JPWO2022130444A1 - - Google Patents
Info
- Publication number
- JPWO2022130444A1 JPWO2022130444A1 JP2022569321A JP2022569321A JPWO2022130444A1 JP WO2022130444 A1 JPWO2022130444 A1 JP WO2022130444A1 JP 2022569321 A JP2022569321 A JP 2022569321A JP 2022569321 A JP2022569321 A JP 2022569321A JP WO2022130444 A1 JPWO2022130444 A1 JP WO2022130444A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/046506 WO2022130444A1 (ja) | 2020-12-14 | 2020-12-14 | 部品実装機およびクランプ制御方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022130444A1 true JPWO2022130444A1 (ja) | 2022-06-23 |
Family
ID=82057369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022569321A Pending JPWO2022130444A1 (ja) | 2020-12-14 | 2020-12-14 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230413502A1 (ja) |
JP (1) | JPWO2022130444A1 (ja) |
CN (1) | CN116368951A (ja) |
DE (1) | DE112020007842T5 (ja) |
WO (1) | WO2022130444A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003289199A (ja) | 2002-01-25 | 2003-10-10 | Fuji Mach Mfg Co Ltd | 対基板作業システム |
JP2004087937A (ja) * | 2002-08-28 | 2004-03-18 | Seiko Epson Corp | 加圧装置、加圧方法、電子部品の圧着方法および電気光学装置の製造方法 |
JP4706668B2 (ja) * | 2007-06-14 | 2011-06-22 | パナソニック株式会社 | 電子部品実装用装置および電子部品実装用装置における基板下受け方法 |
JP4748118B2 (ja) * | 2007-06-14 | 2011-08-17 | パナソニック株式会社 | 電子部品実装用装置および電子部品実装用装置における基板下受け方法 |
JP2015060988A (ja) | 2013-09-19 | 2015-03-30 | 日置電機株式会社 | 基板搬送装置 |
JP6556611B2 (ja) | 2015-12-01 | 2019-08-07 | 株式会社Fuji | 部品実装機 |
-
2020
- 2020-12-14 US US18/252,101 patent/US20230413502A1/en active Pending
- 2020-12-14 WO PCT/JP2020/046506 patent/WO2022130444A1/ja active Application Filing
- 2020-12-14 CN CN202080106855.6A patent/CN116368951A/zh active Pending
- 2020-12-14 DE DE112020007842.6T patent/DE112020007842T5/de active Pending
- 2020-12-14 JP JP2022569321A patent/JPWO2022130444A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022130444A1 (ja) | 2022-06-23 |
DE112020007842T5 (de) | 2023-09-28 |
US20230413502A1 (en) | 2023-12-21 |
CN116368951A (zh) | 2023-06-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231017 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240402 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240510 |