KR0164904B1 - Cathode ray tube - Google Patents

Cathode ray tube Download PDF

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Publication number
KR0164904B1
KR0164904B1 KR1019940032011A KR19940032011A KR0164904B1 KR 0164904 B1 KR0164904 B1 KR 0164904B1 KR 1019940032011 A KR1019940032011 A KR 1019940032011A KR 19940032011 A KR19940032011 A KR 19940032011A KR 0164904 B1 KR0164904 B1 KR 0164904B1
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South Korea
Prior art keywords
film
conductive material
aluminum deposition
present
deposition film
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KR1019940032011A
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Korean (ko)
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KR960019440A (en
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권순철
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엄길용
오리온전기주식회사
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/244Manufacture or joining of vessels, leading-in conductors or bases specially adapted for cathode ray tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/18Luminescent screens
    • H01J29/22Luminescent screens characterised by the binder or adhesive for securing the luminescent material to its support, e.g. vessel

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본발명은 브라운관의 판넬내면에 도포,형성된 형광막에 도포되어 필르밍공정에서의 락카막의 부착강도를 높여주기 위한 필르밍전처리액 조성방법에 관한 것이다.The present invention relates to a method of forming a pre-treatment solution for applying a film to a fluorescent film coated and formed on the inner surface of the CRT to increase the adhesion strength of the lacquer film in the filming process.

종래, 알루미늄증착막에 음전극으로 대전되는 것을 방전시키기 위하여 알루미늄증착막과 판넬측부의 스터드핀을 도전물질로서 상호 통전되게 하였으나, 전술한 도전물질의 도포공정이 수공으로 행해지므로 그 작업이 극히 번거로울 뿐만 아니라, 이 공정으로 인하여 많은 시간을 소비하여야 하는 문제점이 있었다.Conventionally, the aluminum deposition film and the stud pins on the panel side are electrically energized as a conductive material to discharge the negative electrode charged to the aluminum deposition film. However, since the above-described application of the conductive material is performed by hand, the work is extremely troublesome. Due to this process, there has been a problem of spending a lot of time.

따라서, 본발명은 이러한 종래의 문제점을 감안하여 창출한 것으로서, 알루미늄증착막과 판넬측부의 스터드핀을 도전물질로서 상호 통전시키지 않고 필르밍전처리공정에서의 루독스막으로 알루미늄증착막과 판넬측부의 스터드핀을 상호 통전시켜줌으로써, 작업효율을 극대화시키는 것을 물론이고, 이의 생산성을 향상시킨 필르밍전처리액 조성방법을 제공함에 그 목적이 있다.Accordingly, the present invention has been made in view of the above-described problems, and the aluminum deposition film and the stud pin at the panel side are not used as the conductive material to the aluminum deposition film and the panel side stud pin as a conductive material. By energizing the mutual, as well as maximizing the work efficiency, the object of the present invention is to provide a method for forming a pre-treatment solution for improving the productivity thereof.

이와 같은 목적을 달성하기 위하여 본발명은 비도전물질로 조성된 필르밍전처리액에 도전물질인 알루미늄분말을 소정량 첨가하여서 된 것이다.In order to achieve the above object, the present invention is made by adding a predetermined amount of aluminum powder, which is a conductive material, to a film pretreatment liquid composed of a non-conductive material.

Description

필르밍전처리액 조성방법Preparation method of filming solution

본발명은 브라운관의 판넬내면에 도포,형성된 형광막에 도포되어 필르밍공정에서의 락카막의 부착강도를 높여주기 위한 필르밍전처리액 조성방법에 관한 것이다.The present invention relates to a method of forming a pre-treatment solution for applying a film to a fluorescent film coated and formed on the inner surface of the CRT to increase the adhesion strength of the lacquer film in the filming process.

일반적으로 브라운관의 판넬내면에 적,녹,청 3색의 형광체를 도포하여된 형광막은 이의 표면이 매우 거칠기 때문에 이 위에 형광막을 보호하고 대전을 방지하는 동시에 화면의 휘도를 향상시키는 알루미늄막을 증착하게되는데, 이때 평활해야 할 알루미늄증착막이 거친 형광막표면을 따라 함께 굴곡이 생기는 것은 물론이고, 알루미늄증착막에 구멍이 뚫림으로써, 전술한 알루미늄증착막이 제역활을 수행하지 못하게 된다. 이러한 현상을 방지하기 위하여 형광막에 뚫려진 구멍을 메움과 동시에 알루미늄증착막이 이 형광막 상면으로 평활하게 증착되도록 형광막과 알루미늄증착막사이에 특수한 도포물질을 도포하는 필르밍(FILMING)공정을 수행하게 된다.In general, the phosphor film coated with three colors of red, green, and blue phosphors on the inner surface of the CRT has a very rough surface, so that an aluminum film is deposited thereon to protect the fluorescent film, prevent charging, and at the same time improve the brightness of the screen. In this case, the aluminum deposition film to be smoothed may be bent along the surface of the rough fluorescent film, as well as the holes are punched in the aluminum deposition film, thereby preventing the above-mentioned aluminum deposition film from performing the role of decompression. In order to prevent this phenomenon, a filming process is performed in which a special coating material is applied between the fluorescent film and the aluminum deposition film so as to fill the hole drilled in the fluorescent film and at the same time, the aluminum deposition film is smoothly deposited on the upper surface of the fluorescent film. do.

