KR100362145B1 - Surface structure of electric contact and method of forming the contact - Google Patents

Surface structure of electric contact and method of forming the contact Download PDF

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KR100362145B1
KR100362145B1 KR1020010014629A KR20010014629A KR100362145B1 KR 100362145 B1 KR100362145 B1 KR 100362145B1 KR 1020010014629 A KR1020010014629 A KR 1020010014629A KR 20010014629 A KR20010014629 A KR 20010014629A KR 100362145 B1 KR100362145 B1 KR 100362145B1
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nickel
powder
diamond
conductor
contact portion
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KR1020010014629A
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Korean (ko)
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KR20020074687A (en
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신종천
정영배
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주식회사 아이에스시테크놀러지
주식회사 동준엔지니어링
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Abstract

PCB 접촉패드 또는 테스트소켓의 접촉터미널 등의 도체 접촉부에 있어서, 도체층 표면에 도포되어 있는 니켈과 다이아몬드의 혼합분말층과, 니켈과 다이아몬드의 혼합 분말 위에 형성되어 있는 니켈 및 금도금층으로 구성되며, 상기 혼합분말층의 니켈 분말은 도체 표면에 전기적으로 연결되도록 접합되어 있고, 상기 금도금층은 상기 니켈 분말과 전기적으로 연결되도록 접합되어, 도체 접촉부의 수명향상 및 접촉불량을 최소화하기 위한 도체 접촉부 표면구조 및 표면처리 방법이다.In a conductor contact portion such as a PCB contact pad or a contact terminal of a test socket, it is composed of a mixed powder layer of nickel and diamond coated on the surface of the conductor layer, and a nickel and gold plated layer formed on the mixed powder of nickel and diamond, The nickel powder of the mixed powder layer is bonded to be electrically connected to the surface of the conductor, and the gold plating layer is bonded to be electrically connected to the nickel powder, so that the conductor contact portion surface structure is minimized to improve the life and poor contact of the conductor contact portion. And surface treatment methods.

Description

도체 접촉부 표면구조 및 표면처리 방법{Surface structure of electric contact and method of forming the contact}Surface structure of electric contact and method of forming the contact}

본 발명은 PCB, 플렉시블 PCB, 테스트소켓 접촉터미널 등의 도체 접촉부(contact)에 니켈과 다이아몬드의 혼합분말을 도포하고 이 위에 니켈 및 금도금층을 형성하는 도체 접촉부 표면처리 방법 및 도체 접촉부에 관한 것이다.The present invention relates to a conductor contact surface treatment method and a conductor contact portion which apply a mixed powder of nickel and diamond to a conductor contact such as a PCB, a flexible PCB, a test socket contact terminal, and form a nickel and gold plated layer thereon.

일반적으로 반도체소자는 인쇄회로기판(PCB)이나 플렉시블 PCB(FPC)의 접촉패드에 납땜 부착된다. PCB 등의 접촉패드는 포토리소그라피 기법에 의해 동박면으로 형성되는데, 동박면을 그대로 접촉부로 사용하기도 하고 신뢰성 향상을 위하여동박면에 금도금을 하여 사용하기도 한다.In general, a semiconductor device is soldered to a contact pad of a printed circuit board (PCB) or a flexible PCB (FPC). Contact pads such as PCBs are formed on the copper foil surface by photolithography, and the copper foil surface may be used as a contact portion or gold plated on the copper foil to improve reliability.

한편, 반도체소자를 테스트하기 위해서는, 테스트할 반도체소자(device under test, DUT)를 테스트소켓(test socket)에 삽입하여야 한다. 따라서, 테스트소켓의 접촉터미널에 DUT의 리드(lead)가 빈번하게 삽입/분리된다. 테스트소켓의 접촉터미널에는 거의 필수적으로 금도금을 하여 접촉저항을 줄이도록 하고 있다.In order to test a semiconductor device, a semiconductor device to be tested (device under test, DUT) must be inserted into a test socket. Therefore, the lead of the DUT is frequently inserted / disconnected to the contact terminal of the test socket. The contact terminals of the test socket are almost always gold-plated to reduce the contact resistance.

