JPWO2023067736A1 - - Google Patents
Info
- Publication number
- JPWO2023067736A1 JPWO2023067736A1 JP2022513335A JP2022513335A JPWO2023067736A1 JP WO2023067736 A1 JPWO2023067736 A1 JP WO2023067736A1 JP 2022513335 A JP2022513335 A JP 2022513335A JP 2022513335 A JP2022513335 A JP 2022513335A JP WO2023067736 A1 JPWO2023067736 A1 JP WO2023067736A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/038798 WO2023067736A1 (ja) | 2021-10-20 | 2021-10-20 | SiC単結晶基板及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2023067736A1 true JPWO2023067736A1 (ja) | 2023-04-27 |
JP7339434B1 JP7339434B1 (ja) | 2023-09-05 |
JPWO2023067736A5 JPWO2023067736A5 (ja) | 2023-09-20 |
Family
ID=86058059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022513335A Active JP7339434B1 (ja) | 2021-10-20 | 2021-10-20 | SiC単結晶基板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240141544A1 (ja) |
JP (1) | JP7339434B1 (ja) |
CN (1) | CN117425752A (ja) |
WO (1) | WO2023067736A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4069508B2 (ja) | 1998-07-21 | 2008-04-02 | 株式会社デンソー | 炭化珪素単結晶の製造方法 |
JP3248071B2 (ja) | 1998-10-08 | 2002-01-21 | 日本ピラー工業株式会社 | 単結晶SiC |
JP2010280546A (ja) * | 2009-06-05 | 2010-12-16 | Bridgestone Corp | 炭化珪素単結晶の製造方法 |
WO2020184059A1 (ja) * | 2019-03-11 | 2020-09-17 | 日本碍子株式会社 | SiC複合基板及び半導体デバイス |
EP4036281A4 (en) * | 2019-09-27 | 2023-08-02 | Kwansei Gakuin Educational Foundation | SIC MONOCRYSTAL MANUFACTURING METHOD, SIC MONOCRYSTAL MANUFACTURING DEVICE, AND SIC MONOCRYSTAL SLICE |
WO2021100564A1 (ja) * | 2019-11-20 | 2021-05-27 | 日本碍子株式会社 | SiC基板及びその製法 |
-
2021
- 2021-10-20 CN CN202180099091.7A patent/CN117425752A/zh active Pending
- 2021-10-20 WO PCT/JP2021/038798 patent/WO2023067736A1/ja active Application Filing
- 2021-10-20 JP JP2022513335A patent/JP7339434B1/ja active Active
-
2024
- 2024-01-11 US US18/410,216 patent/US20240141544A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN117425752A (zh) | 2024-01-19 |
WO2023067736A1 (ja) | 2023-04-27 |
US20240141544A1 (en) | 2024-05-02 |
JP7339434B1 (ja) | 2023-09-05 |
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