제를 예로 들 수 있다.In addition, plasticizers, such as trimellitate trioctyl and pyromellitate tetraoctyl, are mentioned.
이들 가소제 중에서 특히 폴리에테르-에스테르계 가소제가 바람직하다.Among these plasticizers, polyether ester plasticizers are particularly preferable.
이상과 같은 가소제 (D)는 성분 (A) 100중량부에 대해 1~150중량부, 특히 5~50 중량부의 범위에서 사용하는 것이 바람직하다.It is preferable to use the above plasticizers (D) in 1-150 weight part, especially 5-50 weight part with respect to 100 weight part of components (A).
가교제 (E)Crosslinking agent (E)
본 발명의 점착제 조성물에는 필요에 따라 가교제 (E)를 더 첨가할 수 있다. 이와 같은 가교제로서는 구체적으로,A crosslinking agent (E) can be further added to the adhesive composition of this invention as needed. Specifically as such a crosslinking agent,
다가이소시아네이트의 폴리이소네이트 화합물 및 이들 폴리이소시아네이트 화합물의 3량체,Polyisocyanate compounds of polyisocyanates and trimers of these polyisocyanate compounds,
상기 폴리이소시아네이트 화합물과 폴리올 화합물을 반응시켜 얻을 수 있는 말단 이소시아네이트 우레탄프리폴리머,Terminal isocyanate urethane prepolymer obtained by making the said polyisocyanate compound and polyol compound react,
이들의 폴리이소시아네이트 화합물, 이들 폴리이소시아네이트 화합물의 3량체 또는 말단이소시아네이트우레탄프리폴리머를, 페놀, 옥심류 등으로 봉쇄한 블록화 폴리이소시아네이트 화합물을 예로 들 수 있다.The blocked polyisocyanate compound which sealed these polyisocyanate compounds, the trimer of these polyisocyanate compounds, or terminal isocyanate urethane prepolymer by phenol, an oxime, etc. is mentioned.
다가이소시아네이트의 구체적인 예로서는 2,4-토릴렌디이소시아네이트, 2,6-토릴렌디이소시아네이트, 1,3-크실리렌디이소시아네이트, 1,4-크실리렌디이소시아네이트, 디페닐메탄-4,4'-디이소시아네이트, 디페닐메탄-2,4'-디이소시아네이트, 3-메틸디페닐메탄디이소시아네이트, 헥사메틸렌디이소시아네이트, 이소포론디이소시아네이트, 디시클로헥실메탄-4,4'-디이소시아네이트, 디시클로헥실메탄-2,4'-디이소시아네이트, 리신이소시아네이트 등을 예로 들 수 있다.Specific examples of the polyisocyanate include 2,4-torylene diisocyanate, 2,6-torylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'-diisocyanate , Diphenylmethane-2,4'- diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexyl methane-4,4'- diisocyanate, dicyclohexyl methane- 2,4'- diisocyanate, a lysine isocyanate, etc. are mentioned.
가교제 (E)의 첨가량은, 성분 (A) 100중량부에 대해 0.1~10중량부, 특히 1~10중량부의 범위에서 사용하는 것이 바람직하다.It is preferable to use the addition amount of a crosslinking agent (E) in 0.1-10 weight part with respect to 100 weight part of components (A) especially 1-10 weight part.
광중합개시제(F)Photopolymerization Initiator (F)
또한 에너지선으로서 자외선을 사용하는 경우에는 상기의 조성물중에 광중합개시제(F)를 혼입하여 중합, 경화 시간 및 자외선 조사량을 낮추는 것이 가능하다.In addition, when using an ultraviolet-ray as an energy ray, it is possible to mix a photoinitiator (F) in the said composition, and to reduce superposition | polymerization, hardening time, and the amount of ultraviolet irradiation.
