KR0131558Y1 - Apparatus for baking semiconductor wafer - Google Patents
Apparatus for baking semiconductor wafer Download PDFInfo
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- KR0131558Y1 KR0131558Y1 KR2019950013980U KR19950013980U KR0131558Y1 KR 0131558 Y1 KR0131558 Y1 KR 0131558Y1 KR 2019950013980 U KR2019950013980 U KR 2019950013980U KR 19950013980 U KR19950013980 U KR 19950013980U KR 0131558 Y1 KR0131558 Y1 KR 0131558Y1
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- hot plate
- wafer
- baking apparatus
- support means
- semiconductor wafer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Abstract
반도체 웨이퍼의 베이크장치의 핫 플레이트(Hot Plate)에 구비되는 웨이퍼 지지수단(30)이 개시되어 있는데, 그 상부 표면에 3개 이상의 홀이 형성된 핫 플레이트(Hot Plate); 상기 핫 플레이트(10)의 상기 홀에 위치하고 있으면서, 상기 반도체 웨이퍼를 상기 핫 플레이트(10)로부터 일정간격 유지하며 지지하기 위한 지지수단(30); 상기 지지수단(30)을 상기 핫 플레이트(10)에 고정하기 위한 고정수단(40)을 포함하여 구성되며, 포토레지스트 코팅의 두께를 일정하게 유지할 수 있고, 웨이퍼상에 형성되는 구조물의 선폭이 균일성을 유지할 수 있게 되며 생산라인의 생산성을 높일 수 있다.Disclosed is a wafer support means (30) provided in a hot plate of a baking apparatus of a semiconductor wafer, comprising: a hot plate having three or more holes formed on an upper surface thereof; Support means (30) for supporting the semiconductor wafer while being located in the hole of the hot plate (10) while maintaining a predetermined distance from the hot plate (10); It comprises a fixing means 40 for fixing the support means 30 to the hot plate 10, it is possible to maintain a constant thickness of the photoresist coating, the line width of the structure formed on the wafer is uniform Can maintain the productivity and increase the productivity of the production line.
Description
제1도(a)도 및 (b)도는 종래의 베이크장치의 단면도.1 (a) and (b) are cross-sectional views of a conventional baking apparatus.
제2(a)도 및 제2(b)도는 종래의 베이크장치의 핫 플레이트(Hot Plate)의 프록시미티(Proximity) 볼(Ball) 또는 핀(Pin)이 분실된 상태를 나타낸 단면도.2 (a) and 2 (b) are cross-sectional views showing a state in which a proximity ball or pin of a hot plate of a conventional baking apparatus is missing.
제3(a)도 및 제3(b)도는 종래의 베이크장치의 프록시미티 볼 또는 핀이 핫 플레이트 위로 빠져나온 상태를 나타낸 단면도.3 (a) and 3 (b) are cross-sectional views showing a state in which a proximity ball or pin of a conventional baking apparatus is pulled out onto a hot plate.
제4도는 본 고안의 일실시예에 따른 웨이퍼 지지수단이 고정수단에 의해 핫 플레이트(Hot Plate)에 결합된 베이크장치의 단면도.4 is a cross-sectional view of a baking apparatus in which a wafer support means is coupled to a hot plate by a fixing means according to an embodiment of the present invention.
제5도는 본 고안의 일실시예에 따른 베이크장치의 웨이퍼 지지수단 및 고정수단의 단면도.5 is a cross-sectional view of the wafer holding means and the fixing means of the baking apparatus according to an embodiment of the present invention.
제6도는 본 고안의 다른 실시예에 따른 베이크장치의 웨이퍼 지지수단의 단면도.6 is a cross-sectional view of the wafer supporting means of the baking apparatus according to another embodiment of the present invention.
