JPWO2021229961A1 - - Google Patents
Info
- Publication number
- JPWO2021229961A1 JPWO2021229961A1 JP2022504714A JP2022504714A JPWO2021229961A1 JP WO2021229961 A1 JPWO2021229961 A1 JP WO2021229961A1 JP 2022504714 A JP2022504714 A JP 2022504714A JP 2022504714 A JP2022504714 A JP 2022504714A JP WO2021229961 A1 JPWO2021229961 A1 JP WO2021229961A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202016874749A | 2020-05-15 | 2020-05-15 | |
US16/874,853 | 2020-05-15 | ||
US16/874,782 US11473849B2 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
US16/874,937 | 2020-05-15 | ||
US16/874,898 US20210356211A1 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
US16/874,801 US11473850B2 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
US16/874,801 | 2020-05-15 | ||
US16/874,878 US20210356214A1 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
US16/874,782 | 2020-05-15 | ||
US16/874,898 | 2020-05-15 | ||
US16/874,749 | 2020-05-15 | ||
US16/874,937 US11585606B2 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
US16/874,878 | 2020-05-15 | ||
US16/874,853 US11013145B1 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
PCT/JP2021/014797 WO2021229961A1 (en) | 2020-05-15 | 2021-04-07 | Vapor chamber |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021229961A1 true JPWO2021229961A1 (en) | 2021-11-18 |
JPWO2021229961A5 JPWO2021229961A5 (en) | 2022-04-26 |
JP7088435B2 JP7088435B2 (en) | 2022-06-21 |
Family
ID=78525759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022504714A Active JP7088435B2 (en) | 2020-05-15 | 2021-04-07 | Vapor chamber |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7088435B2 (en) |
CN (1) | CN219037720U (en) |
WO (1) | WO2021229961A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023150314A (en) * | 2022-03-31 | 2023-10-16 | 住友精密工業株式会社 | Method for manufacturing boiling type cooler, and boiling type cooler |
WO2024075631A1 (en) * | 2022-10-06 | 2024-04-11 | 株式会社村田製作所 | Thermal diffusion device and electronic apparatus |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010243035A (en) * | 2009-04-03 | 2010-10-28 | Sony Corp | Heat transport device, electronic apparatus and method of manufacturing the heat transport device |
US20150226493A1 (en) * | 2009-03-06 | 2015-08-13 | Kelvin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
WO2018003957A1 (en) * | 2016-07-01 | 2018-01-04 | 古河電気工業株式会社 | Vapor chamber |
JP2018503058A (en) * | 2015-01-22 | 2018-02-01 | ピメムズ インコーポレイテッドPiMEMS, Inc. | High performance two-phase cooling system |
WO2018199216A1 (en) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | Vapor chamber |
JP2018189349A (en) * | 2017-04-28 | 2018-11-29 | 株式会社村田製作所 | Vapor chamber |
JP2019020001A (en) * | 2017-07-12 | 2019-02-07 | 株式会社村田製作所 | Vapor chamber |
WO2020026907A1 (en) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | Vapor chamber |
US20200103176A1 (en) * | 2018-09-28 | 2020-04-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
-
2021
- 2021-04-07 WO PCT/JP2021/014797 patent/WO2021229961A1/en active Application Filing
- 2021-04-07 JP JP2022504714A patent/JP7088435B2/en active Active
- 2021-04-07 CN CN202190000458.0U patent/CN219037720U/en active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150226493A1 (en) * | 2009-03-06 | 2015-08-13 | Kelvin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
JP2010243035A (en) * | 2009-04-03 | 2010-10-28 | Sony Corp | Heat transport device, electronic apparatus and method of manufacturing the heat transport device |
US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
JP2018503058A (en) * | 2015-01-22 | 2018-02-01 | ピメムズ インコーポレイテッドPiMEMS, Inc. | High performance two-phase cooling system |
WO2018003957A1 (en) * | 2016-07-01 | 2018-01-04 | 古河電気工業株式会社 | Vapor chamber |
WO2018199216A1 (en) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | Vapor chamber |
JP2018189349A (en) * | 2017-04-28 | 2018-11-29 | 株式会社村田製作所 | Vapor chamber |
JP2019020001A (en) * | 2017-07-12 | 2019-02-07 | 株式会社村田製作所 | Vapor chamber |
WO2020026907A1 (en) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | Vapor chamber |
US20200103176A1 (en) * | 2018-09-28 | 2020-04-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
Also Published As
Publication number | Publication date |
---|---|
CN219037720U (en) | 2023-05-16 |
WO2021229961A1 (en) | 2021-11-18 |
JP7088435B2 (en) | 2022-06-21 |
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