이와 같은 광중합 개시제 (F)로서는 구체적으로 벤조페논, 아세토페논, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인이소프로필에테르, 벤조인이소부틸에테르, 벤조인안식향산, 벤조인안식향산메틸, 벤조인디메틸케탈, 2,4-디에틸티오크산톤, 1-히드록시시클로헥실페닐케톤, 벤질디페닐술피드, 테트라메틸티우람모노술피드, 아조비스이소부티로니트릴, 벤질, 디벤질, 디아세틸, β-클로로안트라퀴논 등을 예로 들 수 있다. 광중합개시제 (F)는 (B)와 (C)의 합계 100중량부에 대해서 0.1~20중량부, 특히 2~10중량부의 범위에서 사용하는 것이 바람직하다.Specific examples of such a photopolymerization initiator (F) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoate, Benzoin dimethyl ketal, 2,4-diethyl thioxanthone, 1-hydroxycyclohexylphenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, Diacetyl, (beta) -chloro anthraquinone, etc. are mentioned. It is preferable to use a photoinitiator (F) in 0.1-20 weight part with respect to a total of 100 weight part of (B) and (C), especially 2-10 weight part.
본 발명의 점착제 조성물은 상기와 같은 아크릴계 공중합체 (A), 에너지선 중합성 우레탄아크릴레이트올리고머 (B), 에너지선 중합성 화합물 (C), 더욱 바람직하게는 가소제 (D), 필요에 따라 가교제 (E)와 광중합개시제 (F)를 첨가하고 통상의 방법으로 혼합하여 얻어진다.The pressure-sensitive adhesive composition of the present invention is an acrylic copolymer (A), energy ray-polymerizable urethane acrylate oligomer (B), energy ray-polymerizable compound (C), more preferably a plasticizer (D), and a crosslinking agent as necessary. It is obtained by adding (E) and a photoinitiator (F), and mixing by a conventional method.
본 발명의 점착제 조성물은 충분한 고무 탄성을 나타내고, 에너지선을 조사하기 전에는 피착체에 대해 충분한 감압 접착성과 초기 접착성을 갖는다. 한편 에너지선을 조사한 후에는 고무탄성을 유지하면서 피착체에 대한 접착력이 격감하고, 점착제의 잔류 없이 피착체로부터 제거하는 것이 가능하다. 그러므로 본 발명의 점착제 조성물은 첩부 후의 박리를 전제로 한 용도에 유용하게 사용할 수 있다.The adhesive composition of this invention shows sufficient rubber elasticity, and has sufficient pressure-sensitive adhesiveness and initial adhesiveness with respect to a to-be-adhered body before irradiating an energy ray. On the other hand, after irradiating an energy ray, the adhesive force with respect to a to-be-adhered body deteriorates, maintaining rubber elasticity, and it can remove from an adherend without remaining an adhesive. Therefore, the adhesive composition of this invention can be usefully used for the use on the premise of peeling after sticking.
점착 시트Adhesive sheet
본 발명의 점착시트는 전술한 점착제 조성물로부터 이루어지는 점착제층으로 도포된 기재를 포함한다. 본 발명의 점착시트는 그 점착제 조성물을 콤마 코터, 그라비아 코터, 다이 코터, 리버스 코터 등을 이용해서 일반적인 공지의 방법으로 각종 기재상에 적당한 두께로 도포하고 건조시켜 점착제층을 형성하고, 다음으로 필요에 따라 점착제층상에 이형시트를 부착시킴으로써 얻어진다.The adhesive sheet of this invention contains the base material apply | coated with the adhesive layer which consists of the above-mentioned adhesive composition. In the pressure-sensitive adhesive sheet of the present invention, the pressure-sensitive adhesive composition is coated on a variety of substrates by appropriate thickness using a comma coater, gravure coater, die coater, reverse coater, etc., and dried to form a pressure-sensitive adhesive layer. It is obtained by adhering a release sheet on the pressure-sensitive adhesive layer.
점착제층의 두께는 용도에 따라 다르지만 통상 1~100㎛, 바람직하게는 5~50㎛, 특히 바람직하게는 10~30㎛ 정도이다. 또한 기재의 두께는 통상 10~300㎛, 바람직하게는 20~200㎛, 특히 바람직하게는 50~150㎛ 정도이다.Although the thickness of an adhesive layer changes with uses, it is 1-100 micrometers normally, Preferably it is 5-50 micrometers, Especially preferably, it is about 10-30 micrometers. Moreover, the thickness of a base material is 10-300 micrometers normally, Preferably it is 20-200 micrometers, Especially preferably, it is about 50-150 micrometers.