제7도는 본 고안의 또 다른 실시예에 따른 베이크장치의 웨이퍼 지지수단의 단면도.7 is a cross-sectional view of the wafer supporting means of the baking apparatus according to another embodiment of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 핫 플레이트 20 : 홀10: hot plate 20: hole
30 : 지지수단 40 : 고정수단30: support means 40: fixing means
본 고안은 반도체 웨이퍼의 베이크장치에 관한 것으로, 특히 베이크장치의 핫 플레이트(Hot Plate)에 구비되는 웨이퍼 지지수단에 관한 것이다.The present invention relates to a baking apparatus for a semiconductor wafer, and more particularly, to a wafer support means provided in a hot plate of a baking apparatus.
반도체 웨이퍼의 포토레지스트 공정에서는 웨이퍼에 포토레지스트를 코팅하기 전후 및 포토레지스트를 현상하기 전후에 프리베이크(Pre-Bake)와 소프트베이크(Soft Bake)를 실시하게 되는데, 베이크장치의 핫 플레이트(Hot Plate)의 상부 표면에는 웨이퍼를 지지하기 위한 수단으로서 3개 이상의 프록시미티(proximity) 볼(Ball) 또는 핀(Pin)이 구비되는데, 이들 지지수단은 웨이퍼와 플레이트(Hot Plate)사이의 간격을 0.1mm 정도로 균일하게 유지함으로써, 웨이퍼의 온도를 일정하게 유지시켜 주고, 웨이퍼의 뒷면이 먼지등의 입자에의해 오염되지 않도록 하는 한편, 포토레지스트의 두께와 포토레지스트의 현상 전후의 정상파(Standing Wave) 영향을 최소화하여 웨이퍼상에 형성되는 구조물의 선폭(CD)에 중요한 역할을 하고 있다.In the photoresist process of the semiconductor wafer, pre-baking and soft baking are performed before and after coating the photoresist on the wafer and before and after developing the photoresist, which is a hot plate of the baking apparatus. At the top surface of the wafer), three or more proximity balls or pins are provided as a means for supporting the wafer, and the supporting means has a 0.1 mm gap between the wafer and the hot plate. By keeping the temperature uniform, the temperature of the wafer is kept constant and the back surface of the wafer is not contaminated by particles such as dust, while the thickness of the photoresist and the standing wave before and after the development of the photoresist are affected. Minimization plays an important role in the line width (CD) of structures formed on wafers.
그러나 종래의 반도체 웨이퍼 베이크장치의 단면도인 제1도에 도시된 바와 같이, 종래에는 프록시미티 볼(3) 및 핀(4)등의 웨이퍼 지지수단이 별도의 고정수단 없이 핫 플레이트(1)의 상부에 형성된 홀(2)에 단순하게 놓여있었을 뿐이어서, 핫 플레이트(1)가 상하로 움직이거나 웨이퍼가 공정라인을 따라 흘러갈 때, 또는 주기적인 세척작업시에 지지수단이 홀(2)에서 빠져나와 분실되거나(제2도 참조), 핫 플레이트(1)를 굴러다님으로 인하여(제3도 참조), 웨이퍼(5)가 핫 플레이트(1)면에 대하여 비스듬하게 기울어지고, 그 결과 포토레지스트 코팅의 두께가 변화되어 바람직스럽지 못하고, 웨이퍼(5)에 형성된 구조물의 선폭의 불균일성을 가져오는 등의 문제점이 있었다. 이를 방지하기 위해서는 작업자가 상기 지지수단이 핫 플레이트(1)에 정상적으로 위치하고 있는지 여부를 주기적으로 확인해야 하는 불편이 있었다.However, as shown in FIG. 1, which is a cross-sectional view of a conventional semiconductor wafer baking apparatus, conventionally, wafer supporting means such as proximity balls 3 and pins 4 are provided on the upper portion of the hot plate 1 without any additional fixing means. It simply lies in the hole 2 formed in the groove, so that the support means are removed from the hole 2 when the hot plate 1 moves up and down, the wafer flows along the process line, or during periodic cleaning operations. Lost (see FIG. 2) or rolling the hot plate 1 (see FIG. 3) causes the wafer 5 to tilt at an angle to the hot plate 1 surface, resulting in a photoresist coating. The thickness of is changed, which is not preferable, and there are problems such as unevenness of the line width of the structure formed on the wafer 5. In order to prevent this, the worker has to inconvenience periodically to check whether the support means is normally located on the hot plate (1).