종래의 PCB 등의 접촉패드나 테스트소켓의 접촉터미널 표면에 형성된 금도금층이 벗겨지면 동박층에 녹이 슬어 피막이 형성되어 접촉저항이 증가하게 되는 문제가 발생한다. 특히, 테스트소켓 접촉터미널에서와 같이 빈번하게 리드(lead) 삽입이 이루어지는 경우에는 접촉부위의 잦은 마찰로 인해 금도금층의 박리현상이 보다 쉽게 일어나게 되므로 접촉부에서의 접촉저항의 피해가 심각해진다. 또한, 영하 온도에서 행하는 저온시험시에는 테스트소켓의 접촉터미널과 반도체소자의 리드 사이의 접촉부에서 얼음막이 형성되어 접촉저항을 증가시키는 현상이 발생한다.When the gold plated layer formed on the contact pad of the conventional PCB or the contact terminal of the test socket is peeled off, the copper foil layer is rusted and a film is formed to increase the contact resistance. In particular, when the lead is frequently inserted, as in the test socket contact terminal, the peeling of the gold plated layer occurs more easily due to the frequent friction of the contact portion, thereby causing serious damage to the contact resistance at the contact portion. In addition, during the low temperature test conducted at minus temperature, an ice film is formed at the contact portion between the contact terminal of the test socket and the lead of the semiconductor element to increase the contact resistance.

따라서, 본 발명의 목적은 상기의 문제점을 해결하기 위한 것으로서, 도체 접촉부의 표면에 니켈과 다이아몬드의 혼합분말을 도포하고 이 위에 니켈 및 금도금층을 형성하여 상기 도체 접촉부를 표면처리하는 방법을 제공하는 것이며, 또 다른 목적은, 도체 접촉부에 니켈과 다이아몬드의 혼합분말층이 형성되고 이 위에 니켈 및 금도금층이 형성되어 있는 도체 접촉부를 제공하는 것이다.Accordingly, an object of the present invention is to solve the above problems, and to provide a method for surface treatment of the conductor contact by applying a mixed powder of nickel and diamond on the surface of the conductor contact portion and forming a nickel and gold plated layer thereon. Another object is to provide a conductor contact portion in which a mixed powder layer of nickel and diamond is formed on a conductor contact portion, and a nickel and gold plated layer is formed thereon.

도1은 본 발명의 PCB상의 도체접촉부에서의 표면처리 방법 예시도.1 is a view illustrating a surface treatment method in a conductor contact portion on a PCB of the present invention.

도2는 본 발명에 따른 도체접촉부를 PCB에 적용한 실시예의 측면도.2 is a side view of an embodiment in which the conductor contact portion according to the present invention is applied to a PCB.

도3은 본 발명의 PCB상의 도체접촉부에 반도체소자를 부착한 예시도.3 is an exemplary view in which a semiconductor element is attached to a conductor contact portion on a PCB of the present invention.

<도면부호의 설명><Description of Drawing>

자력선(2), PCB(20), PCB 접촉패드(10), 혼합분말층(12), 니켈 및 금도금층 (14), 반도체소자 리드(16), 반도체소자(18)Magnetic lines 2, PCB 20, PCB contact pads 10, mixed powder layer 12, nickel and gold plated layers 14, semiconductor device leads 16, semiconductor devices 18

상기의 목적을 달성하기 위하여, 본 발명에 따른 도체 접촉부의 표면처리방법은 도체 접촉부를 도금액 속에 담가 놓은 상태에서 니켈과 다이아몬드 혼합분말을 도금액에 투입하여, 상기 니켈과 다이아몬드 혼합분말을 도체 접촉부에 침전시킨 후 혼합분말이 도금액에 의해 도체 접촉부에 도금접합되도록 하는 단계, 도체 접촉부에 도포되어 있는 다이아몬드 분말과 도체 접촉부에 접합된 니켈에 금(Au) 도금을 하여 도체 접촉부와 니켈 분말과 금도금층이 전기적으로 연결되도록 접합하는 단계로 구성된다.In order to achieve the above object, the surface treatment method of the conductor contact portion according to the present invention is to put the nickel and diamond mixed powder in the plating solution in the state in which the conductor contact portion is immersed in the plating solution, to precipitate the nickel and diamond mixed powder to the conductor contact portion After the mixed powder is plated and bonded to the conductor contact portion by the plating solution, the diamond powder applied to the conductor contact portion and nickel bonded to the conductor contact portion are plated with gold (Au) to electrically connect the conductor contact portion, the nickel powder and the gold plating layer. It is composed of a step of bonding to be connected.

