JPWO2022085563A1 - - Google Patents

Info

Publication number
JPWO2022085563A1
JPWO2022085563A1 JP2022557443A JP2022557443A JPWO2022085563A1 JP WO2022085563 A1 JPWO2022085563 A1 JP WO2022085563A1 JP 2022557443 A JP2022557443 A JP 2022557443A JP 2022557443 A JP2022557443 A JP 2022557443A JP WO2022085563 A1 JPWO2022085563 A1 JP WO2022085563A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022557443A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022085563A1 publication Critical patent/JPWO2022085563A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/06—Polyurethanes from polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022557443A 2020-10-23 2021-10-14 Pending JPWO2022085563A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020178234 2020-10-23
PCT/JP2021/038077 WO2022085563A1 (fr) 2020-10-23 2021-10-14 Composition de résine, film de liaison, stratifié avec couche de composition de résine, stratifié et film de protection contre les ondes électromagnétiques

Publications (1)

Publication Number Publication Date
JPWO2022085563A1 true JPWO2022085563A1 (fr) 2022-04-28

Family

ID=81290455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022557443A Pending JPWO2022085563A1 (fr) 2020-10-23 2021-10-14

Country Status (5)

Country Link
JP (1) JPWO2022085563A1 (fr)
KR (1) KR20230113299A (fr)
CN (1) CN116390855A (fr)
TW (1) TW202222977A (fr)
WO (1) WO2022085563A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7223090B1 (ja) * 2021-09-28 2023-02-15 古河電気工業株式会社 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
WO2024009969A1 (fr) * 2022-07-06 2024-01-11 東亞合成株式会社 Composition adhésive, film de liaison, stratifié comprenant une couche de composition adhésive, stratifié et film de protection contre les ondes électromagnétiques

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846290U (ja) 1981-09-19 1983-03-29 株式会社明電舎 電流型三相インバ−タの制御回路
JP3849789B2 (ja) 2003-10-20 2006-11-22 東洋紡績株式会社 積層体
JP4994679B2 (ja) * 2005-03-04 2012-08-08 昭和電工株式会社 皮膜材料形成用ペースト
JP5209888B2 (ja) * 2006-03-09 2013-06-12 昭和電工株式会社 熱硬化性樹脂組成物及びその用途
JP5304152B2 (ja) 2008-09-30 2013-10-02 東洋紡株式会社 接着剤用樹脂組成物、これを含有する接着剤、接着シート及びこれを接着層として含むプリント配線板
WO2015068611A1 (fr) * 2013-11-07 2015-05-14 東洋インキＳｃホールディングス株式会社 Adhésif électroconducteur, feuille adhésive électroconductrice, dispositif de câblage et procédé de fabrication d'un dispositif de câblage
JP2015228457A (ja) * 2014-06-02 2015-12-17 デクセリアルズ株式会社 太陽電池用導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法
CN111196066B (zh) * 2014-09-24 2022-05-10 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
US11044807B2 (en) * 2015-12-25 2021-06-22 Nippon Polytech Corp. Polyurethane, curable composition, overcoat film, and flexible wiring board and production method therefor
JP6955486B2 (ja) * 2016-04-19 2021-10-27 株式会社カネカ プリント配線板の製造方法
CN108368409B (zh) * 2016-05-23 2019-05-07 拓自达电线株式会社 导电性粘接剂组合物

Also Published As

Publication number Publication date
KR20230113299A (ko) 2023-07-28
WO2022085563A1 (fr) 2022-04-28
CN116390855A (zh) 2023-07-04
TW202222977A (zh) 2022-06-16

Similar Documents

Publication Publication Date Title
BR112023005462A2 (fr)
BR112021014123A2 (fr)
BR112023012656A2 (fr)
JPWO2022085563A1 (fr)
BR112022009896A2 (fr)
BR112022024743A2 (fr)
BR112023009656A2 (fr)
BR102021018859A2 (fr)
JPWO2022025207A1 (fr)
BR102021007058A2 (fr)
BR102020022030A2 (fr)
JP1666017S (fr)
BR112023011738A2 (fr)
BR112023016292A2 (fr)
BR112023004146A2 (fr)
BR112023011539A2 (fr)
BR112023011610A2 (fr)
BR112023008976A2 (fr)
BR112023006729A2 (fr)
BR102021020147A2 (fr)
BR102021018926A2 (fr)
BR102021018167A2 (fr)
BR102021017576A2 (fr)
BR112021017747A2 (fr)
BR102021012003A2 (fr)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240502