JPWO2022075409A1 - - Google Patents
Info
- Publication number
- JPWO2022075409A1 JPWO2022075409A1 JP2022555561A JP2022555561A JPWO2022075409A1 JP WO2022075409 A1 JPWO2022075409 A1 JP WO2022075409A1 JP 2022555561 A JP2022555561 A JP 2022555561A JP 2022555561 A JP2022555561 A JP 2022555561A JP WO2022075409 A1 JPWO2022075409 A1 JP WO2022075409A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020169538 | 2020-10-07 | ||
PCT/JP2021/037152 WO2022075409A1 (ja) | 2020-10-07 | 2021-10-07 | 接合体、セラミックス回路基板、および半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022075409A1 true JPWO2022075409A1 (ja) | 2022-04-14 |
Family
ID=81126526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022555561A Pending JPWO2022075409A1 (ja) | 2020-10-07 | 2021-10-07 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230187310A1 (ja) |
EP (1) | EP4227284A1 (ja) |
JP (1) | JPWO2022075409A1 (ja) |
CN (1) | CN115989579A (ja) |
WO (1) | WO2022075409A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024009851A1 (ja) * | 2022-07-05 | 2024-01-11 | 株式会社 東芝 | 接合体、セラミックス回路基板、半導体装置、及び接合体の製造方法 |
CN116082055B (zh) * | 2023-01-18 | 2023-09-26 | 潮州三环(集团)股份有限公司 | 一种拼接陶瓷及其制备方法与应用 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0729859B2 (ja) * | 1985-09-05 | 1995-04-05 | 株式会社東芝 | セラミツクス−金属接合部材 |
JP4077888B2 (ja) * | 1995-07-21 | 2008-04-23 | 株式会社東芝 | セラミックス回路基板 |
JPH09249462A (ja) * | 1996-03-12 | 1997-09-22 | Ngk Insulators Ltd | 接合体、その製造方法およびセラミックス部材用ろう材 |
JP3834351B2 (ja) * | 1996-04-09 | 2006-10-18 | 株式会社東芝 | セラミックス回路基板 |
JP3515334B2 (ja) * | 1996-08-30 | 2004-04-05 | 日本特殊陶業株式会社 | セラミックと金属との接合体 |
JP3445461B2 (ja) * | 1997-03-13 | 2003-09-08 | 株式会社東芝 | ハンダ接合方法および超音波センサー |
JP2005095977A (ja) * | 2003-08-26 | 2005-04-14 | Sanyo Electric Co Ltd | 回路装置 |
JP3887645B2 (ja) * | 2005-07-19 | 2007-02-28 | 株式会社東芝 | セラミックス回路基板の製造方法 |
JP2007173577A (ja) * | 2005-12-22 | 2007-07-05 | Hitachi Metals Ltd | セラミックス回路基板 |
US20080035707A1 (en) * | 2006-08-14 | 2008-02-14 | The Regents Of The University Of California | Transient-liquid-phase joining of ceramics at low temperatures |
US20100068552A1 (en) * | 2008-03-31 | 2010-03-18 | Infineon Technologies Ag | Module including a stable solder joint |
CN104011852B (zh) * | 2011-12-20 | 2016-12-21 | 株式会社东芝 | 陶瓷铜电路基板和使用了陶瓷铜电路基板的半导体装置 |
JP6319643B2 (ja) * | 2012-02-29 | 2018-05-09 | 日立金属株式会社 | セラミックス−銅接合体およびその製造方法 |
JP5672324B2 (ja) * | 2013-03-18 | 2015-02-18 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
JP6111764B2 (ja) * | 2013-03-18 | 2017-04-12 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
KR102131484B1 (ko) * | 2013-08-26 | 2020-07-07 | 미쓰비시 마테리알 가부시키가이샤 | 접합체 및 파워 모듈용 기판 |