또한, 본 발명에 따른 도체 접촉부의 표면처리 방법은 표면처리할 도체 접촉부에 자력을 인가한 상태에서 도체 접촉부에 니켈과 다이아몬드 혼합분말을 뿌리는 단계, 니켈과 다이아몬드 혼합분말을 브러시로 쓸어내어 자력이 인가되는 이외의 부분에 묻은 분말을 제거하는 단계, 니켈과 다이아몬드 분말이 도포되어 있는 도체 접촉부에 자력을 계속 인가하는 상태에서 도체 접촉부를 도금액 속에 투입하여 도체 접촉부에 혼합분말이 도금접합되도록 하는 단계, 도체 접촉부에 도포되어 있는 다이아몬드 분말과 도체 접촉부에 접합된 니켈에 금도금을 하여 도체 접촉부와 니켈 분말과 금도금층이 전기적으로 연결되도록 접합하는 단계로도 구성된다.In addition, in the method for surface treatment of a conductor contact portion according to the present invention, the step of spraying the nickel and diamond mixed powder in the conductor contact portion in the state in which the magnetic force is applied to the conductor contact to be surface-treated, by sweeping the nickel and diamond mixed powder with a brush Removing the powder deposited on a portion other than the applied portion; injecting the conductive contact portion into the plating liquid while the magnetic force is continuously applied to the conductive contact portion on which the nickel and diamond powders are applied; Diamond plating applied to the conductor contact portion and nickel bonded to the conductor contact portion are also gold-plated to bond the conductor contact portion, the nickel powder and the gold plated layer to be electrically connected.

이하, 본 발명에 따른 도체 접촉부의 표면처리 방법의 실시예를 PCB상의 도체접촉부에서의 표면처리 방법 예시도인 도1을 참조하여 설명한다.Hereinafter, an embodiment of the surface treatment method of the conductor contact portion according to the present invention will be described with reference to FIG.

우선, 첫번째 방법은, PCB(20)의 도체 접촉부인 접촉패드(10)를 도금액 속에 담가 놓은 상태에서 니켈과 다이아몬드의 혼합분말(12)을 도금액에 투입한다. 이때, 투입되는 니켈과 다이아몬드의 혼합분말(12)의 양은 접촉패드(10) 면적의 약 10%∼50%의 면적을 차지하는 만큼의 양을 침전시킨다. 접촉패드(10)에 침전시킨 혼합분말(12)은 도금액에 의해 접촉패드(10)에 도금접합 되도록 한 후, 접촉패드(10)에 도포되어 있는 다이아몬드 분말과 접촉패드(10)에 접합된 니켈 분말에 금도금을 하여 접촉패드(10)와 니켈 분말과 금도금층(도2의 14)이 전기적으로 연결되도록 접합하는 방법이다.First, in the first method, the mixed powder 12 of nickel and diamond is introduced into the plating liquid while the contact pad 10 serving as the conductor contact portion of the PCB 20 is immersed in the plating liquid. At this time, the amount of the mixed powder 12 of nickel and diamond is precipitated as much as occupying about 10% to 50% of the area of the contact pad 10. The mixed powder 12 deposited on the contact pad 10 is plated and bonded to the contact pad 10 by a plating solution, and then nickel powder bonded to the contact pad 10 and diamond powder applied to the contact pad 10 are coated. Gold plating is performed on the powder to bond the contact pad 10, the nickel powder, and the gold plating layer 14 (FIG. 2) to be electrically connected.