이에, 본 고안은 상기한 종래의 문제점을 해소시키고자 안출된 것으로서, 본 고안의 목적은 반도체 웨이퍼에 베이크 공정을 행함에 있어서, 포토레지스트 코팅의 두께를 일정하게 유지하고 웨이퍼에 형성된 구조물의 선폭을 균일하게 하는 반도체 웨이퍼의 베이크장치를 제공하는데 있다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to maintain the thickness of the photoresist coating and to maintain the line width of the structure formed on the wafer in the baking process on the semiconductor wafer. It is to provide a baking apparatus for a semiconductor wafer to be uniform.
본 고안의 다른 목적은 반도체 웨이퍼에 베이크공정을 행함에 있어서, 설비의 가동율 및 생산성이 향상된 반도체 웨이퍼의 베이크장치를 제공하는데 있다.Another object of the present invention is to provide a baking apparatus for a semiconductor wafer, in which the operation rate and productivity of equipment are improved in performing the baking process on the semiconductor wafer.
본 고안에 따른 장치는 반도체 웨이퍼의 베이크 장치에 구비되는 프록시미티 볼 및 핀과 같은 웨이퍼 지지수단을 고정수단을 사용하여 핫 플레이트에 고정시켰다는데 특징이 있다.The apparatus according to the present invention is characterized in that wafer holding means such as proximity balls and pins provided in the baking device of a semiconductor wafer are fixed to a hot plate using fixing means.
즉, 본 고안에 따른 반도체 웨이퍼의 베이크장치의 구성은,That is, the configuration of the baking apparatus of the semiconductor wafer according to the present invention,
ㄱ) 그 상부 표면에 3개 이상의 홀이 형성된 핫 플레이트; ㄴ) 상기 핫 플레이트의 홀에 위치하고 있으면서, 상기 반도체 웨이퍼를 상기 핫 플레이트로부터 일정 간격 유지하며 지지하기 위한 웨이퍼지지수단; ㄷ) 상기 웨이퍼 지지수단을 상기 핫 플레이트에 고정하기 위한 고정수단을 포함하여 이루어진다.A) a hot plate having three or more holes formed in its upper surface; B) wafer supporting means for holding the semiconductor wafer at a predetermined distance from the hot plate while being located in the hole of the hot plate; C) fixing means for fixing the wafer support means to the hot plate.
이때, 상기 지지수단은 몸체에 돌출부가 형성된 것이 바람직하고, 상기 고정수단은 중공부가 형성된 링(ring) 형상으로 되어 상기 지지수단의 돌출부에 삽입시켜 결합할 수 있게 하는 것이 바람직하고, 상기 지지수단이나 상기 고정수단이 서로 결합되는 부분 또는 이들이 상기 핫 플레이트의 홀과 결합되는 부분은 테이퍼진 형상으로 되거나 나사 모양을 형성하는 것이 바람직하다. 또한 상기 고정수단은 탄력이 있는 고분자 물질, 특히 사불화에틸렌(Tetfluoroethylene) 중합체로 형성하는 것이 바람직하다.At this time, the support means is preferably formed with a protrusion on the body, the fixing means is preferably a ring (ring) formed with a hollow portion to be inserted into the protrusion of the support means to be coupled, the support means or The portion where the fixing means are coupled to each other or the portion where the fixing means is coupled to the hole of the hot plate is preferably tapered or screw-shaped. In addition, the fixing means is preferably formed of an elastic polymer material, in particular, a tetrafluoroethylene polymer.
