JPWO2022269718A1 - - Google Patents
Info
- Publication number
- JPWO2022269718A1 JPWO2022269718A1 JP2023529244A JP2023529244A JPWO2022269718A1 JP WO2022269718 A1 JPWO2022269718 A1 JP WO2022269718A1 JP 2023529244 A JP2023529244 A JP 2023529244A JP 2023529244 A JP2023529244 A JP 2023529244A JP WO2022269718 A1 JPWO2022269718 A1 JP WO2022269718A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/023474 WO2022269718A1 (ja) | 2021-06-21 | 2021-06-21 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022269718A1 true JPWO2022269718A1 (ja) | 2022-12-29 |
JPWO2022269718A5 JPWO2022269718A5 (ja) | 2024-04-18 |
Family
ID=84545304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023529244A Pending JPWO2022269718A1 (ja) | 2021-06-21 | 2021-06-21 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240145284A1 (ja) |
JP (1) | JPWO2022269718A1 (ja) |
KR (1) | KR20240024780A (ja) |
CN (1) | CN117296140A (ja) |
TW (1) | TW202301528A (ja) |
WO (1) | WO2022269718A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011072260A2 (en) * | 2009-12-10 | 2011-06-16 | Entegris, Inc. | Porous barrier for evenly distributed purge gas in a microenvironment |
TWM489155U (en) * | 2014-06-09 | 2014-11-01 | Gudeng Precision Industrial Co Ltd | Gas diffusion device of wafer pod |
JP6424728B2 (ja) | 2014-07-03 | 2018-11-21 | Tdk株式会社 | 半導体磁器組成物およびptcサーミスタ |
JP6400534B2 (ja) | 2015-07-06 | 2018-10-03 | 信越ポリマー株式会社 | 基板収納容器 |
KR20200011290A (ko) * | 2018-07-24 | 2020-02-03 | 세메스 주식회사 | 기판 처리 장치 |
CN114144871A (zh) * | 2019-07-25 | 2022-03-04 | 未来儿股份有限公司 | 基板收纳容器 |
-
2021
- 2021-06-21 US US18/573,927 patent/US20240145284A1/en active Pending
- 2021-06-21 JP JP2023529244A patent/JPWO2022269718A1/ja active Pending
- 2021-06-21 CN CN202180097767.9A patent/CN117296140A/zh active Pending
- 2021-06-21 WO PCT/JP2021/023474 patent/WO2022269718A1/ja active Application Filing
- 2021-06-21 KR KR1020237038160A patent/KR20240024780A/ko active Search and Examination
-
2022
- 2022-06-15 TW TW111122156A patent/TW202301528A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022269718A1 (ja) | 2022-12-29 |
KR20240024780A (ko) | 2024-02-26 |
TW202301528A (zh) | 2023-01-01 |
CN117296140A (zh) | 2023-12-26 |
US20240145284A1 (en) | 2024-05-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231219 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240507 |