JPWO2021199355A1 - - Google Patents

Info

Publication number
JPWO2021199355A1
JPWO2021199355A1 JP2022511418A JP2022511418A JPWO2021199355A1 JP WO2021199355 A1 JPWO2021199355 A1 JP WO2021199355A1 JP 2022511418 A JP2022511418 A JP 2022511418A JP 2022511418 A JP2022511418 A JP 2022511418A JP WO2021199355 A1 JPWO2021199355 A1 JP WO2021199355A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022511418A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021199355A1 publication Critical patent/JPWO2021199355A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
JP2022511418A 2020-03-31 2020-03-31 Pending JPWO2021199355A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/014952 WO2021199355A1 (en) 2020-03-31 2020-03-31 Resin composition and adhesive tape

Publications (1)

Publication Number Publication Date
JPWO2021199355A1 true JPWO2021199355A1 (en) 2021-10-07

Family

ID=77929805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511418A Pending JPWO2021199355A1 (en) 2020-03-31 2020-03-31

Country Status (5)

Country Link
JP (1) JPWO2021199355A1 (en)
KR (1) KR20230004554A (en)
CN (1) CN115362218B (en)
TW (1) TW202144504A (en)
WO (1) WO2021199355A1 (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2962570B2 (en) 1990-11-14 1999-10-12 ジャパンゴアテックス株式会社 Release protection sheet for hot press lamination
US5308887A (en) * 1991-05-23 1994-05-03 Minnesota Mining & Manufacturing Company Pressure-sensitive adhesives
JP4809988B2 (en) * 2001-03-21 2011-11-09 日東電工株式会社 Silicone pressure-sensitive adhesive composition and pressure-sensitive adhesive tape using the same
JP2004091703A (en) * 2002-09-02 2004-03-25 Shin Etsu Chem Co Ltd Conductive silicone self-adhesive composition and self-adhesive tape
JP2006028311A (en) * 2004-07-14 2006-02-02 Shin Etsu Chem Co Ltd Silicone adhesive composition having excellent heat resistance and production method
JP2008133433A (en) * 2006-10-24 2008-06-12 Oji Paper Co Ltd Adhesive sheet and re-releasable adhesive sheet
JP5872798B2 (en) * 2011-06-14 2016-03-01 日東電工株式会社 Re-peeling adhesive tape and method for producing the same
US8653190B2 (en) * 2011-08-08 2014-02-18 3M Innovative Properties Company Curable cyclic anhydride copolymer/silicone composition
WO2016174713A1 (en) 2015-04-27 2016-11-03 株式会社寺岡製作所 Adhesive tape for mold release
CN109196070B (en) * 2016-05-16 2021-09-14 株式会社寺冈制作所 Adhesive composition and adhesive tape
KR102422197B1 (en) * 2016-07-29 2022-07-20 가부시키가이샤 데라오카 세이사쿠쇼 Pressure-sensitive adhesive sheet
EP3504003B1 (en) * 2016-08-26 2023-01-25 Avery Dennison Corporation Silicone based pressure sensitive adhesive tapes
JP6799067B2 (en) * 2016-09-26 2020-12-09 ダウ・東レ株式会社 Curing Reactive Silicone Gel and Its Applications
US20200164613A1 (en) * 2016-09-26 2020-05-28 Dow Corning Toray Co., Ltd. Laminate, method of manufacturing the same, and method of manufacturing electronic component
JP6884208B2 (en) * 2017-06-28 2021-06-09 旭化成株式会社 Resin composition, manufacturing method of resin composition and molded product
JP6974479B2 (en) * 2017-09-05 2021-12-01 株式会社寺岡製作所 Silicone adhesive composition and adhesive tape

Also Published As

Publication number Publication date
CN115362218A (en) 2022-11-18
WO2021199355A1 (en) 2021-10-07
TW202144504A (en) 2021-12-01
CN115362218B (en) 2023-09-19
KR20230004554A (en) 2023-01-06

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