본 발명의 점착시트의 형상은 테이프상, 라벨상 등이 있다.The shape of the adhesive sheet of this invention is a tape form, a label form, etc.
기재로서는 장방향 및 폭방향에 연신성을 갖는 합성수지 필름을 사용하는 것이 바람직하다.As a base material, it is preferable to use the synthetic resin film which has elongation in the longitudinal direction and the width direction.
이와 같은 본 발명의 점착시트를 피착체에 첩부 후 에너지선을 조사하면 접착력이 격감한다. 그러므로 점착제의 잔사가 피착체에 잔류하는 것 없이 피착체로부터 점착시트를 제거할 수 있다.When the adhesive sheet of this invention is affixed on a to-be-adhered body, when an energy ray is irradiated, adhesive force will fall. Therefore, the adhesive sheet can be removed from the adherend without the residue of the adhesive remaining on the adherend.
따라서 본 발명의 점착시트는 첩부 후의 박리를 전제로 한 용도에 매우 유용하게 쓰일 수 있으며, 예를 들어 반도체가공용 또는 표면보호용 점착시트로서 사용할 수 있다.Therefore, the pressure-sensitive adhesive sheet of the present invention can be used very usefully for applications on the premise of peeling after sticking, and can be used, for example, as a pressure-sensitive adhesive sheet for semiconductor processing or surface protection.
표면보호용 점착시트는 화장판, 유리판, 금속판, 프라스틱판 등의 표면에 첩부시켜 운송중, 가공중에 표면이 오염되거나 손상을 입게 되는 것으로부터 보호해 준다. 보호가 필요없어지면 에너지선을 조사함으로써 쉽게 박리할 수 있다.Surface-protective adhesive sheets are attached to surfaces such as decorative boards, glass plates, metal plates, and plastic plates to protect the surfaces from being contaminated or damaged during transportation and processing. If protection is not needed, it can be easily peeled off by irradiating energy rays.
또한 반도체 가공용 접착시트는 웨이퍼의 이면 연마시 또는 다이싱시 등에 이용할 수 있다.Moreover, the adhesive sheet for semiconductor processing can be utilized at the time of back surface grinding | polishing of a wafer, dicing, etc.
반도체 웨이퍼 표면에는 다수의 회로가 형성되어 있으며, 1개의 회로마다 절단, 분리(다이싱)하여 반도체 칩이 제조되고 있다. 이때 웨이퍼의 두께가 분균일하거나, 이면에 산화피막이 형성되어 있으면 제조된 칩의 성능에 편차가 발생하게 된다. 이때문에 웨이퍼공정의 종료 후 웨이퍼의 이면을 연마하지만, 연마 가루에 의해 회로가 손상을 입는 경우가 있다. 이와 같은 경우에 본 발명의 점착시트를 웨이퍼 표면에 첩착해주면 회로의 손상을 방지할 수 있다. 그래도 에너지선을 조사함으로써 점착제의 잔류 없이 쉽게 점착시트를 박리할 수 있어서 웨이퍼 오염을 일으키지 않는다.Many circuits are formed on the surface of a semiconductor wafer, and a semiconductor chip is manufactured by cutting | disconnecting and dicing (dicing) every single circuit. At this time, if the thickness of the wafer is uniform or an oxide film is formed on the back surface, a variation occurs in the performance of the manufactured chip. For this reason, although the back surface of a wafer is polished after completion | finish of a wafer process, a circuit may be damaged by abrasive powder. In such a case, if the adhesive sheet of the present invention is attached to the wafer surface, damage to the circuit can be prevented. Nevertheless, by irradiating energy rays, the pressure sensitive adhesive sheet can be easily peeled off without remaining of the pressure sensitive adhesive and does not cause wafer contamination.