JP6079505B2 (ja) * | 2013-08-26 | 2017-02-15 | 三菱マテリアル株式会社 | 接合体及びパワーモジュール用基板 |
WO2015046280A1 (ja) * | 2013-09-30 | 2015-04-02 | 三菱マテリアル株式会社 | Cu/セラミックス接合体、Cu/セラミックス接合体の製造方法、及び、パワーモジュール用基板 |
EP3121157B1 (en) * | 2014-03-20 | 2019-03-20 | Mitsubishi Materials Corporation | Bonded body, substrate for power modules, power module and method for producing bonded body |
JP6429208B2 (ja) * | 2014-11-21 | 2018-11-28 | 株式会社日立製作所 | 半導体装置および移動体 |
US20180318922A1 (en) * | 2015-11-06 | 2018-11-08 | Innomaq 21, S.L. | Method for the economic manufacturing of metallic parts |
JP6569511B2 (ja) * | 2015-12-17 | 2019-09-04 | 三菱マテリアル株式会社 | 接合体、冷却器付きパワーモジュール用基板、冷却器付きパワーモジュール用基板の製造方法 |
JP6819299B2 (ja) * | 2016-01-22 | 2021-01-27 | 三菱マテリアル株式会社 | 接合体、パワーモジュール用基板、接合体の製造方法及びパワーモジュール用基板の製造方法 |
WO2017200004A1 (ja) * | 2016-05-19 | 2017-11-23 | 三菱マテリアル株式会社 | パワーモジュール用基板 |
WO2017213207A1 (ja) * | 2016-06-10 | 2017-12-14 | 田中貴金属工業株式会社 | セラミックス回路基板、及び、セラミックス回路基板の製造方法 |
JP6904088B2 (ja) * | 2016-06-30 | 2021-07-14 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、及び、絶縁回路基板 |
WO2018003845A1 (ja) * | 2016-06-30 | 2018-01-04 | 三菱マテリアル株式会社 | 銅/セラミックス接合体、及び、絶縁回路基板 |
CN114478045B (zh) | 2016-07-28 | 2023-08-15 | 株式会社东芝 | 接合体、电路基板及半导体装置 |
CN106312220A (zh) * | 2016-10-12 | 2017-01-11 | 哈尔滨工业大学(威海) | 一种功率模块用陶瓷基板覆铜的低温连接方法 |
CN106514039B (zh) * | 2016-11-03 | 2019-03-08 | 华北水利水电大学 | 一种铜锡钛钎料及其制备方法 |
KR102516917B1 (ko) | 2017-04-25 | 2023-03-31 | 덴카 주식회사 | 세라믹스 회로 기판 및 그 제조 방법과 그것을 사용한 모듈 |
EP3632879B1 (en) * | 2017-05-30 | 2022-02-09 | Denka Company Limited | Ceramic circuit board and method of production |
EP4006002A4 (en) * | 2019-07-23 | 2023-09-06 | NGK Insulators, Ltd. | BONDED SUBSTRATE AND METHOD FOR PRODUCING A BONDED SUBSTRATE |
US20230022285A1 (en) * | 2019-12-19 | 2023-01-26 | Mitsubishi Materials Corporation | Copper/ceramic joined body and insulated circuit board |
WO2023234286A1 (ja) * | 2022-06-02 | 2023-12-07 | 株式会社 東芝 | セラミックス回路基板およびそれを用いた半導体装置 |
CN117362066A (zh) * | 2022-07-01 | 2024-01-09 | 比亚迪股份有限公司 | 陶瓷覆铜基板及其制备方法 |
-
2021
- 2021-10-07 JP JP2022555561A patent/JPWO2022075409A1/ja active Pending
- 2021-10-07 EP EP21877708.4A patent/EP4227284A1/en active Pending
- 2021-10-07 WO PCT/JP2021/037152 patent/WO2022075409A1/ja unknown
- 2021-10-07 CN CN202180053012.9A patent/CN115989579A/zh active Pending
-
2023
- 2023-02-02 US US18/163,466 patent/US20230187310A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4227284A1 (en) | 2023-08-16 |
WO2022075409A1 (ja) | 2022-04-14 |
US20230187310A1 (en) | 2023-06-15 |
CN115989579A (zh) | 2023-04-18 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20230208 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20230623 |