두번째 방법은, PCB(20)의 도체 접촉부인 접촉패드(10)에서, 표면처리할 접촉패드(10) 부분에만 자력(2)을 인가한 상태로 접촉패드(10)에 니켈과 다이아몬드의 혼합분말(12)을 뿌린 후, 자력(2)이 인가되는 이외의 부분에 묻은 니켈과 다이아몬드의 혼합분말(12)을 브러시로 쓸어내어 제거한다. 니켈과 다이아몬드 분말이 도포되어 있는 접촉패드(10)에는 자력(2)을 계속 인가하는 상태에서, 접촉패드(10)를 도금액 속에 투입하여 접촉패드(10)에 혼합분말이 도금접합 되도록 한다. 그리고, 접촉패드(10)에 도포되어 있는 다이아몬드 분말과 접촉패드(10)에 접합된 니켈 분말에 금도금을 하여 접촉패드(10)와 니켈 분말과 금도금층(도2의 14)이 전기적으로 연결되도록 접합하는 방법이다.In the second method, in the contact pad 10, which is a conductor contacting part of the PCB 20, a mixed powder of nickel and diamond on the contact pad 10 with a magnetic force 2 applied to only the part of the contact pad 10 to be surface treated. After spraying (12), the mixed powder 12 of nickel and diamond deposited on the portions other than the magnetic force 2 is applied is brushed off. While the magnetic force 2 is continuously applied to the contact pad 10 coated with nickel and diamond powder, the contact pad 10 is introduced into the plating solution so that the mixed powder is plated-bonded to the contact pad 10. Then, gold plating is performed on the diamond powder applied to the contact pad 10 and the nickel powder bonded to the contact pad 10 so that the contact pad 10, the nickel powder, and the gold plating layer 14 (FIG. 2) are electrically connected to each other. It is a method of bonding.

상기에서 서술한 PCB(20)의 도체 접촉부인 접촉패드(10)의 표면처리 방법에 있어서, 니켈과 다이아몬드의 혼합분말 중의 니켈과 다이아몬드의 혼합비는 70중량% : 30중량%의 비율로 도포되어 있으며, 접촉패드(10)에 도포되는 니켈 분말과 다이아몬드 분말의 직경은 각각 약 10∼30m 이다.In the surface treatment method of the contact pad 10 as the conductor contact portion of the PCB 20 described above, the mixing ratio of nickel and diamond in the mixing powder of nickel and diamond is applied in a ratio of 70% by weight to 30% by weight. The diameters of the nickel powder and the diamond powder applied to the contact pad 10 are about 10 to 30, respectively. m.

한편, 본 발명에 따른 도체 접촉부의 표면구조는 도체층 표면에 도포되어 있는 니켈과 다이아몬드의 혼합분말층과, 니켈과 다이아몬드의 혼합 분말 위에 형성되어 있는 니켈 및 금도금층으로 구성되며, 상기 혼합분말층의 니켈 분말은 도체표면에 전기적으로 연결되도록 접합되어 있고, 상기 금도금층은 상기 니켈 분말과 전기적으로 연결되도록 접합되어 있다.On the other hand, the surface structure of the conductor contact portion according to the present invention is composed of a mixed powder layer of nickel and diamond coated on the surface of the conductor layer, and a nickel and gold plated layer formed on the mixed powder of nickel and diamond, the mixed powder layer The nickel powder is bonded to the conductor surface to be electrically connected, and the gold plating layer is bonded to the nickel powder to be electrically connected.

이와같이 구성되는 도체 접촉부의 구성 및 작용을 PCB 접촉패드에서의 실시예인 도2와 도3을 중심으로 설명한다.The configuration and operation of the conductor contact portion configured as described above will be described with reference to FIGS. 2 and 3 which are embodiments of the PCB contact pad.

전체적인 구성은 도2에서 보는 바와 같이, PCB(20)의 접촉패드(10)상의 도체층 표면에 니켈과 다이아몬드의 혼합분말층(12)이 도포되어 있으며, 니켈과 다이아몬드의 혼합분말층(12) 위에는 니켈 및 금도금층(14)이 형성된다. 이와같이 구성되는 PCB(20) 접촉패드(10)의 도체층 표면에 반도체소자(도3의 18)의 리드(도3의 16)가 전기적인 접촉을 하게 된다.2, the mixed powder layer 12 of nickel and diamond is applied to the surface of the conductor layer on the contact pad 10 of the PCB 20, and the mixed powder layer 12 of nickel and diamond is shown in FIG. Nickel and gold plated layer 14 is formed thereon. The lead (16 in FIG. 3) of the semiconductor element (18 in FIG. 3) makes electrical contact with the surface of the conductor layer of the PCB 20 contact pad 10 configured as described above.

