JPWO2022172900A1 - - Google Patents

Info

Publication number
JPWO2022172900A1
JPWO2022172900A1 JP2022542775A JP2022542775A JPWO2022172900A1 JP WO2022172900 A1 JPWO2022172900 A1 JP WO2022172900A1 JP 2022542775 A JP2022542775 A JP 2022542775A JP 2022542775 A JP2022542775 A JP 2022542775A JP WO2022172900 A1 JPWO2022172900 A1 JP WO2022172900A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022542775A
Other languages
Japanese (ja)
Other versions
JPWO2022172900A5 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022172900A1 publication Critical patent/JPWO2022172900A1/ja
Publication of JPWO2022172900A5 publication Critical patent/JPWO2022172900A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/587—Fine ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laser Beam Processing (AREA)
JP2022542775A 2021-02-12 2022-02-07 Pending JPWO2022172900A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021101 2021-02-12
PCT/JP2022/004738 WO2022172900A1 (fr) 2021-02-12 2022-02-07 Plaque céramique et son procédé de fabrication, carte de circuit imprimé et son procédé de fabrication

Publications (2)

Publication Number Publication Date
JPWO2022172900A1 true JPWO2022172900A1 (fr) 2022-08-18
JPWO2022172900A5 JPWO2022172900A5 (fr) 2023-01-24

Family

ID=82837896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542775A Pending JPWO2022172900A1 (fr) 2021-02-12 2022-02-07

Country Status (2)

Country Link
JP (1) JPWO2022172900A1 (fr)
WO (1) WO2022172900A1 (fr)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541169U (ja) * 1991-11-01 1993-06-01 三菱電機株式会社 プリント基板
JPH09511791A (ja) * 1994-10-20 1997-11-25 エレクトロ サイエンティフィック インダストリーズ インコーポレイテッド 通路をメッキするレーザ法
JP2002223044A (ja) * 2001-01-24 2002-08-09 Tdk Corp 電子部品の製造方法及び集合基板
JP2005345526A (ja) * 2004-05-31 2005-12-15 Sumitomo Heavy Ind Ltd ガルバノスキャナの制御方法、装置及びレーザ加工方法
JP2006134989A (ja) * 2004-11-04 2006-05-25 Mitsubishi Electric Corp ヒートシンク、発熱体、放熱構造物および熱交換器
JP2011110589A (ja) * 2009-11-27 2011-06-09 Hitachi Via Mechanics Ltd レーザ加工方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置
JP2015023087A (ja) * 2013-07-17 2015-02-02 三菱電機株式会社 基板固定構造
JP2016051778A (ja) * 2014-08-29 2016-04-11 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板
WO2019167942A1 (fr) * 2018-02-27 2019-09-06 三菱マテリアル株式会社 Carte de circuit imprimé isolante

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541169U (ja) * 1991-11-01 1993-06-01 三菱電機株式会社 プリント基板
JPH09511791A (ja) * 1994-10-20 1997-11-25 エレクトロ サイエンティフィック インダストリーズ インコーポレイテッド 通路をメッキするレーザ法
JP2002223044A (ja) * 2001-01-24 2002-08-09 Tdk Corp 電子部品の製造方法及び集合基板
JP2005345526A (ja) * 2004-05-31 2005-12-15 Sumitomo Heavy Ind Ltd ガルバノスキャナの制御方法、装置及びレーザ加工方法
JP2006134989A (ja) * 2004-11-04 2006-05-25 Mitsubishi Electric Corp ヒートシンク、発熱体、放熱構造物および熱交換器
JP2011110589A (ja) * 2009-11-27 2011-06-09 Hitachi Via Mechanics Ltd レーザ加工方法
JP2011171349A (ja) * 2010-02-16 2011-09-01 Kyocera Corp 配線基板およびそれを用いた電子装置
JP2015023087A (ja) * 2013-07-17 2015-02-02 三菱電機株式会社 基板固定構造
JP2016051778A (ja) * 2014-08-29 2016-04-11 Ｄｏｗａメタルテック株式会社 金属−セラミックス接合基板
WO2019167942A1 (fr) * 2018-02-27 2019-09-06 三菱マテリアル株式会社 Carte de circuit imprimé isolante

Also Published As

Publication number Publication date
WO2022172900A1 (fr) 2022-08-18

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