마찬가지로 웨이퍼의 다이싱 시에는 절삭 가루에 의해 회로가 손상을 입는 경우가 있으며, 이와 같은 경우에도 본 발명의 점착시트에 의해 회로를 보호할 수 있다. 더욱이 다이싱 시에 웨이퍼를 안정하게 유지해 주므로 본 발명의 점착시트를웨이퍼 표면에 첩부해서 웨이퍼를 고정하는 것도 가능하다. 이와 같이 본 발명의 접착시트를 사용하면 에너지선의 조사 전에는 충분한 접착력으로 웨이퍼를 유지할 수 있고, 다이싱 후 에너지선을 조사하면 접착력이 격감하므로, 점착제에 의한 오염 없이 반도체 칩을 쉽게 픽업할 수 있다. 그래도 에너지선의 조사 후의 점착제층은 고무탄성을 유지하므로 확장하는 공정에서 시트가 전체적으로 충분히 균일하게 늘어난다. 이로 인해 칩 간격을 넓게 하는 것이 가능하고, 칩의 픽업이 더욱 쉬워진다.Similarly, when dicing a wafer, the circuit may be damaged by the cutting powder, and even in such a case, the circuit can be protected by the adhesive sheet of the present invention. Furthermore, since the wafer is stably held during dicing, the adhesive sheet of the present invention can be affixed on the wafer surface to fix the wafer. As described above, when the adhesive sheet of the present invention is used, the wafer can be held with sufficient adhesive force before the irradiation of the energy ray, and the adhesive force decreases when the energy ray is irradiated after dicing, so that the semiconductor chip can be easily picked up without contamination by the adhesive. Nevertheless, the pressure-sensitive adhesive layer after irradiation with energy rays maintains rubber elasticity, so that the sheet is sufficiently uniformly stretched as a whole during the expansion process. This makes it possible to widen the chip spacing, making chip pick-up easier.
본 발명의 점착시트의 기재로서는 특별히 제한은 없지만 예를 들어 에너지선으로 자외선을 이용하는 경우에는 폴리에틸렌필름, 폴리프로필렌필름, 폴리부텐필름, 폴리부타디엔필름, 폴리메틸펜텐필름, 폴리염화비닐필름, 염화비닐공중합체필름, 폴리에틸렌테레프탈레이트필름, 폴리부틸렌테레프탈레이트필름, 폴리우레탄필름, 에틸렌/비닐아세테이트 공중합체필름, 아이오노머수지필름, 에틸렌/(메타)아크릴산공중합체필름, 에틸렌/(메타)아크릴산에스테르공중합체필름, 폴리스티렌필름, 폴리카보네이트필름 등의 투명필름이 사용된다. 또한 이들의 가교필름도 사용된다. 이들의 적층필름이어도 좋다.Although there is no restriction | limiting in particular as base material of the adhesive sheet of this invention, For example, when ultraviolet rays are used as an energy ray, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethyl pentene film, a polyvinyl chloride film, a vinyl chloride Copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene / vinylacetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester Transparent films such as copolymer films, polystyrene films, and polycarbonate films are used. Moreover, these crosslinked films are also used. These laminated films may be sufficient.
또한 에너지선으로서 전자선을 사용하는 경우에는 투명할 필요는 없으므로 상기의 투명필름 외에 이들을 착색한 불투명 필름, 불소 수지필름 등을 사용할 수 있다.In addition, when using an electron beam as an energy ray, since it does not need to be transparent, an opaque film, a fluororesin film, etc. which colored these other than the said transparent film can be used.
상기의 점착제층 중에는 일본특허공개 62(1987)-153,377호 공보에 개시된 에너지선의 조사에 의해 착색된 화합물을 더 함유시키거나, 일본특허공개 62(1987)-153375호 공보에 개시된 에너지선 산란성 무기화합물 분말을 더 함유시킬 수 있다.The pressure-sensitive adhesive layer further contains a compound colored by irradiation with energy rays disclosed in Japanese Patent Application Laid-Open No. 62 (1987) -153,377, or an energy ray scattering inorganic compound disclosed in Japanese Patent Application Laid-Open No. 62 (1987) -153375. The powder may be further contained.