이하, 본 고안의 실시예를 첨부된 도면과 함께 보다 상세하게 설명한다. 각 도면에서 동일한 참조번호로 표시된 부분들은 동일한 요소들을 나타낸다.Hereinafter, embodiments of the present invention will be described in detail with the accompanying drawings. Portions denoted by the same reference numerals in each of the drawings represent the same elements.
제4도는 본 고안의 일실시예에 따른 웨이퍼 지지수단(30)이 고정수단(40)에 의해 핫 플레이트(Hot Plate)(10)에 결합된 베이크장치의 단면도이다. 제3도의 베이크장치와는 다르게 웨이퍼 지지수단(30)이 별도의 고정수단(40)을 통하여 핫 플레이트(10)에 고정되어 있다.4 is a cross-sectional view of the baking apparatus in which the wafer support means 30 according to the embodiment of the present invention is coupled to the hot plate 10 by the fixing means 40. Unlike the baking apparatus of FIG. 3, the wafer supporting means 30 is fixed to the hot plate 10 through a separate fixing means 40.
제5도는 본 고안의 일실시예에 따른 베이크장치의 웨이퍼 지지수단(30) 및 고정수단(40)의 단면도이다.5 is a cross-sectional view of the wafer support means 30 and the fixing means 40 of the baking apparatus according to an embodiment of the present invention.
상기 지지수단(30)은 기저부(31)와 돌출부(32)가 있는 숫나사 모양으로 형성하는데, 상기 돌출부(32)의 상부 표면은 곡면으로 형성함으로써, 이것이 웨이퍼와 직접 접촉할 때 웨이퍼를 손상시키지 않도록 한다. 상기 지지수단(30)을 핫 플레이트(10)에 고정하는 고정수단(40)은 중공부(41)가 있는 링 모양으로 형성하여 상기 지지수단(30)의 돌출부(32)에 끼워지도록 한다. 이때, 상기 고정수단(40)과 지지수단(30)이 결합되는 부위 및 이들이 상기 핫 플레이트(10)와 결합되는 부위는 테이퍼 형상 또는 나사 형상으로 형성하는 것이 지지수단(30)을 핫 플레이트(10)에 보다 용이하고 견고하게 고정할 수 있게 하므로 바람직하다. 또한 상기 고정수단(40)의 재질은 신축성이 있는 고분자, 특히 내열성 등이 우수한 고분자인 사불화에틸렌(Tetfluoroethylene) 중합체가 바람직하다.The support means 30 is formed in a male screw shape having a base 31 and a protrusion 32. The upper surface of the protrusion 32 is formed in a curved surface so that it does not damage the wafer when it is in direct contact with the wafer. do. Fixing means 40 for fixing the support means 30 to the hot plate 10 is formed in a ring shape with a hollow portion 41 to be fitted to the protrusion 32 of the support means 30. At this time, a portion where the fixing means 40 and the support means 30 are coupled, and a portion where the fixing means 40 and the support means 30 are coupled to the hot plate 10 may be formed in a tapered shape or a screw shape. It is preferable because it enables to be fixed more easily and firmly). In addition, the material of the fixing means 40 is preferably an elastic polymer, especially a tetrafluoroethylene polymer which is excellent in heat resistance and the like.
제6도는 본 고안의 다른 실시예에 따른 베이크장치의 웨이퍼 지지수단(30)의 단면도이다.6 is a cross-sectional view of the wafer support means 30 of the baking apparatus according to another embodiment of the present invention.
