JPWO2023162413A1 - - Google Patents
Info
- Publication number
- JPWO2023162413A1 JPWO2023162413A1 JP2024502851A JP2024502851A JPWO2023162413A1 JP WO2023162413 A1 JPWO2023162413 A1 JP WO2023162413A1 JP 2024502851 A JP2024502851 A JP 2024502851A JP 2024502851 A JP2024502851 A JP 2024502851A JP WO2023162413 A1 JPWO2023162413 A1 JP WO2023162413A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022027798 | 2022-02-25 | ||
| PCT/JP2022/045834 WO2023162413A1 (en) | 2022-02-25 | 2022-12-13 | Cooler, method for manufacturing cooler, semiconductor device, and method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162413A1 true JPWO2023162413A1 (en) | 2023-08-31 |
| JPWO2023162413A5 JPWO2023162413A5 (en) | 2024-06-12 |
Family
ID=87765550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502851A Pending JPWO2023162413A1 (en) | 2022-02-25 | 2022-12-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023162413A1 (en) |
| WO (1) | WO2023162413A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006115073A1 (en) * | 2005-04-21 | 2006-11-02 | Nippon Light Metal Company, Ltd. | Liquid-cooled jacket |
| JP5589647B2 (en) * | 2010-07-28 | 2014-09-17 | 日産自動車株式会社 | Cooling system |
| JP5966512B2 (en) * | 2012-03-29 | 2016-08-10 | 三菱マテリアル株式会社 | Manufacturing method of power module substrate with heat sink |
| JP6248842B2 (en) * | 2014-07-16 | 2017-12-20 | 日本軽金属株式会社 | Liquid cooling jacket manufacturing method and liquid cooling jacket |
| JP7130434B2 (en) * | 2018-05-24 | 2022-09-05 | 三井化学株式会社 | cooling jacket |
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2022
- 2022-12-13 JP JP2024502851A patent/JPWO2023162413A1/ja active Pending
- 2022-12-13 WO PCT/JP2022/045834 patent/WO2023162413A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023162413A1 (en) | 2023-08-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240322 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240322 |