아울러 상기의 점착층 중에 대전 방지제를 첨가할 수 있다. 대전방지제를 첨가함으로써 확장공정시 또는 픽업공정시에 발생하는 정전기를 억제할 수 있어 칩의 신뢰성이 증가한다. 대전방지제로서는 구체적으로 음이온성, 양이온성, 비이온성 내지는 양이온성의 일반적으로 공지의 물질들인 계면활성제; 및 카본블랙, 은, 니켈, 안티몬 첨가 주석산화물, 주석 첨가 인듐산화물같은 분체 등이 이용된다. 대전방지제는 점착제층에 0~50중량%, 특별히는 0~30중량%의 범위에서 사용하는 것이 바람직하다.In addition, an antistatic agent can be added to the said adhesion layer. By adding an antistatic agent, the static electricity generated during the expansion process or the pickup process can be suppressed, thereby increasing the reliability of the chip. Antistatic agents include, in particular, surfactants which are generally known materials which are anionic, cationic, nonionic or cationic; And powders such as carbon black, silver, nickel, antimony added tin oxide, tin added indium oxide, and the like. It is preferable to use an antistatic agent in 0-50 weight%, especially 0-30 weight% in an adhesive layer.
아울러 본 발명에는 일본특허공개 63(1988)-205,382호 공보 및 일본특허공개 63(1988)-205,383 공보에 개시되어 있는 것과 같이 기재중에 숫돌 가루가 분산되어 있어도 좋다.Further, in the present invention, grindstone powder may be dispersed in the substrate as disclosed in Japanese Patent Application Laid-Open No. 63 (1988) -205,382 and Japanese Patent Application Laid-Open No. 63 (1988) -205,383.
본 발명의 점착시트에 에너지선을 조사하면 점착력이 상당히 저하되어 웨이퍼칩을 쉽게 점착시트로부터 픽업할 수 있다. 또한 어느 정도의 고무 탄성을 유지할 수 있어서 확장공정에서 원하는 칩 간격을 얻을 수 있고 아울러 칩의 엇갈림 등도 발생하지 않아서 픽업을 안정하게 행할 수 있게 된다.When the energy ray is irradiated onto the pressure sensitive adhesive sheet of the present invention, the adhesive force is considerably lowered, so that the wafer chip can be easily picked up from the pressure sensitive adhesive sheet. In addition, it is possible to maintain a certain degree of rubber elasticity to obtain a desired chip spacing in the expansion process, and also to prevent pick-up and chipping, so that pickup can be performed stably.
이상 설명한 것과 같이 본 발명의 점착제 조성물은 충분한 고무탄성을 보이고, 에너지선을 조사하기 전에는 피착체에 대해 충분한 감압접착성과 초기접착성을 가지며, 에너지선을 조사한 후에는 고무탄성을 유지하면서, 피착체에 대한 접착력이 격감하고, 점착제의 잔류없이 제거할 수 있다. 더욱이 에너지선을 조사한 후의 확장시에 있어서는 칩 정렬성이 우수하다. 그러므로 본 발명의 점착제 조성물은,첩부 후의 박리를 전제로 한 용도, 예를 들면 웨이퍼가공용 또는 표면 보호용 점착시트에 유용하게 사용할 수 있다.As described above, the pressure-sensitive adhesive composition of the present invention exhibits sufficient rubber elasticity, has sufficient pressure-sensitive adhesiveness and initial adhesiveness to the adherend before irradiating energy rays, and maintains rubber elasticity after irradiating energy rays. The adhesive force to is drastically reduced and can be removed without remaining of the pressure-sensitive adhesive. Furthermore, the chip alignment property is excellent at the time of expansion after irradiating an energy ray. Therefore, the adhesive composition of this invention can be usefully used for the use on the premise of peeling after sticking, for example, a wafer process or an adhesive sheet for surface protections.
이하 본 발명을 실시예에 의해 설명하지만 본 발명이 이들 실시예에 한정되는 것은 아니다.EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.
실시예Example
이하의 실시예 및 비교예에 있어서, "180°박리점착력", "칩 정렬성"은 다음과 같이 평가하였다.In the following examples and comparative examples, "180 ° peeling force" and "chip alignment" were evaluated as follows.