전술한 바와 같은 필르밍공정에 관해서 좀 더 상세히 설명하면, 판넬내면의 거친 형광막상에 필름의 균열방지 및 이의 부착강도를 향상시켜주는 무수규산재질의 루독스액을 도포하여 균일한 루독스막을 형성하는 필르밍전처리공정을 거친 다음, 이 루독스막상에 알루미늄증착막이 평활하게 증착되도록 락카막을 도포하는 필르밍공정을 수행하는 한편, 이 필름상에 알루미늄증착막을 평활하게 증착한다.The filming process as described above will be described in more detail. A uniform ludox film is formed by applying an anhydrous silicate luox solution to prevent cracking of the film and improve its adhesion strength on the rough fluorescent film on the inner surface of the panel. After the filming pretreatment step, a filming process is applied to the lacquer film so that the aluminum deposition film is smoothly deposited on the rudox film, while the aluminum deposition film is smoothly deposited on the film.

그런 다음, 전술한 알루미늄증착막에 음전극으로 대전되는 것을 방전시키기 위하여 알루미늄증착막과 판넬측부의 스터드핀을 도전물질로서 상호 통전되게 하였으나, 전술한 도전물질의 도포공정이 수공으로 행해지므로 그 작업이 극히 번거로울 뿐만 아니라, 이 공정으로 인하여 많은 시간을 소비하여야 하는 문제점이 있었다.Then, in order to discharge the charge of the above-mentioned aluminum deposition film with the negative electrode, the aluminum deposition film and the stud pin at the side of the panel were energized with each other as a conductive material. However, since the coating process of the conductive material described above is performed by hand, the work is very cumbersome. In addition, there was a problem in that a lot of time due to this process.

따라서, 본발명은 이러한 종래의 문제점을 감안하여 창출한 것으로서, 알루미늄증착막과 판넬측부의 스터드핀을 도전물질로서 상호 통전시키지 않고 필르밍전처리공정에서의 루독스막으로 알루미늄증착막과 판넬측부의 스터드핀을 상호 통전시켜줌으로써, 작업효율을 극대화시키는 것을 물론이고, 이의 생산성을 향상시킨 필르밍전처리액 조성방법을 제공함에 그 목적이 있다.Accordingly, the present invention has been made in view of the above-described problems, and the aluminum deposition film and the stud pin at the panel side are not used as the conductive material to the aluminum deposition film and the panel side stud pin as a conductive material. By energizing the mutual, as well as maximizing the work efficiency, the object of the present invention is to provide a method for forming a pre-treatment solution for improving the productivity thereof.

이와 같은 목적을 달성하기 위하여 본발명은 비도전물질로 조성된 필르밍전처리액에 도전물질인 알루미늄분말을 소정량 첨가하여서 된 특징이 있다.In order to achieve the above object, the present invention is characterized by adding a predetermined amount of aluminum powder, which is a conductive material, to a film pretreatment liquid composed of a non-conductive material.

이하, 본발명의 바람직한 일 실시예를 상세히 설명한다.Hereinafter, a preferred embodiment of the present invention will be described in detail.

기존의 필르밍전처리액은 비도전성물질로서 조성되어 있는데, 이의 조성물을 보면, 적정량의 순수에 주성분인 루독스액과, 형광막상으로 균일하게 퍼지게하는 계면활성제, 그리고 초산(CH3COOH) 및 폴리 비닐 알콜(Poly Vinyl Alcohol) 또는 폴리 비닐 피롤리돈(Poly Vinyl Pyrollidone)을 첨가, 조성하여서 된다.Existing film pretreatment solution is composed as a non-conductive material, and its composition shows that a suitable amount of pure redox solution, a surfactant which spreads uniformly on a fluorescent film, acetic acid (CH 3 COOH) and poly Polyvinyl alcohol or poly vinyl pyrrolidone may be added and formed.

이와 같이 조성된 필르밍전처리액에 도전성물질인 알루미늄분말을 소정량, 예컨대 약 5 % - 15 % 정도 첨가하여 전술한 필르밍전처리액이 도전성을 지니게 한다.A predetermined amount, for example, about 5% to about 15% of an aluminum powder, which is a conductive material, is added to the filming pretreatment liquid thus prepared to make the above-described filming pretreatment liquid have conductivity.

