JPWO2022269718A1 - - Google Patents

Info

Publication number
JPWO2022269718A1
JPWO2022269718A1 JP2023529244A JP2023529244A JPWO2022269718A1 JP WO2022269718 A1 JPWO2022269718 A1 JP WO2022269718A1 JP 2023529244 A JP2023529244 A JP 2023529244A JP 2023529244 A JP2023529244 A JP 2023529244A JP WO2022269718 A1 JPWO2022269718 A1 JP WO2022269718A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023529244A
Other versions
JPWO2022269718A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022269718A1 publication Critical patent/JPWO2022269718A1/ja
Publication of JPWO2022269718A5 publication Critical patent/JPWO2022269718A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • H01L21/67393Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67366Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023529244A 2021-06-21 2021-06-21 Pending JPWO2022269718A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023474 WO2022269718A1 (ja) 2021-06-21 2021-06-21 基板収納容器

Publications (2)

Publication Number Publication Date
JPWO2022269718A1 true JPWO2022269718A1 (ja) 2022-12-29
JPWO2022269718A5 JPWO2022269718A5 (ja) 2024-04-18

Family

ID=84545304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529244A Pending JPWO2022269718A1 (ja) 2021-06-21 2021-06-21

Country Status (6)

Country Link
US (1) US20240145284A1 (ja)
JP (1) JPWO2022269718A1 (ja)
KR (1) KR20240024780A (ja)
CN (1) CN117296140A (ja)
TW (1) TW202301528A (ja)
WO (1) WO2022269718A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011072260A2 (en) * 2009-12-10 2011-06-16 Entegris, Inc. Porous barrier for evenly distributed purge gas in a microenvironment
TWM489155U (en) * 2014-06-09 2014-11-01 Gudeng Precision Industrial Co Ltd Gas diffusion device of wafer pod
JP6424728B2 (ja) 2014-07-03 2018-11-21 Tdk株式会社 半導体磁器組成物およびptcサーミスタ
JP6400534B2 (ja) 2015-07-06 2018-10-03 信越ポリマー株式会社 基板収納容器
KR20200011290A (ko) * 2018-07-24 2020-02-03 세메스 주식회사 기판 처리 장치
CN114144871A (zh) * 2019-07-25 2022-03-04 未来儿股份有限公司 基板收纳容器

Also Published As

Publication number Publication date
WO2022269718A1 (ja) 2022-12-29
KR20240024780A (ko) 2024-02-26
TW202301528A (zh) 2023-01-01
CN117296140A (zh) 2023-12-26
US20240145284A1 (en) 2024-05-02

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231219

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240507