180°박리점착력180 ° peeling strength
실시예 및 비교예에서 얻어진 점착시트를 23℃, 65% RH의 분위기에서 반도체 웨이퍼 경면에 2kg 고무롤러를 왕복시킴으로써 첩부하고 30분간 방치한 후, 만능형인장시험기(주식회사 오리엔텍제, TENSILON/UTM-4-100)을 이용해서 박리속도 300mm/분으로 180°박리점착력을 측정하였다. 또한 같은 조건에서 첩부, 방치 후 기재시트 측으로부터 고압수은 램프(220mW/cm2)로 조사거리 10cm, 라인속도 5(m/분)으로 자외선을 조사한 후, 마찬가지로 180°박리점착력을 측정하였다.The pressure-sensitive adhesive sheets obtained in Examples and Comparative Examples were affixed by reciprocating 2 kg rubber rollers on a mirror surface of a semiconductor wafer in an atmosphere of 23 ° C. and 65% RH, and allowed to stand for 30 minutes. -4-100) was used to measure the 180 ° peeling force at a peel rate of 300 mm / min. In addition, under the same conditions, after irradiation with ultraviolet light at an irradiation distance of 10 cm and a line speed of 5 (m / min) with a high-pressure mercury lamp (220 mW / cm 2 ) from the base sheet side, the 180 ° peeling force was similarly measured.
칩 정렬성Chip alignment
점착시트를 6인치 실리콘웨이퍼 및 고리(ring) 프레임에 첩부한 후, 다이사(DISCO사 제)를 사용해서 12mm2칩으로 다이싱하였다. 이때 사용한 블레이드는 27HECC 2050(DISCO사 제)이고, 테프에 잘려들어가는 양은 30㎛였다. 다이싱 후의 시료에 테프 뒷면으로 자외선(220mW/cm2, 160mJ/cm2)을 조사하였다. 다음으로 확장치구로서 CPS-100AS 확장유닛(니치덴기계 제)을 사용해서 시트를 17mm 확장하였다. 이 경우 칩의 정렬성을 육안 및 칩 간격의 측정에 의해 판정하였다. 칩 간격의 측정은 다음과 같이 행하였다.The adhesive sheet was affixed on a 6-inch silicon wafer and a ring frame, and then diced with a 12 mm 2 chip using a die yarn (manufactured by DISCO). The blade used at this time was 27HECC 2050 (made by DISCO), and the amount cut into the tape was 30 µm. The sample after dicing was irradiated with ultraviolet (220 mW / cm 2 , 160 mJ / cm 2 ) to the back side of the tape. Next, the sheet was expanded 17 mm using the CPS-100AS expansion unit (manufactured by Nichiden Machinery) as the expansion jig. In this case, the alignment of chips was determined by visual observation and measurement of chip spacing. The chip spacing was measured as follows.
실리콘웨이퍼의 평면 내에 있어서, 오리엔테이션 플랫(flat)에 대해 수직인 X축과 오리엔테이션 플랫에 대해 평행한 Y축 각각의 방향으로 실리콘웨이퍼의 중심부분을 지나는 임의의 1열의 칩 간격을 모두 측정하고 그 평균치를 칩 간격 x로 하여 표준편차(σn-1)를 정렬성을 나타내는 값으로 하였다. 여기서 표준편차가 작을수록 칩 간격의 흐트러짐이 적고 정렬성은 양호하며 픽업시에 오동작을 일으키는 경우가 없게 된다.In the plane of the silicon wafer, measure all the chip spacings of any one row across the center of the silicon wafer in the direction of each of the X axis perpendicular to the orientation flat and the Y axis parallel to the orientation flat and average The standard deviation (σn -1 ) was made into the value which shows alignment property, making X into chip space x. In this case, the smaller the standard deviation, the less the chip gap, the better the alignment, and the less the malfunction occurs during pickup.