그런 다음, 도전성 필르밍전처리액을 판넬내면에 형성된 형광막에 도포하는데, 이때 이 필르밍전처리액이 판넬내벽의 스터드핀까지 도포한 다음, 전술한 필르밍전처리액위에 필르밍공정인 락카막을 도포, 형성한 후 이 위에 알루미늄막을 증착시킨 상태에서 필르밍전처리막 및 필르밍막을 소각처리하면, 필르밍전처리액에 있던 알루미늄분말이 형광막과 알루미늄증착막사이에 분포되고, 전술한 알루미늄증착막의 음전극을 스터드핀을 통해 방전시킨다.Then, the conductive film pretreatment liquid is applied to the fluorescent film formed on the inner surface of the panel, in which case the film pretreatment liquid is applied to the stud pins of the inner wall of the panel, and then the lacquer film, which is the filming process, is applied to the aforementioned film pretreatment liquid. And incineration of the filming film and filming film while the aluminum film is deposited thereon, the aluminum powder in the filming solution is distributed between the fluorescent film and the aluminum film, and the negative electrode of the aluminum film is Discharge through the stud pins.

위에서 설명한 필르밍전처리액의 조성방법은 본발명의 한 가능한 실시예에 불과하며, 예컨대 이의 조성물은 앞서 설명한 본발명의 범위내에서 얼마든지 그 변경이 가능하다.The composition method of the filming pretreatment liquid described above is only one possible embodiment of the present invention, and the composition thereof may be changed as many as possible within the scope of the present invention described above.

이와 같이 구성된 본발명의 작용 및 효과를 상세히 설명한다.The operation and effects of the present invention configured as described above will be described in detail.

기존의 필르밍전처리액에 도전성물질인 알루미늄분말을 소정량 첨가하여 전술한 필르밍전처리액이 도전성을 지니게 하여 이를 형광막에서 판넬내벽의 스터드핀까지 도포한 다음, 전술한 필르밍전처리액위에 필르밍공정인 락카막을 도포, 형성하고, 이 위에 알루미늄막을 증착시킨 상태에서 필르밍 전처리막 및 필르밍막을 소각처리하여 필르밍전처리액에 있던 알루미늄분말이 형광막과 알루미늄증착막사이에 분포되도록 함으로써, 전술한 알루미늄증착막의 음전극을 스터드핀을 통해 방전시켜 알루미늄증착막의 대전을 방지한다.By adding a predetermined amount of aluminum powder, which is a conductive material, to the existing pre-treatment solution, the above-mentioned pre-treatment solution is conductive, and then applied to the stud pins of the inner wall of the panel from the fluorescent film. By applying and forming a lacquer film, which is a reaming process, and incineration of the filming pretreatment film and the filming film with the aluminum film deposited thereon, the aluminum powder in the filming pretreatment liquid is distributed between the fluorescent film and the aluminum deposition film. The negative electrode of the aluminum deposition film is discharged through the stud pins to prevent charging of the aluminum deposition film.

따라서, 본발명은 알루미늄증착막과 판넬측부의 스터드핀을 종전과 같이 도전물질로서 상호 통전시키지 않고 필르밍전처리공정에서 형성되는 루독스막으로 알루미늄증착막과 판넬측부의 스터드핀을 상호 통전시켜줌으로써, 작업효율을 극대화시키는 것을 물론이고, 이의 생산성을 향상시킨 효과가 있다.Therefore, the present invention is to work by allowing the aluminum deposition film and the stud pins on the panel side to pass through the aluminum deposition film and the panel side stud pins formed in the film pretreatment process without conducting each other as a conductive material as before. As well as maximizing the efficiency, there is an effect to improve its productivity.

Claims (3)

필르밍전처리액 조성방법에 있어서, 비도전물질로 조성된 필르밍전처리액에 도전물질을 소정량 첨가하는 것을 특징으로 한 필르밍전처리액 조성방법.A method of forming a pre-treatment liquid, wherein a predetermined amount of conductive material is added to the pre-treatment liquid formed of a non-conductive material. 제1항에 있어서, 상기한 도전물질을 필르밍전처리액에 약 5 % - 15 % 정도 첨가하는 것을 특징으로 한 필르밍전처리액 조성방법.The method of claim 1, wherein about 5% to about 15% of the conductive material is added to the pretreatment solution. 제1항에 있어서, 상기한 도전물질을 알루미늄분말로 하는 것을 특징으로 한 필르밍전처리액 조성방법.The method of claim 1, wherein the conductive material is aluminum powder.
KR1019940032011A 1994-11-30 1994-11-30 Cathode ray tube KR0164904B1 (en)

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KR0164904B1 true KR0164904B1 (en) 1998-12-15

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