JPWO2024009768A1 - - Google Patents

Info

Publication number
JPWO2024009768A1
JPWO2024009768A1 JP2024523559A JP2024523559A JPWO2024009768A1 JP WO2024009768 A1 JPWO2024009768 A1 JP WO2024009768A1 JP 2024523559 A JP2024523559 A JP 2024523559A JP 2024523559 A JP2024523559 A JP 2024523559A JP WO2024009768 A1 JPWO2024009768 A1 JP WO2024009768A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024523559A
Other versions
JPWO2024009768A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024009768A1 publication Critical patent/JPWO2024009768A1/ja
Publication of JPWO2024009768A5 publication Critical patent/JPWO2024009768A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2024523559A 2022-07-07 2023-06-21 Pending JPWO2024009768A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022109776 2022-07-07
PCT/JP2023/022899 WO2024009768A1 (ja) 2022-07-07 2023-06-21 保持装置

Publications (2)

Publication Number Publication Date
JPWO2024009768A1 true JPWO2024009768A1 (ja) 2024-01-11
JPWO2024009768A5 JPWO2024009768A5 (ja) 2024-07-09

Family

ID=89453269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024523559A Pending JPWO2024009768A1 (ja) 2022-07-07 2023-06-21

Country Status (3)

Country Link
JP (1) JPWO2024009768A1 (ja)
TW (1) TW202410284A (ja)
WO (1) WO2024009768A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10008404B2 (en) * 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
JP6621548B2 (ja) * 2017-07-06 2019-12-18 日本碍子株式会社 半導体製造装置用部材及びその製法
US20220181183A1 (en) * 2019-03-29 2022-06-09 Kyocera Corporation Gas plug, electrostatic attraction member, and plasma treatment device
JP7397974B2 (ja) * 2020-04-27 2023-12-13 京セラ株式会社 通気性部材、半導体製造装置用部材、プラグおよび吸着部材

Also Published As

Publication number Publication date
TW202410284A (zh) 2024-03-01
WO2024009768A1 (ja) 2024-01-11

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