JPWO2021205803A1 - - Google Patents

Info

Publication number
JPWO2021205803A1
JPWO2021205803A1 JP2022514347A JP2022514347A JPWO2021205803A1 JP WO2021205803 A1 JPWO2021205803 A1 JP WO2021205803A1 JP 2022514347 A JP2022514347 A JP 2022514347A JP 2022514347 A JP2022514347 A JP 2022514347A JP WO2021205803 A1 JPWO2021205803 A1 JP WO2021205803A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022514347A
Other versions
JPWO2021205803A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021205803A1 publication Critical patent/JPWO2021205803A1/ja
Publication of JPWO2021205803A5 publication Critical patent/JPWO2021205803A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
JP2022514347A 2020-04-10 2021-03-09 Pending JPWO2021205803A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020070679 2020-04-10
JP2020199982 2020-12-02
PCT/JP2021/009381 WO2021205803A1 (ja) 2020-04-10 2021-03-09 熱電変換素子、熱電変換モジュール、接合材、及び熱電変換素子を製造する方法

Publications (2)

Publication Number Publication Date
JPWO2021205803A1 true JPWO2021205803A1 (ja) 2021-10-14
JPWO2021205803A5 JPWO2021205803A5 (ja) 2024-02-08

Family

ID=78022529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514347A Pending JPWO2021205803A1 (ja) 2020-04-10 2021-03-09

Country Status (5)

Country Link
US (2) US11957055B2 (ja)
EP (1) EP4135057A4 (ja)
JP (1) JPWO2021205803A1 (ja)
CN (1) CN115398657A (ja)
WO (1) WO2021205803A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293906A (ja) * 1996-04-25 1997-11-11 Osaka Gas Co Ltd 熱電変換素子
UA82048C2 (uk) 2000-11-10 2008-03-11 Эли Лилли Энд Компани Агоністи альфа-рецепторів, активованих проліфератором пероксисом
KR20030092692A (ko) * 2002-05-30 2003-12-06 이지환 열전소자와 전극이 일체화된 열전재료의 제조 방법
JP6094136B2 (ja) * 2012-10-12 2017-03-29 日立化成株式会社 熱電変換素子組立体及び熱電変換モジュール及びその製造方法
US10121953B2 (en) * 2015-10-27 2018-11-06 Panasonic Intellectual Property Management Co., Ltd. Thermoelectric conversion material
EP3179526B1 (en) 2015-10-27 2018-12-26 Panasonic Intellectual Property Management Co., Ltd. Thermoelectric conversion material
WO2020003554A1 (ja) 2018-06-27 2020-01-02 パナソニックＩｐマネジメント株式会社 熱電変換素子及び熱電変換モジュール

Also Published As

Publication number Publication date
CN115398657A (zh) 2022-11-25
US20230044945A1 (en) 2023-02-09
US20240164211A1 (en) 2024-05-16
EP4135057A1 (en) 2023-02-15
EP4135057A4 (en) 2023-09-20
US11957055B2 (en) 2024-04-09
WO2021205803A1 (ja) 2021-10-14

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