JPWO2022130444A1 - - Google Patents

Info

Publication number
JPWO2022130444A1
JPWO2022130444A1 JP2022569321A JP2022569321A JPWO2022130444A1 JP WO2022130444 A1 JPWO2022130444 A1 JP WO2022130444A1 JP 2022569321 A JP2022569321 A JP 2022569321A JP 2022569321 A JP2022569321 A JP 2022569321A JP WO2022130444 A1 JPWO2022130444 A1 JP WO2022130444A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022569321A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022130444A1 publication Critical patent/JPWO2022130444A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022569321A 2020-12-14 2020-12-14 Pending JPWO2022130444A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/046506 WO2022130444A1 (ja) 2020-12-14 2020-12-14 部品実装機およびクランプ制御方法

Publications (1)

Publication Number Publication Date
JPWO2022130444A1 true JPWO2022130444A1 (ja) 2022-06-23

Family

ID=82057369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022569321A Pending JPWO2022130444A1 (ja) 2020-12-14 2020-12-14

Country Status (5)

Country Link
US (1) US20230413502A1 (ja)
JP (1) JPWO2022130444A1 (ja)
CN (1) CN116368951A (ja)
DE (1) DE112020007842T5 (ja)
WO (1) WO2022130444A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289199A (ja) 2002-01-25 2003-10-10 Fuji Mach Mfg Co Ltd 対基板作業システム
JP2004087937A (ja) * 2002-08-28 2004-03-18 Seiko Epson Corp 加圧装置、加圧方法、電子部品の圧着方法および電気光学装置の製造方法
JP4706668B2 (ja) * 2007-06-14 2011-06-22 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置における基板下受け方法
JP4748118B2 (ja) * 2007-06-14 2011-08-17 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置における基板下受け方法
JP2015060988A (ja) 2013-09-19 2015-03-30 日置電機株式会社 基板搬送装置
JP6556611B2 (ja) 2015-12-01 2019-08-07 株式会社Ｆｕｊｉ 部品実装機

Also Published As

Publication number Publication date
WO2022130444A1 (ja) 2022-06-23
DE112020007842T5 (de) 2023-09-28
US20230413502A1 (en) 2023-12-21
CN116368951A (zh) 2023-06-30

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