JPWO2021171819A1 - - Google Patents

Info

Publication number
JPWO2021171819A1
JPWO2021171819A1 JP2022503144A JP2022503144A JPWO2021171819A1 JP WO2021171819 A1 JPWO2021171819 A1 JP WO2021171819A1 JP 2022503144 A JP2022503144 A JP 2022503144A JP 2022503144 A JP2022503144 A JP 2022503144A JP WO2021171819 A1 JPWO2021171819 A1 JP WO2021171819A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022503144A
Other versions
JP7327637B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021171819A1 publication Critical patent/JPWO2021171819A1/ja
Application granted granted Critical
Publication of JP7327637B2 publication Critical patent/JP7327637B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521Constructional features
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02Microphones

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2022503144A 2020-02-26 2021-01-14 超音波センサ Active JP7327637B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020030254 2020-02-26
JP2020030254 2020-02-26
PCT/JP2021/001044 WO2021171819A1 (ja) 2020-02-26 2021-01-14 超音波センサ

Publications (2)

Publication Number Publication Date
JPWO2021171819A1 true JPWO2021171819A1 (ja) 2021-09-02
JP7327637B2 JP7327637B2 (ja) 2023-08-16

Family

ID=77490851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022503144A Active JP7327637B2 (ja) 2020-02-26 2021-01-14 超音波センサ

Country Status (5)

Country Link
US (1) US20220393096A1 (ja)
JP (1) JP7327637B2 (ja)
CN (1) CN115023957A (ja)
DE (1) DE112021000436T5 (ja)
WO (1) WO2021171819A1 (ja)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07136164A (ja) * 1993-11-12 1995-05-30 Olympus Optical Co Ltd 超音波探触子
JP2003061193A (ja) * 2001-08-16 2003-02-28 Tayca Corp 積層圧電振動子およびそれを用いた超音波の送受波方法
JP2005093541A (ja) * 2003-09-12 2005-04-07 Matsushita Electric Works Ltd 圧電素子およびその製造方法
JP2006093916A (ja) * 2004-09-22 2006-04-06 Olympus Corp 音響流アクチュエータ
JP2008531110A (ja) * 2005-02-22 2008-08-14 ヒューマンスキャン・カンパニー・リミテッド 積層型超音波トランスデューサ及びその製造方法
WO2013047544A1 (ja) * 2011-09-30 2013-04-04 株式会社村田製作所 超音波センサ
WO2015060132A1 (ja) * 2013-10-22 2015-04-30 株式会社村田製作所 積層セラミック構造体及びその製造方法並びに圧電アクチュエータ
WO2016133016A1 (ja) * 2015-02-16 2016-08-25 株式会社村田製作所 超音波センサ
WO2016147917A1 (ja) * 2015-03-16 2016-09-22 株式会社村田製作所 超音波センサ
WO2016158762A1 (ja) * 2015-03-31 2016-10-06 株式会社村田製作所 圧電素子およびこれを備える超音波センサ
KR20180137974A (ko) * 2017-06-20 2018-12-28 임정택 초음파 센서 및 그 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6359499A (ja) 1986-08-21 1988-03-15 ライオン株式会社 キトサン系抄造体の製造方法
JP3345844B2 (ja) 1993-11-26 2002-11-18 日本特殊陶業株式会社 超音波送受波器
JP7136164B2 (ja) 2020-09-25 2022-09-13 フジテック株式会社 乗客コンベア

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07136164A (ja) * 1993-11-12 1995-05-30 Olympus Optical Co Ltd 超音波探触子
JP2003061193A (ja) * 2001-08-16 2003-02-28 Tayca Corp 積層圧電振動子およびそれを用いた超音波の送受波方法
JP2005093541A (ja) * 2003-09-12 2005-04-07 Matsushita Electric Works Ltd 圧電素子およびその製造方法
JP2006093916A (ja) * 2004-09-22 2006-04-06 Olympus Corp 音響流アクチュエータ
JP2008531110A (ja) * 2005-02-22 2008-08-14 ヒューマンスキャン・カンパニー・リミテッド 積層型超音波トランスデューサ及びその製造方法
WO2013047544A1 (ja) * 2011-09-30 2013-04-04 株式会社村田製作所 超音波センサ
WO2015060132A1 (ja) * 2013-10-22 2015-04-30 株式会社村田製作所 積層セラミック構造体及びその製造方法並びに圧電アクチュエータ
WO2016133016A1 (ja) * 2015-02-16 2016-08-25 株式会社村田製作所 超音波センサ
WO2016147917A1 (ja) * 2015-03-16 2016-09-22 株式会社村田製作所 超音波センサ
WO2016158762A1 (ja) * 2015-03-31 2016-10-06 株式会社村田製作所 圧電素子およびこれを備える超音波センサ
KR20180137974A (ko) * 2017-06-20 2018-12-28 임정택 초음파 센서 및 그 제조 방법

Also Published As

Publication number Publication date
DE112021000436T5 (de) 2022-10-13
JP7327637B2 (ja) 2023-08-16
CN115023957A (zh) 2022-09-06
US20220393096A1 (en) 2022-12-08
WO2021171819A1 (ja) 2021-09-02

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