JPWO2023047592A1 - - Google Patents
Info
- Publication number
- JPWO2023047592A1 JPWO2023047592A1 JP2022556090A JP2022556090A JPWO2023047592A1 JP WO2023047592 A1 JPWO2023047592 A1 JP WO2023047592A1 JP 2022556090 A JP2022556090 A JP 2022556090A JP 2022556090 A JP2022556090 A JP 2022556090A JP WO2023047592 A1 JPWO2023047592 A1 JP WO2023047592A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/035418 WO2023047592A1 (ja) | 2021-09-27 | 2021-09-27 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP7188658B1 JP7188658B1 (ja) | 2022-12-13 |
| JPWO2023047592A1 true JPWO2023047592A1 (ja) | 2023-03-30 |
Family
ID=84441420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022556090A Active JP7188658B1 (ja) | 2021-09-27 | 2021-09-27 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7188658B1 (ja) |
| WO (1) | WO2023047592A1 (ja) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109075048A (zh) * | 2016-06-30 | 2018-12-21 | 琳得科株式会社 | 半导体加工用片 |
| WO2018216621A1 (ja) * | 2017-05-22 | 2018-11-29 | 日立化成株式会社 | 半導体装置の製造方法及びエキスパンドテープ |
| WO2019172219A1 (ja) * | 2018-03-07 | 2019-09-12 | リンテック株式会社 | 粘着シート |
| JP7256786B2 (ja) * | 2018-03-07 | 2023-04-12 | リンテック株式会社 | 粘着シート |
| WO2019172220A1 (ja) * | 2018-03-07 | 2019-09-12 | リンテック株式会社 | 粘着シート |
| WO2020218468A1 (ja) * | 2019-04-25 | 2020-10-29 | リケンテクノス株式会社 | ダイシングフィルム用基材フィルム、及びダイシングフィルム、並びに製造方法 |
| WO2020230468A1 (ja) * | 2019-05-15 | 2020-11-19 | タキロンシーアイ株式会社 | ダイシングテープ用基材フィルム |
| CN114514296B (zh) * | 2019-10-04 | 2024-03-29 | 琳得科株式会社 | 粘合片 |
| JP7377723B2 (ja) * | 2020-01-21 | 2023-11-10 | タキロンシーアイ株式会社 | ダイシングテープ用基材フィルム |
| JP2022030093A (ja) * | 2020-08-06 | 2022-02-18 | 昭和電工マテリアルズ株式会社 | 半導体装置の製造方法及びエキスパンドテープ |
| JP7111213B1 (ja) * | 2021-04-22 | 2022-08-02 | 大日本印刷株式会社 | 半導体加工用粘着テープ |
-
2021
- 2021-09-27 JP JP2022556090A patent/JP7188658B1/ja active Active
- 2021-09-27 WO PCT/JP2021/035418 patent/WO2023047592A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP7188658B1 (ja) | 2022-12-13 |
| WO2023047592A1 (ja) | 2023-03-30 |
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