상기 지지수단(30)은 머리부(32)와 그 하부에 형성된 돌출부(33)에 의하여 구성되고, 웨이퍼와 직접 접촉하게 되는 상기 지지수단(30)의 머리부(32)는 상부표면이 곡면으로 되어 있다. 제6도에 도시된 실시예가 상기 제5도의 실시예와 다른 점은, 상기 지지수단(30)을 고정하기 위하여, 먼저 링모양의 상기 고정수단(40)을 상기 핫 플레이트(10)의 홀(20)에 고정한 후, 상기 지지수단(30)을 상기 고정수단(40)에 고정시킨다는 것이다.The support means 30 is constituted by a head 32 and a protrusion 33 formed at the bottom thereof, and the head 32 of the support means 30 which is in direct contact with the wafer has a curved upper surface. It is. The embodiment shown in FIG. 6 differs from the embodiment of FIG. 5 in that, in order to fix the support means 30, first, the ring-shaped fixing means 40 is first mounted on the hole of the hot plate 10. After fixing to 20, it is to fix the support means 30 to the fixing means (40).
제7도는 본 고안의 또 다른 실시예에 다른 베이크장치의 웨이퍼 지지수단(30)의 단면도이다. 제7도에 도시된 실시예가 상기 제5도 및 상기 제6도의 실시예와 다른 점은, 상기 지지수단(30)의 몸체(34)에 2개의 돌출부(35)(36)가 형성되어 있다는 점이다. 이들 2개의 돌출부(35)(36)중 웨이퍼와 접촉하는 상부 돌출부(35)의 상부표면은 곡면으로 형성된다. 상기 지지수단(30)은 하부 돌출부(36)와 결합되어 상기 지지수단(30)을 핫 플레이트(10)에 고정한다.7 is a cross-sectional view of the wafer support means 30 of the baking apparatus according to another embodiment of the present invention. The embodiment shown in FIG. 7 differs from the embodiment of FIGS. 5 and 6 in that two protrusions 35 and 36 are formed in the body 34 of the support means 30. to be. Of these two protrusions 35 and 36, the upper surface of the upper protrusion 35 in contact with the wafer is formed into a curved surface. The support means 30 is coupled to the lower protrusion 36 to fix the support means 30 to the hot plate 10.
상술한 본 고안에 따른 반도체 웨이퍼의 베이크장치의 장점으로서는, 포토레지스트 코팅의 두께를 일정하게 유지하고, 웨이퍼상에 형성되는 구조물의 선폭이 균일성을 유지할 수 있게 되며, 생산라인의 생산성을 높일 수 있다는 것을 들 수 있다.As an advantage of the above-described baking apparatus of a semiconductor wafer according to the present invention, the thickness of the photoresist coating can be kept constant, the line width of the structure formed on the wafer can be maintained uniform, and the productivity of the production line can be increased. It can be said that there is.
상기한 설명에서 많은 사항이 구체적으로 기재되어 있으나, 그들은 고안의 범위를 한정하는 것이라기보다는 바람직한 실시예의 예시로서 해석되어야 한다. 예를 들어 본 고안이 속하는 분야에서 통상의 지식을 가진자라면 상기한 지지수단이나 고정수단의 형상을 변형하여 본 고안을 실시할 수 있음이 명백하다. 때문에 본 고안의 범위는 설명된 실시예에 의하여 정하여질 것이 아니고 실용신안등록청구범위에 기재된 기술적 사상에 의해 정하여져야 한다.While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. For example, it will be apparent to those skilled in the art that the present invention can be implemented by modifying the shape of the support means or the fixing means. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the utility model registration claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950013980U KR0131558Y1 (en) | 1995-06-20 | 1995-06-20 | Apparatus for baking semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950013980U KR0131558Y1 (en) | 1995-06-20 | 1995-06-20 | Apparatus for baking semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970003188U KR970003188U (en) | 1997-01-24 |
| KR0131558Y1 true KR0131558Y1 (en) | 1999-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950013980U KR0131558Y1 (en) | 1995-06-20 | 1995-06-20 | Apparatus for baking semiconductor wafer |
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| Country | Link |
|---|---|
| KR (1) | KR0131558Y1 (en) |
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1995
- 1995-06-20 KR KR2019950013980U patent/KR0131558Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
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| KR970003188U (en) | 1997-01-24 |
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