JPWO2021117396A1 - - Google Patents

Info

Publication number
JPWO2021117396A1
JPWO2021117396A1 JP2021563798A JP2021563798A JPWO2021117396A1 JP WO2021117396 A1 JPWO2021117396 A1 JP WO2021117396A1 JP 2021563798 A JP2021563798 A JP 2021563798A JP 2021563798 A JP2021563798 A JP 2021563798A JP WO2021117396 A1 JPWO2021117396 A1 JP WO2021117396A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021563798A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021117396A1 publication Critical patent/JPWO2021117396A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021563798A 2019-12-11 2020-11-09 Pending JPWO2021117396A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019223752 2019-12-11
PCT/JP2020/041710 WO2021117396A1 (ja) 2019-12-11 2020-11-09 カチオン硬化性組成物、硬化物および接合体

Publications (1)

Publication Number Publication Date
JPWO2021117396A1 true JPWO2021117396A1 (ja) 2021-06-17

Family

ID=76329757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021563798A Pending JPWO2021117396A1 (ja) 2019-12-11 2020-11-09

Country Status (4)

Country Link
JP (1) JPWO2021117396A1 (ja)
CN (1) CN114761460B (ja)
TW (1) TW202122444A (ja)
WO (1) WO2021117396A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022202683A1 (ja) * 2021-03-22 2022-09-29
JP2024063368A (ja) * 2022-10-26 2024-05-13 デクセリアルズ株式会社 接続材料、接続構造体、及び接続構造体の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181005A (ja) * 1984-09-28 1986-04-24 Seikosha Co Ltd 発振器
JPH07268065A (ja) * 1993-11-17 1995-10-17 Sophia Syst:Kk 紫外線硬化型の無溶媒導電性ポリマー材料
JP4860831B2 (ja) * 2001-03-01 2012-01-25 株式会社リコー 光硬化型エポキシ樹脂組成物および光硬化型表示素子用シール剤
JP2002284966A (ja) * 2001-03-27 2002-10-03 Mitsubishi Gas Chem Co Inc 難燃性カチオン重合性樹脂組成物
JP5302496B2 (ja) * 2003-12-19 2013-10-02 ヘンケル コーポレイション カチオン硬化型エポキシ樹脂組成物
JP2007002073A (ja) * 2005-06-22 2007-01-11 Adeka Corp 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形方法
JP5764419B2 (ja) * 2011-07-19 2015-08-19 株式会社ダイセル 硬化性エポキシ樹脂組成物
CN102504745B (zh) * 2011-11-09 2013-09-04 烟台德邦科技有限公司 一种双固化包封胶及其制备方法
JP6920635B2 (ja) * 2015-12-02 2021-08-18 株式会社スリーボンド カチオン硬化性樹脂組成物
CN105441001A (zh) * 2015-12-24 2016-03-30 深圳市浩力新材料技术有限公司 一种高性能光通讯器件用接着剂及其制备方法
KR102294414B1 (ko) * 2016-04-06 2021-08-25 가부시끼가이샤 쓰리본드 양이온 경화성 수지 조성물
JP6856213B2 (ja) * 2017-03-07 2021-04-07 地方独立行政法人大阪産業技術研究所 紫外線硬化性樹脂組成物

Also Published As

Publication number Publication date
CN114761460B (zh) 2024-03-15
WO2021117396A1 (ja) 2021-06-17
CN114761460A (zh) 2022-07-15
TW202122444A (zh) 2021-06-16

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