정리해 보면, 상기 혼합분말층의 니켈 분말은 PCB 접촉패드의 도체층 표면에 전기적으로 연결되도록 접합되어 있으며, 상기 금도금층은 상기 니켈 분말과 전기적으로 연결되도록 접합되어 있다. 아울러, 니켈 및 금도금층은 부분적으로 혼합분말층 사이로 접촉패드와 직접 접합된다.In summary, the nickel powder of the mixed powder layer is bonded to be electrically connected to the conductor layer surface of the PCB contact pad, and the gold plating layer is bonded to be electrically connected to the nickel powder. In addition, the nickel and gold plated layers are directly bonded to the contact pads partially between the mixed powder layers.

도3에서, PCB(20)의 접촉패드(10)상의 도체층 표면에는 니켈 분말과 다이아몬드 분말의 혼합분말층(12)이 도체 접촉부 면적의 약 10%∼50%의 면적을 차지하는 만큼의 양으로 도포된다. 도체 접촉부의 표면처리 방법에서 설명한 바와 같이, 도포되는 니켈과 다이아몬드의 혼합분말 중의 니켈과 다이아몬드의 혼합비는 70중량% : 30중량%의 비율로 도포되며, 도포되는 니켈 분말과 다이아몬드 분말의 직경은 각각 약 10∼30m이다.In Fig. 3, on the surface of the conductor layer on the contact pad 10 of the PCB 20, the mixed powder layer 12 of nickel powder and diamond powder takes an amount of about 10% to 50% of the area of the conductor contact portion. Is applied. As described in the method for surface treatment of the conductor contact portion, the mixing ratio of nickel and diamond in the mixed powder of nickel and diamond to be applied is applied in a ratio of 70% by weight to 30% by weight, and the diameters of the nickel powder and diamond powder to be applied are respectively About 10-30 m.

반복 설명하면, 상기의 혼합분말층(12) 위에는 니켈 및 금도금층(14)이 도포되어 있으며, 니켈 및 금도금층(14)은 혼합분말층(12) 즉, 니켈 분말과 다이아몬드 분말 사이의 간격에도 채워진다.Repeatedly described above, the nickel and gold plated layer 14 is coated on the mixed powder layer 12, and the nickel and gold plated layer 14 is applied to the mixed powder layer 12, that is, the gap between the nickel powder and the diamond powder. Is filled.

이상에서와 같이, 본 발명에서의 다이아몬드 분말은 절연체로 금도금이 되지 않으므로 댐(dam)역할을 하여 금도금이 박리되는 것을 막아 도체 접촉부의 수명을 향상시키는 역할을 하며, 니켈 분말은 전체적으로 금도금이 되어 전기적인 접촉불량을 제거하는 역할과 댐역할도 한다. 또한, 니켈 및 금도금층이 니켈 분말과 다이아몬드 분말 사이의 간격에도 채워져 도체층과 직접적으로 연결되므로 약 10g이하의 힘으로도 전기적인 접촉이 이루어지며, 접촉저항도 줄일 수 있다.As described above, since the diamond powder in the present invention is not gold-plated as an insulator, it serves as a dam to prevent gold plating from peeling off, thereby improving the life of the conductor contact portion, and the nickel powder is gold-plated as a whole. It also plays a role of eliminating contact failures and dams. In addition, since the nickel and gold plated layers are also filled in the gap between the nickel powder and the diamond powder to be directly connected to the conductor layer, electrical contact is made even with a force of about 10 g or less, and the contact resistance can be reduced.