이하의 실시예에서 아크릴계 공중합체 (A), 에너지선 중합성우레탄아크릴레이트올리고머 (B), 에너지선 중합성 화합물 (C), 가소제 (D), 가교제 (E) 및 광중합개시제 (F)로서 다음과 같은 것을 사용하였다.In the following examples, the acrylic copolymer (A), the energy ray polymerizable urethane acrylate oligomer (B), the energy ray polymerizable compound (C), the plasticizer (D), the crosslinking agent (E) and the photopolymerization initiator (F) The same thing was used.
아크릴계 공중합체 (A)Acrylic Copolymer (A)
(A) : 부틸아크릴레이트와 2-히드록시에틸아크릴레이트의 공중합체, 분자량=15 ×105 (A): copolymer of butyl acrylate and 2-hydroxyethyl acrylate, molecular weight = 15 x 10 5
에너지선 중합성우레탄아크릴레이트올리고머 (B)Energy-ray polymerizable urethane acrylate oligomer (B)
(B) : 분자량=10,000, 관능기수=3(B): molecular weight = 10,000, functional number = 3
에너지선 중합화합물 (C)Energy Ray Polymerization Compound (C)
(C) : 테트라히드로푸르푸릴아크릴레이트, 분자량=270, 관능기수=1(C): tetrahydrofurfuryl acrylate, molecular weight = 270, number of functional groups = 1
가소제 (D)Plasticizer (D)
(D) : 에테르에스테르계 가소제, 분자량=500(D): ether ester plasticizer, molecular weight = 500
가교제 (E)Crosslinking agent (E)
(E) : 폴리이소시아네이트계 가교제(E): polyisocyanate crosslinking agent
광중합개시제 (F)Photopolymerization Initiator (F)
(F) : 벤조페논계 광중합개시제(F): Benzophenone type photoinitiator
실시예 1Example 1
상기 성분 (A) 100 중량부, (B) 120중량부, (C) 80중량부, (E) 3.5중량부, (F) 9중량부를 혼합하여 점착제 조성물을 얻었다. 이 점착제 조성물을 건조 후의 도포두께가 10㎛가 되도록, 80㎛ 두께의 폴리염화비닐필름에 도포한 후, 100℃에서 1분간 건조하여 점착시트를 얻었다.100 weight part of said components (A), 120 weight part of (B), 80 weight part of (C), 3.5 weight part of (E), and 9 weight part of (F) were mixed, and the adhesive composition was obtained. After apply | coating this adhesive composition to the polyvinyl chloride film of 80 micrometers thickness so that the application thickness after drying might be set to 10 micrometers, it dried at 100 degreeC for 1 minute, and obtained the adhesive sheet.
얻어진 점착시트를 사용해서 "180°박리점착력" 및 "칩 정렬성"을 상기와 같이 해서 평가했다. 결과를 표1에 기재하였다. 제1도에 확장시 칩의 배열을 도시하였다."180 degree peeling force" and "chip alignment property" were evaluated as mentioned above using the obtained adhesive sheet. The results are shown in Table 1. Figure 1 shows the arrangement of the chip upon expansion.
실시예 2Example 2
실시예 1에 상기 성분 (D)를 15중량부를 첨가한 이외에는 실시예 1과 같은 조작을 행하였다. 결과를 표1에 기재하였다. 제2도에 확장시 칩의 배열을 도시하였다.The same operation as in Example 1 was performed except that 15 parts by weight of the component (D) was added to Example 1. The results are shown in Table 1. 2 shows the arrangement of chips upon expansion.
비교예 1Comparative Example 1
실시예 1의 성분 (C)를 첨가하지 않고, 성분 (A) 100중량부, (B) 120중량부,(E) 3.5중량부, (F) 5.5중량부를 혼합하여 얻은 점착제 조성물을 사용해서 실시예 1과 같은 조작을 행하였다. 결과를 표1에 기재하였다. 제3도에 확장시 칩의 배열을 도시하였다.It carries out using the adhesive composition obtained by mixing 100 weight part of components (A), 120 weight part (B), 3.5 weight part (E), and 5.5 weight part (F), without adding component (C) of Example 1. The same operation as in Example 1 was performed. The results are shown in Table 1. Figure 3 shows the arrangement of the chip upon expansion.