본 발명에 의하면, 도체 접촉부에 니켈과 다이아몬드를 통해서 금도금을 하므로, 니켈과 다이아몬드 분말이 댐 역할을 하여 금도금층의 박리가 쉽게 일어나지 않기 때문에 PCB 접촉패드나 테스트소켓의 접촉터미널 등의 도체 접촉부 수명을 연장시킨다. 또한, 본 발명에 의하면, 도체 접촉부의 표면이 니켈과 다이아몬드 분말에 의해 울퉁불퉁해지므로 저온시험시에 접촉부 표면에 형성된 얼음이 반도체소자의 리드에 의해서 깨지면서 리드와 접촉부가 접촉될 수 있어서 얼음막에 의한 접촉저항의 증가 문제를 없앨 수 있다.According to the present invention, since gold plating is conducted through nickel and diamond on the contact portion of the conductor, nickel and diamond powder act as a dam, and thus the gold plating layer is not easily peeled off. Therefore, the life of the conductor contact portion such as the PCB contact pad or the contact terminal of the test socket is extended. Extend. In addition, according to the present invention, since the surface of the conductor contact portion is rugged by nickel and diamond powder, the ice formed on the contact surface during the low temperature test may be broken by the lead of the semiconductor element, and the lead and the contact portion may contact each other. The problem of increase in contact resistance can be eliminated.

Claims (10)

PCB 접촉패드 또는 테스트소켓의 접촉터미널 등의 도체 접촉부가,Conductor contacts, such as PCB contact pads or test terminals, 도체층 표면에 도포되어 있는 니켈과 다이아몬드의 혼합분말층과, 니켈과 다이아몬드의 혼합 분말 위에 형성되어 있는 니켈 및 금도금층으로 구성되며,It is composed of a mixed powder layer of nickel and diamond applied to the conductor layer surface, and a nickel and gold plated layer formed on the mixed powder of nickel and diamond, 상기 혼합분말층의 니켈 분말은 도체 표면에 전기적으로 연결되도록 접합되어 있고, 상기 금도금층은 상기 니켈 분말과 전기적으로 연결되도록 접합되어 있는 것을 특징으로 하는, 도체 접촉부.The nickel powder of the mixed powder layer is bonded so as to be electrically connected to the surface of the conductor, and the gold plated layer is connected to the nickel powder to be electrically connected. 청구항 1에서, 상기 니켈과 다이아몬드 혼합분말의 양은 도체 접촉부 면적의 약 10~50%의 면적을 차지하는 만큼의 양인 것을 특징으로 하는, 도체 접촉부.2. The conductor contact as claimed in claim 1, wherein the amount of the nickel and diamond mixed powder is an amount occupying about 10 to 50% of the area of the conductor contact. 청구항 1에서, 니켈과 다이아몬드 혼합분말 중의 니켈 : 다이아몬드 혼합비는 70중량% : 30중량%인 것을 특징으로 하는, 도체 접촉부.The conductor contact portion as set forth in claim 1, wherein the nickel: diamond mixing ratio in the nickel and diamond mixed powder is 70% by weight: 30% by weight. 청구항 1에서, 니켈 분말과 다이아몬드 분말의 직경은 약 10~30㎛ 인 것을 특징으로 하는, 도체 접촉부.The conductor contact as claimed in claim 1, wherein the diameter of the nickel powder and the diamond powder is about 10-30 μm. 청구항 1 또는 2에서, 상기 니켈 및 금도금층은 니켈 분말과 다이아몬드 분말 사이의 간격을 채워서 도체층과 직접 전기적으로 연결되는 것을 특징으로 하는,도체 접촉부.3. The conductor contact as claimed in claim 1, wherein the nickel and gold plated layers are electrically connected directly to the conductor layer by filling a gap between the nickel powder and the diamond powder. 4. 도체 접촉부의 표면을 처리하는 방법으로서,As a method of treating the surface of the conductor contact portion, 도체 접촉부를 도금액 속에 담가 놓은 상태에서 니켈과 다이아몬드 혼합분말을 도금액에 투입하여, 상기 니켈과 다이아몬드 혼합분말을 도체 접촉부에 침전시킨 후 혼합분말이 도금액에 의해 도체 접촉부에 도금접합되도록 하는 단계,Putting the nickel and diamond mixed powder into the plating liquid while the conductor contacting part is immersed in the plating solution, and then precipitating the nickel and diamond mixed powder to the conductor contacting portion and then plating the bonded powder to the conductor contacting portion with the plating liquid; 도체 접촉부에 도포되어 있는 다이아몬드 분말과 도체 접촉부에 접합된 니켈에 금도금을 하여 도체 접촉부와 니켈 분말과 금도금층이 전기적으로 연결되도록 접합하는 단계로 구성되는, 도체 접촉부 표면처리 방법.And gold-plating the diamond powder applied to the conductor contact portion and the nickel bonded to the conductor contact portion to bond the conductor contact portion, the nickel powder, and the gold plating layer so as to be electrically connected to each other. 청구항 6에서, 도금액에 투입하는 니켈과 다이아몬드 혼합분말의 양은 도체 접촉부 면적의 약 10~50%의 면적을 차지하는 만큼의 양인 것을 특징으로 하는, 도체 접촉부 표면처리 방법.The method according to claim 6, wherein the amount of the nickel and diamond mixed powder to be added to the plating liquid is an amount that occupies about 10 to 50% of the area of the conductor contact portion. 도체 접촉부의 표면을 처리하는 방법으로서,As a method of treating the surface of the conductor contact portion, 표면처리할 도체 접촉부에 자력을 인가한 상태에서 도체 접촉부에 니켈과 다이아몬드 혼합분말을 뿌리는 단계,Spraying nickel and diamond mixed powder on the conductor contact with the magnetic force applied to the conductor contact to be surface treated; 니켈과 다이아몬드 혼합분말을 브러시로 쓸어내어 자력이 인가되는 이외의 부분에 묻은 분말을 제거하는 단계,Sweeping the mixed powder of nickel and diamond with a brush to remove powders on parts other than magnetic force applied; 니켈과 다이아몬드 분말이 도포되어 있는 도체 접촉부에 자력을 계속 인가하는 상태에서 도체 접촉부를 도금액 속에 투입하여 도체 접촉부에 혼합분말이 도금접합되도록 하는 단계,Injecting the conductor contact portion into the plating liquid while the magnetic force is continuously applied to the conductor contact portion coated with nickel and diamond powder so that the mixed powder is plated-bonded to the conductor contact portion; 도체 접촉부에 도포되어 있는 다이아몬드 분말과 도체 접촉부에 접합된 니켈에 금도금을 하여 도체 접촉부와 니켈 분말과 금도금층이 전기적으로 연결되도록 접합하는 단계로 구성되는, 도체 접촉부 표면처리 방법.And gold-plating the diamond powder applied to the conductor contact portion and the nickel bonded to the conductor contact portion to bond the conductor contact portion, the nickel powder, and the gold plating layer so as to be electrically connected to each other. 청구항 6~8중 어느 한 항에서, 니켈과 다이아몬드 혼합분말 중의 니켈 : 다이아몬드 혼합비는 70중량% : 30중량%인 것을 특징으로 하는, 도체 접촉부 표면처리 방법.The method according to any one of claims 6 to 8, wherein the nickel: diamond mixing ratio in the nickel and diamond mixed powder is 70% by weight: 30% by weight. 청구항 6~8중 어느 한 항에서, 니켈 분말과 다이아몬드 분말의 직경은 약 10~30㎛ 인 것을 특징으로 하는, 도체 접촉부 표면처리 방법.9. The method of claim 6, wherein the diameter of the nickel powder and the diamond powder is about 10-30 μm. 10.
KR1020010014629A 2001-03-21 2001-03-21 Surface structure of electric contact and method of forming the contact KR100362145B1 (en)

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US5184399A (en) * 1990-06-29 1993-02-09 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
JPH08316602A (en) * 1995-03-01 1996-11-29 Tokuyama Corp Circuit board
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KR19990002946A (en) * 1997-06-24 1999-01-15 윤종용 Method for manufacturing circuit board having metal bumps and method for manufacturing semiconductor chip package using same

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US5184399A (en) * 1990-06-29 1993-02-09 Kabushiki Kaisha Toshiba Method of manufacturing circuit board
JPH08316602A (en) * 1995-03-01 1996-11-29 Tokuyama Corp Circuit board
JPH08321671A (en) * 1995-05-26 1996-12-03 Nec Corp Bump electrode structure and manufacture thereof
KR19990002946A (en) * 1997-06-24 1999-01-15 윤종용 Method for manufacturing circuit board having metal bumps and method for manufacturing semiconductor chip package using same

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