실시예 1~2와 비교예 1의 결과로부터, 실시예 1~2에 있어서는 표 1 및 제1도 및 제2도에 나타낸 것과 같이 자외선을 조사한 후의 점착력은 현저히 저하하고, 게다가 점착시트의 확장시에는 충분한 칩 간격을 얻을 수 있어서 칩의 정렬성도 양호하였다.From the results of Examples 1 and 2 and Comparative Example 1, in Examples 1 and 2, as shown in Tables 1 and 1 and 2, the adhesive strength after irradiating ultraviolet rays is remarkably lowered, and at the time of expansion of the adhesive sheet. Sufficient chip spacing was obtained, and chip alignment was also good.
이에 비해 비교예 1은 표1 및 제3도에 나타낸 바와 같이 자외선을 조사한 후의 점착력은 저하하지만 점착시트를 확장해도 칩의 간격이 불균일하여 픽업 시 오동작의 원인이 된다.On the contrary, in Comparative Example 1, as shown in Tables 1 and 3, the adhesive strength after irradiation with ultraviolet rays decreases, but even if the adhesive sheet is expanded, the chip spacing is uneven, which causes malfunctions during pickup.
표 1.Table 1.
제1도 : 제1도는 실시예 1의 점착시트를 사용한 칩의 확장시 배열을 나타낸 도면이다.FIG. 1: is a figure which shows the arrangement | positioning at the time of expansion of the chip | tip using the adhesive sheet of Example 1. FIG.
제2도 : 제2도는 실시예 2의 점착시트를 사용한 칩의 확장시 배열을 나타낸 도면이다.FIG. 2: is a figure which shows the arrangement | positioning at the time of expansion of the chip | tip using the adhesive sheet of Example 2. FIG.
제3도 : 제3도는 비교예 1의 점착시트를 사용한 칩의 확장시 배열을 나타낸 도면이다.FIG. 3: is a figure which shows the arrangement | positioning at the time of the expansion of the chip | tip using the adhesive sheet of the comparative example 1. FIG.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP8107328A JPH09291258A (en) | 1996-04-26 | 1996-04-26 | Tacky agent composition and tacky sheet using the same |
JP1996-107328 | 1996-04-26 |
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KR970070154A KR970070154A (en) | 1997-11-07 |
KR100427023B1 true KR100427023B1 (en) | 2005-01-31 |
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KR1019970015395A KR100427023B1 (en) | 1996-04-26 | 1997-04-24 | Adhesive composition and adhesive sheet using the same |
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US (1) | US5955512A (en) |
JP (1) | JPH09291258A (en) |
KR (1) | KR100427023B1 (en) |
GB (1) | GB2312429B (en) |
SG (1) | SG60057A1 (en) |
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- 1997-04-24 GB GB9708263A patent/GB2312429B/en not_active Expired - Fee Related
- 1997-04-24 US US08/847,560 patent/US5955512A/en not_active Expired - Lifetime
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KR101067519B1 (en) | 2003-03-17 | 2011-09-27 | 린텍 가부시키가이샤 | Pressuresensitive adhesive sheet for protecting surface and method for production thereof |
KR100929588B1 (en) * | 2007-09-06 | 2009-12-03 | 제일모직주식회사 | Photocurable composition for adhesive film formation and dicing die-bonding film comprising the same |
KR101888198B1 (en) | 2010-12-28 | 2018-08-13 | 닛토덴코 가부시키가이샤 | Radiation-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
KR20190017158A (en) | 2017-08-10 | 2019-02-20 | 애경화학 주식회사 | High molecular weight acrylic pressure sensitive adhesive composition for semiconductor wafers having non-adhesive property after uv curing |
Also Published As
Publication number | Publication date |
---|---|
US5955512A (en) | 1999-09-21 |
KR970070154A (en) | 1997-11-07 |
JPH09291258A (en) | 1997-11-11 |
GB2312429B (en) | 2000-02-02 |
SG60057A1 (en) | 1999-02-22 |
GB9708263D0 (en) | 1997-06-18 |
GB2312429A (en) | 1997-10-29 |
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